TLV2630IDBVRG4 - Texas Instruments

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SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

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FEATURES

DRail-To-Rail Output

DVICR Includes Ground

DGain-Bandwidth Product ...9 MHz

DSupply Current ...730 µA/Channel

DSingle, Duals, and Quad Versions

DUltralow Power Down Mode

IDD(SHDN) = 4 µA/Channel

DSpecified Temperature Range

−40°C to 125°C...Industrial Grade

DSupply Voltage Range ...2.7 V to 5.5 V

DUltrasmall Packaging

5 or 6 Pin SOT-23 (TLV2630/1)

8 or 10 Pin MSOP (TLV2632/3)

DUniversal Op-Amp EVM (See SLOU060

for More Information)

Operational Amplifier

−

DESCRIPTION

The TLV263x single supply operational amplifiers

provide rail-to-rail output with an input range that

includes ground. The TLV263x takes the minimum

operating supply voltage down to 2.7 V over the

extended industrial temperature range (−40°C to

125°C) while adding the rail-to-rail output swing feature.

The TLV263x also provides a 9 MHz gain-bandwidth

product from only 730 µA of supply current. The

maximum recommended supply voltage is 5.5 V, which,

when coupled with a 2.7-V minimum, allows the devices

to be operated from lithium ion cells.

The combination of wide bandwidth, low noise, and low

distortion makes it ideal for high speed and high

resolution data converter applications. The ground

input range allows it to directly interface to ground rail

referred systems.

All members are available in PDIP and SOIC with the

singles in the small SOT-23 package, duals in the

MSOP, and quads in the TSSOP package.

The 2.7-V operation makes it compatible with Li-Ion

powered systems and the operating supply voltage

range of many micro-power microcontrollers available

today including TI’s MSP430.

AMPLIFIER SELECTION TABLE

DEVICE VDD

[V] IDD/ch

[µA] VICR

[V] GBW

[MHz] SLEW RATE

[V/µs] Vn, 1 kHz

[nV/√Hz]IO

[mA]

OPAx343 2.5−5.5 850 −0.3 to VDD + 0.3 5.5 6 25 40

OPAx743 3.5−12 1100 −0.1 to VDD + 0.1 7 10 30 20

TLV278x 1.8−3.6 650 −0.2 to VDD + 0.2 8 5 9 10

TLV263x 2.7−5.5 730 GND to VDD − 1 9 9.5 50 28

TLV262x 2.7−5.5 750 1 V to VDD + 0.2 11 10 27 28

OPAx353 2.7−5.5 8000 −0.1 to VDD + 0.1 44 22 7 40

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

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PACKAGE/ORDERING INFORMATION(1)

PRODUCT PACKAGE PACKAGE

CODE SYMBOL SPECIFIED

TEMPERATURE RANGE ORDER NUMBER TRANSPORT MEDIA

Single with Shutdown

TLV2630ID SOIC−8 D — TLV2630ID

TLV2630IDR Tube

Tape and Reel

TLV2630IDBV SOT−23−6 DBV VAYI −40°C to 125°CTLV2630IDBVR†

TLV2630IDBVT‡Tape and Reel

TLV2630IP DIP−8 P — TLV2630IP Tube

Single without Shutdown

TLV2631ID SOIC−8 D — TLV2631ID

TLV2631IDR Tube

Tape and Reel

TLV2631IDBV SOT−23−5 DBV VAZI −40°C to 125°CTLV2631IDBVR†

TLV2631IDBVT‡Tape and Reel

TLV2631IP DIP−8 P — TLV2631IP Tube

Dual without Shutdown

TLV2632ID SOIC−8 D — TLV2632ID

TLV2632IDR Tube

Tape and Reel

TLV2632IDGK MSOP−8 DGK AKG −40°C to 125°CTLV2632IDGK

TLV2632IDGKR Tube

Tape and Reel

TLV2632IP DIP−8 P — TLV2632IP Tube

Dual with Shutdown

TLV2633ID SOIC−14 D — TLV2633ID

TLV2633IDR Tube

Tape and Reel

TLV2633IDGS MSOP−10 DGS AKK −40°C to 125°CTLV2633IDGS

TLV2633IDGSR Tube

Tape and Reel

TLV2633IN DIP−14 N — TLV2633IN Tube

Quad without Shutdown

TLV2634ID SOIC−14 D — TLV2634ID

TLV2634IDR Tube

Tape and Reel

TLV2634IN DIP−14 N — −40°C to 125°CTLV2634IN Tube

TLV2634IPW TSSOP−14 PW —

−40 C to 125 C

TLV2634IPW

TLV2634IPWR Tube

Tape and Reel

Quad with Shutdown

TLV2635ID SOIC−16 D — TLV2635ID

TLV2635IDR Tube

Tape and Reel

TLV2635IN DIP−16 N — −40°C to 125°CTLV2635IN Tube

TLV2635IPW TSSOP−16 PW —

−40 C to 125 C

TLV2635IPW

TLV2635IPWR Tube

Tape and Reel

†The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel).

