ALCBSR56,215 - NXP Semiconductors

1. Product profile

1.1 General description

Symmetrical silicon N-channel depletion type junction field-effect transistors (FETs) in a

plastic microminiature envelope designed for application in thick and thin-film circuit s. The

transistors are intended for low-power, chopper or switching applications in industrial

service.

1.2 Features and benefits

Interchangeable drain and source connections

Small package

1.3 Applications

Low-power, chopper or switching applications

Thick and thin-film circuits

1.4 Quick reference data

BSR56; BSR57; BSR58

N-channel FETs

Rev. 3 — 25 June 2014 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions BSR56 BSR57 BSR58 Unit

Min Max Min Max Min Max

VDS drain-source voltage - 40 - 40 - 40 V

IDSS drain leakage current VDS = 15 V; VGS =0V;

Tmb = 40 C->50->20- >8mA

- - - <100 - <80 mA

VGSoff gate-source cut-off

voltage VDS = 15 V;

ID = 0.5 nA >4 - >2 - >0.8 - V

<10 - <6 - <4 - V

Crs feedback capacitance VDS =0 V; V

GS =10 V;

f = 1 MHz -<5-<5-<5pF

Switching time (VDD = 10 V; VGS = 0 V)

toff turn-off time ID = 20 mA; VGSM = 10 V - <25 - - - - ns

ID = 10 mA; VGSM = 6 V - - - <50 - - ns

ID = 5 mA; VGSM = 4 V -----<100ns

Ptot total power dissipation Tmb = 40 °C - 250 - 250 - 250 mW

Static characteristics

RDSon drain-source on-state

resistance VGS =0V; I

D= 0 A; f = 1 kHz - <25 - <40 - <60 

Product data sheet Rev. 3 — 25 June 2014 2 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

2. Pinning information

[1] Drain and source are interchangeable.

3. Ordering information

4. Marking

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1drain [1]

2source [1]

3gate

sym054

Table 3. Ordering information

Type number Package

Name Description Version

BSR56 TO-236AB plastic surface-mounted package; 3 leads SOT23

BSR57

BSR58

Table 4. Marking codes

Type number Marking code

BSR56 M4P

BSR57 M5P

BSR58 M6P

Product data sheet Rev. 3 — 25 June 2014 3 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

5. Limiting values

[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.

6. Thermal characteristics

[1] Mounted on a ceramic substrate, 8 mm 10 mm 0.7 mm.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage - 40 V

VGS gate-source voltage - 40 V

VDG drain-gate voltage - 40 V

IGgate current - 50 mA

Ptot total power dissipation Tamb = 40 C[1] -250mW

Tstg storage temperature 65 +150 C

Tjjunction temperature - 150 C

Fig 1. Power derating curve

Tamb (°C)

Ptot

(mW)

300

200

100

40 20080 120 160

aaa-013766

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to

ambient [1] 430 K/W

Product data sheet Rev. 3 — 25 June 2014 4 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

7. Characteristics

Table 7. Characteristics

Tamb = 25



C unless otherwise specified.

Symbol Parameter Conditions BSR56 BSR57 BSR58 Unit

Min Max Min Max Min Max

IGSS gate-source cut-off

current VDS = 0 V;

VGS = 20 V - 1.0 - 1.0 - 1.0 nA

IDSX drain cut-off current VDS = 15 V;

VGS = 10 V - 1.0 - 1.0 - 1.0 nA

V(BR)GSS gate-source breakdown

voltage IG = 1 A;

VDS = 0 V ->40->40->40V

VGSoff gate-source cut-off

voltage VDS =15V;

ID = 0.5 nA >4 - >2 - >0.8 - V

<10 - <6 - <4 - V

IDdrain current VDS =15V; V

GS = 0 V - >50 - >20 - >8 mA

---<100-<80mA

Crs feedback capacit ance VDS =0 V; V

GS =10 V;

f = 1 MHz -<5-<5-<5pF

RDSon drain-source on-state

resistance VGS =0V; I

D=0A;

f = 1 kHz -<25-<40-<60

VDSon drain-source on-state

voltage VGS =0V; I

D= 20 mA - <750 - - - - mV

VGS =0V; I

D=10mA ---<500--mV

VGS =0V; I

D=5mA -----<400mV

Switching times (VDD = 10 V; VGS = 0 V)

tddelay time ID = 20 mA; VGSM = 10 V - <6 - - - - ns

ID = 10 mA; VGSM = 6 V ---<6--ns

ID = 5 mA; VGSM = 4 V - - - - - <10 ns

trrise time ID = 20 mA; VGSM = 10 V - <3 - - - - ns

ID = 10 mA; VGSM = 6 V ---<4--ns

ID = 5 mA; VGSM = 4 V - - - - - <10 ns

toff turn-off time ID = 20 mA; VGSM = 10 V -<25----ns

ID = 10 mA; VGSM = 6 V - - - <50 - - ns

ID = 5 mA; VGSM = 4 V - - - - - <100 ns

Product data sheet Rev. 3 — 25 June 2014 5 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

Fig 2. Switching times waveforms

(1) BSR56; R = 464 

(2) BSR57; R = 953 

(3) BSR58; R = 1910 

Fig 3. Test circuit

Table 8. Test data

Type Pulse genera tor Oscilloscope

tr, tfZoCitrRi

BSR56 0.02  1 ns 50  2.5 pF  0.75 ns  1 M

BSR57 0.02  1 ns 50  2.5 pF  0.75 ns  1 M

BSR58 0.02  1 ns 50  2.5 pF  0.75 ns  1 M

aaa-013765

GSM

10%

90%

200 ns

off

aaa-013764

TUT

50 Ω

Product data sheet Rev. 3 — 25 June 2014 6 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

8. Package outline

Fig 4. Package outline SOT23 (TO-236AB)

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT023 TO-236AB

sot023_po

06-03-16

14-06-19

Plastic surface-mounted package; 3 leads SOT023

0 1 2 mm

scale

Unit

max

nom

min

1.1 0.1 0.15 3.0 1.4

0.2

Dimensions (mm are the original dimensions)

A1bp

0.48

cDEee

0.95

HELpQvw

0.11.9

2.1 0.150.9 0.09 2.8 1.20.38

2.5 0.45

0.45

0.55

detail X

Product data sheet Rev. 3 — 25 June 2014 7 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

9. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BSR56_57_58 v.3 20140625 Product data sheet - BSR56_57_58_CNV_2

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

BSR56_57_58_CNV_2 19910401 Product specification - -

Product data sheet Rev. 3 — 25 June 2014 8 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) d escribed in th is docume nt may have changed since this docume nt was pub lished and may dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full dat a sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability rela ted to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 25 June 2014 9 of 10

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristi cs sections of this

document, and as such is not complete, exhaustive or legally binding.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a pri or

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting f rom customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BSR56; BSR57; BSR58

N-channel FETs

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 June 2014

Document identifier: BS R56_57_58

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10