NCV33269DTRK-012G - ON Semiconductor L.L.C.

August, 2006 − Rev. 22 1Publication Order Number:

MC33269/D

MC33269, NCV33269

800 mA, Adjustable Output,

Low Dropout Voltage

Regulator

The MC33269/NCV33269 series are low dropout, medium current,

fixed and adjustable, positive voltage regulators specifically designed

for use in low input voltage applications. These devices offer the

circuit designer an economical solution for precision voltage

regulation, while keeping power losses to a minimum.

The regulator consists of a 1.0 V dropout composite PNP−NPN pass

transistor, current limiting, and thermal shutdown.

Features

•3.3 V, 5.0 V, 12 V and Adjustable Versions

2.85 V version available as MC34268

•Space Saving DPAK, SO−8 and SOT−223 Power Packages

•1.0 V Dropout

•Output Current in Excess of 800 mA

•Thermal Protection

•Short Circuit Protection

•Output Trimmed to 1.0% Tolerance

•Pb−Free Packages are Available

•NCV Prefix for Automotive and Other Applications Requiring Site

and Control Changes

DEVICE TYPE/NOMINAL OUTPUT VOLTAGE

MC33269D

MC33269DT

NCV33269DTRK*

MC33269T

MC33269D−3.3

MC33269DT−3.3

NCV33269DTRK−3.3*

MC33269T−3.3

MC33269ST−3.3

Adj

3.3 V

MC33269D−5.0

MC33269DT−5.0

MC33269T−5.0

MC33269D−012

MC33269DT−012

NCV33269DTRK−012*

MC33269T−012

5.0 V

12 V

*NCV prefix is for automotive and other applications requiring site and change

control.

TO−220AB

T SUFFIX

CASE 221AB

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

GND/Adj

SO−8

D SUFFIX

CASE 751

DPAK

DT SUFFIX

CASE 369C

Vin

1. GND/Adj

2. Vout

3. Vin

(Top View)

Vout Vout

Heatsink surface (shown as terminal 4 in

case outline drawing) is connected to Pin 2.

SOT−223

ST SUFFIX

CASE 318E

(Top View)

13(Top View)

123

123123

(Top View)

Heatsink surface (shown as terminal 4 in

case outline drawing) is connected to Pin 2.

See general marking information in the device marking

section on page 9 of this data sheet.

DEVICE MARKING INFORMATION

1. GND/Adj

2. Vout

3. Vin

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MC33269, NCV33269

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MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply Input Voltage Vin 20 V

Power Dissipation

Case 369C (DPAK) TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

qJA

qJC

Internally Limited

6.0

°C/W

Case 751 (SO−8) TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

qJA

qJC

Internally Limited

160

°C/W

Case 221A (TO−220) TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

qJA

qJC

Internally Limited

5.0

°C/W

Case 318E (SOT−223) TA = 25°C

Thermal Resistance, Junction−to−Ambient

Thermal Resistance, Junction−to−Case

qJA

qJC

Internally Limited

156

°C/W

Operating Die Junction Temperature Range TJ−40 to +150 °C

Operating Ambient Temperature Range MC33269

NCV33269 TA−40 to +125

−40 to +125 °C

Storage Temperature Tstg −55 to +150 °C

Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM)

Machine Model (MM) ESD 4000

400 V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended O p e r a t i n g Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

ELECTRICAL CHARACTERISTICS (CO = 10 mF, TA = 25°C, for min/max values TA = −40°C to +125°C, unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit

Output Voltage (Iout = 10 mA, TA = 25°C) 3.3 Suffix (VCC = 5.3 V)

5.0 Suffix (VCC = 7.0 V)

12 Suffix (VCC = 14 V)

VO3.27

4.95

11.88

3.3

5.0

3.33

5.05

12.12

Output Voltage (Line, Load and Temperature) (Note 1)

(1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA)

