TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 1 of 34
3901008056
June 2012
Rev 014
Features
Fully compliant to GMW3089 V2.4 and J2411 Single Wire CAN specification for Class B
in-vehicle communications
Only 60 µA worst case sleep mode current independent from CAN voltage range
Operating voltage range 5V to 26.5V
Up to 40 kbps bus speed
Up to 100 kbps high-speed transmission mode
Logic inputs compatible with 3.3V and 5V supply systems
Control pin for external voltage regulators
Low RFI due to output wave shaping in normal and high voltage wake up mode
Fully integrated receiver filter
Bus terminals proof against short-circuits and transients in automotive environment
Loss of ground protection, very low leakage current (typ. 20µA at 26.5V and 125°C)
Protection against load dump, jump start
Thermal overload and short circuit protection
Under voltage lockout
Bus dominant time-out feature
Pb-Free 14-pin thermally enhanced and 8-pin SOIC package
Ordering Code
Product Code Temperature Code Package Code Option Code Packing Form Code
TH8056 K DC AAA-008 TU
TH8056 K DC AAA-008 RE
TH8056 K DC AAA-014 TU
TH8056 K DC AAA-014 RE
Legend:
Temperature Code: K for Temperature Range -40°C to 125°C
Package Code: DC for SOIC150Mil
Option Code: XXX-008 for 8 Leads, XXX-014 for 14 Leads.
Packing Form: RE for Reel, TU for Tube
Ordering example: TH8056KDC-AAA-008-TU
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 2 of 34
3901008056
June 2012
Rev 014
General Description
The TH8056 is a physical layer device for a single wire data link capable of operating with various CSMA/CR protocols
such as the Bosch Controller Area Network (CAN) version 2.0. This serial data link network is intended for use in
applications where a high data rate is not required and a lower data rate can achieve cost reductions in both the physical
media components and the microprocessor and/or dedicated logic devices that use the network.
The network shall be able to operate in either the normal data rate mode or the high-speed data download mode for
assembly line and service data transfer operations. The high-speed mode is only intended to be operational when the
bus is attached to an off-board service node. This node shall provide temporary bus electrical loads which facilitate
higher speed operation.
The bit rate for normal communications is typically 33.33kbit/s, for high-speed transmissions as described above a typical
bit rate of 83.33kbit/s is recommended. The TH8056 is designed in accordance with the Single Wire CAN Physical Layer
Specification GMW3089 V2.4 and supports many additional features like under-voltage lock-out, time-out for faulty
blocked
input signals, output blanking time in case of bus ringing and a very low sleep mode current.
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 3 of 34
3901008056
June 2012
Rev 014
Contents
1.
Functional Diagram .................................................................................................... 5
2.
Electrical Specification .............................................................................................. 6
2.1
Operating Conditions ............................................................................................. 6
2.2
Absolute Maximum Ratings ................................................................................... 6
2.3
Static Characteristics ............................................................................................. 7
2.4
Dynamic Characteristics ........................................................................................ 9
2.5
Bus loading requirements .................................................................................... 10
2.6
Timing Diagrams ................................................................................................. 12
3.
Functional Description ............................................................................................. 14
3.1
TxD Input pin ....................................................................................................... 14
3.2
Mode 0 and Mode 1 pins ..................................................................................... 15
3.3
RxD Output pin .................................................................................................... 16
3.4
Bus LOAD pin ...................................................................................................... 16
3.5
V
bat
INPUT
pin .................................................................................................... 17
3.6
CAN BUS pin ....................................................................................................... 17
3.7
INH Pin (TH8056 KDC A only) ............................................................................. 17
3.8
State Diagram ...................................................................................................... 19
3.9
Power Dissipation ................................................................................................ 20
3.9.1.
Thermal behaviour of TH8056 with SOIC8 – TH8056 KDC A8 .................... 21
3.10
Application Circuitry ............................................................................................. 23
4.
Pin Description ......................................................................................................... 24
5.
Package Dimensions ................................................................................................ 26
5.1
SOIC14 ................................................................................................................ 26
5.2
SOIC8 .................................................................................................................. 27
6.
Tape and Reel Specification .................................................................................... 28
6.1
Tape Specification ............................................................................................... 28
6.2
Reel Specification for SOIC14NB ........................................................................ 29
7.
ESD/EMC Remarks ................................................................................................... 30
7.1
General Remarks ................................................................................................ 30
7.2
ESD-Test ............................................................................................................. 30
7.3
EMC .................................................................................................................... 30
7.4
Latch Up Test ...................................................................................................... 30
8.
Revision History ....................................................................................................... 31
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 4 of 34
3901008056
June 2012
Rev 014
9.
Standard information regarding manufacturability of Melexis products with
different soldering processes ......................................................................................... 33
10.
Disclaimer .............................................................................................................. 34
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 5 of 34
3901008056
June 2012
Rev 014
1.
Functional Diagram
Figure 1 - Block Diagram
TxD
MODE0
RxD
CANH
MODE
CONTROL
MODE1
Time Out
Wave Shaping
CAN Driver
Reverse
Current
Protection
Biasing&
V
BAT
Monitor
V
BAT
5V Supply &
References
Reverse
Current
Protection
Feedback-
Loop
Loss of
Ground
Detection
Receive
Comparator
Input
Filter
RCOsc
TH8056
RxD Blanking
Time Filter
GND
LOAD
INH *
Wake up filter
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 6 of 34
3901008056
June 2012
Rev 014
* INH terminal is present on TH8056 KDC A only
2.
