General Description
The MAX3205E/MAX3207E/MAX3208E low-capaci-
tance, ±15kV ESD-protection diode arrays with an inte-
grated transient voltage suppressor (TVS) clamp are
suitable for high-speed and general-signal ESD protec-
tion. Low input capacitance makes these devices ideal
for ESD protection of signals in HDTV, PC monitors
(DVI™, HDMI™), PC peripherals (FireWire®, USB 2.0),
server interconnect (PCI Express™, Infiniband®),
datacom, and interchassis interconnect. Each channel
consists of a pair of diodes that steer ESD current puls-
es to VCC or GND.
The MAX3205E/MAX3207E/MAX3208E protect against
ESD pulses up to ±15kV Human Body Model, ±8kV
Contact Discharge, and ±15kV Air-Gap Discharge, as
specified in IEC 61000-4-2. An integrated TVS ensures
that the voltage rise seen on VCC during an ESD event
is clamped to a known voltage. These devices have a
2pF input capacitance per channel, and a channel-to-
channel capacitance variation of only 0.05pF, making
them ideal for use on high-speed, single-ended, or dif-
ferential signals.
The MAX3207E is a two-channel device suitable for
USB 1.1, USB 2.0 (480Mbps), and USB OTG applica-
tions. The MAX3208E is a four-channel device for
Ethernet and FireWire applications. The MAX3205E is a
six-channel device for cell phone connectors and
SVGA video connections.
The MAX3205E is available in 9-bump, tiny chip-scale
(UCSP™), and 16-pin, 3mm x 3mm, thin QFN pack-
ages. The MAX3207E is available in a small 6-pin
SOT23 package. The MAX3208E is available in 10-pin
µMAX®and 16-pin, 3mm x 3mm TQFN packages. All
devices are specified for the -40°C to +125°C automo-
tive operating temperature range.
Applications
DVI Input/Output Protection
Set-Top Boxes
PDAs/Cell Phones
Graphics Controller Cards
Displays/Projectors
High-Speed, Full-Speed and Low-Speed USB
Port Protection
FireWire IEEE 1394 Ports
Consumer Equipment
High-Speed Differential Signal Protection
Features
♦Low Input Capacitance of 2pF Typical
♦Low Channel-to-Channel Variation of 0.05pF
from I/O to I/O
♦High-Speed Differential or Single-Ended ESD
Protection
±15kV–Human Body Model
±8kV–IEC 61000-4-2, Contact Discharge
±15kV–IEC 61000-4-2, Air-Gap Discharge
♦Integrated Transient Voltage Suppressor (TVS)
♦Optimized Pinout for Minimized Stub Instances on
Controlled-Impedance Differential-Transmission
Line Routing
♦-40°C to +125°C Automotive Operating
Temperature Range
♦UCSP Packaging Available
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
19-3361; Rev 2; 3/05
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*EP = Exposed pad.
FireWire is a registered trademark of Apple Computer, Inc.
PCI Express is a trademark of PCI-SIG Corporation.
DVI is a trademark of Digital Display Working Group.
HDMI is a trademark of HDMI Licensing, LCC.
InfiniBand is a registered trademark of InfiniBand Trade
Association.
UCSP is a trademark and µMAX is a registered trademark of
Maxim Integrated Products, Inc.
Typical Operating Circuit and Pin Configurations appear at
end of data sheet.
PART TEMP
RANGE
PIN-
PACKAGE
PKG
CODE
MAX3205EABL-T - 40°C to + 125°C 9 UCSP-9 B9-2
MAX3205EATE - 40°C to + 125°C 16 TQFN-EP*
(3mm x 3mm) T1633-4
MAX3207EAUT-T - 40°C to + 125°C 6 SOT23-6 U6-1
MAX3208EAUB - 40°C to + 125°C 10 µMAX U10-2
MAX3208EATE - 40°C to + 125°C 16 TQFN-EP*
(3mm x 3mm) T1633-4
Selector Guide
PART ESD-PROTECTED
I/O PORTS TOP MARK
MAX3205EABL-T 6 AES
MAX3205EATE 6 ACO
MAX3207EAUT-T 2 ABVG
MAX3208EAUB 4 —
MAX3208EATE 4 ACN
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +5V, TA= TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +5V and TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Parameters are 100% production tested at +25°C. Limits over temperature are guaranteed by design only.
