© Semiconductor Components Industries, LLC, 2009
July, 2009 Rev. 7
1Publication Order Number:
SL05T1/D
SL05T1 Series
300 Watt, SOT-23 Low
Capacitance TVS for High
Speed Line Protections
This new family of TVS offers transient overvoltage protection with
significantly reduced capacitance. The capacitance is lowered by
integrating a compensating diode in series. This integrated solution
offers ESD protection for high speed interfaces such as communication
systems, computers, and computer peripherals.
Features
TVS Diode in Series with a Compensating Diode Offers <5 pF
Capacitance
ESD Protection Meeting IEC 6100042, 44, 45
Peak Power Rating of 300 W, 8 × 20 ms
BiDirection Protection Can Be Achieved By Using Two Devices
Flammability Rating UL 94 V0
PbFree Packages are Available
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
SOT23 (TO236)
CASE 318
STYLE 26
21
3
(NC)
1
2
3
Device Package Shipping
ORDERING INFORMATION
SL05T1 SOT23 3000/Tape & Reel
SL15T1 SOT23 3000/Tape & Reel
SL24T1 SOT23 3000/Tape & Reel
Lxx M G
G
MARKING
DIAGRAM
See specific marking information in the device marking
column of the table on page 3 of this data sheet.
DEVICE MARKING INFORMATION
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Lxx = Device Code
xx = 05, 12, 15, or 24
M = Date Code*
G= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SL24T1G SOT23
(PbFree)
3000/Tape & Reel
SL15T1G SOT23
(PbFree)
3000/Tape & Reel
SL05T1G SOT23
(PbFree)
3000/Tape & Reel
SL12T1G SOT23
(PbFree)
3000/Tape & Reel
SL05T1 Series
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation @ 8x20 usec (Note 1)
@ TL 25°C
Ppk 300 W
IEC 6100042 Level 4
Contact Discharge
Air Discharge
IEC 6100044 EFT
IEC 6100045 Lightning
Vpp
±8
±16
40
12
kV
kV
A
A
Total Power Dissipation on FR5 Board (Note 2) @ TA = 25°C
Derate above 25°C
°PD°225
1.8
°mW°
mW/°C
Thermal Resistance Junction to Ambient RqJA 556 °C/W
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C
Derate above 25°C
°PD°300
2.4
°mW
mW/°C
Thermal Resistance JunctiontoAmbient RqJA 417 °C/W
Junction and Storage Temperature Range TJ, Tstg 55 to +150 °C
Lead Solder Temperature Maximum (10 Second Duration) TL260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Nonrepetitive current pulse per Figure 2
2. FR5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
UNIDIRECTIONAL
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
QVBR Maximum Temperature Coefficient of VBR
IFForward Current
VFForward Voltage @ IF
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
UniDirectional TVS
IPP
IF
V
I
IR
IT
VRWM
VCVBR
VF
SL05T1 Series
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3
ELECTRICAL CHARACTERISTICS
Device
Device
Marking
VRWM IR @ VRWM
Breakdown Voltage
(Note 4)
VC, Clamping Voltage
(Note 5) Max
IPP
Capacitance
VBR @ 1 mA (Volts) @ 1 A @ 5 A @ VR = 0 V, 1 MHz (pF)
(V) (mA) Min Max (V) (V) (A) Typ Max
SL05 L05 5.0 20 6.0 8.0 9.8 11 17 3.5 5.0
SL12 L12 12 1.0 13.3 15.5 19 24 12 3.5 5.0
SL15 L15 15 1.0 16.7 18.5 24 30 10 3.5 5.0
SL24 L24 24 1.0 26.7 29 43 55 5.0 3.5 5.0
4. VBR measured at pulse test current of 1 mA at an ambient temperature of 25°C
5. Surge current waveform per Figure 2
TYPICAL CHARACTERISTICS
0.1 10
10
Figure 1. Maximum Peak Power Rating
1
PULSE WIDTH (ms)
100 1000
1
0.1
0.01
Figure 2. 8 × 20 ms Pulse Waveform
PPK, PEAK POWER (kW)
100
90
80
70
60
50
40
30
20
10
00204060
t, TIME (ms)
% OF PEAK PULSE CURRENT
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
PEAK VALUE IRSM @ 8 ms
HALF VALUE IRSM/2 @ 20 ms
80
Figure 3. Typical Junction Capacitance
55 25 150
10
1
0.1
0.01
Figure 4. Typical Leakage Over Temperature
TEMPERATURE (°C)
@ 50% VRWM
4
3.5
3
2
1.5
0.5
0
C, CAPACITANCE (pF), 1 MHz FREQ.
2.5
1
@ ZERO BIAS @ VRWM
SL05
SL15
SL24
LEAKAGE (mA)
SL05T1
SL05T1 Series
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4
Applications Background
This new family of TVS devices (SL05T1 series) are
designed to protect sensitive electronics such as
communications systems, computers, and computer
peripherals against damage due to ESD conditions or
transient voltage conditions. Because of their low
capacitance value (less than 5 pF), they can be used in high
speed I/O data lines. Low capacitance is achieved by
integrating a compensating diode in series with the TVS
which is basically based in the below theoretical principle:
Capacitance in parallel: CT = C1+C2+....+Cn
Capacitance in series: 1/CT = (1/C1)+(1/C2)+....+(1/Cn)
The Figure 5 shows the integrated solution of the SL05T1
series device:
Figure 5.
COMPENSATING
DIODE
TVS
In the case that an overvoltage condition occurs in the I/O
line protected by the SL05T1 series device, the TVS is
reversedbiased while the compensation diode is
forwardbiased so the resulting current due to the transient
voltage is drained to ground.
If protection in both polarities is required, an additional
device is connected in inverseparallel with reference to the
first one, the Figure 6 illustrates the inverseparallel
connection for bidirectional or unidirectional lines:
Figure 6.
3
2
1
3
2
1
An alternative solution to protect unidirectional lines, is to
connect a fast switching steering diode in parallel with the
SL05T1 series device. When the steering diode is
forwardbiased, the TVS will avalanche and conduct in
reverse direction. It is important to note that by adding a
steering diode, the effective capacitance in the circuit will be
increased, therefore the impact of adding a steering diode
must be taken in consideration to establish whether the
incremental capacitance will affect the circuit functionality
or not. The Figure 7 shows the connection between the
steering diode and the SL05T1 series device:
Figure 7.
STEERING DIODE
SL05T1 DEVICE
Another typical application in which the SL05T1 series
device can be utilized, is to protect multiple I/O lines. The
protection in each of the I/O lines is achieved by connecting
two devices in inverseparallel. The Figure 8 illustrates how
multiple I/O line protection is achieved:
Figure 8.
OUTPUTINPUT
For optimizing the protection, it is recommended to use ground planes and short path lengths to minimize the PCB’s ground inductance.
SL05T1 Series
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5
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
ǒmm
inchesǓ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
q
e
EE
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b0.37 0.44 0.50 0.015
c0.09 0.13 0.18 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
STYLE 26:
PIN 1. CATHODE
2. ANODE
3. NO CONNECTION
2.10 2.40 2.64 0.083 0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.029
c
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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USA/Canada
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Phone: 421 33 790 2910
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Phone: 81357733850
SL05T1/D
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