‡The T Suffix denotes smaller quantities (250 pieces per mini-reel).

1. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

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SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†

Supply voltage, VDD (see Note 1) 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Differential input voltage, VID ±VDD

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI (see Note 1) GND to VDD − 1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input current, II (any input) ± 10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output current, IO±40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating free-air temperature range, TA: I-suffix −40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum junction temperature, TJ150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 2: All voltage values, except differential voltages, are with respect to GND.

recommended operating conditions

MIN MAX UNIT

Supply voltage, VDD

Single supply 2.7 5.5

Supply voltage, VDD Split supply ±1.35 ±2.75 V

Common-mode input voltage range, VICR GND VDD−1 V

Operating free-air temperature, TAI-suffix −40 125 °C

Shutdown on/off voltage level‡

VIL 0.4

Shutdown on/off voltage level‡

VIH 2

‡Relative to GND.

electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)

dc performance

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

25°C 250 3500

VIO

Input offset voltage

Full range 4500 µV

VIO Input offset voltage V

= V

/2,

V = V /2

TLV2634/5

25°C 250 4200

VIC = VDD/2,

VO = VDD/2 TLV2634/5 Full range 5200 µV

αVIO Temperature coefficient of input offset

voltage

ODD

25°C 3 µV/°C

VDD = 2.7 V

25°C 76 100

CMRR

Common-mode rejection ratio

VIC = GND to VDD−1 V

= 2.7 V

Full range 67

CMRR

Common-mode rejection ratio

= GND to V

−1 V

VDD = 5 V

25°C 77 100

= 5 V

Full range 74

AVD

Large-signal differential voltage

RL = 2 kΩ, VO(PP) = VDD−1 V

25°C 90 100

AVD

Large-signal differential voltage

amplification RL = 2 kΩ, VO(PP) = VDD−1 V Full range 82 dB

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electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)

(continued)

input characteristics

PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT

IIO

Input offset current

25°C 1 50

IIO Input offset current

VIC = VDD/2,

Full range 100

IIB

Input bias current

VIC = VDD/2,

VO = VDD/2 25°C 1 50 pA

IIB Input bias current

VO = VDD/2

Full range 200

ri(d) Differential input resistance 25°C 1000 GΩ

Ci(c) Common-mode input capacitance f = 1 kHz 25°C 12 pF

†Full range is −40°C to 125°C for the I-suffix.

output characteristics

PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT

VDD = 2.7 V

25°C 2.6 2.67

VIC = VDD/2, IOH = −1 mA

VDD = 2.7 V Full range 2.55

VIC = VDD/2, IOH = −1 mA

VDD = 5 V

25°C 4.92 4.98

VOH

High-level output voltage

VDD = 5 V Full range 4.9

VOH High-level output voltage

VDD = 2.7 V

25°C 2.25 2.43 V

VIC = VDD/2, IOH = −10 mA

VDD = 2.7 V Full range 2.15

VIC = VDD/2, IOH = −10 mA

VDD = 5 V

25°C 4.7 4.8

VDD = 5 V Full range 4.65

VDD = 2.7 V

25°C 0.03 0.1

VIC = VDD/2, IOL = 1 mA

VDD = 2.7 V Full range 0.15

VIC = VDD/2, IOL = 1 mA

VDD = 5 V

25°C 0.025 0.08

VOL

Low-level output voltage

VDD = 5 V Full range 0.1

VOL Low-level output voltage

VDD = 2.7 V

25°C 0.26 0.45 mV

VIC = VDD/2, IOL = 10 mA

VDD = 2.7 V Full range 0.47

VIC = VDD/2, IOL = 10 mA

VDD = 5 V

25°C 0.2 0.3

VDD = 5 V Full range 0.35

VDD = 2.7 V,

Sourcing 14

Output current

VDD = 2.7 V,

VO = 0.5 V from rail Sinking

25°C

IOOutput current

VDD = 5 V,

Sourcing 25°C28 mA

VDD = 5 V,

VO = 0.5 V from rail Sinking 28

Sourcing

VDD = 2.7 V 50

IOS

Short-circuit output current

Sourcing VDD = 5 V

25°C

IOS Short-circuit output current

Sinking

VDD = 2.7 V 25°C50 mA

Sinking VDD = 5 V 95

†Full range is −40°C to 125°C for the I-suffix.