Note 2: Idealized clamp voltages. See the Applications Information section for more information.
Note 3: Guaranteed by design, not production tested.
VCC to GND...........................................................-0.3V to +6.0V
I/O_ to GND................................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA= +70°C)
6-Pin SOT23 (derate 8.7mW/°C above +70°C)............696mW
9-Pin UCSP (derate 4.7mW/°C above +70°C) .............379mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
16-Pin Thin QFN (derate 20.8mW/°C above +70°C) .1667mW
Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature .....................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 0.9 5.5 V
Supply Current ICC 1 100 nA
Diode Forward Voltage VFIF = 10mA 0.65 0.95 V
Positive transients VCC + 25
TA = +25°C, ±15kV Human
Body Model, IF = 10A Negative transients -25
Positive transients VCC + 60
TA = +25°C, ±8kV Contact
Discharge (IEC 61000-4-2),
IF = 24A Negative transients -60
Positive transients VCC + 100
Channel Clamp Voltage
(Note 2) VC
TA = +25°C, ±15kV Air-Gap
Discharge (IEC 61000-4-2),
IF = 45A Negative transients -100
V
Channel Leakage Current -0.1 +0.1 µA
MAX3205EABL-T
MAX3207EAUT 2.5 3
MAX3205EATE
MAX3208EATE 2.7 3.2
Channel I/O Capacitance V
C C
= + 3.3V , b i as of V
C C / 2
MAX3208EAUB 2.6 3.1
pF
Channel I/O to I/O
Variation in Capacitance ∆CIN VCC = +3.3V, bias of VCC / 2, CI/O_ to GND ±0.05 pF
TRANSIENT SUPPRESSOR
VCC Capacitance to GND 10 pF
ESD Trigger Voltage dV/dt ≤ 1V/ns (Note 3) 9 V
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________ 3
CLAMP VOLTAGE
vs. DC CURRENT
MAX3205E toc01
DC CURRENT (mA)
CLAMP VOLTAGE (V)
13011090705030
0.5
0.7
0.9
1.1
1.3
1.5
0.3
10 150
I/O_ TO VCC
GND TO I/O_
LEAKAGE CURRENT
vs. TEMPERATURE
MAX3205E toc02
TEMPERATURE (°C)
LEKAGE CURRENT (pA)
80400
10
100
1000
10,000
1
-40 120
INPUT CAPACITANCE
vs. INPUT VOLTAGE
MAX3205E toc03
INPUT VOLTAGE (V)
INPUT CAPACITANCE (pF)
4321
1
2
3
4
0
05
Typical Operating Characteristics
(VCC = +5V, TA = +25°C, unless otherwise noted.)
Pin Description
PIN
MAX3205E
MAX3207E
MAX3208E
TQFN UCSP SOT23 µMAX TQFN
NAME
FUNCTION
4, 5, 7,
12, 13, 15
A2, A3, B1,
B3, C1, C2
1, 4
1, 4, 6, 9 4, 7, 12, 15 I/O_
ESD-Protected Channel
1, 3, 6, 8, 9,
11, 14, 16
— 3, 6
2, 5, 7, 10
1, 3, 5, 6,
8, 9, 11,
13, 14, 16
N.C.
No Connection. Not internally connected.
—B2———
N.C.
No Connection. The solder sphere is omitted from this
location (see the Packaging Information section).
2A1232
GND
Ground. Connect GND with a low-impedance
connection to the ground plane.
10 C3 5 8 10
VCC
Power-Supply Input. Bypass VCC to GND with a 0.1µF
ceramic capacitor as close to the device as possible.
EP — — — EP EP Exposed Pad. Connect EP to GND.
MAX3205E/MAX3207E/MAX3208E
Detailed Description
The MAX3205E/MAX3207E/MAX3208E low-capacitance,
±15kV ESD-protection diode arrays with an integrated
transient voltage suppressor (TVS) clamp are suitable for
high-speed and general-signal ESD protection. Low
input capacitance makes these devices ideal for ESD
protection of signals in HDTV, PC monitors (DVI, HDMI),
PC peripherals (FireWire, USB 2.0), Server Interconnect
(PCI Express, Infiniband), Datacom, and Inter-Chassis
Interconnect. Each channel consists of a pair of diodes
that steer ESD current pulses to VCC or GND. The
MAX3205E, MAX3207E, and MAX3208E are two, four,
and six channels (see the Functional Diagram).
The MAX3205E/MAX3207E/MAX3208E are designed to
work in conjunction with a device’s intrinsic ESD pro-
tection. The MAX3205E/MAX3207E/MAX3208E limit the
excursion of the ESD event to below ±25V peak voltage
when subjected to the Human Body Model waveform.
When subjected to the IEC 61000-4-2 waveform, the
peak voltage is limited to ±60V when subjected to
Contact Discharge. The peak voltage is limited to
±100V when subjected to Air-Gap Discharge. The
device protected by the MAX3205E/MAX3207E/
MAX3208E must be able to withstand these peak volt-
ages, plus any additional voltage generated by the par-
asitic of the board.
A TVS is integrated into the MAX3205E/MAX3207E/
MAX3208E to help clamp ESD to a known voltage. This
helps reduce the effects of parasitic inductance on the
VCC rail by clamping VCC to a known voltage during an
ESD event. For the lowest possible clamp voltage dur-
ing an ESD event, placing a 0.1µF capacitor as close to
VCC as possible is recommended.
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
4 _______________________________________________________________________________________
MAX3207E
VCC
GND
I/O1 I/O2
MAX3208E
VCC
GND
I/O1 I/O2 I/O3 I/O4
MAX3205E
VCC
GND
I/O1 I/O2 I/O5 I/O6
I/O3 I/O4
Functional Diagram
Applications Information
Design Considerations
Maximum protection against ESD damage results from
proper board layout (see the Layout Recommendations
section). A good layout reduces the parasitic series
inductance on the ground line, supply line, and protect-
ed signal lines. The MAX3205E/MAX3207E/MAX3208E
ESD diodes clamp the voltage on the protected lines
during an ESD event and shunt the current to GND or
VCC. In an ideal circuit, the clamping voltage (VC) is
defined as the forward voltage drop (VF) of the protec-
tion diode, plus any supply voltage present on the cath-
ode.
For positive ESD pulses:
VC= VCC + VF
For negative ESD pulses:
VC=-V
F
The effect of the parasitic series inductance on the
lines must also be considered (Figure 1).
For positive ESD pulses:
For negative ESD pulses:
where, IESD is the ESD current pulse.
During an ESD event, the current pulse rises from zero
to peak value in nanoseconds (Figure 2). For example,
in a 15kV IEC-61000 Air-Gap Discharge ESD event, the
pulse current rises to approximately 45A in 1ns (di/dt =
45 x 109). An inductance of only 10nH adds an addi-
tional 450V to the clamp voltage, and represents
approximately 0.5in of board trace. Regardless of the
device’s specified diode clamp voltage, a poor layout
with parasitic inductance significantly increases the
effective clamp voltage at the protected signal line.
Minimize the effects of parasitic inductance by placing
the MAX3205E/MAX3207E/MAX3208E as close to the
connector (or ESD contact point) as possible.
A low-ESR 0.1µF capacitor is recommended between
VCC and GND in order to get the maximum ESD protec-
tion possible. This bypass capacitor absorbs the
charge transferred by a positive ESD event. Ideally, the
supply rail (VCC) would absorb the charge caused by a
positive ESD strike without changing its regulated
value. All power supplies have an effective output
impedance on their positive rails. If a power supply’s
effective output impedance is 1Ω, then by using V = I x
R, the clamping voltage of VCincreases by the equa-
tion VC= IESD x ROUT. A +8kV IEC 61000-4-2 ESD
event generates a current spike of 24A. The clamping
voltage increases by VC= 24A x 1Ω, or VC= 24V.
Again, a poor layout without proper bypassing increas-
es the clamping voltage. A ceramic chip capacitor
mounted as close as possible to the MAX3205E/
MAX3207E/MAX3208E VCC pin is the best choice for
this application. A bypass capacitor should also be
placed as close to the protected device as possible.
VV Lx
dI
dt Lx
dI
dt
CFD ESD ESD
() ()
=− +
⎛
⎝
⎜⎞
⎠
⎟+⎛
⎝
⎜⎞
⎠
⎟
⎛
⎝
⎜⎞
⎠
⎟
()
213
VV V Lx
dI
dt Lx
dI
dt
CCCFD ESD ESD
() ()
=+ +
⎛
⎝
⎜⎞
⎠
⎟+⎛
⎝
⎜⎞
⎠
⎟
()
112
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________ 5
L1
PROTECTED
LINE
L3
D2
GROUND RAIL
POSITIVE SUPPLY RAIL
I/O_
D1
L2
Figure 1. Parasitic Series Inductance
tR = 0.7ns to 1ns 30ns
60ns
t
100%
90%
10%
I
PEAK
I
Figure 2. IEC 61000-4-2 ESD Generator Current Waveform
MAX3205E/MAX3207E/MAX3208E
±15kV ESD Protection
ESD protection can be tested in various ways. The
MAX3205E/MAX3207E/MAX3208E are characterized
for protection to the following limits:
• ±15kV using the Human Body Model
• ±8kV using the Contact Discharge Method specified
in IEC 61000-4-2
• ±15kV using the IEC 61000-4-2 Air-Gap Discharge
Method
ESD Test Conditions
ESD performance depends on a number of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 3 shows the Human Body Model, and Figure 4
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the device through a
1.5kΩresistor.
IEC 61000-4-2
The IEC 61000-4-2 standard covers ESD testing and
performance of finished equipment. The MAX3205E/
MAX3207E/MAX3208E help users design equipment
that meets Level 4 of IEC 61000-4-2. The main differ-
ence between tests done using the Human Body Model
and IEC 61000-4-2 is higher peak current in IEC 61000-
4-2. Because series resistance is lower in the IEC
61000-4-2 ESD test model (Figure 5), the ESD-
withstand voltage measured to this standard is general-
ly lower than that measured using the Human Body
Model. Figure 2 shows the current waveform for the
±8kV, IEC 61000-4-2 Level 4, ESD Contact Discharge
test. The Air-Gap Discharge test involves approaching
the device with a charged probe. The Contact
Discharge method connects the probe to the device
before the probe is energized.
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
6 _______________________________________________________________________________________
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1MΩ
RD
1.5kΩ
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 3. Human Body ESD Test Model
IP 100%
90%
36.8%
tRL TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
0
AMPERES
Figure 4. Human Body Model Current Waveform
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50Ω to 100ΩRD
330Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 5. IEC 61000-4-2 ESD Test Model
Layout Recommendations
Proper circuit-board layout is critical to suppress ESD-
induced line transients (See Figure 6). The MAX3205E/
MAX3207E/MAX3208E clamp to 100V; however, with
improper layout, the voltage spike at the device can be
much higher. A lead inductance of 10nH with a 45A
current spike results in an additional 450V spike on the
protected line. It is essential that the layout of the PC
board follows these guidelines:
1) Minimize trace length between the connector or
input terminal, I/O_, and the protected signal line.
2) Use separate planes for power and ground to reduce
parasitic inductance and to reduce the impedance to
the power rails for shunted ESD current.
3) Ensure short low-inductance ESD transient return
paths to GND and VCC.
4) Minimize conductive power and ground loops.
5) Do not place critical signals near the edge of the PC
board.
6) Bypass VCC to GND with a low-ESR ceramic capaci-
tor as close to VCC as possible.
7) Bypass the supply of the protected device to GND
with a low-ESR ceramic capacitor as close to the
supply pin as possible.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, go to the Maxim
website at www.maxim-ic.com/ucsp for the Application
Note, UCSP—A Wafer-Level Chip-Scale Package.
Chip Information
DIODE COUNT:
MAX3205E: 7
MAX3207E: 3
MAX3208E: 5
PROCESS: BiCMOS
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________ 7
VCC
PROTECTED LINE
NEGATIVE ESD-
CURRENT
PULSE
PATH TO
GROUND
PROTECTED
CIRCUIT
GND
D1
I/O_ VC
D2
L1
L3
L2
Figure 6. Layout Considerations
MAX3205E
MAX3207E
MAX3208E
0.1µF
0.1µF
I/0_
I/0
I/0 LINE
VCC
VCC
PROTECTED
CIRCUIT
Typical Operating Circuit
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
8 _______________________________________________________________________________________
TOP VIEW
16 15 14 13
9
10
11
12
N.C.
VCC
N.C.
I/O2
4
3
2
1
I/O4
N.C.
GND
N.C.
5678
N.C.
N.C.
I/O3
N.C.
N.C.
I/O1
N.C.
N.C.
MAX3208E
THIN QFN
16 15 14 13
9
10
11
12
N.C.
VCC
N.C.
I/O3
4
3
2
1
I/O6
N.C.
GND
N.C.
5678
I/O5
N.C.
I/O4
N.C.
N.C.
I/O1
N.C.
I/O2
MAX3205E
THIN QFN
GND
I/O2N.C.
1 6 N.C.
5V
CC
I/O1
MAX3207E
SOT23
2
34
1
2
3
4
5
10
9
8
7
6
N.C.
I/O4
VCC
N.C.I/O2
GND
N.C.
I/O1
MAX3208E
µMAX
I/O3N.C.
MAX3205E
UCSP
(BUMPS ON BOTTOM)
A2 A3 I/O5
A1
GND
I/O1
I/O2
I/O6
B1 B3 I/O4
C1 C2 C3 VCC
I/O3
Pin Configurations
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________ 9
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
9LUCSP, 3x3.EPS
I11
21-0093
PACKAGEOUTLINE,3x3UCSP
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
10 ______________________________________________________________________________________
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
10LUMAX.EPS
PACKAGEOUTLINE,10LuMAX/uSOP
1
1
21-0061 I
REV.DOCUMENTCONTROLNO.APPROVAL
PROPRIETARYINFORMATION
TITLE:
TOPVIEW
FRONTVIEW
1
0.498REF
0.0196REF
S
6°
SIDEVIEW
α
BOTTOMVIEW
0° 0° 6°
0.037REF
0.0078
MAX
0.006
0.043
0.118
0.120
0.199
0.0275
0.118
0.0106
0.120
0.0197BSC
INCHES
1
10
L1
0.0035
0.007
e
c
b
0.187
0.0157
0.114
H
L
E2
DIM
0.116
0.114
0.116
0.002
D2
E1
A1
D1
MIN
-A
0.940REF
0.500BSC
0.090
0.177
4.75
2.89
0.40
0.200
0.270
5.05
0.70
3.00
MILLIMETERS
0.05
2.89
2.95
2.95
-
MIN
3.00
3.05
0.15
3.05
MAX
1.10
10
0.6±0.1
0.6±0.1
Ø0.50±0.1
H
4XS
e
D2
D1
b
A2 A
E2
E1 L
L1
c
α
GAGEPLANE
A2 0.030 0.037 0.75 0.95
A1
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
______________________________________________________________________________________ 11
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
6LSOT.EPS
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
12 ______________________________________________________________________________________
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
12x16L QFN THIN.EPS
0.10 C0.08 C
0.10MC A B
D
D/2
E/2
E
A1
A2
A
E2
E2/2
L
k
e
(ND-1)Xe
(NE-1)Xe
D2
D2/2
b
L
e
L
C
L
e
C
L
L
C
L
C
E
12
21-0136
PACKAGEOUTLINE
12,16L,THINQFN,3x3x0.8mm
MAX3205E/MAX3207E/MAX3208E
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
1.DIMENSIONING&TOLERANCINGCONFORMTOASMEY14.5M-1994.
EXPOSEDPADVARIATIONS
1.10
T1633-1 0.95
CODES
PKG.
T1233-1
MIN.
0.95
NOM.
1.10
D2
1.25
1.10
0.95
1.25
NOM.
1.10
MAX.
1.25
MIN.
0.95
MAX.
1.25
E2
12
N
k
A2
0.25
NE
A1
ND
0
0.20REF
--
3
0.02
3
0.05
L
e
E
0.45
2.90
b
D
A
0.20
2.90
0.70
0.50BSC.
0.55
3.00
0.65
3.10
0.25
3.00
0.75
0.30
3.10
0.80
16
0.20REF
0.25 -
0
4
0.02
4
-
0.05
0.50BSC.
0.30
2.90
0.40
3.00
0.20
2.90
0.70
0.25
3.00
0.75
3.10
0.50
0.80
3.10
0.30
PKG
REF. MIN.
12L3x3
NOM. MAX. NOM.
16L3x3
MIN. MAX.
0.35x45∞
PINID JEDEC
WEED-1
0.35x45∞WEED-2
2.ALLDIMENSIONSAREINMILLIMETERS.ANGLESAREINDEGREES.
3.NISTHETOTALNUMBEROFTERMINALS.
4.THETERMINAL#1IDENTIFIERANDTERMINALNUMBERINGCONVENTIONSHALLCONFORMTO
JESD95-1SPP-012.DETAILSOFTERMINAL#1IDENTIFIERAREOPTIONAL,BUTMUSTBELOCATED
WITHINTHEZONEINDICATED.THETERMINAL#1IDENTIFIERMAYBEEITHERAMOLDOR
MARKEDFEATURE.
5.DIMENSIONbAPPLIESTOMETALLIZEDTERMINALANDISMEASUREDBETWEEN0.20mmAND0.25mm
FROMTERMINALTIP.
6.NDANDNEREFERTOTHENUMBEROFTERMINALSONEACHDANDESIDERESPECTIVELY.
7.DEPOPULATIONISPOSSIBLEINASYMMETRICALFASHION.
8.COPLANARITYAPPLIESTOTHEEXPOSEDHEATSINKSLUGASWELLASTHETERMINALS.
9.DRAWINGCONFORMSTOJEDECMO220REVISIONC.
NOTES:
E22
21-0136
PACKAGEOUTLINE
12,16L,THINQFN,3x3x0.8mm
T1233-3 1.10 1.25 0.95 1.10 0.35x45∞1.25 WEED-1
0.95
T1633F-3 0.65
T1633-4 0.95
0.80 0.95 0.65 0.80
1.10 1.25 0.95 1.10
0.225x45∞
0.95 WEED-2
0.35x45∞
1.25 WEED-2
T1633-2 0.95 1.10 1.25 0.95 1.10 0.35x45∞
1.25 WEED-2
NO
DOWN
BONDS
ALLOWED
YES
NO
YES
N/A
NO