© Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 1
1Publication Order Number:
NLX2GU04/D
NLX2GU04
Dual Unbuffered Inverter
The NLX2GU04 MiniGatet is an advanced high−speed CMOS
dual unbuffered inverter in ultra−small footprint.
This device is well suited for use in oscillator, pulse−shaping and
high input impedance amplifier applications. For digital applications,
the NLX2G04 is recommended.
The NLX2GU04 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
Features
•Designed for 1.65 V to 5.5 V VCC Operation
•Unbuffered for Crystal Oscillator and Analog Applications
•16 mA Balanced Output Source and Sink Capability
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input and Output Pins
•Ultra−Small Packages
•These are Pb−Free Devices
IN A2 OUT Y2
1
OUT Y2
IN A1
GND
OUT Y1
IN A2
1
2
3
5
4
Figure 1. Pinout (Top View)
Figure 2. Logic Symbol
6
VCC
IN A1 OUT Y2
1
PIN ASSIGNMENT
1
2
3IN A2
IN A1
GND
4
5V
CC
OUT Y2
FUNCTION TABLE
L
H
AY
H
L6 OUT Y1
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See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
L = Device Marking
M = Date Code
1
1
1
ULLGA6
1.0 x 1.0
CASE 613AD
ULLGA6
1.2 x 1.0
CASE 613AE
ULLGA6
1.45 x 1.0
CASE 613AF
MARKING
DIAGRAMS
L
M
L
M
L
M
UDFN6
1.2 x 1.0
CASE 517AA
UDFN6
1.45 x 1.0
CASE 517AQ
UDFN6
1.0 x 1.0
CASE 517BX
1
X M
1
X M
1
X M
NLX2GU04
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage −0.5 to +7.0 V
VIN DC Input Voltage −0.5 to +7.0 V
VOUT DC Output Voltage −0.5 to +7.0 V
IIK DC Input Diode Current VIN < GND −50 mA
IOK DC Output Diode Current VOUT < GND −50 mA
IODC Output Source/Sink Current ±50 mA
ICC DC Supply Current Per Supply Pin ±100 mA
IGND DC Ground Current per Ground Pin ±100 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias 150 °C
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
ILATCHUP Latchup Performance Above VCC and Below GND at 125 °C (Note 5) ±500 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/UESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V
VIN Digital Input Voltage 0 5.5 V
VOUT Output Voltage 0 5.5 V
TAOperating Free−Air Temperature −55 +125 °C
Dt/DVInput Transition Rise or Fall Rate VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
0
0
100
20
ns/V
NLX2GU04
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Conditions VCC (V)
TA = 25 5C TA = +855C
TA = −555C to
+1255C
Unit
Min Typ Max Min Max Min Max
VIH Low−Level
Input
Voltage
1.65
2.3 to 5.5
0.85 x
VCC
0.80 x
VCC
0.85 x
VCC
0.80 x
VCC
0.85 x
VCC
0.80 x
VCC
V
VIL Low−Level
Input
Voltage
1.65
2.3 to 5.5
0.15 x
VCC
0.20 x
VCC
0.15 x
VCC
0.20 x
VCC
0.15 x
VCC
0.20 x
VCC
V
VOH High−
Level
Output
Voltage
VIN = VIH or VIL
IOH = −100 mA
1.65 to
5.5
VCC −
0.1
VCC VCC −
0.1
VCC −
0.1
V
VIN = VIH or VIL
IOH = −3 mA
IOH = −4 mA
IOH = −6 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.52
2.1
2.3
2.6
2.5
4.0
1.29
1.9
2.2
2.4
2.3
3.8
1.29
1.9
2.2
2.4
2.3
3.8
VOL Low−Level
Output
Voltage
VIN = VIH or VIL
IOL = 50 mA
1.65 to
5.5
0.1 0.1 0.1 V
VIN = VIH or VIL
IOH = 3 mA
IOH = 4 mA
IOH = 6 mA
IOH = 8 mA
IOH = 12 mA
IOH = 16 mA
1.65
2.3
2.7
3.0
3.0
4.5
0.08
0.12
0.2
0.24
0.36
0.31
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
IIN Input
Leakage
Current
0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA
IOFF Power−Off
Output
Leakage
Current
VOUT = 5.5 V 0 1.0 10 10 mA
ICC Quiescent
Supply
Current
0 v VIN v VCC 5.5 1.0 10 10 mA
NLX2GU04
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4
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol Parameter
VCC
(V)
Test
Condition
TA = 25 5C
TA = −555C
to +1255C
Unit
Min Typ Max Min Max
tPLH,
tPHL
Propagation Delay,
Input A to Output Y
1.65 to 1.95 RL = 1 MW,
CL = 15 pF
1.5 1.8 5.5 1.5 11 ns
2.3 to 2.7 RL = 1 MW,
CL = 15 pF
1.2 3.3 5.7 1.2 6.3
3.0 to 3.6 RL = 1 MW,
CL = 15 pF
0.8 2.7 4.1 0.8 4.5
RL = 500 W,
CL = 50 pF
1.2 4.0 6.4 1.2 7.0
4.5 to 5.5 RL = 1 MW,
CL = 15 pF
0.5 2.2 3.3 0.5 3.6
RL = 500 W,
CL = 50 pF
0.8 3.4 5.6 0.8 6.2
CIN Input Capacitance 5.5 VIN = 0 V or
VCC
7 pF
COUT Output Capacitance 5.5 VIN = 0 V or
VCC
8 pF
CPD Power Dissipation Capacitance
(Note 6)
5.5 10 MHz
VIN = 0 V or
VCC
25 pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
VCC
GND
50%
50% VCC
A or B
Y
tPHL
tPLH
Figure 3. Switching Waveforms
Figure 4. Test Circuit
PULSE
GENERATOR
RT
DUT
VCC
RL
CL
RT = ZOUT of pulse generator (typically 50 W)
NLX2GU04
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5
ORDERING INFORMATION
Device Package Shipping†
NLX2GU04AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04MUTCG UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04AMUTCG UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2GU04AMUTCG UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLX2GU04
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6
PACKAGE DIMENSIONS
UDFN6 1.2x1.0, 0.4P
CASE 517AA
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42 6X
1.07
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉ
ÉÉÉ
ÉÉÉ
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
NLX2GU04
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7
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
b0.20 0.30
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.30 0.40
L1 −−− 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
ÉÉ
ÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DETAIL A
NLX2GU04
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8
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
ÉÉÉ
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.12 0.22
D1.00 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
L1
13
46
M
MDIMENSIONS: MILLIMETERS
0.22
5X
0.48 6X
1.18
0.53 PITCH
0.35
1
PKG
OUTLINE
NLX2GU04
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9
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.12 0.22
D1.00 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
5X
0.48 6X
1.18
0.53 PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLX2GU04
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10
PACKAGE DIMENSIONS
ULLGA6 1.2x1.0, 0.4P
CASE 613AE
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉ
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.20 BSC
E1.00 BSC
e0.40 BSC
L0.25 0.35
L1 0.35 0.45
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
5X
0.49 6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLX2GU04
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11
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉ
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
13
46
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
5X
0.49 6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NLX2GU04/D
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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