HS3AB - HS3MB creat by ART 3.0AMPS High Efficient Surface Mount Rectifiers SMB/DO-214AA Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 260/10 seconds at terminals Meet MSL level 1, per J-STD-020D, lead free maximum peak of 260 Plastic material used carries Underwriters Laboratory Classification 94V-0 Green compound with suffix "G" on packing code & prefix "G" on datecode Mechanical Data Case: Molded plastic Terminal: Pure tin plated, lead free Polarity: Indicated by cathode band Packing: 12mm tape per EIA STD RS-481 Weight: 0.093 grams Ordering Information (example) Part No. Package Packing HS3AB SMB 850 / 7" REEL Packing code Packing code (Green) R5 R5G Maximum Ratings and Electrical Characteristics Rating at 25 ambient temperature unless otherwise specified. Maximum Repetitive Peak Reverse Voltage VRRM HS 3AB 50 Maximum RMS Voltage VRMS 35 70 140 210 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 300 400 600 800 1000 V Maximum Average Forward Rectified Current IF(AV) 3 A Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) IFSM 100 A Parameter Symbol Maximum Instantaneous Forward Voltage (Note 1) @3A Maximum Reverse Current @ Rated VR TA=25 TA=125 VF HS 3BB 100 HS 3DB 200 HS 3FB 300 HS 3GB 400 HS 3JB 600 HS 3KB 800 HS 3MB 1000 1.0 1.3 uA 250 50 75 Typical Junction Capacitance (Note 3) Cj 80 50 Storage Temperature Range V 10 IR Trr Operating Temperature Range V 1.7 Maximum Reverse Recovery Time (Note 2) Typical Thermal Resistance Unit nS pF O RjA 60 TJ - 55 to + 150 O C - 55 to + 150 O C TSTG C/W Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. Version:I13 RATINGS AND CHARACTERISTIC CURVES (HS3AB THRU HS3MB) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL REVERSE CHARACTERISTICS 3.5 1000 3 2 1.5 1 RESISTIVE OR INDUCTIVE LOAD 0.5 0 0 25 50 75 100 125 150 175 FIG. 3 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 300 250 8.3mS Single Half Sine Wave JEDEC Method 10 TA=25 1 0.1 200 0 20 TA=25 150 60 80 100 120 140 FIG. 5 TYPICAL FORWARD CHARACTERISTICS 100 50 TA=25 0 10 100 1000 NUMBER OF CYCLES AT 60 Hz FIG. 4 TYPICAL JUNCTION CAPACITANCE 175 40 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 100 1 150 TA=25 125 CAPACITANCE (pF) TA=125 100 100 HS3AB-HS3GB 75 50 INSTANTANEOUS FORWARD CURRENT (A) PEAK FORWARD SURGE URRENT (A) LEAD TEMPERATURE (oC) INSTANTANEOUS REVERSE CURRENT (uA) AVERAGE FORWARD CURRENT (A) 2.5 10 HS3AB-HS3DB HS3GB 1 HS3JB-HS3MB HS3JB-HS3MB 25 0.1 0 0.1 1 10 REVERSE VOLTAGE (V) 100 1000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 FORWARD VOLTAGE (V) Version:I13 Ordering information Part No. HS3XB (Note) Packing code Packing code (Green) 850 / 7" REEL R5 R5G 3K / 13" REEL R4 R4G M4 M4G Package Packing SMB SMB 3K / 13" Plastic REEL SMB Note: "x" is Device Code from "A" thru "B". Tape & Reel specification Reel Size Tape Size 7" 12mm Reel Size Tape Size 13" 12mm A 2.0 178 A max 330 B 0.4 1.9 B 0.5 2 C +0.5;-0.2 13 C 0.5 13 D min 21 D min 20.2 N 1.0 62 N 0.5 75 G +0.8;-0 12.2 G +2.0;-0 12.4 T max 14.6 T max 18.4 Unit (mm) Suggested PAD Layout Symbol A B C D E Unit(mm) 2.3 2.5 4.3 1.8 6.7 Version:I13 Dimensions DIM. Unit(mm) Unit(inch) Min Max Min Max A 1.95 2.10 0.077 0.083 B 3.48 3.73 0.137 0.147 C 4.25 4.75 0.167 0.187 D 1.99 2.61 0.078 0.103 E 0.90 1.41 0.035 0.056 F 5.10 5.30 0.201 0.209 G 0.10 0.20 0.004 0.008 H I 0.15 0.15 0.31 0.31 0.006 0.006 0.012 0.012 Marking Diagram P/N = Specific Device Code G = Green Compound YW = Date Code F= Factory Code Version:I13 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Taiwan Semiconductor: HS3AB HS3BB HS3DB HS3FB HS3GB HS3JB HS3KB HS3MB