Electrical Specification
All voltages are referenced to ground (GND). Positive currents flow into the IC.
The absolute maximum ratings (in accordance with IEC 134) given in the table below are limiting values that
do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term
exposure to limiting values may affect the reliability of the device.
2.1 Operating Conditions
Parameter Symbol Min Max Unit
Battery voltage V
BAT
5.0 18 V
Operating ambient temperature
for TH8056 KDC A
T
A
-
40
°C
Junction temperature T
J
-40 150 °C
2.2 Absolute Maximum Ratings
Parameter Symbol Condition Min Max Unit
Supply Voltage
V
BAT
-
0.3
18
V
Short-term supply voltage V
BAT.ld
Load dump; t<500ms
40
V
Jump start; t<1min
26.5
Transient supply voltage
V
BAT.tr1
ISO 7637/1 pulse 1
[1]
-
50
V
Transient supply voltage
V
BAT..tr2
ISO 7637/1
pulses 2
[1]
V
Transient supply voltage
V
BAT..tr3
ISO 7637/1 pulses 3A, 3B
-
200
V
CANH voltage V
CANH
V
BAT
<=
26.5V
-
20
40
V
V
BAT
= 0
-
40
40
Transient bus voltage
V
CANH..tr1
ISO 7637/1 pulse 1
[2]
-
50
V
Transient bus voltage
V
CANH.tr2
ISO
7637/1 pulses 2
[2]
V
Transient bus voltage
V
CANH.tr3
ISO 7637/1 pulses 3A, 3B
[2]
-
200
V
DC voltage on pin LOAD V
LOAD
via R
T
> 2kΩ -40 40 V
DC voltage on pins TxD, MODE1, MODE0,RxD,
V
DC
-
0.3
7
V
ESD capability of any pin (Human Body Model) ESD
HBM
Human body model,
equivalent to discharge
100pF with 1.5kΩ,
-2 2 kV
Maximum latch
–
up free current at any Pin
I
LATCH
-
500
mA
Thermal impedance
[3]
Θ
JA
in free air
, SOIC14
70
K/W
in free air, SOIC8
Storage temperature
T
stg
-
55
°C
Junction temperature
T
vj
-
40
°C
[1]
ISO 7637 test pulses are applied to VBAT via a reverse polarity diode and >1uF blocking capacitor .
[2]
ISO 7637 test pulses are applied to CANH via a coupling capacitance of 1 nF.
[3]
The application board shall be realized with a ground copper foil area >150mm2 (low conductance board in accordance to
JEDEC51-7)
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 7 of 34
3901008056
June 2012
Rev 014
2.3 Static Characteristics
Unless otherwise specified all values in the following tables are valid for V
BAT
= 5V to 26.5V and T
AMB
=-40°C
to 125
o
C. All voltages are referenced to ground (GND), positive currents flow into the IC.
Parameter Symbol Condition Min Typ Max Unit
PIN VBAT
Operating supply voltage
V
BAT
6
12
18
V
Low battery operating supply voltage
V
BAT_L
except
high
-
speed
/
sleep mode
5
6
V
Short duration Operating supply voltage V
BAT_JS
T<1min, T
amb
< 85°C
(except high-speed mode) 18 26.5 V
Under
-
voltage lock
-
out
V
BATuv
4.
0
4.8
V
Supply current, recessive, all active modes
I
BAT
V
BAT
= 18V , TxD open
5
8
mA
Normal mode supply current, dominant I
BATN [2]
V
BAT
=
26.5V
MODE0=MODE1=H TxD=L,
R
load
= 200Ω
30 35 mA
High-speed mode supply current, dominant I
BATH [2]
V
BAT
= 16
V
MODE0=H,MODE1=L,TxD=L,
R
load
= 75Ω
60 75 mA
Wake-up mode supply current, dominant I
BATW [2]
V
BAT
=
26.5V
MODE0=L,MODE1=H, TxD=L,
R
load
= 200Ω
60 75 mA
Sleep
mode supply current
I
BATS
V
BAT
=1
3
V,
T
amb
< 85°C
4
0
6
0
µA
PIN CANH
Bus output voltage, low battery V
oh_l
R
L
> 200Ω,
Normal, high-speed mode,
5V < V
BAT
< 6V
3.4 5.1 V
Bus output voltage V
oh
R
L
> 200Ω, Normal mode,
6V < V
BAT
< 26.5V 4.4 5.1 V
Bus output voltage, high-speed mode V
oh
R
L
> 75Ω, high-speed mode,
8V < V
BAT
< 16V 4.2 5.1 V
Fixed Wake-up Output High Voltage V
ohWuFix
Wake-up mode, R
L
> 200Ω,
11.2V < V
BAT
< 26.5V 9.9 12.5 V
Offset Wake-up Output High Voltage V
ohWuOffset
Wake-up mode, R
L
> 200Ω,
5V < V
BAT
< 11.2V V
BAT
– 1.5
V
BAT
V
Recessive state output voltage V
ol
Recessive state or sleep mode,
R
load
= 6.5
kΩ, -0.2 0.20 V
Bus short circuit current -I
CAN_SHORT
V
CANH
= 0V, V
BAT
=
26.5V
,
TxD = 0V 50 350 mA
Bus leakage current during loss of ground
I
LKN_CAN[1]
Loss of ground, V
CANH
= 0V
-
50
10
µA
Bus leakage current, bus positive
I
LKP_CAN
TxD high;
-
10
10
µA
Bus input threshold
V
ih
Normal, high
-
speed mode
2.0
2.1
2.2
V
Bus input threshold low battery
V
ihlb
Normal mode 5V<V
BAT
<6V
1.6
1.7
2.2
V
Fixed Wake
-
up Input High Voltage
Threshold V
i
hWuFix
[2]
Sleep mode, V
BAT
> 11.2V 6.6 7.9 V
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 8 of 34
3901008056
June 2012
Rev 014
Parameter Symbol Condition Min Typ Max Unit
Offset Wake
-
up Input High Voltage
Threshold V
ihWuOffset
[2]
Sleep mode V
BAT
-4.3 V
BAT
-3.25
V
PIN LOAD
Voltage on switched ground pin V
LOAD
I
LOAD
=
1
mA
, all active modes
and sleep mode 0.1 V
Voltage on switched ground pin
V
LOAD_LOB
I
LOAD
= 7mA , V
BAT
= 0V
1
V
Load resistance during loss of battery R
LOAD_LOB
V
BAT
= 0
R
LOAD
-10%
R
LOAD
+35% Ω
PIN TXD,MODE0,MODE1
High level input voltage
V
ih
2.0
V
Low level input voltage
V
il
0.65
V
TxD pull
-
up current
-
I
IL_TXD
TxD = L, MODE0 and 1 = H
20
50
µA
MODE pull-down resistor R
MODE_pd
20 50 kΩ
PIN RXD
Low
level output voltage
V
ol_rxd
I
RxD
= 2mA
0.4
V
High level output leakage
I
ih_rxd
V
RxD
= 5V
-
10
10
µA
RxD output current
I
rxd
V
RxD
= 5V
70
mA
PIN INH
High level output voltage
V
oh_INH
I
INH
=
-
180µA
V
S
-
0.8V
V
S
-
0.5V
V
Leakage current
I
INH_lk
Mode0/1 = L ,V
INH
= 0V
-
5
5
µA
Over
-
temperature Protection
Thermal shutdown
T
sd [2]
°C
Thermal recovery
T
rec [2]
°C
[1]
Leakage current in case of loss of ground is the sum of both currents I
LKN_CAN
and
I
LKN_LOAD
.
[2]
Thresholds are
not tested in production, but characterized and guaranteed by design
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 9 of 34
3901008056
June 2012
Rev 014
2.4 Dynamic Characteristics
Unless otherwise specified all values in the following table are valid for V
BAT
= 5V to 26.5V and T
AMB
= -40°C
to 125
o
C.
Parameter Symbol Condition Min Typ Max Unit
Transmit delay in normal
wake
-
up
mode, rising edge t
Tr [1]
min and max loads acc.
T
o
2.5 Bus loading requirements 2 6.3 µs
Transmit delay in wake
-
up mode to V
ihWU
,
rising edge t
TWUr [2]
min and max loads acc.
T
o
2.5 Bus loading requirements 3 18 µs
Transmit delay in normal mode,
falling edge t
Tf [3]
min and max loads acc.
T
o
2.5 Bus loading requirements 1.8 10 µs
Transmit delay in wake
-
up mode,
falling edge t
TWU1f [3]
min and max loads acc.
T
o
2.5 Bus loading requirements 3 13.7 µs
Transmit delay in high
-
speed mode,
rising edge t
THSr [4]
min and max loads acc.
T
o
2.5 Bus loading requirements 0.1 1.5 µs
Transmit delay in high
-
speed mode,
falling edge t
THSf[5]
min and max loads acc.
T
o
2.5 Bus loading requirements 0.04 3 µs
Receive delay , all active modes t
DR [6]
CANH high to low transition 0.2 1 µs
Receive delay , all active modes t
RD [6]
CANH low to high transition 0.2 1 µs
Input minimum pulse length, all active
modes t
mpDR [6]
CANH high to low transition 0.1 1 µs
Input minimum pulse length, all active
modes t
mpRD [6]
CANH low to high transition 0.1 1 µs
Wake-up filter time delay t
WUF
See diagrams, Figure 3 10 70 µs
Receive blanking time after
TxD L-H
transition t
rb
See diagrams, Figure 4 0.5 6 µs
TxD time-out reaction time t
tout
All active modes 10 30 ms
Delay from Normal to
High
-
speed
/HVWU
Mode t
dnhs
30 ms
Delay from
High
-
speed
/HVWU to Normal
Mode t
dhsn
30 ms
Delay from Normal Mode to Standby t
dsby
V
BAT
= 6V to 26.5V 500 µs
Delay from Standby to Sleep Mode t
dsleep
V
BAT
= 6V to 26.5V 100 500 ms
Delay from Sleep to normal Mode t
dsnwu
V
BAT
= 6V to 26.5V 50 ms
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 10 of 34
3901008056
June 2012
Rev 014
[1]
The maximum signal delay time for a bus rising edge is measured from V
cmos il
on the TxD input pin to the V
ihMax
+ V
g off
max
level on CANH at maximum network time constant , minimum signal delay time for a bus rising edge is measured from V
cmos ih
on the TxD input pin to 1V on CANH at minimum network time constant .These definitions are valid in both normal and HVWU
mode
[2]
The maximum signal delay time for a bus rising edge in HVWU mode is measured from V
cmos il
on the TxD input pin to the
V
ihWUMax
+ V
g off
max level on CANH at maximum network time constant, minimum signal delay time for a bus rising edge is
measured from V
cmos ih
on the TxD input pin to 1V on CANH at minimum network time constant
[3]
Maximum signal delay time for a bus falling edge is measured from V
cmos ih
on the TxD input pin to 1V on CANH at maximum
network time constant, minimum signal delay time for a bus falling edge is measured from V
cmos ih
on the TxD input pin to the
V
ihMax
+ V
g off
max level on CANH. These definitions are valid in both normal and HVWU mode.