power supply

PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT

IDD

Supply current (per channel)

VO = VDD/2,

SHDN = VDD

25°C 730 1000

IDD Supply current (per channel) VO = VDD/2,

SHDN = V

DD Full range 1350 µA

PSRR

Supply voltage rejection ratio

VDD = 2.7 V to 5.5 V,

No load

25°C 70 90

PSRR

Supply voltage rejection ratio

(∆VDD /∆VIO)

VDD = 2.7 V to 5.5 V,

VIC = VDD/2 No load Full range 65 dB

†Full range is −40°C to 125°C for the I-suffix.

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electrical characteristics at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted)

(continued)

dynamic performance

PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT

GBWP Gain-bandwidth product RL = 2 kΩ, CL = 10 pF, f = 10 kHz 9 MHz

SR+

Positive slew rate at unity gain

RL = 2 kΩCL = 50 pF

VDD = 2.7 V,

VO(PP) = 1.7 V 6

V/ s

SR+ Positive slew rate at unity gain RL = 2 kΩ, CL = 50 pF VDD = 5 V,

VO(PP) = 3.5 V 6V/µs

SR−

Negative slew rate at unity gain

RL = 2 kΩCL = 50 pF

VDD = 2.7 V,

VO(PP) = 1.7 V 25°C10 V/µs

SR− Negative slew rate at unity gain RL = 2 kΩ, CL = 50 pF VDD = 5 V,

VO(PP) = 3.5 V 9.5 V/µs

φmPhase margin

RL = 2 kΩ,

CL = 10 pF

50 °

Gain margin

= 2 k

Ω

= 10 pF

20 dB

†Full range is −40°C to 125°C for the I-suffix.

noise/distortion performance

PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT

VO(PP) = VDD/2,

AV = 1 0.003%

THD + N Total harmonic distortion plus noise VO(PP) = VDD/2,

RL = 2 kΩ, f = 10 kHz

AV = 10 0.02%

THD + N

Total harmonic distortion plus noise

RL = 2 kΩ, f = 10 kHz

AV = 100

25°C

0.095%

Equivalent input noise voltage

f = 1 kHz 25°C50

nV/√Hz

VnEquivalent input noise voltage f = 10 kHz 30

nV/√Hz

InEquivalent input noise current f = 1 kHz 0.9 fA/√Hz

shutdown characteristics

PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT

IDD(SHDN)

Supply current, per channel in shutdown

SHDN = 0.4 V

25°C 4 17

IDD(SHDN

)

Supply current, per channel in shutdown

mode (TLV2630, TLV2633, TLV2635)

SHDN = 0.4 V

Full range 19 µA

t(on)

Amplifier turnon time‡

RL = 2 kΩ

VDD = 2.7 V 4.5

t(on)

Amplifier turnon time‡

RL = 2 kΩ,

CL = 10 pF

VDD = 5 V 25°C1.5 µs

t(off) Amplifier turnoff time‡

CL = 10 pF

25 C

200 ns

†Full range is −40°C to 125°C for the I-suffix.

‡Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current

has reached half its final value.

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DISSIPATION RATING TABLE

PACKAGE

≤

TA = 125

PACKAGE

ΘJC

(°C/W)

ΘJA

(°C/W)