(1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA) 3.3 Suffix

5.0 Suffix

12 Suffix

3.23

4.9

11.76

3.3

5.0

3.37

5.1

12.24

Reference Voltage for Adjustable Voltage

(Iout = 10 mA , Vin − Vout = 2.0 V, TA = 25°C) Vref 1.235 1.25 1.265 V

Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage

(1.25 V ≤ Vin − Vout ≤ 15 V, Iout = 500 mA)

(1.35 V ≤ Vin − Vout ≤ 10 V, Iout = 800 mA)

Vref 1.225 1.25 1.275 V

Line Regulation (Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25°C) Regline − − 0.3 %

Load Regulation (Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25°C) Regload − − 0.5 %

Dropout Voltage (Iout = 500 mA)

(Iout = 800 mA) Vin −V

out −

−1.0

1.1 1.25

1.35 V

Ripple Rejection (10 Vpp, 120 Hz Sinewave; Iout = 500 mA) RR 55 − − dB

Current Limit (Vin − Vout = 10 V) ILimit 800 − − mA

Quiescent Current (Fixed Output) (1.5 V ≤ Vout ≤ 3.3 V)

(5 V ≤ Vout ≤ 12 V) IQ−

−5.5

−8.0

20 mA

Minimum Required Load Current Fixed Output Voltage

Adjustable Voltage ILoad −

8.0 −

−0

−mA

Adjustment Pin Current IAdj − − 120 mA

1. The MC33269−12, Vin − Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin.

MC33269, NCV33269

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Vin

Vout

VAdj Gnd

Trim Links

This device contains 38 active transistors.

Figure 1. Internal Schematic

MC33269, NCV33269

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IO, OUTPUT LOAD CURRENT (mA)

Vout

−V

Figure 2. Dropout Voltage versus

Output Load Current

1.5

1.3

1.1

0.9

0.7

0.5 0 200 400 600 800 1000

Figure 3. Transient Load Regulation

, DROPOUT VOLTAGE (V)

20 ms/DIV

Cin = 10 mF

CO = 10 mF Tantalum

Vin = VO + 3.0 V

Preload = 0.1 A

0 A

0.5 A

100

, OUTPUTIOVO, OUTPUTΔ

VOLTAGE DEVIATIONCURRENT

TA = 25°CTA = −40°C

TA = 125°C

mV/Div

−55

900

−25 0 25 50 75 100 125

940

980

1020

1060

1100

Figure 4. Dropout Voltage

versus Temperature Figure 5. MC33269−XX Output DC Current versus

Input−Output Differential Voltage

TA, AMBIENT TEMPERATURE (°C)

IO = 800 mA

, OVERVOLTAGE INPUT THRESHOLD (%V )

FB(OV) FB

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

02.0 4.0 6.0 8.0 10 12 14 16

INPUT−OUTPUT VOLTAGE DIFFERENTIAL (V)

TA = 25°C

MC33269D−XX

L = 25 mm Copper

OUTPUT CURRENT (A)

0.1 1.0 10 100

Figure 6. MC33269 Ripple Rejection

versus Frequency Figure 7. MC33269−ADJ Ripple Rejection

versus Frequency

RR, RIPPLE REJECTION RATIO (dB)

f, FREQUENCY (kHz)

RR, RIPPLE REJECTION RATIO (dB)

100101.0

f, FREQUENCY (kHz)

Vin = 8.0 V

Vout = 5.0 V

IL = 800 mA

CAdj = 22 mF

TA = 25°C

0.1

Vin = VO + 3.0 V

IL = 800 mA

TA = 25°C

VO = 12 V

VO = 3.3 V or 5.0 V

MC33269, NCV33269

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ÏÏÏ

R , THERMAL RESISTANCE

JAθ

JUNCTION-TO-AIR ( C/W)°

120

160

200

240

280

0.35

0.42

0.50

0.63

0.83

1.25

2.50

010203025155.0

L, LENGTH OF COPPER (mm)

PD(max) for TA = 50°C

Minimum

Size Pad

, MAXIMUM POWER DISSIPATION (W)

Free Air

Mounted

Vertically

RqJA

2.0 oz. Copper

ÏÏÏÏ

Figure 8. SOP−8 Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

R , THERMAL RESISTANCE,

JAθJUNCTION−TO−AIR ( C/W)°

RqJA

ÏÏÏ

2.0 oz.

Copper

Graph represents symmetrical layout

3.0 mmL

PD(max) for TA = 50°C

110

130

150

170

L, LENGTH OF COPPER (mm)

02030504010

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

R , THERMAL RESISTANCE,

JAθJUNCTION−TO−AIR ( C/W)°

Figure 9. DPAK Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

ÏÏÏÏ

2.0 oz. Copper

RqJA

Minimum

Size Pad

Free Air

Mounted

Vertically

PD(max) for TA = 50°C

100

010203025155.0

L, LENGTH OF COPPER (mm)

0.4

0.8

1.2

1.6

2.0

2.4

Figure 10. SOT−223 Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

MC33269, NCV33269

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APPLICATIONS INFORMATION

Figures 11 through 15 are typical application circuits. The

output current capability of the regulator is in excess of

800 mA, with a typical dropout voltage of less than 1.0 V.

Internal protective features include current and thermal

limiting.

* The MC33269 requires an external output capacitor for

stability. The capacitor should be at least 10 mF with an

equivalent series resistance (ESR) of less than 10 W but

greater than 0.2 W over the anticipated operating

temperature range. W ith economical electrolytic capacitors,

cold temperature operation can pose a problem. As

temperature decreases, the capacitance also decreases and

the ESR increases, which could cause the circuit to oscillate.

Also capacitance and ESR of a solid tantalum capacitor is

more stable over temperature. The use of a low ESR ceramic

capacitor placed within close proximity to the output of the

device could cause instability.

** An input bypass capacitor is recommended to improve

transient response or if the regulator is connected to the

supply input filter with long wire lengths. This will reduce

the circuit’s sensitivity to the input line impedance at high

frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,

or other capacitor having low internal impedance at high

frequencies should be chosen. The bypass capacitor should

be mounted with shortest possible lead or track length

directly across the regulator’s input terminals. Applications

should be tested over all operating conditions to insure

stability.

Internal thermal limiting circuitry is provided to protect

the integrated circuit in the event that the maximum junction

temperature is exceeded. When activated, typically at

170°C, the output is disabled. There is no hysteresis built

into the thermal limiting circuit. As a result, if the device is

overheating, the output will appear to be oscillating. This

feature is provided to prevent catastrophic failures from

accidental device overheating. It is not intended to be used

as a substitute for proper heat−sinking.

Figure 11. Typical Fixed Output Application

MC33269−XX

Vin Vout

GND

10 mF

An input capacitor is not necessary for stability, however

it will improve the overall performance.

Figure 12. Typical Adjustable Output Application

MC33269

Vin Vout

Adj Co

10 mF

CAdj***

***CAdj is optional, however it will improve the ripple rejection.

The MC34269 develops a 1.25 V reference voltage between the

output and the adjust terminal. Resistor R1, operates with

constant current to flow through it and resistor R2. This current

should be set such that the Adjust Pin current causes negligible

drop across resistor R2. The total current with minimum load

should be greater than 8.0 mA.

Figure 13. Current Regulator

MC33269

Vin Iout

Adj

Iout+

Figure 14. Battery Backed−Up Power Supply

MC33269−XX

Vin Vout

MC33269−XX

GND

10 mF

Figure 15. Digitally Controlled Voltage Regulator

MC33269

Vin Vout

Adj

10 mF

R2 sets the maximum output voltage. Each transistor

reduces the output voltage when turned on.

The Schottky diode in series with the ground leg of the upper

regulator shifts its output voltage higher by the forward

voltage drop of the diode. This will cause the lower device

to remain off until the input voltage is removed.

Vout+1.25ǒ1)R2

R1Ǔ)I

AdjR2

1.25

Cin

Cin Co

10 mF

Cin

GND Cin

MC33269, NCV33269

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ORDERING INFORMATION

Device Package Shipping Information†

MC33269D SO−8 98 Units / Rail

MC33269DG SO−8

(Pb−Free)

MC33269DR2 SO−8 2500 Units / Tape & Reel

MC33269DR2G SO−8

(Pb−Free)

MC33269DT DPAK 75 Units / Rail

MC33269DTG DPAK

(Pb−Free)

MC33269DTRK DPAK 2500 Units / Tape & Reel

MC33269DTRKG DPAK

(Pb−Free)

MC33269T TO−220 50 Units / Rail

MC33269TG TO−220

(Pb−Free)

MC33269D−3.3 SO−8 98 Units / Rail

MC33269D−3.3G SO−8

(Pb−Free)

MC33269DR2−3.3 SO−8 2500 Units / Tape & Reel

MC33269DR2−3.3G SO−8

(Pb−Free)

MC33269DT−3.3 DPAK 75 Units / Rail

MC33269DT−3.3G DPAK

(Pb−Free)

MC33269DTRK−3.3 DPAK 2500 Units / Tape & Reel

MC33269DTRK−3.3G DPAK

(Pb−Free)

MC33269ST−3.3T3 SOT−223 4000 Units / Tape & Reel

MC33269ST−3.3T3G SOT−223

(Pb−Free)

MC33269T−3.3 TO−220 50 Units / Rail

MC33269T−3.3G TO−220

(Pb−Free)

MC33269D−5.0 SO−8 98 Units / Rail

MC33269D−5.0G SO−8

(Pb−Free)

MC33269DR2−5.0 SO−8 2500 Units / Tape & Reel

MC33269DR2−5.0G SO−8

(Pb−Free)

MC33269DT−5.0 DPAK 75 Units / Rail

MC33269DT−5.0G DPAK

(Pb−Free)

MC33269DTRK−5.0 DPAK 2500 Units / Tape & Reel

MC33269DTRK−5.0G DPAK

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV prefix is for automotive and other applications requiring site and control changes.

MC33269, NCV33269

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ORDERING INFORMATION (continued)

Device Package Shipping Information†

MC33269T−5.0 TO−220 50 Units / Rail

MC33269T−5.0G TO−220

(Pb−Free)

MC33269D−012 SO−8 98 Units / Rail

MC33269D−012G SO−8

(Pb−Free)

MC33269DR2−012 SO−8 2500 Units / Tape & Reel

MC33269DR2−012G SO−8

(Pb−Free)

MC33269DT−012 DPAK 75 Units / Rail

MC33269DT−012G DPAK

(Pb−Free)

MC33269DTRK−012 DPAK 2500 Units / Tape & Reel

MC33269DTRK−012G DPAK

(Pb−Free)

MC33269T−012 TO−220 50 Units / Rail

MC33269T−012G TO−220

(Pb−Free)

NCV33269DTRK* DPAK

2500 Units / Tape & Reel

NCV33269DTRKG* DPAK

(Pb−Free)

NCV33269DTRK−3.3* DPAK

NCV33269DTRK−3.3G* DPAK

(Pb−Free)

NCV33269DTRK−012* DPAK

NCV33269DTRK−012G* DPAK

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NCV prefix is for automotive and other applications requiring site and control changes.

MC33269, NCV33269

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SO−8

D SUFFIX

CASE 751

269AJ

ALYW

8269−3

ALYW

69−12

ALYW

269−5

ALYW

MARKING DIAGRAMS

123

269AJG

ALYWW

123

69−12G

ALYWW

123

269−3G

ALYWW

123

269−5G

ALYWW

DPAK

DT SUFFIX

CASE 369C

TO−220AB

T SUFFIX

CASE 221A

33269T

AWLYWWG

33269T−12

AWLYWWG

33269T−33

AWLYWWG

33269T−5

AWLYWWG

SOT−223

ST SUFFIX

CASE 318E

AYW

2693 G

A = Assembly Location

L, WL = Wafer Lot

Y = Year

W, WW = Work Week

G = Pb−Free Package

G= Pb−Free Package

(Note: Microdot may be in either location)

132132132132

MC33269, NCV33269

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PACKAGE DIMENSIONS

SO−8

D SUFFIX

CASE 751−07

ISSUE AH

SEATING

PLANE

X 45_

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

AMIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024 1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC33269, NCV33269

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PACKAGE DIMENSIONS

DPAK

DT SUFFIX

CASE 369C−01

ISSUE O

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244 3.0

0.118

6.172

0.243

ǒmm

inchesǓ

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2 PL

0.13 (0.005) T

−T− SEATING

PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.235 0.245 5.97 6.22

B0.250 0.265 6.35 6.73

C0.086 0.094 2.19 2.38

D0.027 0.035 0.69 0.88

E0.018 0.023 0.46 0.58

F0.037 0.045 0.94 1.14

G0.180 BSC 4.58 BSC

H0.034 0.040 0.87 1.01

J0.018 0.023 0.46 0.58

K0.102 0.114 2.60 2.89

L0.090 BSC 2.29 BSC

R0.180 0.215 4.57 5.45

S0.025 0.040 0.63 1.01

U0.020 −−− 0.51 −−−

V0.035 0.050 0.89 1.27

Z0.155 −−− 3.93 −−−

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

123

MC33269, NCV33269

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PACKAGE DIMENSIONS

SOT−223

ST SUFFIX

CASE 318E−04

ISSUE L

1.5

0.059 ǒmm

inchesǓ

SCALE 6:1

3.8

0.15

2.0

0.079

6.3

0.248

2.3

0.091 2.3

0.091

2.0

0.079

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

123

0.08 (0003)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

HEDIM

AMIN NOM MAX MIN

MILLIMETERS

1.50 1.63 1.75 0.060

INCHES

A1 0.02 0.06 0.10 0.001

b0.60 0.75 0.89 0.024

b1 2.90 3.06 3.20 0.115

c0.24 0.29 0.35 0.009

D6.30 6.50 6.70 0.249

E3.30 3.50 3.70 0.130

e2.20 2.30 2.40 0.087

0.85 0.94 1.05 0.033

0.064 0.068

0.002 0.004

0.030 0.035

0.121 0.126

0.012 0.014

0.256 0.263

0.138 0.145

0.091 0.094

0.037 0.041

NOM MAX

L1 1.50 1.75 2.00 0.060

6.70 7.00 7.30 0.264 0.069 0.078

0.276 0.287

HE− −

0°10°0°10°

MC33269, NCV33269

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PACKAGE DIMENSIONS

TO−220AB, SINGLE GAUGE

T SUFFIX

CASE 221AB−01

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL

BODY AND LEAD IRREGULARITIES ARE

ALLOWED.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.570 0.620 14.48 15.75

B0.380 0.405 9.66 10.28

C0.160 0.190 4.07 4.82

D0.025 0.035 0.64 0.88

F0.142 0.147 3.61 3.73

G0.095 0.105 2.42 2.66

H0.110 0.155 2.80 3.93

J0.018 0.025 0.46 0.64

K0.500 0.562 12.70 14.27

L0.045 0.060 1.15 1.52

N0.190 0.210 4.83 5.33

Q0.100 0.120 2.54 3.04

R0.080 0.110 2.04 2.79

S0.020 0.055 0.508 1.39

T0.235 0.255 5.97 6.47

U0.000 0.050 0.00 1.27

V0.045 −−− 1.15 −−−

Z−−− 0.080 −−− 2.04

123

SEATING

PLANE

−T−

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, af filiates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MC33269/D

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative