- 8 1 | 7 6 | 5 4 | 3 2 | TSAR UNPUBL [ESD Fe PORTER <= io oer REVISIONS | Ocener 9 RFT RESET | _ AA |22 bepary ESR Io =e | MECHANICAL: a _ [_et_[ ReWsED PER Eco-11-005140 | zowant [RK HMR | : .850 MAX A a > ~ [ec [eco-11-015766 [sowvzori] EL [LR | ey | \ AX MATERIALS: | o HOUSING - THERMOPLASTIC PET POLYESTER FLAMMABILITY RATING UL 94V-0. i o SHIELD - .010 THICK, C26800 BRASS PREPLATED WITH 30yINCH MIN SEMI-BRIGHT | Bose hh 2 4, 6 8 NICKEL. SOLDER TABS POST DIPPED WITH 100mINCH MIN SAC SOLDER | 625 zie g 645 MOD JACK CONTACTS - 0.0157 X 0.018" PHOSPHOR BRONZE, S0wINCH MIN OVERALL e ZEN a NICKEL UNDERPLATE WITH SELECT SOINCH MIN HARD GOLD FINISH PLATE. | ars 2 & 4 SOLDERTAILS WITH 100pINCH MIN MATTE TIN AND/OR SAC SOLDER DIP | a | D (LT ~ AX B45 JACK CAVITY CONFORMS TO FCC RULES AND REGULATIONS PART 68, SUB D rf .050 TYP | PART F. | 100 TYP / AX MAGNETICS | .725 MAX -IMPEDANCE: 100 OHMS | -TURNS RATIO (CHIP:CABLE}: TX = 11, RX = 11 -OPEN CIRCUIT INDUCTANCE [OCL): 350pH MIN @190kHz, 0.1VRMS, | 105 . amADC BIAS FROM OC TO 70C, TX AND RX | -PERFORMANCE @ 25C: |. Pin Designations Z INSERTION LOSS (ILI: 1.1dB MAX FROM 0.5MHz TO 100MHz | _ L RETURN LOSS (RL): 18dB MIN FROM 0.SMHZ TO 30MHz | | 18-20LOGIf/30)dB MIN FROM 30,1MHz TO 60MHz g ~~ eee 12dB MIN FROM 60.1MHz TO 80MHz | 600 MAX CROSSTALK ATTENUATION: 35dB MIN FROM 0.5MHz TO &0MHz | 555 . 33-20*LOG(f/50)dB MIN FROM 40.1MHz TO 100MHz Oo COMMON MODE REJECTION RATIO (CMRR}: 30dB MIN FROM 0.5MHz TO 100MHz | -ISOLATION VOLTAGE:2250VDC (MAX] FOR 60 SECONDS WITH A RISE TIME OF | 500V/SEC. | RJ-1 l iii | | rill | RJ-8 wu 145+.010 4. OPERATING TEMPERATURE: FROM 0C TO +70C | c 1 8 j AX INDICATED CONNECTIONS ARE FOR NIC CONFIGURATION. THE MAGNETICS ARE c | we 050 TYP SYMMETRICAL, AND SUPPORTS AUTO-MDI/MDIX, | AX TE CONNECTIVITY LOGO, PART NUMBER, DATE CODE, COUNTRY OF ORIGIN AND | ELECTRICAL: %. foe 350 AGENCY APPROVAL MARKING IN APPROXIMATE LOCATION SHOWN | +.015 LB \E \ . 860-500 426 SERIES MAGNETIC CIRCUIT 7. THE PART IS RECOMMENDED FOR WAVE SOLDERING PROCESS, | EK z 6.062(2x) PREHEAT TEMPERATURE IS 120C TO 160C, 120 SECONDS TO 180 SECONDS, | 7 9 oO Oo PEAK SOLDERING TEMPERATURE IS 260 C MAX, 10 SECONDS MAX p | ao 9.126(2X) | | @ a e +.015 @ | 575 +815 | | TOP OF PC | = = .010 Q oO C1 ls Suggested Panel Cutout Tow gy sds 4 a | ry) rT) Suggested PCB Layout Q QO 7 | 4 4 4 (Component Side) | Dita ae omoz SE cues | | R2 | R1 | | R3 R4 | | n NS 6605424 | A 3 2 3 + 3 3 2 3 PART NUMBER A THIS DRAWING IS A CONTROLLED DocuMENT. |>S BWARZOOS | a 2 z moms aes | ETE corey | es < 2 2 INCHES [Ba GAROL 1X1 MAG45(TM), MODULAR JACK, 1 PLS a. 4N2Z SCHEMATIC, 426 SERIES CIRCUIT, SHIELDED, F ce tae : 10 | 108-2100 _| DECOUPLING CAPACITOR, NO LEDS = z aaPLenTaN SP . C1 = 1000 pF, 2kV CAPACITOR Rate | a e Sa | OE CoE oa wo TESHOTED TO | ex mm, vec = A 1 |00779\C=6605424 = | R1-R4 = 75 OHMS, 1/16 W RESISTORS GUSTONER DRAWING ws Pa To 4008 G/11) Lo ed