TA ≤ 25 C

POWER RATING

TA = 125 C

POWER RATING

D (8) 38.3 176 710 mW 142 mW

D (14) 26.9 122.3 1022 mW 204.4 mW

D (16) 25.7 114.7 1090 mW 218 mW

DBV (5) 55 324.1 385 mW 77.1 mW

DBV (6) 55 294.3 425 mW 85 mW

DGK (8) 54.2 259.9 481 mW 96.1 mW

DGS (10) 54.1 259.7 485 mW 97 mW

N (14, 16) 32 78 1600 mW 320.5 mW

P (8) 41 104 1200 mW 240.4 mW

PW (14) 29.3 173.6 720 mW 144 mW

PW (16) 28.7 161.4 774 mW 154.9 mW

TYPICAL CHARACTERISTICS

Table of Graphs

FIGURE

VIO Input offset voltage vs Common-mode input voltage 1, 2

CMRR Common-mode rejection ratio vs Frequency 3

VOH High-level output voltage vs High-level output current 4, 6

VOL Low-level output voltage vs Low-level output current 5, 7

IDD Supply current vs Supply voltage 8

IDD Supply current vs Free-air temperature 9

PSRR Power supply rejection ratio vs Frequency 10

AVD Differential voltage amplification & phase vs Frequency 11

Gain-bandwidth product

vs Supply voltage 12

Gain-bandwidth product vs Free-air temperature 13

Slew rate

vs Supply voltage 14

SR Slew rate vs Free-air temperature 15, 16

φmPhase margin vs Load capacitance 17

VnEquivalent input noise voltage vs Frequency 18

Crosstalk vs Frequency 19

Voltage-follower large-signal pulse response 20

Voltage-follower small-signal pulse response 21

IDD(SHDN) Shutdown supply current vs Free-air temperature 22

IDD(SHDN) Shutdown supply current vs Supply voltage 23

IDD(SHDN) Shutdown supply current/output voltage vs Time 24

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SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

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TYPICAL CHARACTERISTICS

Figure 1

−200

200

400

600

800

1000

1200

−0.3 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1

INPUT OFFSET VOLTAGE

COMMON-MODE INPUT VOLTAGE

VDD = 2.7 V

TA = 25° C

VInput Offset Voltage −

−V

VICR − Common-Mode Input Voltage − V

2.4 2.7

Figure 2

−200

200

400

600

800

1000

1200

−0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5

INPUT OFFSET VOLTAGE

COMMON-MODE INPUT VOLTAGE

VDD = 5 V

TA = 25° C

VInput Offset Voltage −−Vµ

VICR − Common-Mode Input Voltage − V

Figure 3

100

110

120 VDD = 2.7 V and 5 V

TA = 25° C

COMMON-MODE REJECTION RATIO

FREQUENCY

f − Frequency − Hz

CMRR − Common-Mode Rejection Ratio − dB

10 1k 1M10k 100k100

Figure 4

0.0

0.3

0.6

0.9

1.2

1.5

1.8

2.1

2.4

2.7

0 5 10 15 20 25 30 35 40 45

VDD = 2.7 V

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

VOH − High-Level Output Voltage − V

IOH − High-Level Output Current − mA

TA = 25°C

TA = 0°C

TA = −40°C

TA = 125°C

TA = 70°C

Figure 5

0.0

0.3

0.6

0.9

1.2

1.5

1.8

2.1

2.4

2.7

0 5 10 15 20 25 30 35 40 45

VDD = 2.7 V

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

TA = 25°C

TA = 0°C

TA = −40°C

TA = 125°C

TA = 70°C

IOL − Low-Level Output Current − mA

V − Low-Level Output Voltage − V

Figure 6

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0 102030405060708090100

TA = 25°C

TA = 0°C

TA = −40°C

VDD = 5 V

HIGH-LEVEL OUTPUT VOLTAGE

HIGH-LEVEL OUTPUT CURRENT

VOH − High-Level Output Voltage − V

IOH − High-Level Output Current − mA

TA = 125°C

TA = 70°C

Figure 7

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0 102030405060708090100

VDD = 5 V

LOW-LEVEL OUTPUT VOLTAGE

LOW-LEVEL OUTPUT CURRENT

IOL − Low-Level Output Current − mA

V − Low-Level Output Voltage − V

TA = 125°C

TA = 70°C

TA = 25°C

TA = 0°C

TA = −40°C

Figure 8

100

200

300

400

500

600

700

800

900

1000

1100

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

AV= 1

VIC = VDD/2

SUPPLY CURRENT

SUPPLY VOLTAGE

VDD − Supply Voltage − V

I Supply Current − − A/chµ

TA = 125°C

TA = 70°C

TA = 25°C

TA = 0°C

TA = −40°C

Figure 9

100

200

300

400

500

600

700

800

900

1000

1100

−40 −25 −10 5 20 35 50 65 80 95 110 125

AV= 1

VIC = VDD/2

SUPPLY CURRENT

FREE-AIR TEMPERATURE

TA − Free-Air Temperature − °C

VDD = 5 V

VDD = 2.7 V

I Supply Current − − A/chµ

 

 

 

SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

8www.ti.com

TYPICAL CHARACTERISTICS

100 VDD = 2.7 V and 5 V

TA = 25° C

POWER SUPPLY REJECTION RATIO

FREQUENCY

f − Frequency − Hz

10 1k 10M10k 100k100

− Power Supply Rejection Ratio − dBPSRR

PSSR+

PSSR−

1M −10

100

1 k 10 k 100 k 1 M 10 M

−90

−60

−30

120

f − Frequency − Hz

DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE

FREQUENCY

− Differential Voltage Amplification − dBAVD

Gain

Phase

VDD = 2.7 V

RL= 2 kΩ

CL = 10 pF

TA = 25° C

Phase −°

Figure 10 Figure 11

Figure 12

2 2.5 3 3.5 4 4.5 5 5.5 6

GAIN-BANDWIDTH PRODUCT

SUPPLY VOLTAGE

Gain-Bandwidth Product − MHz

VDD − Supply Voltage − V

RL = 2 kΩ

CL = 10 pF

f = 10 kHz

Figure 13

−40 −25 −10 5 20 35 50 65 80 95 110125

GAIN-BANDWIDTH PRODUCT

FREE-AIR TEMPERATURE

TA − Free-Air Temperature − °C

Gain-Bandwidth Product − MHz

VDD = 2.7 and 5 V

RL = 2 kΩ

CL = 10 pF

f = 10 kHz

Figure 14

2.5 3 3.5 4 4.5 5 5.5 6

SR−

SR+

VDD − Supply Voltage − V

SR − Slew Rate − V/µs

AV = 1

RL = 2 kΩ

CL = 50 pF

V(step) = 1 Vpp

TA = 25° C

SLEW RATE

SUPPLY VOLTAGE

Figure 15

−40 −25 −10 5 20 35 50 65 80 95 110 125

VDD = 2.7 V

AV = 1

RL = 2 kΩ

CL = 50 pF

V(step) = 1 Vpp

SLEW RATE

FREE-AIR TEMPERATURE

TA − Free-Air Temperature − °C

SR − Slew Rate − V/µs

SR−

SR+

Figure 16

−40 −25 −10 5 20 35 50 65 80 95 110 125

SR−

SR+

SLEW RATE

FREE-AIR TEMPERATURE

TA − Free-Air Temperature − °C

SR − Slew Rate − V/µs

VDD = 5 V

AV = 1

V(step) = 1 Vpp

RL = 2 kΩ

CL = 50 pF

Figure 17

10 100 1 k

PHASE MARGIN

LOAD CAPACITANCE

CL − Load Capacitance − pF

φm− Phase Margin − °

VDD = 2.7 V and 5 V

RL = 2 kΩ

AV = 1

TA = 25°C

Rnull = 100 Ω

Rnull = 20 Ω

Rnull = 0 Ω

 

 

 

SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

www.ti.com

TYPICAL CHARACTERISTICS

Figure 18

100

150

200

250

300

350

400

450

500 VDD = 2.7 V and 5 V

TA = 25° C

f − Frequency − Hz

10 1k 100k10k100

EQUIVALENT INPUT NOISE VOLTAGE

FREQUENCY

nV/ Hz− Equivalent Input Noise Voltage −Vn

Figure 19

f − Frequency − Hz

10 1k 100k10k100

CROSSTALK

FREQUENCY

Crosstalk − dB

Shutdown Crosstalk

VDD = 2.7 V and 5 V

RL = 2 kΩ

CL = 10 pF

AV = 1

VO(PP) = VDD/2

TA = 25°C

All Channels

Crosstalk

−20

−40

−60

−80

−100

−120

−140

Figure 20

0123456

−2

−1

VOLTAGE-FOLLOWER LARGE-SIGNAL

PULSE RESPONSE

t − Time − µs

− Common-Mode Input Voltage − VVIC

− Output Voltage − VVO

VDD = 5 V

VIC = VDD/2

RL = 2 kΩ

CL = 10 pF

AV = 1

TA = 25°C

VIC

Figure 21

2.40

2.45

2.50

2.55

2.60

2.65

2.70

2.75

2.80

0 0.2 0.4 0.6 0.8 1 1.4

2.40

2.45

2.50

2.55

2.60

VOLTAGE-FOLLOWER SMALL-SIGNAL

PULSE RESPONSE

t − Time − µs

VDD = 5 V

VIC = 100 mV

RL = 2 kΩ

CL = 10 pF

AV = 1

TA = 25°C

VIC

− Output Voltage − VVO

− Common-Mode Input Voltage − VVIC

1.2

Figure 22

−40 −25−10 5 20 35 50 65 80 95 110 125

TA − Free-Air Temperature − °C

VDD = 5 V

VDD = 2.7 V

Shutdown = 0 V

AV = 1

VIC = VDD/2

VDD = 3.6 V

SHUTDOWN SUPPLY CURRENT

FREE-AIR TEMPERATURE

DD(SD)

I Shutdown Supply Current −− A/chµ

Figure 23

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

VDD − Supply Voltage − V

Shutdown = 0 V

AV = 1

VIC = VDD/2

SHUTDOWN SUPPLY CURRENT

SUPPLY VOLTAGE

DD(SD)

I Shutdown Supply Current −− A/chµ

TA = 125°C

TA = 70°C

TA = 25°C

TA = 0°C

TA = −40°C

 

 

 

SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

10 www.ti.com

TYPICAL CHARACTERISTICS

012345

SHUTDOWN SUPPLY CURRENT / OUTPUT VOLTAGE

TIME

678

SD − Shutdown Pulse − V

t − Time − µs

0.0

1.0

2.0

3.0

4.0

5.0

− Output Voltage − mVVO

0.0

0.5

1.0

1.5

2.0

2.5

1.0

0.5

0.0

1.5

IDD(SD)

DD(SD)

I Shutdown Supply Current −−Aµ

2.0

VDD = 5 V

AV = 1

RL = 2 kΩ

CL = 10 pF

VIC = VDD/2

TA = 25°C

Figure 24

 

 

 

SLOS362A − JUNE 2001 − REVISED JANUAR Y 2005

www.ti.com

TLV263x PACKAGE PINOUTS

(TOP VIEW)

OUT

GND

IN+

VDD

IN−

TLV2631

DBV PACKAGE

1OUT

1IN−

1IN+

GND

1SHDN

VDD

2OUT

2IN−

2IN+

2SHDN

(TOP VIEW)

OUT

GND

IN+

VDD

IN−

TLV2630

DBV PACKAGE

5SHDN

TLV2633

DGS PACKAGE

(TOP VIEW)

NC − No internal connection

IN−

IN+

GND

SHDN

VDD

OUT

TLV2630

D OR P PACKAGE

(TOP VIEW)

IN−

IN+

GND

VDD

OUT

TLV2631

D OR P PACKAGE

(TOP VIEW)

1OUT

1IN−

1IN+

GND

1SHDN

VDD

2OUT

2IN−

2IN+

2SHDN

(TOP VIEW)

TLV2633

D OR N PACKAGE

1OUT

1IN−

1IN+

VDD

2IN+

2IN−

2OUT

4OUT

4IN−

4IN+

GND

3IN+

3IN−

3OUT

(TOP VIEW)

TLV2634

D, N, OR PW PACKAGE

1OUT

1IN−

1IN+

VDD

2IN+

2IN−

2OUT

1/2SHDN

4OUT

4IN−

4IN+

GND

3IN+

3IN−

3OUT

3/4SHDN

(TOP VIEW)

TLV2635

D, N, OR PW PACKAGE

1OUT

1IN−

1IN+

GND

VDD

2OUT

2IN−

2IN+

TLV2632

D, DGK, OR P PACKAGE

(TOP VIEW)

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

TLV2630IDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2630IDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2631IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2631IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2631IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2631IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632ID ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632IDG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632IDR ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2632IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2633IDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2633IDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2634ID ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2634IDG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

TLV2634IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

TLV2634IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TLV2630IDBVR SOT-23 DBV 6 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3

TLV2631IDBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3

TLV2631IDBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3

TLV2632IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

TLV2632IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

TLV2633IDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

TLV2634IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TLV2630IDBVR SOT-23 DBV 6 3000 182.0 182.0 20.0

TLV2631IDBVR SOT-23 DBV 5 3000 182.0 182.0 20.0

TLV2631IDBVT SOT-23 DBV 5 250 182.0 182.0 20.0

TLV2632IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0

TLV2632IDR SOIC D 8 2500 340.5 338.1 20.6

TLV2633IDGSR MSOP DGS 10 2500 358.0 335.0 35.0

TLV2634IPWR TSSOP PW 14 2000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 2

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