[4]
The signal delay time in high-speed mode for a bus rising edge is measured from V
cmos il
on the TxD input pin to the V
ihMax
+ V
g
off
max level on CANH at maximum high-speed network time constant.
[5]
The signal delay time in high-speed mode for a bus falling edge is measured from V
cmos ih
on the TxD input pin to 1V on CANH
at maximum high-speed network time constant
[6]
Receive delay time is measured from the rising / falling edge crossing of the nominal Vih value on CANH to the falling
(Vcmos_il_max) / rising (Vcmos_ih_min) edge of RxD. This parameter is tested by applying a square wave signal to CANH.
The minimum slew rate for the bus rising and falling edges is 50V/us. The low level on bus is always 0V. For normal mode
and high-speed mode testing the high level on bus is 4V. For HVWU mode testing the high level on bus is Vbat – 2V.
2.5 Bus loading requirements
Parameter Symbol Min Typ Max Unit
Number of system nodes 2 32
Network distance between any two ECU nodes Bus length 60 M
Node Series Inductor Resistance (if required) R
ind
3.5 Ohm
Ground Offset Voltage V
goff
1.3 V
Ground Offset Voltage, low battery
V
gofflb
0.1 V
BAT
0.6
V
Device Capacitance (unit load) C
ul
135 150 300 pF
Network Total Capacitance C
tl
396 19000 pF
Device Resistance (unit load) R
ul
6435 6490 6665 Ohm
Device Resistance (min load) R
min
2000 Ohm
Network Total Resistance R
tl
200 3332 Ohm
High-Speed Mode Network Resistance to GND R
load
75 135 Ohm
Network Time Constant
[1]
τ
1 4 µs
Network Time Constant, high-speed mode
[1]
τ
1.5 µs
[1]
The network time constant incorporates the bus wiring capacitance. The minimum value is selected to limit radiated emissions. The
maximum value is selected to ensure proper communication under all communication modes. Not all combinations of R and C are
possible. The following load conditions are used for the measurement of the dynamic characteristics:
Normal
and
high volt.
W
ake
-
up
mode
High
-
speed
mode
min.load/min tau 3.3KΩ/ 540pF Additional 140
Ω tool resistance to
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 11 of 34
3901008056
June 2012
Rev 014
min.load/max tau 3.3KΩ/ 1.2nF ground in parallel
max.load/min tau 200Ω/ 5nF Additional 120
Ω tool resistance to
ground in parallel
max.load/max tau 200Ω/ 20nF
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 12 of 34
3901008056
June 2012
Rev 014
2.6 Timing Diagrams
Figure 2 – Input / Output Timing
t
T
V
RxD
V
CANH
V
TxD
1V
V
ih
max + V
goff
max
t
D
t
DR
50%
50%
t
R
t
F
t
t
t
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 13 of 34
3901008056
June 2012
Rev 014
Figure 3 – Wake-up Filter Time Delay
V
RxD
V
CANH
t
WU
t
t
V
ih
+V
goff
t
WU
< t
WuF
t
Wu
t
WuF
wake up
interrupt
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 14 of 34
3901008056
June 2012
Rev 014
Figure 4 – Receive Blanking Time
3.
Functional Description
3.1 TxD Input pin
Logic command to transmit on the single wire CAN bus
TxD Polarity
TxD = logic 1 (or floating) on this pin produces an undriven or recessive bus state (low bus voltage)
TxD = logic 0 on this pin produces either a bus normal or a bus high-voltage dominant state
depending on the transceiver mode state (high bus voltage)
If the TxD pin is driven to a logic low state while Mode 0,1 pins are in the 0,0 or sleep state, the transceiver
cannot drive the CAN Bus pin to the dominant state.
The transceiver provides an internal pull up on the TxD pin, which will cause the transmitter to default to the
bus recessive state, when TxD is not driven.
TxD input signals are standard CMOS logic levels for 3.3V and 5V supply voltages.
V
RxD
V
CANH
V
TxD
V
ih
t
rb
50%
t
t
t
50%
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 15 of 34
3901008056
June 2012
Rev 014
Time-out feature
In case of a faulty blocked dominant TxD input signal the CANH output is switched off automatically after the
specified TxD time-out reaction time to prevent a dominant bus. The transmission is continued by next TxD L
to H transition without delay.
3.2 Mode 0 and Mode 1 pins
Select transceiver operating modes
The transceiver provides a weak internal pull-down current on each of these pins, which causes the
transceiver to default to sleep mode when they are not driven. The Mode input signals are standard CMOS
logic level for 3.3V and 5V supply voltages.
M0
M1
Mode
L L Sleep Mode
H L High-Speed
L H High-Voltage Wake-Up
H H Normal Mode
Figure 5 – Truth Table
Mode 0 = 0, Mode 1 = 0 – Sleep mode
Transceiver is in low-power state, waiting for wake-up via high-voltage signal or by mode pins change to any
state other than 0,0. In this state, the CAN Bus pin is not in the dominant state regardless of the state of the
TxD pin.
Mode 0 = 1, Mode 1 = 0 – High-Speed mode
This mode allows high-speed download with bitrates up to 100Kbit/s. The output waveshaping circuit is
disabled in this mode. Bus transmitters which require communicating in high-speed mode are able to drive
reduced bus resistance during this mode.
Note: High-speed mode is only allowed with connected tool resistance in parallel to the network load. Otherwise the stability of the
output signal is not guaranteed because of the slew rate enhancement for the required rise times .
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 16 of 34
3901008056
June 2012
Rev 014
Mode 0 = 0, Mode 1 = 1 – Transmit with high voltage signals to wake up remote nodes (HVWU)
This bus includes a selective node awake capability, which allows normal communication to take place
among some nodes while leaving the other nodes in an undisturbed sleep state. This is accomplished by
controlling the signal voltages such that all nodes must wake up when they receive a higher voltage
message signal waveform. The communication system communicates to the nodes information as to which
nodes are to stay operational (awake) and which nodes are to put themselves into a non-communicating
low-power “sleep” state. Communication at the lower, normal voltage levels does not disturb the sleeping
nodes.
Mode 0 = 1, Mode 1 = 1 – Normal speed and signal voltage mode
Transmission bit rate in normal communication is 33.333 Kbits/sec. In normal transmission mode the
TH8056 supports controlled waveform rise and overshoot times. Waveform trailing edge control is required
to assure that high frequency components are minimized at the beginning of the downward voltage slope.
The remaining fall time occurs after the bus is inactive with drivers off and is determined by the RC time
constant of the total bus load.
3.3 RxD Output pin
Logic data as sensed on the single wire CAN bus
RxD polarity
RxD = logic 1 on this pin indicates a bus recessive state (low bus voltage)
RxD = logic 0 on this pin indicates a bus normal or high-voltage bus dominant state
RxD in Sleep Mode
RxD does not pass signals to the micro processor while in sleep mode until a valid wake-up bus voltage level
is received or the Mode 0, 1 pins are not 0,0 respectively. When the valid wake-up bus signal awakens the
transceiver, the RxD pin signalizes an interrupt (logic 0 for dominant high-voltage signal). If there is no mode
change within the time stated, the transceiver reenters the sleep mode as described in 3.7
When not in sleep mode all valid bus signals will be sent out on the RxD pin.
RxD Typical Load
Resistance: 2.7 kohms
Capacitance: < 25 pF
3.4 Bus LOAD pin
Resistor ground with internal open-on-loss-of-ground protection
When the ECU experiences a loss of ground condition, this pin is switched to a high impedance state.
The ground connection through this pin is not interrupted in any transceiver operating mode including the
sleep mode. The ground connection is interrupted only when there is a valid loss of ground condition.
This pin provides the bus load resistor with a path to ground which contributes less than 0.1 volts to the bus
offset voltage when sinking the maximum current through one unit load resistor.
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 17 of 34
3901008056
June 2012
Rev 014
The transceiver’s maximum bus leakage current contribution to V
ol
from the LOAD pin when in a loss of
ground state is 50 uA over all operating temperatures and 3.5 V < V
batt
< 26.5V.
3.5 V
bat
INPUT
pin
Vehicle Battery Voltage
The transceiver is fully operational as described in chapter 2 over the range 6V<V
bat IC
<18V as measured
between the GND pin and this pin.
For 5V < V
bat IC
< 6V the bus operates in normal mode with reduced dominant output voltage and reduced
receiver input voltage. High voltage wake-up call is not possible (dominant output voltage is the same as in
normal or high-speed mode).
The transceiver operates in normal mode and high-voltage wake-up mode if 18V < V
bat IC
< 26.5V at 85°C for
one minute.
For 0V< V
bat IC
< 4.8V, the bus is passive (not driven dominantly) and RxD is undriven (high), regardless of
the state of the TxD pin (under-voltage lock-out).
3.6 CAN BUS pin
Bus Input/Output
Wave Shaping in normal and HVWU mode
Wave shaping is incorporated into the transmitter to minimize EMI radiated emissions. An important
contributor to emissions is the rise and fall times during output transitions at the “corners” of the voltage
waveform. The resultant waveform is one half of a sine wave of frequency 50 – 65 kHz at the rising
waveform edge and one quarter of this sine wave at falling or trailing edge.
Short circuits
If the CAN BUS pin is shorted to ground for any duration of time, the current is limited to the specified value,
until an over-temperature shut-down circuit disables the output high side drive source transistor (before the
local die temperature exceeds the damage limit threshold).
Loss of ground
In case of an ECU loss of ground condition, the LOAD pin is switched into high impedance state. The CANH
transmission is continued until the under-voltage lock-out voltage threshold is detected.
Loss of battery
In case of battery loss (VBAT = 0 or open) the transceiver does not disturb bus communication. The
maximum reverse current into power supply system doesn’t exceed 500µA.
3.7 INH Pin (TH8056 KDC A only)
This Pin is a high-voltage highside switch used to control the ECU’s regulated microcontroller voltage supply.
After power-on the transceiver automatically enters an intermediate standby mode, the INH output will
become HIGH (VBAT) and therefore the external voltage regulator will provide the Vcc supply for the ECU .
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 18 of 34
3901008056
June 2012
Rev 014
If there is no mode change within the time stated, the transceiver reenters the sleep mode and the INH
output goes to logic 0 (floating). When the transceiver has detected a valid wake-up condition (bus HVWU
traffic which exceeds the wake-up filter time delay) the INH output will become HIGH (VBAT) again and the
same procedure starts as described after power-on. In case of a mode change into any active mode the
sleep timer is stopped and INH keeps high (VBAT) level. If the transceiver enters the sleep mode (M0,1=0),
INH goes to logic 0 (floating) no sooner than 100ms when no wake-up signal is present.
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 19 of 34
3901008056
June 2012
Rev 014
3.8 State Diagram
Sleep Mode
M0/1 INH/CAN
low floating
V
BAT
on
V
BAT
standby
M0&1=>Low
M0/1 =>High
wake up
request
from Bus
M0/1 =>High
(if V
CC_ECU
on)
[1]
low after HVWU, high after V
BAT
on & V
CCECU
present
INH
low
M0/1
V
S
low
[1]
RxD
high /
Normal Mode
M0 INH
high V
BAT
M1
high
High Speed Mode
M0 INH
high V
BAT
M1
low
HVWU Mode
M0 INH
low V
BAT
M1
high
CAN
float.
after min. 100ms
-> no mode change
-> no valid wake up
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 20 of 34
3901008056
June 2012
Rev 014
Figure 6 – State Diagram
3.9 Power Dissipation
The TH8056 has an integrated protection against thermal overload. If the junction temperature reaches the
thermal shutdown threshold the TH8056 disables the transmitter driver to reduce the power dissipation to
protect the IC itself from thermal overload. The function of the transceiver will become again available if the
junction temperate drops below the thermal recovery temperature.
To secure a stable functioning within the application and to avoid a transmitter switch off due to thermal
overload under normal operating conditions, the application must take care of the maximum power
dissipation of the IC. The junction temperature can be calculated with:
T
J
= T
a
+ P
d
* θ
ja
T
J
Junction temperature
T
a
Ambient temperature
P
d
Dissipated power
θ
ja
Thermal resistance
The Junction temperature shouldn’t exceed under normal operating conditions the limit specified in chapter
2.3 Static Characteristics.
The power dissipation of an IC is the major factor determining the junction temperature. The TH8056
consumes current in different functions. A part of the supply current goes to the load and the other part
dissipates internally. The internal part has a constant passive part and an active part which depends on the
actual bus transmission. The complete internal part causes and increasing of the junction temperature.
P
tot
= P
INT_a
+ P
INT
_
P
P
INT_a
Internal power dissipation active
P
INT_p
Internal power dissipation passive
P
tot
Overall power dissipation
D Duty cycle for data transmission
The internal passive part can be calculated with the operating voltage and the normal mode supply current
recessive. The active part can be calculated with the voltage drop of the driving transistor and the current of
the CAN bus. The active part generates only during data transmission power dissipation. Therefore the duty
cycle has to be taken into account.
P
INT_p
= V
BAT
* I
BAT
P
INT_a
= (V
BAT
– V
CANH
) * I
load
* D
V
BAT
Battery supply voltage
I
BAT
Normal mode supply current recessive
I
load
Can network current
D Duty cycle for data transmission
V
CANH
Voltage at CANH pin
The power dissipation of the load can be calculated with the CANH voltage and the CAN bus current.
P
load
= V
CANH
* I
load
* D
where
I
load
= V
CANH
/ R
load_net
P
load
Power dissipation of the load resistor
I
load
Current of CAN network
V
CANH
Voltage at CANH pin
R
load_net
Network total resistance
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 21 of 34
3901008056
June 2012
Rev 014
Assumptions:
V
BAT
= 26.5V
R
load
= 6.49 kΩ
Network with 32 nodes
V
CANH
= 5.1V
I
BAT
= 6mA
D = 50%
T
a
= 125°C
Θ
JA
= 70k/W (Thermally enhanced SOIC14 package)
Computations:
R
load_net
= 6.49kΩ / 32nodes = 203Ω
I
load
= 5.1V / 203Ω = 25mA
P
load
= 5.1V * 25mA * 0.5 = 64mW
P
INT_a
= (26.5V – 5.1V) * 25mA * 0.5 = 267mW
P
INT_P
= 26.5V * 6mA = 159mW
P
tot
= 267mW + 159mW = 426mW
T
j
= 125°C + 426mW * 70k/W = 155°C
The above calculation shows that under worst case conditions (max. operating voltage, max bus load, max
ambient temperature) the TH8056 with the thermally enhanced SOIC14 package operates below the thermal
limit. A stable functioning is possible up to these limits.
3.9.1. Thermal behaviour of TH8056 with SOIC8 – TH8056 KDC A8
The thermal impedance of an SOIC8 package is about twice in comparison to the thermally enhanced
SOIC14 package. Therefore the maximum power dissipation within this package is only about the half.
The using of the SOIC8 version of TH8056 depends on the network architecture (number of nodes), the
max. ambient temperature and the needed functionality (using of INH pin).
The following diagram shows the relationship between junction temperature, ambient temperature and
number of nodes, which have to be taken into account for using the SOIC8 version.
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 22 of 34
3901008056
June 2012
Rev 014
Figure 7 – Save operating area of SOIC8 package
80
90
100
110
120
130
140
150
160
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
Number of Network Nodes
Junction Temperature
Save Operating Area
SOIC8 Package
U
BAT
= 26.5V; T
a
= 85°C
U
BAT
= 18V; T
a
= 105°C
U
BAT
= 26.5V; T
a
= 105°C
U
BAT
= 18V; T
a
= 125°C
U
BAT
= 26.5V; T
a
= 125°C
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 23 of 34
3901008056
June 2012
Rev 014
3.10 Application Circuitry
Figure 8 – Application Circuitry TH8056 KDC A
100nF
TxD
TH8056
CAN controller
RxD
MODE0
MODE1
V
BAT
Voltage regulator
+5V
V
BAT
ECU connector to
Single Wire CAN Bus
LOAD
CANH
GND
VBAT
47µH
6.49k
100pF
2.7k
ESD Protection -
TPSMA16A or
MMBZ27VCLT1 or
equivalent
10
11
12
5
3
4
21,7,8,14
V
BAT_ECU
[1]
[1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses)
9
INH
other loads
100pF
1k
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 24 of 34
3901008056
June 2012
Rev 014
Figure 9 – Application circuitry TH8056 KDC A8
4.
Pin Description
TH8056 KDC A
TH8056 KDC A8
100nF
TxD
TH8056
CAN controller
RxD
MODE0
MODE1
V
BAT
Voltage regulator
+5V
V
BAT
ECU connector to
Single Wire CAN Bus
LOAD
CANH
GND
VBAT
47µH
6.49k
100pF
2.7k
ESD Protection -
TPSMA16A or
MMBZ27VCLT1 or
equivalent
5
6
7
4
2
3
18
V
BAT_ECU
[1]
[1] recommended capacitance at VBAT_ECU > 1uF (immunity to ISO7637/1 test pulses)
other loads
100pF
1k
TH8056
1
2
3
4
8
TxD
VBATRXD
MODE0
GND
CANH
LOADMODE1
7
6
5
9
10
11
12
13
14GND
GNDGND
INH
N.C.
N.C.
TH8056
1
2
3
TxD
VBATRXD
MODE0
GND
CANH
LOADMODE1
4 5
6
7
8
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 25 of 34
3901008056
June 2012
Rev 014
Pin
TH8056 KDC A
Pin
TH8056 KDC A8 Name IO-Typ Description
1 - GND P Ground
2 1 TXD I Transmit data from MCU to CAN
3 2 MODE0 I Operating mode select input 0
4 3 MODE1 I Operating mode select input 1
5 4 RXD O Receive data from CAN to MCU
6 - N.C.
7 - GND P Ground
8 - GND P Ground
9 - INH O Control Pin for external voltage regulator (high voltage
high side switch)
10 5 VBAT P Battery voltage
11 6 LOAD O Resistor load (loss of ground low side switch )
12 7 CANH I/O Single wire CAN bus pin
13 - N.C.
14 8 GND P Ground
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 26 of 34
3901008056
June 2012
Rev 014
5.
Package Dimensions
5.1 SOIC14
Small Outline Integrated Circiut (SOIC),
SO
IC
14, 150 mil
A1 B C D E e H h L A
α
αα
α
ZD A2
All Dimension in mm, coplanarity < 0.1 mm
min
max
0.10
0.25
0.36
0.45
0.19
0.25
8.56
8.74
3.8
1
3.99
1.27
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0°
8°
0.51
1.37
1.57
All Dimension in inch, coplanarity < 0.004”
min
max
0.004
0.01
0.014
0.018
0.0075
0.0098
0.337
0.344
0.160
0.167
0.050
0.228
0.244
0.010
0.020
0.016
0.050
0.060
0.068
0°
8°
0.020
0.054
0.062
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 27 of 34
3901008056
June 2012
Rev 014
5.2 SOIC8
Small Outline Integrated Circiut (SOIC),
SO
IC
8
, 150 mil
A1 B C D E e H h L A α
αα
α ZD A2
All Dimension in mm, coplanarity < 0.1 mm
min
max
0.10
0.25
0.36
0.46
0.19
0.25
4
.
80
4.98
3.8
1
3.99
1.27
5.80
6.20
0.25
0.50
0.41
1.27
1.52
1.72
0°
8°
0.53
1.37
1.57
All Dimension in inch, coplanarity < 0.004”
min
max
0.004
0.0098
0.014
0.018
0.0075
0.0098
0.
0.196
0.1
5
0
0.157
0.050
0.228
4
0.244
0.0
0.0198
0.016
0.050
0.060
0.068
0°
8°
0.021
0.054
0.062
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 28 of 34
3901008056
June 2012
Rev 014
6.
Tape and Reel Specification
6.1 Tape Specification
Standard Reel with diameter of 13“
Package
Parts per Reel
Width
Pitch
SOIC14
30
00
16 mm
8 mm
SOIC8
30
00
12 mm
8 mm
D
0
E
P
0
P
2
T
max
T
1 max
G
1 min
G
2 min
B
1 max
D
1 min
F
P
1
R
min
T
2 max
W
SOIC14
1.5
+0.1
1.75
±0.1
4.0
±0.1
2.0
±0.1 0.6 0.1 0.75 0.75 12.1 1.5
7.5
±0.1
4
–
12
±0.1 30 8.0
16.0
±0.3
SOIC8
1.5
+0.1
1.75
±0.1
4.0
±0.1
2.0
±0.1 0.6 0.1 0.75 0.75 8.2 1.5
5.5
±0.05
4
±0.1 30 6.5
12.0
±0.3
A
0
, B
0
, K
0
can be calculated with package specification. Cover Tape width 13.3 mm.
max. 10°
Top View Sectional View
max. 10°
IC pocket
R min.
W
F
E
Cover Tape
P
0
P
2
D
0
P
1
D
1
< A
0
>
B
0
G
2
G
1
T
2
T
T
1
B
1
K
0
S
1
Abwickelrichtung
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 29 of 34
3901008056
June 2012
Rev 014
6.2 Reel Specification for SOIC14NB
A
D*
B*
C
W
2
W
1
N
A
max
B*
C
D*
min
2.0 ±0.5
13.0 +0,5/
-
0,2
20.2
Width of half reel
N
min
W
1
W
2
max
4 mm
100.0
4.4
7.1
8 mm
100.0
8.4
11.1
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 30 of 34
3901008056
June 2012
Rev 014
7.
ESD/EMC Remarks
7.1 General Remarks
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
7.2 ESD-Test
The TH8056 is tested according to MIL883D (human body model).
7.3 EMC
The test on EMC impacts is done according to ISO 7637-1 for power supply pins and ISO 7637-3 for data-
and signal pins.
Power Supply pin VBAT, CANH, LOAD:
Testpulse
Condition
Duration
1
t
1
= 5 s / U
S
=
-
100 V /
t
D
= 2 ms
5000 pulses
2
t
1
= 0.5 s / U
S
= 100 V / t
D
= 0.05 ms
5000 pulses
3a/b
U
S
=
-
V/ U
S
= 2
00 V
burst 100ns / 10 ms / 90 ms break 1h
5
R
i
= 0.5 Ω, t
D
= 400 ms
t
r
= 0.1 ms / U
P
+U
S
= 40 V 10 pulses every 1min
7.4 Latch Up Test
The TH8056 is tested according to JESD78 (Class 2).
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 31 of 34
3901008056
June 2012
Rev 014
8.
Revision History
Version
Changes
Remark
Date
001
Initial Release
Sep. 2002
001a
-
Added chapter revision
history
- Error corrected within Figure 1 - Block Diagram
March
2003
002
-
Pin
out
corrected within
Figure
8
–
Application Circuitry
06/13/03
003
-
compatibility to GMW3089 Version 2.2
- Static Characteristics modified according to GMW3089 V2.2
- Dynamic Characteristics modified according to GMW3089 V2.2
- Bus loading requirements modified according to GMW3089 V2.2
- High-speed Mode added remark
- V
BAT
input pin description changed
- Add Tape and Reel Specification
- Change of ESD/EMC Remarks
09/18/03
004
-
Changed application circuitry according to GMW3089 Rev.2.2
12/01/03
005
-
Change of chapter 9. Assembl
y Information
05/13/04
006
-
Change of Order Code
06/14/04
007
-
Update
of
cha
p
ter “F
eature
s” with
compatibility to GMW3089
V2.3 and very low leakage current during loss of ground
- Update of chapter “Features” high voltage wake up mode
instead of high speed ..
- Change of “Static characteristics”
o Supply current dominant
o Transmit delay
- Change of “Dynamic characteristics”
o Input min pulse length
o Condition for mode change from normal to standby,
standby to sleep and sleep to normal
- Change of application circuitry acc. To GMW3089 V2.3 Spec.
24/06/04
008
-
Change of “Static characteristics”
o Offset Wake-up Output High Voltage
o
Mode pull down resistor
31/08/04
009
-
Additional Package Version SOIC8
- Additional chapter “Power Dissipation”
15/04/05
010
-
Adaption of sleep mode condition acc
.
T
o GMW3089 Rev.
- Change of ESD capability of CANH pin
- Update of Assembly information
21/03/06
011
-
Change of Parameter “Input minumum pulse length at CANH”
- Change of “Short duration operating supply voltage”
- Change of “Receive Delay”
- Change of “Low level input voltage” at TxD, Mode 0,1
08
/1
2
/06
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 32 of 34
3901008056
June 2012
Rev 014
Version
Changes
Remark
Date
012
-
Change of load pin definition to be compliant to GMW3089 2.4
07/03/07
013
-
Change of
chapter 6.1 Tape Specification
o
Number of parts per reel
09/11/10
014
-
Logo,
disclaimer,information regarding solderability
, ordering
code
14/june/12
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 33 of 34
3901008056
June 2012
Rev 014
9. Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
TH8056
Enhanced Single Wire CAN Transceiver
TH8056 – Datasheet Page 34 of 34
3901008056
June 2012
Rev 014
10.
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore,
prior to designing this product into a system, it is necessary to check with Melexis for current information.
This product is intended for use in normal commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or high reliability applications, such as military,
medical life-support or life-sustaining equipment are specifically not recommended without additional
processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2012 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa, Asia: America:
Phone: +32 1367 0495 Phone: +1 248 306 5400
E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com
ISO/TS 16949 and ISO14001 Certified