MC14043BDR2 - ON Semiconductor - Datasheet.Directory

June, 2011 − Rev. 7

1Publication Order Number:

MC14043B/D

MC14043B, MC14044B

CMOS MSI

Quad R−S Latches

The MC14043B and MC14044B quad R−S latches are constructed

with MOS P−Channel and N−Channel enhancement mode devices in a

single monolithic structure. Each latch has an independent Q output

and set and reset inputs. The Q outputs are gated through three−state

buffers having a common enable input. The outputs are enabled with a

logical “1” or high on the enable input; a logical “0” or low

disconnects the latch from the Q outputs, resulting in an open circuit at

the Q outputs.

Features

•Double Diode Input Protection

•Three−State Outputs with Common Enable

•Outputs Capable of Driving Two Low−power TTL Loads or One

Low−Power Schottky TTL Load Over the Rated Temperature

Range

•Supply Voltage Range = 3.0 Vdc to 18 Vdc

•These Devices are Pb−Free and are RoHS Compliant

MAXIMUM RATINGS (Voltages Referenced to VSS)

Symbol Parameter Value Unit

VDD DC Supply Voltage Range −0.5 to +18.0 V

Vin, Vout Input or Output Voltage Range

(DC or Transient)

−0.5 to VDD + 0.5 V

Iin, Iout Input or Output Current

(DC or Transient) per Pin

±10 mA

PDPower Dissipation, per Package

(Note 1)

500 mW

TAAmbient Temperature Range −55 to +125 °C

Tstg Storage Temperature Range −65 to +150 °C

TLLead Temperature

(8−Second Soldering)

260 °C

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. Temperature Derating:

Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C

This device contains protection circuitry to guard against damage due to high

static voltages or electric fields. However, precautions must be taken to avoid

applications of any voltage higher than maximum rated voltages to this

high−impedance circuit. For proper operation, Vin and Vout should be constrained

to the range VSS v (Vin or Vout) v VDD.

Unused inputs must always be tied to an appropriate logic voltage level

(e.g., either VSS or VDD). Unused outputs must be left open.

http://onsemi.com

MARKING

DIAGRAMS

PDIP−16

P SUFFIX

CASE 648

MC140xxBCP

AWLYYWWG

SOIC−16

D SUFFIX

CASE 751B

140xxBG

AWLYWW

xx = Specific Device Code

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G = Pb−Free Indicator

SOEIAJ−16

F SUFFIX

CASE 966

MC14043B

ALYWG

See detailed ordering and shipping information in the package

dimensions section on page 5 of this data sheet.

ORDERING INFORMATION

16

1

16

1

16

MC14043B, MC14044B

http://onsemi.com

2

MC14043B

TRUTH TABLE

X = Don’t Care

MC14044B

SRE Q

High

Impedance

XX0

No Change

0

1

0

1

0

1

0

1

TRUTH TABLE

X = Don’t Care

S R EQ

High

Impedance

XX0

0

1

0

No Change

0

1

0

1

0

1

ENABLE

R3

S3

R2

S2

R1

S1

R0

S0 4

3

6

7

12

11

14

15

5

Q3

Q2

Q1

Q0

2

9

10

1

ENABLE

S3

R3

S2

R2

S1

R1

S0

R0 4

3

6

7

12

11

14

15

5

Q3

Q2

Q1

Q0

13

9

10

1

VDD = PIN 16

VSS = PIN 8

NC = PIN 2

VDD = PIN 16

VSS = PIN 8

NC = PIN 13

PIN ASSIGNMENT

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

S2

NC

S3

R3

VDD

Q1

Q2

R2

S0

R0

Q0

Q3

VSS

R1

S1

E

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

R2

Q0

R3

S3

VDD

Q1

Q2

S2

R0

S0

NC

Q3

VSS

S1

R1

E

NC = NO CONNECTION

MC14043B MC14044B

MC14043B, MC14044B

http://onsemi.com

3

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)

ÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎÎ

Symbol

ÎÎÎ

VDD

Vdc

ÎÎÎÎÎ

− 55_C

ÎÎÎÎÎÎÎÎÎ

25_C

ÎÎÎÎÎ

125_C

ÎÎÎ

Unit

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎÎ

Min

ÎÎÎ

Typ

(Note 2)

ÎÎÎÎ

Max

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎÎÎÎÎÎÎÎ

Output Voltage “0” Level

Vin = VDD or 0

“1” Level

Vin = 0 or VDD

ÎÎÎÎ

VOL

ÎÎÎ

5.0

10

15

ÎÎÎ

−

ÎÎÎ

0.05

ÎÎÎÎ

−

ÎÎÎ

0

ÎÎÎÎ

0.05

ÎÎÎ

−

ÎÎÎ

0.05

ÎÎÎ

Vdc

ÎÎÎÎ

VOH

ÎÎÎ

5.0

10

15

ÎÎÎ

4.95

9.95

14.95

ÎÎÎ

−

ÎÎÎÎ

4.95

9.95

14.95

ÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎ

4.95

9.95

14.95

ÎÎÎ

−

ÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎ

Input Voltage “0” Level

(VO = 4.5 or 0.5 Vdc)

(VO = 9.0 or 1.0 Vdc)

(VO = 13.5 or 1.5 Vdc)

“1” Level

(VO = 0.5 or 4.5 Vdc)

(VO = 1.0 or 9.0 Vdc)

(VO = 1.5 or 13.5 Vdc)

ÎÎÎÎ

VIL

ÎÎÎ

5.0

10

15

ÎÎÎ

−

ÎÎÎ

1.5

3.0

4.0

ÎÎÎÎ

−

ÎÎÎ

2.25

4.50

6.75

ÎÎÎÎ

1.5

3.0

4.0

ÎÎÎ

−

ÎÎÎ

1.5

3.0

4.0

ÎÎÎ

Vdc

ÎÎÎÎ

VIH

ÎÎÎ

5.0

10

15

ÎÎÎ

3.5

7.0

11

ÎÎÎ

−

ÎÎÎÎ

3.5

7.0

11

ÎÎÎ

2.75

5.50

8.25

ÎÎÎÎ

−

ÎÎÎ

3.5

7.0

11

ÎÎÎ

−

ÎÎÎ

Vdc

ÎÎÎÎÎÎÎÎÎÎ

Output Drive Current

(VOH = 2.5 Vdc) Source

(VOH = 4.6 Vdc)

(VOH = 9.5 Vdc)

(VOH = 13.5 Vdc)

(VOL = 0.4 Vdc) Sink

(VOL = 0.5 Vdc)

(VOL = 1.5 Vdc)

ÎÎÎÎ

IOH

ÎÎÎ

5.0

10

15

ÎÎÎ

– 3.0

– 0.64

– 1.6

– 4.2

ÎÎÎ

−

ÎÎÎÎ

– 2.4

– 0.51

– 1.3

– 3.4

ÎÎÎ

– 4.2

– 0.88

– 2.25

– 8.8

ÎÎÎÎ

−

ÎÎÎ

– 1.7

– 0.36

– 0.9

– 2.4

ÎÎÎ

−

ÎÎÎ

mAdc

ÎÎÎÎ

IOL

ÎÎÎ

5.0

10

15

ÎÎÎ

0.64

1.6

4.2

ÎÎÎ

−

ÎÎÎÎ

0.51

1.3

3.4

ÎÎÎ

0.88

2.25

8.8

ÎÎÎÎ

−

ÎÎÎ

0.36

0.9

2.4

ÎÎÎ

−

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎ

Input Current

ÎÎÎÎ

Iin

ÎÎÎ

15

ÎÎÎ

−

ÎÎÎ

±0.1

ÎÎÎÎ

−

ÎÎÎ

±0.00001

ÎÎÎÎ

±0.1

ÎÎÎ

−

ÎÎÎ

±1.0

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎ

Input Capacitance

(Vin = 0)

ÎÎÎÎ

Cin

ÎÎÎ

−

ÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

−

ÎÎÎ

5.0

ÎÎÎÎ

7.5

ÎÎÎ

−

ÎÎÎ

−

ÎÎÎ

pF

ÎÎÎÎÎÎÎÎÎÎ

Quiescent Current

(Per Package)

ÎÎÎÎ

IDD

ÎÎÎ

5.0

10

15

ÎÎÎ

−

ÎÎÎ

1.0

2.0

4.0

ÎÎÎÎ

−

ÎÎÎ

0.002

0.004

0.006

ÎÎÎÎ

1.0

2.0

4.0

ÎÎÎ

−

ÎÎÎ

30

60

120

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎ

Total Supply Current (Notes 3 & 4)

(Dynamic plus Quiescent,

Per Package)

(CL = 50 pF on all outputs all

buffers switching)

ÎÎÎÎ

IT

ÎÎÎ

5.0

10

15

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

IT = (0.58 mA/kHz) f + IDD

IT = (1.15 mA/kHz) f + IDD

IT = (1.73 mA/kHz) f + IDD

ÎÎÎ

mAdc

ÎÎÎÎÎÎÎÎÎÎ

Three−State Output Leakage

Current

ÎÎÎÎ

ITL

ÎÎÎ

15

ÎÎÎ

−

ÎÎÎ

± 0.1

ÎÎÎÎ

−

ÎÎÎ

± 0.0001

ÎÎÎÎ

± 0.1

ÎÎÎ

−

ÎÎÎ

± 3.0

ÎÎÎ

mAdc

2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

3. The formulas given are for the typical characteristics only at 25_C.

4. To calculate total supply current at loads other than 50 pF:

IT(CL) = IT(50 pF) + (CL − 50) Vfk

where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.004.

MC14043B, MC14044B

http://onsemi.com

4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎÎÎ

Symbol

ÎÎÎÎ

VDD

Vdc

ÎÎÎÎ

Min

ÎÎÎÎ

Typ

(Note 6)

ÎÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Rise Time

tTLH = (1.35 ns/pF) CL + 32.5 ns

tTLH = (0.60 ns/pF) CL + 20 ns

tTLH = (0.40 ns/pF) CL + 20 ns

ÎÎÎÎÎ

tTLH

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

100

50

40

ÎÎÎÎ

200

100

80

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Fall Time

tTHL = (1.35 ns/pF) CL + 32.5 ns

tTHL = (0.60 ns/pF) CL + 20 ns

tTHL = (0.40 ns/pF) CL + 20 ns

ÎÎÎÎÎ

tTHL

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

100

50

40

ÎÎÎÎ

200

100

80

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Propagation Delay Time

tPLH = (0.90 ns/pF) CL + 130 ns

tPLH = (0.36 ns/pF) CL + 57 ns

tPLH = (0.26 ns/pF) CL + 47 ns

ÎÎÎÎÎ

tPLH

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

175

75

60

ÎÎÎÎ

350

175

120

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

tPHL = (0.90 ns/pF) CL + 130 ns

tPHL = (0.90 ns/pF) CL + 57 ns

tPHL = (0.26 ns/pF) CL + 47 ns

ÎÎÎÎÎ

tPHL

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

175

75

60

ÎÎÎÎ

350

175

120

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Set, Set Pulse Width

ÎÎÎÎÎ

tW

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

200

100

70

ÎÎÎÎ

80

40

30

ÎÎÎÎ

−

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Reset, Reset Pulse Width

ÎÎÎÎÎ

tW

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

200

100

70

ÎÎÎÎ

80

40

30

ÎÎÎÎ

−

ÎÎÎ

ns

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Three−State Enable/Disable Delay

ÎÎÎÎÎ

tPLZ,

tPHZ,

tPZL,

tPZH

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

150

80

55

ÎÎÎÎ

300

160

110

ÎÎÎ

ns

5. The formulas given are for the typical characteristics only at 25_C.

6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

AC WAVEFORMS

MC14043B MC14044B

20 ns 20 ns

90%

10%

RESET

SET

Q

tPHL tPLH

20 ns 20 ns

50%

90%

50%

10%

tTHL tTLH

90%

50%

10%

VDD

VSS

VDD

VSS

VOH

VOL

RESET

SET

Q

20 ns 20 ns

90%

10%

50%

20 ns 20 ns

90%

10%

50%

tTLH tTHL

50% 10%

90%

tPLH tPHL

VDD

VSS

VDD

VSS

VOH

VOL

MC14043B, MC14044B

http://onsemi.com

5

THREE−STATE ENABLE/DISABLE DELAYS

Set, Reset, Enable, and Switch Conditions for 3−State Tests

Test Enable S1 S2 Q

MC14043B MC14044B

S R S R

tPZH Open Closed A VDD VSS VSS VDD

tPZL Closed Open B VSS VDD VDD VSS

tPHZ Open Closed A VDD VSS VSS VDD

tPLZ Closed Open B VSS VDD VDD VSS

ENABLE

QA

QB

50%

tPZH

10%

tPZL

tPHZ

tPLZ

10%

90%

VDD

VSS

VDD

VOL

VOH

VSS

ORDERING INFORMATION

Device Package Shipping†

MC14043BCPG PDIP−16

(Pb−Free)

500 Units / Rail

MC14043BDG SOIC−16

(Pb−Free)

48 Units / Rail

MC14043BDR2G SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

MC14043BFELG SOEIAJ−16 2000 Units / Tape & Reel

MC14044BCPG PDIP−16

(Pb−Free)

500 Units / Rail

MC14044BDG SOIC−16

(Pb−Free)

48 Units / Rail

MC14044BDR2G SOIC−16

(Pb−Free)

2500 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

TO

OUTPUT

UNDER

TEST

VDD

S1

S2

1 k

CL

50 pF

VSS

MC14043B, MC14044B

http://onsemi.com

6

PACKAGE DIMENSIONS

PDIP−16

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648−08

ISSUE T

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS

WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE

MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

−A−

B

FC

S

H

GD

J

L

M

16 PL

SEATING

18

916

K

PLANE

−T−

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.740 0.770 18.80 19.55

B0.250 0.270 6.35 6.85

C0.145 0.175 3.69 4.44

D0.015 0.021 0.39 0.53

F0.040 0.70 1.02 1.77

G0.100 BSC 2.54 BSC

H0.050 BSC 1.27 BSC

J0.008 0.015 0.21 0.38

K0.110 0.130 2.80 3.30

L0.295 0.305 7.50 7.74

M0 10 0 10

S0.020 0.040 0.51 1.01

____

SOEIAJ−16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966−01

ISSUE A

HE

A1

DIM MIN MAX MIN MAX

INCHES

--- 2.05 --- 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.10 0.20 0.007 0.011

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0

0.70 0.90 0.028 0.035

--- 0.78 --- 0.031

A1

HE

Q1

LE

_10 _0

_10 _

LE

Q1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005) 0.10 (0.004)

1

16 9

8

D

Z

E

A

b

c

D

E

e

L

M

Z

MC14043B, MC14044B

http://onsemi.com

7

PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B−05

ISSUE K NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

18

16 9

SEATING

PLANE

F

J

M

RX 45_

G

8 PLP

−B−

−A−

M

0.25 (0.010) B S

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010) A S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

6.40

16X

0.58

16X 1.12

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

16

89

8X

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MC14043B/D

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative