This is information on a product in full production.
June 2012 Doc ID 9346 Rev 4 1/7
7
STTH310
High voltage ultrafast rectifier
Datasheet production data
Features
Low forward voltage drop
High reliability
High surge current capability
Soft switching for reduced EMI disturbances
Planar technology
Description
The STTH310, which uses ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering,
demagnetization in power supplies and other
power switching applications.
Table 1. Device summary
Symbol Value
IF(AV) 3 A
VRRM 1000 V
Tj(max) +175 °C
VF (max) 1.42 V
trr (max) 75 ns
SMC
STTH310S
DO-201AD C2
STTH310
DO-201AD
STTH310
www.st.com
Characteristics STTH310
2/7 Doc ID 9346 Rev 4
1 Characteristics
To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.075 IF2(RMS)
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 1000 V
IF(AV) Average forward current, δ = 0.5 TL = 75 °C, δ = 0.5 DO-201AD 3 A
TL = 75 °C, δ = 0.5 SMC 3
IFSM Forward surge current tp = 8.3 ms sinusoidal DO-201AD 55 A
SMC 45
Tstg Storage temperature range - 65 to +175 °C
TjOperating junction temperature range -40 to +175 °C
Table 3. Thermal parameters
Symbol Parameter Value Unit
Rth(j-l) Junction to lead L = 10 mm DO-201AD 20
°C/WSMC 20
Rth(j-a) Junction to ambient L = 10 mm DO-201AD 75
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IRReverse leakage current Tj = 25 °C VR = VRRM
--10
µA
Tj = 125 °C - - 50
VFForward voltage drop Tj = 25 °C IF = 3 A --1.7
V
Tj = 150 °C - 0.98 1.42
Table 5. Dynamic electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A
IR = 1 A, Tj = 25 °C - - 75 ns
tfr Forward recovery time IF = 3 A, dIF/dt = 50 A/µs
VFR = 1.1 x VFmax, Tj = 25 °C
--300ns
VFP Forward recovery voltage - - 12 V
STTH310 Characteristics
Doc ID 9346 Rev 4 3/7
Figure 5. Thermal resistance junction to ambient versus copper surface under each lead
Figure 1. Conduction losses versus
average current
Figure 2. Forward voltage drop versus
forward current
P(W)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I (A)
F(AV)
T
δ=tp/T tp
δ= 1
δ= 0.05
δ= 0.5
δ= 0.2
δ= 0.1
I (A)
FM
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5
T =25°C
(maximum values)
j
V (V)
FM
T =150°C
(maximum values)
j
T =150°C
(typical values)
j
Figure 3. Relative variation of thermal
impedance junction ambient
versus pulse duration (DO-201AD)
Figure 4. Relative variation of thermal
impedance junction ambient
versus pulse duration (SMC)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
T
δ
=tp/T tp
t (s)
p
Epoxy printed circuit board, FR4,
L = 10 mm
leads
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
T
δ=tp/T tp
t (s)
p
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
Epoxy printed circuit board, FR4,
S = 1cm2
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
012345
SMB
DO-201AD
L =10mm
leads
S(cm²)
Epoxy printed circuit board, FR4,
copper thickness = 35 µm
Package information STTH310
4/7 Doc ID 9346 Rev 4
2 Package information
Epoxy meets UL94, V0
Band indicates cathode
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 6. Footprint, dimensions in mm (inches)
Table 6. SMC dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b(1)
1. Dimensions b and c apply to plated leads
2.90 3.20 0.114 0.126
c(1) 0.15 0.40 0.006 0.016
D 5.55 6.25 0.218 0.246
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
L 0.75 1.50 0.030 0.059
E
CLE2
E1
D
A1
A2 b
8.19
1.545.111.54
(0.061) (0.201)
(0.322)
(0.124)
(0.061)
3.14
STTH310 Package information
Doc ID 9346 Rev 4 5/7
Table 7. DO-201AD dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A - 9.50 - 0.374
B 25.40 - 1.000 -
C - 5.30 - 0.209
D - 1.30 - 0.051
E - 1.25 - 0.049
Notes
1 - The lead diameter ø D is not
controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)
Table 8. DO-201AD C2 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A - - 9.5 - - 0.374
B 13.75 - 17.75 0.541 - 0.699
C - - 5.3 - - 0.208
D - - 1.3 - - 0.051
E 3.1 3.6 4.1 0.122 0.142 0.161
F 2.4 3.15 3.9 0.094 0.124 0.153
G - 1.6 - - 0.063 -
H 14.9 - 15.6 0.587 - 0.614
I 0.5 0.6 0.8 0.019 0.024 0.031
J - 18.78 - - 0.739 -
K 3.8 - 4.8 0.150 - 0.189
Note
The difference between E dimensions on
both sides of resinous body (which
express the bending centering) must not
be larger than 0.7 millimeter.
ØC
ØD
A
EE
Note 2
Note 1 Note 1
BB
J
A
I
D
55.9°
50.8°
H
G = D + 0.2 to 0.4 mm
E
R0.5
R0.5
B
MIN
MAX
KF
(G = hole in the PCB)
10° max
C
Ordering information STTH310
6/7 Doc ID 9346 Rev 4
3 Ordering information
4 Revision history
Table 9. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STTH310S S10 SMC 0.245 g 2500 Tape and reel
STTH310 STTH310 DO-201AD 1.16 g 600 Ammopack
STTH310RL STTH310 DO-201AD 1.16 g 1900 Tape and reel
STTH310-C2 STTH 310 DO-201AD C2 1.12 g 500 Box
Table 10. Document revision history
Date Revision Changes
Jan-2003 1 First release.
03-Apr-2007 2 DO-201AD C2 package added. SMC package
information updated.
07-Dec-09 3 Updated Table 6 package dimensions.
21-Jun-2012 4 Updated Tj in Table 1 and Table 2 and change min. Tstg
to -65 °C in Table 2.
STTH310
Doc ID 9346 Rev 4 7/7
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com