D-8 DGN-8 THS4130 THS4131 DGK-8 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com HIGH-SPEED, LOW-NOISE, FULLY-DIFFERENTIAL I/O AMPLIFIERS Check for Samples: THS4130, THS4131 FEATURES DESCRIPTION * The THS413x is one in a family of fully-differential input/differential output devices fabricated using Texas Instruments' state-of-the-art BiComI complementary bipolar process. 1 23 * * * * High Performance - 150 MHz, -3 dB Bandwidth (VCC = 15 V) - 51 V/s Slew Rate - -100 dB Third Harmonic Distortion at 250 kHz Low Noise - 1.3 nV/Hz Input-Referred Noise Differential-Input/Differential-Output - Balanced Outputs Reject Common-Mode Noise - Reduced Second-Harmonic Distortion Due to Differential Output Wide Power-Supply Range - VCC = 5 V Single Supply to 15 V Dual Supply ICC(SD) = 860 A in Shutdown Mode (THS4130) The THS413x is made of a true fully-differential signal path from input to output. This design leads to an excellent common-mode noise rejection and improved total harmonic distortion. VIN- VOCM VCC+ VOUT+ 1 8 2 7 3 6 4 5 VIN+ PD VCC- VOUT- VIN- VOCM VCC+ VOUT+ 1 8 2 7 3 6 4 5 VIN+ NC VCC- VOUT- HIGH-SPEED DIFFERENTIAL I/O FAMILY APPLICATIONS * * * * * THS4131 D, DGN, OR DGK PACKAGE (TOP VIEW) THS4130 D, DGN, OR DGK PACKAGE (TOP VIEW) Single-Ended To Differential Conversion Differential ADC Driver Differential Antialiasing Differential Transmitter And Receiver Output Level Shifter DEVICE NUMBER OF CHANNELS THS4130 1 X THS4131 1 - SHUTDOWN RELATED DEVICES DEVICE DESCRIPTION THS412x 100 MHz, 43 V/s, 3.7 nV/Hz THS414x 160 MHz, 450 V/s, 6.5 nV/Hz THS415x 180 MHz, 850 V/s, 9 nV/Hz TOTAL HARMONIC DISTORTION vs FREQUENCY Typical A/D Application Circuit VDD VIN VOCM + - AIN - + AIN -5 V AVDD AVSS DVDD Vref DIGITAL OUTPUT THD - Total Harmonic Distortion - dB -20 5V VOUT = 2 VPP -30 -40 -50 -60 VCC = 5 V to 5 V -70 -80 -90 VCC = 15 V -100 100 k 1M f - Frequency - Hz 10 M 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. AVAILABLE OPTIONS (1) PACKAGED DEVICES SMALL OUTLINE (D) TA 0C to +70C -40C to +85C (1) MSOP PowerPADTM (DGN) MSOP SYMBOL (DGK) SYMBOL EVALUATION MODULES THS4130CD THS4130CDGN AOB THS4130CDGK ATP THS4130EVM THS4131CD THS4131CDGN AOD THS4131CDGK ATQ THS4131EVM THS4130ID THS4130IDGN AOC THS4130IDGK ASO -- THS4131ID THS4131IDGN AOE THS4131IDGK ASP -- For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range,unless otherwise noted. UNIT VCC- to VCC+ Supply voltage 33 V VI Input voltage VCC IO (2) Output current VID 150 mA 6 V Differential input voltage Continuous total power dissipation See Dissipation Rating table TJ (3) Maximum junction temperature TJ (4) Maximum junction temperature, continuous operation, long-term reliability TA Operating free-air temperature TSTG (2) (3) (4) +125C C-suffix 0C to +70C I-suffix -40C to +85C -65C to +150C Storage temperature ESD ratings: (1) +150C HBM 2500 V CDM 1500 V MM 200 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The THS413x may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the PowerPAD thermally-enhanced package. The absolute maximum temperature under any condition is limited by the constraints of the silicon process. The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. DISSIPATION RATING TABLE POWER RATING (2) JC (C/W) TA= +25C TA = +85C D 97.5 38.3 1.02 W 410 mW DGN 58.4 4.7 1.71 W 685 mW DGK 134 72 750 mW 300 mW PACKAGE (1) (2) 2 JA (1) (C/W) This data was taken using the JEDEC standard High-K test PCB. Power rating is determined with a junction temperature of +125C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below +125C for best performance and long-term reliability. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN Supply voltage, VCC+ to VCC- Operating free-air temperature, TA TYP MAX 2.5 15 Single supply 5 30 C-suffix 0 +70 -40 +85 Dual supply I-suffix UNIT V C ELECTRICAL CHARACTERISTICS (1) VCC= 5 V, RL = 800, and TA = +25C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DYNAMIC PERFORMANCE Small-signal bandwidth (-3 dB), single-ended input, differential output, VI = 63 mVPP BW Small-signal bandwidth (-3 dB), single-ended input, differential output, VI = 63 mVPP SR Slew rate (2) Settling time to 0.1% ts Settling time to 0.01% VCC = 5 Gain = 1, Rf = 390 125 VCC = 5 Gain = 1, Rf = 390 135 VCC = 15 Gain = 1, Rf = 390 150 VCC = 5 Gain = 2, Rf = 750 80 VCC = 5 Gain = 2, Rf = 750 85 VCC = 15 Gain = 2, Rf = 750 90 Gain = 1 Step voltage = 2 V, gain = 1 MHz 52 V/s 78 ns 213 ns DISTORTION PERFORMANCE VCC = 5 Total harmonic distortion, differential input, differential output, gain = 1, Rf = 390 , RL = 800 , VO= 2 VPP VCC = 5 VCC = 15 THD VCC = 5 VO = 4 VPP VCC = 15 SFDR Spurious-free dynamic range, differential input, differential output, gain = 1, Rf = 390 , RL = 800 , f = 250 kHz VO= 2 VPP VO = 4 VPP f = 250 kHz -95 f = 1 MHz -81 f = 250 kHz -96 f = 1 MHz -80 f = 250 kHz -97 f = 1 MHz -80 f = 250 kHz -91 f = 1 MHz -75 f = 250 kHz -91 f = 1 MHz -75 VCC = 2.5 97 VCC = 5 98 VCC = 15 99 VCC = 5 93 VCC = 15 dBc dB 95 Third intermodulation distortion VI(PP) = 4 V, G = 1, F1 = 3 MHz, F2 = 3.5 MHz -53 dBc Third-order intercept VI(PP) = 4 V, G = 1, F1 = 3 MHz, F2 = 3.5 MHz 41.5 dB NOISE PERFORMANCE Vn Input voltage noise f = 10 kHz 1.3 nV/Hz In Input current noise f = 10 kHz 1 pA/Hz DC PERFORMANCE Open-loop gain Input offset voltage V(OS) TA = +25C 71 TA = full range 69 TA = +25C 78 dB 0.2 2 3.5 TA = full range 3 Common-mode input offset voltage, referred to VOCM TA = +25C 0.2 V/C Input offset voltage drift TA = full range 4.5 IIB Input bias current TA = full range 2 6 IOS Input offset current TA = full range 100 500 Offset drift (1) (2) 2 mV A nA nA/C The full range temperature is 0C to +70C for the C-suffix, and -40C to +85C for the I-suffix. Slew rate is measured from an output level range of 25% to 75%. Copyright (c) 2000-2011, Texas Instruments Incorporated 3 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com ELECTRICAL CHARACTERISTICS(1) (continued) VCC= 5 V, RL = 800, and TA = +25C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT CHARACTERISTICS CMRR Common-mode rejection ratio VICR Common-mode input voltage range RI Input resistance CI Input capacitance, closed loop ro Output resistance TA = full range 80 95 dB -3.77 to 4.3 -4 to 4.5 V Measured into each input terminal Open loop 34 M 4 pF 41 OUTPUT CHARACTERISTICS TA = +25C 1.2 to 3.8 0.9 to 4.1 TA = full range 1.3 to 3.7 4 VCC = 5 V Output voltage swing VCC = 5 V VCC = 15 V VCC = 5 V, RL = 7 IO Output current VCC = 5 V, RL = 7 VCC = 15 V, RL = 7 TA = +25C TA = full range V 3.7 3.6 TA = +25C 10.5 TA = full range 10.2 TA = +25C 25 TA = full range 20 TA = +25C 30 TA = full range 28 TA = +25C 60 TA = full range 65 12.4 45 55 mA 85 POWER SUPPLY VCC Supply voltage range ICC Quiescent current Single supply Split supply VCC = 5 V VCC = 15 V ICC(SD) Quiescent current (shutdown) (THS4130 only) (3) PSRR Power-supply rejection ratio (dc) (3) 4 V = -5 V 4 33 2 16.5 TA = +25C 12.3 TA = full range 15 16 TA = +25C 14 TA = +25C 0.86 TA = full range 1.4 1.5 TA = +25C 73 TA = full range 70 98 V mA mA dB For detailed information on the behavior of the power-down circuit, see the Power-Down Mode section in the Principles of Operation. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS TABLE OF GRAPHS FIGURE Small-signal frequency response Figure 1, Figure 2 Small-signal frequency response (various supplies) Figure 3 Small-signal frequency response (various CF) Figure 4 Small-signal frequency response (various CL) Figure 5 Large-signal transient response (differential in/single out) Figure 6 Large-signal frequency response CMMR Common-mode rejection ratio ICC Supply current IIB Input bias current Figure 7 vs Frequency vs Free-air temperature Figure 9 vs Free-air temperature (shutdown state) Figure 10 vs Free-air temperature Figure 11 Settling time PSRR Power-supply rejection ratio Figure 12 vs Frequency (differential out) Large-signal transient response THD Total harmonic