Ver. 201306
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics(Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG10WR27MNC 0603/1608 0.27±25% 0.12 ±25 % 1.30
CIG10WR47MNC 0603/1608 0.47±20% 0.15 ±20 % 1.10
CIG10W1R0MNC 0603/1608 1.0±20% 0.20 ±20 % 0.95
CIG10W1R5MNC 0603/1608 1.5±20% 0.25 ±20 % 0.80
CIG10W2R2MNC 0603/1608 2.2±20% 0.30 ±20 % 0.75
CIG10W3R3MNC 0603/1608 3.3±20% 0.40 ±20 % 0.70
CIG10W4R7MNC 0603/1608 4.7±20% 0.50 ±20 % 0.62
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG10W Series (1608/ EIA 0603)
The smallest multilayer power inductor(1.6mm×0.8mm)
Lower Profile (0.8mm max)
Low DC resistance
Magnetically shielded structure
Free of all RoHS-regulated substances
Ver. 201306
CI G 10 W 2R2 M N C
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (W:Normal Type)
(5) Inductance (R47:0.47uH, 2R2:2.2uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4,000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PRODUCT IDENTIFICATION
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question
regarding the data sheets, please contact our sales personnel or application engineers.
