SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 * * * * DW OR NT PACKAGE (TOP VIEW) Functionally Equivalent to AM29861 and AM29862 Choice of True or Inverting Logic Power-Up High-Impedance State Package Options include Plastic Small Outline Packages, Plastic Chip Carriers, and Standard Plastic DIPs GBA A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 GND description These 10-bit bus transceivers are designed for asynchronous two-way communication between data buses. The control function implementation allows for maximum flexibility in timing. These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic levels at the enable inputs (GBA and GAB). The SN74' family is characterized for operation from 0C to 70C. FUNCTION TABLE INPUTS OPERATION GAB GBA ALS29861 L H A to B ALS29862 A to B H L B to A B to A H H Isolation Isolation L L Latch A and B Latch A and B (A = B) (A = B) 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 GAB A2 A1 GBA NC VCC B1 B2 FN PACKAGE (TOP VIEW) A3 A4 A5 NC A6 A7 A8 5 4 3 2 1 28 27 26 25 6 24 7 23 8 22 9 21 10 20 11 19 12 13 14 15 16 17 18 B3 B4 B5 NC B6 B7 B8 A9 A10 GND NC GAB B10 B9 The enable inputs can be used to disable the device so that the buses are effectively isolated. 1 NC - No internal connection Copyright 1988, Texas Instruments Incorporated !"#$%&'#! ( )*$$+!' &( #" ,*-.)&'#! /&'+0 $#/*)'( )#!"#$% '# (,+)")&'#!( ,+$ '1+ '+$%( #" +2&( !('$*%+!'( ('&!/&$/ 3&$$&!'40 $#/*)'#! ,$#)+((!5 /#+( !#' !+)+((&$.4 !).*/+ '+('!5 #" &.. ,&$&%+'+$(0 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 logic symbols 'ALS29861 GBA GAB A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 1 13 GBA EN 1 GAB EN 2 2 23 1 3 'ALS29862 B1 A1 2 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 B2 A2 B3 A3 B4 A4 B5 A5 B6 A6 B7 A7 B8 A8 B9 A9 B10 A10 1 13 POST OFFICE BOX 655303 EN 2 2 23 1 3 22 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 * DALLAS, TEXAS 75265 B1 2 4 These symbols are in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for DW and NT packages. 2 EN 1 B2 B3 B4 B5 B6 B7 B8 B9 B10 SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 logic diagrams 'ALS29861 GAB A1 A2 A3 A4 A5 'ALS29862 13 1 2 23 3 22 4 21 5 20 6 19 7 18 A6 A7 A8 A9 A10 8 17 9 16 10 15 11 GBA GAB B1 A1 B2 A2 B3 A3 B4 A4 B5 A5 B6 A6 B7 A7 B8 A8 B9 A9 14 B10 13 1 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 A10 GBA B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 Pin numbers shown are for DW and NT packages. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage: All inputs and I/O ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C recommended operating conditions VCC VIH MIN NOM MAX UNIT Supply voltage 4.75 5 5.25 V High-level input Voltage 2 V VIL IOH IOL Low-level input Voltage 0.8 V High-level output current -24 mA Low-level output current 48 mA TA Operating free-air temperature 70 C 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL II TEST CONDITIONS VCC = 4.75 V, VCC = 4.75 V, VCC = 4.75 V, VCC = 4.75 V, II = - 18 mA IOH = - 15 mA IOH = - 24 mA VCC = 5.25 V, IOL = 48 mA VI = 5.5 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VO = 0 V MIN TYP A or B ports A or B ports IOS 'ALS29861 ICC 'ALS29862 V V 0.35 0.5 V 0.1 mA 20 20 A A -0.1 VCC = 5.25 V -0.1 -75 -250 40 65 40 65 All typical values are at VCC = 5 V, TA = 25C For I/O ports, the parameters IIH and IIL include the off-state output current. Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second. 4 -1.2 2 Control inputs IIL UNIT 2.4 Control inputs IIH MAX POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 mA mA mA SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 SN74ALS29861 switching characteristics PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ FROM (INPUT) TO (OUTPUT) TEST CONDITIONS See Figure 1 VCC = 5 V, TA = 25C MIN CL = 300 pF A or B B or A CL = 50 pF GAB or GBA GAB or GBA CL = 300 pF A or B CL = 50 pF CL = 50 pF A or B CL = 5 pF TYP VCC = 4.75 V to 5.25 V, TA = 0C to 70C MAX MIN UNIT MAX 8 11 15 11 14 15 4.8 6 8 5.2 6.2 8 11 17 20 17 21 23 6.5 12 15 9.5 12 15 11.2 16 17 4.5 9 12 3.5 8 9 3.5 8 9 ns ns ns SN74ALS29862 switching characteristics PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPZH tPZL tPHZ tPLZ tPHZ tPLZ FROM (INPUT) TO (OUTPUT) TEST CONDITIONS See Figure 1 CL = 300 pF A or B B or A CL = 50 pF GAB or GBA GAB or GBA CL = 300 pF A or B CL = 50 pF CL = 50 pF A or B CL = 5 pF POST OFFICE BOX 655303 VCC = 5 V, TA = 25C MIN TYP VCC = 4.75 V to 5.25 V, TA = 0C to 70C MAX MIN 7.3 10 14 10.5 12.9 14 4 5.2 7 4.9 5.9 7.5 11 17 20 17 21 23 6.5 12 15 9.5 12 15 11.2 16 17 4.5 9 12 3.5 8 9 3.5 8 9 * DALLAS, TEXAS 75265 UNIT MAX ns ns ns 5 SDAS097B - D2915, JANUARY 1986 - REVISED AUGUST 1988 PARAMETER MEASUREMENT INFORMATION SWITCH POSITION TABLE VCC Test Point S1 From Output Under Test 180 CL (see Note A) All Diodes 1N916 or 1N3064 R1 1 k TEST S1 S2 tPLH tPHL tPZH tPZL Closed Closed Open Closed Closed Closed Closed Open tPHZ tPLZ Closed Closed Closed Closed RL S2 LOAD CIRCUIT 3V Timing Input High-Level Input 1.5 V 0V 3V 1.5 V 0V th tsu 1.5 V tw 3V Data Input 1.5 V 3V 1.5 V Low-Level Input 0V 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS PULSE DURATIONS VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 3V 1.5 V Output Control 0V 1.5 V 0V tPHL tPLH tPZL VOH In-Phase Output 1.5 V 1.5 V 1.5 V tPLZ VOL tPLH tPHL Out-of-Phase Output Waveform 1 (see Note B) VOH 1.5 V 1.5 V 1.5 V VOL tPZH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPHZ 4.5 V 1.5 V VOL 0.5 V VOH Waveform 2 (see Note B) 1.5 V 1.5 V 0.5 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. Figure 1 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74ALS29861DW OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861DWR OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861DWR OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861NT OBSOLETE PDIP NT 24 TBD Call TI Call TI SN74ALS29861NT OBSOLETE PDIP NT 24 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN74ALS29861DW OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861DWR OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861DWR OBSOLETE SOIC DW 24 TBD Call TI Call TI SN74ALS29861NT OBSOLETE PDIP NT 24 TBD Call TI Call TI SN74ALS29861NT OBSOLETE PDIP NT 24 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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