vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 1 of 11
Product Description
The V•I Chip bus converter is a high efficiency (>95%),
narrow input range Sine Amplitude ConverterTM (SACTM)
operating from a 330 to 365 Vdc primary bus to deliver
an isolated low voltage secondary. The off-line BCM
provides an isolated 10.3 -11.4 V distribution bus and is
ideal for use in silver boxes and PFC front ends. Due to
the fast response time and low noise of the BCM, the
need for limited life aluminum electrolytic or tantalum
capacitors at the input of POL converters is reduced—or
eliminated—resulting in savings of board area, materials
and total system cost.
The BCM achieves a power density of 1017 W/in3in
a V•I Chip package compatible with standard pick-and-
place and surface mount assembly processes. The
V•I Chip package provides flexible thermal management
through its low junction-to-case and junction-to-board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction-to-case and junction-to-lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Parameter Values Unit Notes
+In to -In -1.0 to 400 Vdc
500 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc
+Out to -Out -0.5 to 16.0 Vdc
Isolation voltage 4,242 Vdc Input to Output
Output current 28 A Continuous
Peak output current 42.0 A For 1 ms
Output power 300 W Continuous
Peak output power 450 W For 1 ms
Case temperature 225 °C MSL 5
245 °C MSL 6
Operating junction temperature(1) -40 to 125 °C T-Grade
Storage temperature -40 to 125 °C T-Grade
• 352 V to 11 V V•I ChipTM Converter
• 300 Watt (450 Watt for 1 ms)
• High density – up to 1017 W/in3
• Small footprint – 260 W/in2
• Low weight – 0.5 oz (14 g)
• ZVS / ZCS isolated sine
amplitude converter
• Typical efficiency 95%
• 125°C operation
• <1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 28.0 A
K = 1/32
Rout = 12.5 m max
©
BCMTM
Bus Converter
Absolute Maximum Ratings
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
BCM352F110T300A00
BCM352T110T300A00
(Formerly VIB0001TFJ)
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 2 of 11
Specifications
Parameter Min Typ Max Unit Note
Input voltage range 330 352 365 Vdc
Input dV/dt 1 V/µs
Input undervoltage turn-on 329 Vdc
Input undervoltage turn-off 275 Vdc
Input overvoltage turn-on 366 Vdc
Input overvoltage turn-off 399 Vdc
Input quiescent current 0.9 mA PC low
Inrush current overshoot 0.225 A Using test circuit in Figure 18; See Figure 1
Input current 1.0 Adc
Input reflected ripple current 640 mA p-p Using test circuit in Figure 18; See Figure 4
No load power dissipation 6.4 7.7 W
Internal input capacitance 0.3 µF
Internal input inductance 5 nH
Recommended external input capacitance 2 µF 200 nH maximum source inductance; See Figure 18
Input (Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Figure 1 — Inrush transient current at full load and 352 Vin with PC
enabled
Figure 2 — Output voltage turn-on waveform with PC enabled at full load
and 352 Vin
Figure 3 — Output voltage turn-on waveform with input turn-on at full
load and 352 Vin
Figure 4 — Input reflected ripple current at full load and 352 Vin
Input Waveforms
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 3 of 11
Specifications (continued)
Parameter Min Typ Max Unit Note
Output voltage 10.3 11.4 Vdc No load
9.97 11.1 Vdc Full load
Output power 0 300 W 354 - 365 VIN
Rated DC current 0 28 Adc POUT≤300 W
Peak repetitive power 450 W Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
Current share accuracy 5 10 % See Parallel Operation on Page 10
Efficiency
Half load 94.0 94.8 % See Figure 5
Full load 94.5 95.5 % See Figure 5
Internal output inductance 1.1 nH
Internal output capacitance 37 µF Effective value
Load capacitance 1,200 µF
Output overvoltage setpoint 11.4 Vdc
Output ripple voltage
No external bypass 270 400 mV p-p See Figures 7 and 9
10 µF bypass capacitor 10.2 mV p-p See Figure 8
Short circuit protection set point 45.0 Adc Module will shut down
Average short circuit current 13.7 mA
Effective switching frequency 3.7 3.9 4.1 MHz Fixed, 2.0 MHz per phase
Line regulation
K 0.0309 1/32 0.0316 VOUT = K•VIN at no load
Load regulation
ROUT 9.8 12.5 mΩ
Transient response
Voltage overshoot 72 mV 100% load step; See Figures 10 and 11
Response time 200 ns See Figures 10 and 11
Recovery time 1 µs See Figures 10 and 11
Output overshoot
Input turn-on 0 mV No output filter; See Figure 3
PC enable 0 mV No output filter; See Figure 2
Output turn-on delay
From application of power 428 ms No output filter; See Figure 3
From release of PC pin 37 µs No output filter
Output (Conditions are at 352 Vin, full load, and 25°C ambient unless otherwise specified)
Efficiency vs. Output Power
82
84
86
88
90
92
94
96
0 30 60 90 120 150 180 210 240 270 300
Output Power (W)
Efficiency (%)
Figure 5 — Efficiency vs. output power at 352 Vin
Power Dissipation
4
6
8
10
12
14
16
0 30 60 90 120 150 180 210 240 270 300
Output Power (W)
Power Dissipation (W)
Figure 6 — Power dissipation as a function of output power
Output Waveforms
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 4 of 11
Specifications (continued)
Figure 8 — Output voltage ripple at full load and 352 Vin with 10 µF
ceramic external bypass capacitor and 20 nH of distribution inductance.
Figure 7 — Output voltage ripple at full load and 352 Vin without any
external bypass capacitor.
Ripple vs. Output Power
150
175
200
225
250
275
300
0 30 60 90 120 150 180 210 240 270 300
Output Power (W)
Output Ripple (mVpk-pk)
Figure 9 — Output voltage ripple vs. output power at 352 Vin without any
external bypass capacitor.
Figure 10 — 0 -28.0 A load step with 2 µF input capacitor and no
output capacitor.
Figure 11 — 28.0-0 A load step with 2 µF input capacitor and no output
capacitor.
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 5 of 11
Parameter Min Typ Max Unit Note
Primary control (PC)
DC voltage 4.8 5.0 5.2 Vdc
Module disable voltage 2.4 2.5 Vdc
Module enable voltage 2.5 2.6 Vdc
Current limit 2.4 2.5 2.9 mA Source only
Enable delay time 37 µs
Disable delay time 16 µs See Figure 12, time from PC low to output low
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Figure 12 — VOUT at full load vs. PC disable Figure 13 — PC signal during over current fault
Specifications (continued)
Parameter Min Typ Max Unit Note
MTBF
MIL-HDBK-217F 3.5 Mhrs 25°C, GB
Isolation specifications
Voltage 4,242 Vdc Input to Output
Capacitance 500 pF Input to Output
Resistance 10 MΩInput to Output
Agency approvals
cTÜVus UL/CSA 60950-1, EN 60950-1
CE Mark Low Voltage Directive
RoHS
Mechanical See Mechanical Drawings, Figures 15 & 16
Weight 0.53/15 oz/g
Dimensions
Length 1.28/ 32,5 in /mm
Width 0.87 / 22 in /mm
Height 0.265/ 6,73 in /mm
Thermal
Over temperature shutdown 125 130 135 °C Junction temperature
Thermal capacity 9.3 Ws/°C
Junction-to-case thermal impedance (RθJC)1.1 °C/W
Junction-to-board thermal impedance (RθJB)2.1 °C/W
General
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 6 of 11
Pin / Control Functions
+In / -In – DC Voltage Input Ports
The V•I Chip input voltage range should not be exceeded. An internal
under / over voltage lockout-function prevents operation outside of the
normal operating input range. The BCM turns on within an input voltage
window bounded by the “Input under-voltage turn-on” and “Input over-
voltage turn-off” levels, as specified. The V•I Chip may be protected
against accidental application of a reverse input voltage by the addition
of a rectifier in series with the positive input, or a reverse rectifier in
shunt with the positive input located on the load side of the input fuse.
The connection of the V•I Chip to its power source should be
implemented with minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed with a RC
damper to retain low source impedance and stable operation. With an
interconnect inductance of 200 nH, the RC damper may be 2 µF in series
with 0.3Ω. A single electrolytic or equivalent low-Q capacitor may be
used in place of the series RC bypass.
PC – Primary Control
The Primary Control port is a multifunction node that provides the
following functions:
Enable / Disable – If the PC port is left floating, the BCM output is
enabled. Once this port is pulled lower than 2.4 Vdc with respect to
–In, the output is disabled. This action can be realized by employing
a relay, opto-coupler, or open collector transistor. Refer to Figures 1-
3, 12 and 13 for the typical enable / disable characteristics. This port
should not be toggled at a rate higher than 1 Hz. The PC port should
also not be driven by or pulled up to an external voltage source.
Primary Auxiliary Supply – The PC port can source up to 2.4 mA at
5.0 Vdc. The PC port should never be used to sink current.
Alarm – The BCM contains circuitry that monitors output overload,
input over voltage or under voltage, and internal junction temperatures.
The PC port will toggle in response to an over current or over
temperature fault and will remain low in response to an input
undervoltage / overvoltage fault.
TM and RSV – Reserved for factory use.
+Out / -Out – DC Voltage Output Ports
Two sets of contacts are provided for the +Out port. They must be
connected in parallel with low interconnect resistance. Similarly, two sets
of contacts are provided for the –Out port. They must be connected in
parallel with low interconnect resistance. Within the specified operating
range, the average output voltage is defined by the Level 1 DC behavioral
model of Figure 19. The current source capability of the BCM is rated in
the specifications section of this document.
The low output impedance of the BCM reduces or eliminates the need
for limited life aluminum electrolytic or tantalum capacitors at the input
of POL converters.
Total load capacitance at the output of the BCM should not exceed the
specified maximum. Owing to the wide bandwidth and low output
impedance of the BCM, low frequency bypass capacitance and
significant energy storage may be more densely and efficiently provided
by adding capacitance at the input of the BCM.
-In
PC
RSV
TM
+In
-Out
+Out
-Out
+Out
Bottom View
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
4 3 2 1
A
B
C
D
E
H
J
K
L
M
N
P
R
T
Figure 14 — BCM pin configuration
Signal
Name Designation
+In A1-E1, A2-E2
–In L1-T1, L2-T2
TM H1, H2
RSV J1, J2
PC K1, K2
+Out A3-D3, A4-D4,
J3-M3, J4-M4
–Out E3-H3, E4-H4,
N3-T3, N4-T4
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 7 of 11
Mechanical Drawings
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 15 — BCM J-Lead mechanical outline; Onboard mounting
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Figure 16 — BCM PCB land layout information
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 8 of 11
Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 17 — Hole location for push pin heat sink relative to V•I Chip
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 9 of 11
Behavioral & Test Circuits
I
Q
+
–
+
VOUT
VIN
V•I
K
+
–
+
–
IOUT ROUT
–
LIN = 5 nH
+
–
+
–
VOUT
COUT
VIN
V•I
K
+
–
+
–
CIN
IOUT
RCOUT
IQ
ROUT
RCIN
V•I Chip Bus Converter Level 1 DC Behavioral Model for 352 V to 11 V, 300 W
V•I Chip Bus Converter Level 2 Transient Behavioral Model for 352 V to 11 V, 300 W
Figure 19 — This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
Figure 20 — This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
©
©
18 mA
1/32 • Iout 1/32 • Vin
9.8 m
0.3µF
32 mΩ
18 mA
1/32 • Iout 1/32 • Vin
0.22 nH
1.1 mΩ
9.8 mΩ
0.2 mΩ
37 µF
Lout = 1.1 nH
Load
+
–
R2
2 kΩ
D1
SW1
Enable/Disable Switch
Input reflected ripple
measurement point
-In
PC
RSV
TM
+In
-Out
+Out
-Out
+Out
BCM
K
Ro
Figure 18 — BCM test circuit
1.5 A
Fuse
C1
2µF
electrolytic C3
10 µF
R3
5mΩ
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
F1
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
Page 10 of 11
Parallel Operation
The BCM will inherently current share when operated in an array. Arrays
may be used for higher power or redundancy in an application.
Current sharing accuracy is maximized when the source and load
impedance presented to each BCM within an array are equal. The
recommended method to achieve matched impedances is to dedicate
common copper planes within the PCB to deliver and return the current
to the array, rather than rely upon traces of varying lengths. In typical
applications the current being delivered to the load is larger than that
sourced from the input, allowing traces to be utilized on the input side if
necessary. The use of dedicated power planes is, however, preferable.
The BCM power train and control architecture allow bi-directional power
transfer, including reverse power processing from the BCM output to its
input. Reverse power transfer is enabled if the BCM input is within its
operating range and the BCM is otherwise enabled. The BCM’s ability to
process power in reverse improves the BCM transient response to an
output load dump.
Input Impedance Recommendations
To take full advantage of the BCM capabilities, the impedance presented
to its input terminals must be low from DC to approximately 5 MHz. The
source should exhibit low inductance (less than 100 nH) and should have
a critically damped response. If the interconnect inductance exceeds 100
nH, the BCM input pins should be bypassed with an RC damper (e.g., 2
µF in series with 0.3 ohm) to retain low source impedance and stable
operations. Given the wide bandwidth of the BCM, the source response
is generally the limiting factor in the overall system response.
Anomalies in the response of the source will appear at the output of the
BCM multiplied by its K factor. The DC resistance of the source should be
kept as low as possible to minimize voltage deviations. This is especially
important if the BCM is operated near low or high line as the over/under
voltage detection circuitry could be activated.
Input Fuse Recommendations
V•I Chips are not internally fused in order to provide flexibility in
configuring power systems. However, input line fusing of V•I Chips must
always be incorporated within the power system. A fast acting fuse
should be placed in series with the +In port.
Application Notes
For BCM and V•I Chip application notes on soldering, thermal
management, board layout, and system design click on the link below:
http://www.vicorpower.com/technical_library/application_information/chips/
BCM Applications
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00 Rev. 1.6
12/10
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's
Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898;
7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and 6,984,965
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: custserv@vicorpower.com
Technical Support: apps@vicorpower.com
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper
application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended
to the original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this
warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping
instructions. Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges
incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within
the terms of this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