distortion Figure 8 Figure 13 Figure 14 vs Frequency Figure 15 vs Frequency Figure 16, Figure 17 vs Output voltage Figure 18, Figure 19 vs Frequency Figure 20, Figure 21 vs Output voltage Figure 22, Figure 23 Second-harmonic distortion Third-harmonic distortion Vn Voltage noise vs Frequency Figure 24 In Current noise vs Frequency Figure 25 V(OS) Input offset voltage vs Common-mode output voltage Figure 26 VO Output voltage vs Differential load resistance Figure 27 zo Output impedance vs Frequency Figure 28 Copyright (c) 2000-2011, Texas Instruments Incorporated 5 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS SMALL-SIGNAL FREQUENCY RESPONSE SMALL-SIGNAL FREQUENCY RESPONSE 3 25 RL = 800 , VCC = 5 V, VI = 63 mVPP Gain = 10_Rf = 4 k 20 1 Gain = 5_Rf = 2 k Rf = 620 Gain = 1, RL = 800 , VCC = 5 V, VI = 63 mVPP 0 Output - dB Output -dB 15 2 10 Gain = 2_Rf = 750 5 -1 Rf = 390 -2 -3 -4 Gain = 1_Rf = 390 -5 0 -6 -5 -7 -10 100 k 1M 10 M 100 M f - Frequency - Hz -8 100 k 1G 1M 10 M 100 M f - Frequency - Hz Figure 1. Figure 2. SMALL-SIGNAL FREQUENCY RESPONSE (VARIOUS SUPPLIES) SMALL-SIGNAL FREQUENCY RESPONSE (VARIOUS CF) 2 3 VCC= 15 1 2 CF = 0 pF 1 0 0 -1 VCC= 5 Output - dB Output - dB -1 -2 -3 -4 -7 -3 CF = 1 pF -4 -6 Gain = 1, RL = 800 , Rf = 390 , VI = 63 mVPP -8 100 k 1M -7 -8 -9 10 M 100 M f - Frequency - Hz Figure 3. 6 -2 -5 -5 -6 1G 1G -10 100 k 1M 10 M 100 M f - Frequency - Hz 1G Figure 4. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) SMALL-SIGNAL FREQUENCY RESPONSE (VARIOUS CL) LARGE-SIGNAL TRANSIENT RESPONSE (DIFFERENTIAL IN/SINGLE OUT) 5 3 2 CL = 10 pF VO+ Large Signal Transient Response - V 4 1 Gain = 1, RL = 800 , VCC = 5 V, VI = 63 mVPP, Rf = 390 Output - dB 1 -0 CL = 0 pF -1 -2 -3 -4 -5 -6 -7 -8 100 k 10 M 100 M f - Frequency - Hz VO- -0.5 0.5 0 VI (Diff) -0.5 1G 0 0.1 0.2 0.4 0.3 t - Time - s 0.5 Figure 5. Figure 6. LARGE-SIGNAL FREQUENCY RESPONSE COMMON-MODE REJECTION RATIO vs FREQUENCY 0.6 CMRR - Common Mode Rejection Ratio - dB -50 VCC = 15 V 0 -5 Output - dB 0 -1 1M 5 -10 VCC = 5 V -15 -20 0.5 Gain = 1 Rf = 390 , RL = 800 , CF = 0 pF, VI = 0.2 VRMS -25 100 k 1M VCC = 5 V 10 M 100 M f - Frequency - Hz Figure 7. Copyright (c) 2000-2011, Texas Instruments Incorporated 1G -55 Rf = 1 k, VCC = 5 V -60 -65 -70 -75 -80 -85 -90 -95 -100 100 k 1M 10 M f - Frequency - Hz 100 M Figure 8. 7 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) SUPPLY CURRENT vs FREE-AIR TEMPERATURE (SHUTDOWN STATE) SUPPLY CURRENT vs FREE-AIR TEMPERATURE 940 15 14.5 920 VCC = 15 V I CC - Supply Current - A I CC - Supply Current - mA 14 13.5 13 12.5 VCC = 5 V 12 11.5 900 880 860 840 11 820 10.5 -20 0 20 40 60 80 TA - Free-Air Temperature - C Figure 9. Figure 10. INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE SETTLING TIME 2.4 2.04 2.35 2.02 2.3 IIB+ 2.25 2.2 2.15 2 RF = 510 CF = 1 pF, VCC = 5 V VO = 4 VPP RL = 800 1.98 1.96 1.94 IIB- 2.1 2.05 -50 1.92 1.9 -25 0 25 50 75 TA - Free-Air Temperature - C Figure 11. 8 800 -50 -25 0 25 50 75 100 TA - Free-Air Temperature (Shutdown State) - C 100 VO - Output Voltage - V IIB- Input Bias Current - A 10 -40 100 0 25 50 75 100 t - Time - ns 125 150 Figure 12. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) POWER-SUPPLY REJECTION RATIO vs FREQUENCY (DIFFERENTIAL OUT) LARGE-SIGNAL TRANSIENT RESPONSE -50 2.5 Gain = 1, Rf = 330 , RL = 400 1.5 -60 VCC = 5 V -70 -80 VCC = - 5 V G = 1, Rf = 390 , RL = 800 , CF = 0 pF, CL = 10 pF, VI_Peak = 2 V, VCC = 15 V TA = 25C 1 5 0 -5 -1 -1.5 -90 -2 -100 10 k VO- 100 k 1M 10 M f - Frequency (Differential Out) - Hz -2.5 100 M 0 160 TOTAL HARMONIC DISTORTION vs FREQUENCY SECOND-HARMONIC DISTORTION vs FREQUENCY 200 -30 VOUT = 2 VPP -40 -50 VCC = 5 V to 5 V -70 -80 VCC = 15 V -90 -100 100k 120 Figure 14. -40 -60 80 Figure 13. Second Harmonic Distortion - dBc -30 40 t - Time - nS -20 THD - Total Harmonic Distortion - dB VO+ 2 VO - Output Voltage - V PSRR - Power Supply Rejection Ratio - dB -40 VO = 2 VPP, RL = 800 , Rf = 390 , G=1 Single Ended Input Differential Output -50 -60 VCC = 5 V -70 -80 -90 -100 VCC = 15V, 5V 1M f - Frequency - Hz Figure 15. Copyright (c) 2000-2011, Texas Instruments Incorporated 10M -110 100 k 1M f - Frequency - Hz 10 M Figure 16. 9 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) SECOND-HARMONIC DISTORTION vs FREQUENCY SECOND-HARMONIC DISTORTION vs OUTPUT VOLTAGE -92 -30 -50 VO = 4 VPP, RL = 800 , Rf = 390 , G=1 VCC = 5 V -60 -70 -80 VCC = 15 V -90 -100 1M f - Frequency - Hz -102 -104 Single Ended Input Differential Output 0 1 2 3 4 5 VO - Output Voltage - V SECOND-HARMONIC DISTORTION vs OUTPUT VOLTAGE THIRD-HARMONIC DISTORTION vs FREQUENCY -40 -92 -94 VCC = 5 V -96 -98 VCC = 5 V -100 -102 Single Ended Input Differential Output 1 6 7 -30 Third Harmonic Distortion - dBc Second Harmonic Distortion - dBc -100 Figure 18. -90 f = 500 KHz RL = 800 , Rf = 390 , G=1 2 3 4 5 VO - Output Voltage - V Figure 19. 10 VCC = 15 V Figure 17. VCC = 15 V -106 0 VCC = 5 V VCC = 5 V -98 10 M -88 -104 -96 -106 -110 100 k f = 250 KHz RL = 800 , Rf = 390 , G=1 -94 Second Harmonic Distortion - dBc Second Harmonic Distortion - dBc -40 Single Ended Input Differential Output 6 7 -50 VO = 4 VPP RL = 800 , Rf = 390 , G=1 VCC = 5 V -60 VCC = 15 V -70 -80 -90 -100 -110 100 k Single Ended Input Differential Output 1M f - Frequency - Hz 10 M Figure 20. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) THIRD-HARMONIC DISTORTION vs FREQUENCY THIRD-HARMONIC DISTORTION vs OUTPUT VOLTAGE -88 -30 VO = 2 VPP, RL = 800 , Rf = 390 , Gain = 1 -50 Single Ended Input Differential Output -60 -70 VCC = 15 V -80 VCC = 5 V -90 VCC = 5 V -100 -94 VCC = 5 V -96 VCC = 5 V -98 f = 500 KHz RL = 800 , Rf = 390 , G=1 -100 -102 -104 1M f - Frequency - Hz Single Ended Input Differential Output 0 10 M 1 2 3 4 5 6 7 VO - Output Voltage - V Figure 21. Figure 22. THIRD-HARMONIC DISTORTION vs OUTPUT VOLTAGE VOLTAGE NOISE vs FREQUENCY -88 10 f = 250 KHz RL = 800 , Rf = 390 , G=1 -92 VCC = 5 V Vn - Voltage Noise - nV/ Hz -90 Third Harmonic Distortion - dBc -92 -106 -110 100 k -94 -96 VCC = 5 V -98 VCC = 15 V -100 -102 -104 -106 VCC = 15 V -90 Third Harmonic Distortion - dBc Third Harmonic Distortion - dBc -40 Single Ended Input Differential Output 1 0 1 2 3 4 5 VO - Output Voltage - V Figure 23. Copyright (c) 2000-2011, Texas Instruments Incorporated 6 7 10 100 1k 10 k 100 k f - Frequency - Hz Figure 24. 11 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) CURRENT NOISE vs FREQUENCY INPUT OFFSET VOLTAGE vs COMMON-MODE OUTPUT VOLTAGE 7E-12 1000 V(OS) - Input Offset Voltage - V I n - Current Noise - pA/ Hz 6E-12 5E-12 4E-12 3E-12 2E-12 1E-12 0 VCC = 2.5 V 600 400 200 0 VCC = 5 V VCC = 15 V -200 -400 1 10 100 1k f - Frequency - Hz 10 k -600 -12 100 k Figure 26. OUTPUT VOLTAGE vs DIFFERENTIAL LOAD RESISTANCE OUTPUT IMPEDANCE vs FREQUENCY 100 Rf = 1 k G=2 5 VCC = 15 V VOUT+ VCC = 5 V VOUT- VCC = 5 V 0 -5 -10 12 VCC = 5 V VOUT+ zo - Output impedance - 10 -9 -6 -3 0 3 6 9 VOCM - Common-Mode Output Voltage - V Figure 25. 15 VO - Output Voltage - V 800 Rf = 1 k, RL = 800 , G=1 VOUT- 10 1 VCC = 15 V -15 100 1000 10 k RL - Differential Load Resistance - Figure 27. 12 100 k 0.1 100 k 1M 10 M 100 M f - Frequency - Hz 1G Figure 28. Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com APPLICATION INFORMATION RESISTOR MATCHING Resistor matching is important in fully-differential amplifiers. The balance of the output on the reference voltage depends on matched ratios of the resistor. CMRR, PSRR, and cancellation of the second-harmonic distortion diminish if resistor mismatch occurs. Therefore, it is recommended to use 1% tolerance resistors or better to keep the performance optimized. VOCM sets the dc level of the output signals. If no voltage is applied to the VOCMpin, it is set to the midrail voltage internally defined as: VCC ) VCC - ) 2 (1) In the differential mode, the VOCM on the two outputs cancel each other. Therefore, the output in the differential mode is the same as the input in the gain of 1. VOCM has a high bandwidth capability up to the typical operation range of the amplifier. For the prevention of noise going through the device, use a 0.1 F capacitor on the VOCM pin as a bypass capacitor. Figure 29 shows the simplified diagram of the THS413x. VCC+ Output Buffer VIN- x1 VOUT+ C VIN+ R Vcm Error Amplifier + _ C x1 R VOUT- Output Buffer VCC+ 30 k VCC- 30 k VCC- VOCM Figure 29. THS413x Simplified Diagram Copyright (c) 2000-2011, Texas Instruments Incorporated 13 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com DATA CONVERTERS Data converters are one of the most popular applications for the fully-differential amplifiers. Figure 30 shows a typical configuration of a fully-differential amplifier attached to a differential analog-to-digital converter (ADC). VDD VCC 5V VIN + - AIN1 - + AIN2 VOCM 0.1 F AVDD DVDD AVSS Vref -5 V VCC- Figure 30. Fully-Differential Amplifier Attached to a Differential ADC Fully-differential amplifiers can operate with a single supply. VOCM defaults to the midrail voltage, VCC/2. The differential output may be fed into a data converter. This method eliminates the use of a transformer in the circuit. If the ADC has a reference voltage output (Vref), then it is recommended to connect it directly to the VOCM of the amplifier using a bypass capacitor for stability. For proper operation, the input common-mode voltage to the input terminal of the amplifier should not exceed the common-mode input voltage range. VDD VCC 5V VIN + - AIN1 - + AIN2 VOCM 0.1 F AVDD DVDD AVSS Vref Figure 31. Fully-Differential Amplifier Using a Single Supply 14 Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com Some single-supply applications may require the input voltage to exceed the common-mode input voltage range. In such cases, the circuit configuration of Figure 32 is suggested to bring the common-mode input voltage within the specifications of the amplifier. VDD VCC Rf VCC RPU Rg VIN 5V VP V OCM - AIN1 - + AIN2 AVDD VOUT RPU VCC DVDD THS1206 0.1 F Rg VOUT + AVSS Vref Rf Figure 32. Circuit With Improved Common-Mode Input Voltage Equation 2 is used to calculate RPU: V -V P CC R + PU 1 1 V -V ) V -V IN P RG OUT P RF (2) DRIVING A CAPACITIVE LOAD Driving capacitive loads with high-performance amplifiers is not a problem as long as certain precautions are taken. The first is to realize that the THS413x has been internally compensated to maximize its bandwidth and slew rate performance. When the amplifier is compensated in this manner, capacitive loading directly on the output decreases the device phase margin leading to high-frequency ringing or oscillations. Therefore, for capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series with the output of the amplifier, as shown in Figure 33. A minimum value of 20 should work well for most applications. For example, in 50- transmission systems, setting the series resistor value to 50 both isolates any capacitance loading and provides the proper line impedance matching at the source end. 390 20 390 Output THS413x 20 390 Output 390 Figure 33. Driving a Capacitive Load Copyright (c) 2000-2011, Texas Instruments Incorporated 15 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com ACTIVE ANTIALIAS FILTERING For signal conditioning in ADC applications, it is important to limit the input frequency to the ADC. Low-pass filters can prevent the aliasing of the high-frequency noise with the frequency of operation. Figure 34 presents a method by which the noise may be filtered in the THS413x. C1 R2 VCC R4 + VIN- - VIN+ THS413x - + C2 Vs C3 R3 R1 + THS1050 VIN- VOCM VOCM R3 R1 VIN+ R(t) C3 VIC R4 VCC- + C1 R2 Figure 34. Antialias Filtering The transfer function for this filter circuit is: Rt 2R4 ) Rt K x H (f) + d f 2 1 jf 1 ) j2fR4RtC3 - ) 1 ) 2R4 ) Rt FSF x fc Q FSF x fc 2 x R2R3C1C2 1 FSF x fc + and Q + R3C1 ) R2C1 ) KR3C1 2 2 x R2R3C1C2 Where K + R2 R1 (3) (4) K sets the pass band gain, fc is the cutoff frequency for the filter, FSF is a frequency scaling factor, and Q is the quality factor. FSF + Re 2 ) |Im| 2 and Q + Re 2 ) |Im| 2Re 2 (5) where Re is the real part, and Im is the imaginary part of the complex pole pair. Setting R2 = R, R3 = mR, C1 = C, and C2 = nC results in: 2 x mn 1 FSF x fc + and Q + 1 ) m(1 ) K) 2RC 2 x mn (6) Start by determining the ratios, m and n, required for the gain and Q of the filter type being designed, then select C and calculate R for the desired fc. 16 Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com PRINCIPLES OF OPERATION THEORY OF OPERATION The THS413x is a fully-differential amplifier. Differential amplifiers are typically differential in/single out, whereas fully-differential amplifiers are differential in/differential out. THS413x Fully differential Amplifier VCC+ Differential Amplifier Rf R(g) _ _ VIN- VIN+ + + R(g) Rf VO+ + _ VO- VOCM VCC- Figure 35. Differential Amplifier Versus a Fully-Differential Amplifier To understand the THS413x fully-differential amplifiers, the definition for the pin outs of the amplifier are provided. Input voltage definition V Output voltage definition V Transfer function V ID + VI) - V I- VO) - VO- OD + OD + V Output common mode voltage V V OC ID x A + V Differential Structure Rejects Coupled Noise at The Input VIN- VIN+ Differential Structure Rejects Coupled Noise at The Power Supply IC V + OC VI) ) VI- 2 + (7) VO) ) VO- 2 (8) f (9) OCM (10) Differential Structure Rejects Coupled Noise at The Output VCC+ _ + + _ VO+ VO- VOCM VCC- Figure 36. Definition of the Fully-Differential Amplifier Copyright (c) 2000-2011, Texas Instruments Incorporated 17 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com Figure 37 and Figure 38 depict the differences between the operation of the THS413x fully-differential amplifier in two different modes. Fully-differential amplifiers can work with differential input or can be implemented as single in/differential out. Rf VIN- VCC+ R(g) -+ Vs VO+ +- VIN+ VO- VOCM R(g) VCC- Rf Note: For proper operation, maintain symmetry by setting Rf1 = Rf2 = Rf and R(g)1 = R(g)2 = R(g) A = Rf/R(g) Figure 37. Amplifying Differential Signals Rf VIN- R(g) VCC+ RECOMMENDED RESISTOR VALUES VO+ -+ +- VIN+ Vs VO- VOCM R(g) GAIN R(g) Rf 1 2 5 10 390 374 402 402 390 750 2010 4020 VCC- Rf Figure 38. Single In With Differential Out If each output is measured independently, each output is one-half of the input signal when gain is 1. The following equations express the transfer function for each output: V + 1 V O 2 I (11) The second output is equal and opposite in sign: V + -1 V O 2 I 18 (12) Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com Fully-differential amplifiers may be viewed as two inverting amplifiers. In this case, the equation of an inverting amplifier holds true for gain calculations. One advantage of fully-differential amplifiers is that they offer twice as much dynamic range compared to single-ended amplifiers. For example, a 1-VPP ADC can only support an input signal of 1 VPP. If the output of the amplifier is 2 VPP, then it is not as practical to feed a 2-VPP signal into the targeted ADC. Using a fully-differential amplifier enables the user to break down the output into two 1-VPP signals with opposite signs and feed them into the differential input nodes of the ADC. In practice, the designer has been able to feed a 2-V peak-to-peak signal into a 1-V differential ADC with the help of a fully-differential amplifier. The final result indicates twice as much dynamic range. Figure 39 illustrates the increase in dynamic range. The gain factor should be considered in this scenario. The THS413x fully-differential amplifier offers an improved CMRR and PSRR due to its symmetrical input and output. Furthermore, second-harmonic distortion is improved. Second harmonics tend to cancel because of the symmetrical output. a VOD= 1-0 = 1 VCC+ +1 _ VIN- VIN+ + + _ VO+ 0 VO- +1 0 VOCM VOD = 0-1 = -1 VCC- b Figure 39. Fully-Differential Amplifier With Two 1-VPP Signals Similar to the standard inverting amplifier configuration, input impedance of a fully-differential amplifier is selected by the input resistor, R(g). If input impedance is a constraint in design, the designer may choose to implement the differential amplifier as an instrumentation amplifier. This configuration improves the input impedance of the fully-differential amplifier. Figure 40 depicts the general format of instrumentation amplifiers. The general transfer function for this circuit is: V R OD f 1 ) 2R2 + R R1 V -V (g) IN1 IN2 (13) THS4012 R(g) + _ VIN1 Rf R2 _ R1 THS413x + R2 _ + VIN2 THS4012 R(g) Rf Figure 40. Instrumentation Amplifier Copyright (c) 2000-2011, Texas Instruments Incorporated 19 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com CIRCUIT LAYOUT CONSIDERATIONS To achieve the levels of high-frequency performance of the THS413x, follow proper printed-circuit board (PCB) high-frequency design techniques. A general set of guidelines is given below. In addition, a THS413x evaluation board is available to use as a guide for layout or for evaluating the device performance. * Ground planes--It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. * Proper power-supply decoupling--Use a 6.8-F tantalum capacitor in parallel with a 0.1-F ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1-F ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1-F capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. * Sockets--Sockets are not recommended for high-speed operational amplifiers. The additional lead inductance in the socket pins often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board are the best implementation. * Short trace runs/compact part placements--Optimum high-frequency performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance at the input of the amplifier. * Surface-mount passive components--Using surface-mount passive components is recommended for high-frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. 20 Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com POWER-DOWN MODE The power-down mode is used when power saving is required. The power-down terminal (PD) found on the THS413x is an active low terminal. If it is left as a no-connect terminal, the device always stays on due to an internal 50 k resistor to VCC. The threshold voltage for this terminal is approximately 1.4 V above VCC-. This means that if the PD terminal is 1.4 V above VCC-, the device is active. If the PD terminal is less than 1.4 V above VCC-, the device is off. For example, if VCC- = -5 V, then the device is on when PD reaches -3.6 V, (-5 V + 1.4 V = -3.6 V). By the same calculation, the device is off below -3.6 V. It is recommended to pull the terminal to VCC- in order to turn the device off. Figure 41 shows the simplified version of the power-down circuit. While in the power-down state, the amplifier goes into a high-impedance state. The amplifier output impedance is typically greater than 1 M in the power-down state. VCC 50 k To Internal Bias Circuitry Control PD VCC- Figure 41. Simplified Power-Down Circuit Due to the similarity of the standard inverting amplifier configuration, the output impedance appears to be very low while in the power-down state. This is because the feedback resistor (Rf) and the gain resistor (R(g)) are still connected to the circuit. Therefore, a current path is allowed between the input of the amplifier and the output of the amplifier. An example of the closed loop output impedance is shown in Figure 42. Output Impedance - 2200 VCC = 5 V G=1 Rf = 1 k PD = VCC- 1200 200 100 k 1M 10 M 100 M f - Frequency - Hz 1G Figure 42. Output Impedance (In Power-Down) vs Frequency Copyright (c) 2000-2011, Texas Instruments Incorporated 21 THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com GENERAL PowerPAD DESIGN CONSIDERATIONS The THS413x is available packaged in a thermally-enhanced DGN package, which is a member of the PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is mounted (see Figure 43a and Figure 43b). This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package (see Figure 43c). Because this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal pad. The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat dissipating device. The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of the surface mount with the previously awkward mechanical methods of heatsinking. More complete details of the PowerPAD installation process and thermal management techniques can be found in the Texas Instruments Technical Brief, (PowerPAD Thermally-Enhanced Package SLMA002). This document can be found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering. DIE Side View (a) Thermal Pad DIE End View (b) A. Bottom View (c) The thermal pad (PowerPAD) is electrically isolated from all other pins and can be connected to any potential from VCC- to VCC+. Typically, the thermal pad is connected to the ground plane becase this plane tends to physically be the largest and is able to dissipate the most amount of heat. Figure 43. Views of Thermally-Enhanced DGN Package 22 Copyright (c) 2000-2011, Texas Instruments Incorporated THS4130 THS4131 SLOS318H - MAY 2000 - REVISED MAY 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (January 2010) to Revision H * Changed footnote A in Figure 43 ........................................................................................................................................ 22 Changes from Revision F (January 2006) to Revision G * Page Page Changed DGK package specifications in the Dissipation Rating table ................................................................................ 2 Copyright (c) 2000-2011, Texas Instruments Incorporated 23 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGKR ACTIVE VSSOP DGK 8 THS4130CDGKRG4 ACTIVE VSSOP DGK 8 THS4130CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130CDGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 1 Samples (Requires Login) THS4130CD TBD (3) Call TI Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp THS4130IDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4130IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 17-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp THS4131IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGN ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGNG4 ACTIVE MSOPPowerPAD DGN 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGNR ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDGNRG4 ACTIVE MSOPPowerPAD DGN 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS4131IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com (3) 17-Aug-2012 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing THS4130CDGNR MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4130IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4130IDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4130IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 THS4131CDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4131CDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4131CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 THS4131IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4131IDGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 THS4131IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) THS4130CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 THS4130IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 THS4130IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 THS4130IDR SOIC D 8 2500 367.0 367.0 35.0 THS4131CDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 THS4131CDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 THS4131CDR SOIC D 8 2500 367.0 367.0 35.0 THS4131IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 THS4131IDGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 THS4131IDR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated