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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2665
SNVS009H –NOVEMBER 1999–REVISED MARCH 2016
LM2665 Switched Capacitor Voltage Converter
1
1 Features
1• Input Voltage for Voltage Doubler: 2.5 V to 5.5 V
• Voltage Divider Splits Voltage: 1.8 V to 11 V
• Doubles or Splits Input Supply Voltage
• 12-ΩTypical Output Impedance
• 90% Typical Conversion Efficiency at 40 mA
• 1-µA Typical Shutdown Current
2 Applications
• Cellular Phones
• Pagers
• PDAs
• Operational Amplifier Power Suppliers
• Interface Power Suppliers
• Handheld Instruments
• Fire Detection and Notification
• Industrial Handheld Radios
• Blood Pressure Monitors
3 Description
The LM2665 CMOS charge-pump voltage converter
operates as a voltage doubler for an input voltage in
the range of 2.5 V to 5.5 V. Two low-cost capacitors
and a diode (needed during start-up) are used in this
circuit to provide up to 40 mA of output current. The
LM2665 can also work as a voltage divider to split a
voltage in the range of 1.8 V to 11 V in half.
The LM2665 operates at 160-kHz oscillator frequency
to reduce output resistance and voltage ripple. With
an operating current of only 650 µA (operating
efficiency greater than 90% with most loads) and
1-µA typical shutdown current, the LM2665 provides
ideal performance for battery powered systems.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM2665 SOT-23 (6) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Voltage Doubler
Splitting Vin in Half
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics ............................................. 5
7 Parameter Measurement Information .................. 7
7.1 Test Circuit................................................................ 7
8 Detailed Description.............................................. 8
8.1 Overview................................................................... 8
8.2 Functional Block Diagram......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9 Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Applications .................................................. 9
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 13
12 Device and Documentation Support................. 14
12.1 Community Resources.......................................... 14
12.2 Trademarks........................................................... 14
12.3 Electrostatic Discharge Caution............................ 14
12.4 Glossary................................................................ 14
13 Mechanical, Packaging, and Orderable
Information........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (July 2015) to Revision H Page
• Added several new "Applications" to page 1.......................................................................................................................... 1
Changes from Revision F (May 2013) to Revision G Page
• Added Pin Configuration and Functions section, ESD Rating table, Feature Description ,Device Functional Modes,
Application and Implementation,Power Supply Recommendations,Layout,Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections................................................................................................ 1
Changes from Revision E (May 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 12
1
2
3
6
5
4
3
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5 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
Pin Functions
PIN TYPE DESCRIPTION
NO. NAME VOLTAGE DOUBLER VOLTAGE SPLIT
1 V+ Power Power supply positive voltage input Positive voltage output
2 GND Ground Power supply ground input Same as doubler
3 CAP−Power Connect this pin to the negative terminal of the
charge-pump capacitor. Same as doubler
4 SD Input Shutdown control pin, tie this pin to ground in
normal operation. Same as doubler
5 OUT Power Positive voltage output Power supply positive voltage input
6 CAP+ Power Connect this pin to the positive terminal of the
charge-pump capacitor. Same as doubler
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and must be
avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.
(4) The maximum allowable power dissipation is calculated by using PD-MAX = (TJ-MAX −TA)/RθJA, where TJ-MAX is the maximum junction
temperature, TAis the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
V+ to GND voltage 5.8 V
OUT to GND voltage 11.6 V
OUT to V+ voltage 5.8 V
SD (GND −0.3 V) (V+ + 0.3 V)
V+ and OUT continuous output current 50 mA
Output short-circuit duration to GND(3) 1 sec
Continuous power dissipation (TA= 25°C)(4) 600 mW
TJ-MAX(4) 150 °C
Lead temperature (soldering, 10 sec.) 300 °C
Storage temperature, Tstg −65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Operating junction temperature –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM2665
UNITDBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 210 °C/W
5
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(1) In the test circuit, capacitors C1and C2are 3.3-µF, 0.3-Ωmaximum ESR capacitors. Capacitors with higher ESR increase output
resistance, reduce output voltage and efficiency.
(2) Min. and Max. limits are ensured by design, test, or statistical analysis.
(3) Typical numbers are not ensured but represent the most likely norm.
(4) The minimum input high for the SD pin equals 40% of V+.
(5) The maximum input low for the SD pin equals 20% of V+.
(6) Specified output resistance includes internal switch resistance and capacitor ESR. See the details in Application and Implementation for
simple negative voltage converter.
(7) The output switches operate at one half of the oscillator frequency, ƒOSC = 2ƒSW.
6.5 Electrical Characteristics
MIN and MAX limits apply over the full operating temperature range. Unless otherwise specified: TJ= 25°C, V+ = 5 V,
C1= C2= 3.3 μF.(1)
PARAMETER TEST CONDITIONS MIN(2) TYP(3) MAX(2) UNIT
V+ Supply voltage 2.5 5.5 V
IQSupply current No load 650 1250 µA
ISD Shutdown supply current 1 µA
VSD Shutdown pin input voltage Normal operation 2(4) V
Shutdown mode 0.8(5)
ILOutput current 40 mA
RSW Sum of the Rds(on)of the four internal
MOSFET switches IL= 40 mA 3.5 8Ω
ROUT Output resistance(6) IL= 40 mA 12 25 Ω
ƒOSC Oscillator frequency See(7) 80 160 kHz
ƒSW Switching frequency See(7) 40 80 kHz
PEFF Power efficiency RL(1 kΩ) between GND and OUT 90% 94%
IL= 40 mA to GND 90%
VOEFF Voltage conversion efficiency No load 99% 99.96%
6.6 Typical Characteristics
(Circuit of Figure 9, V+ = 5 V unless otherwise specified)
Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Temperature
6
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Typical Characteristics (continued)
(Circuit of Figure 9, V+ = 5 V unless otherwise specified)
Figure 3. Output Source Resistance vs Supply Voltage Figure 4. Output Source Resistance vs Temperature
Figure 5. Output Voltage Drop vs Load Current Figure 6. Oscillator Frequency vs Supply Voltage
Figure 7. Oscillator Frequency vs Temperature Figure 8. Shutdown Supply Current vs Temperature
C1*
VIN
CIN*
VOUT
IL
D1
LM2665
V+ OUT
CAP+
CAP-
SD
GND
C2*ROUT
*CIN, C1 and C2 are 3.3 µF OS-CON capacitors.
1
2
3
64
5
7
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7 Parameter Measurement Information
7.1 Test Circuit
Figure 9. LM2665 Test Circuit
LM2665
SD
V+
CAP+
OUT
GND
OSCILLATOR Switch Array
Switch Drivers CAP-
8
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8 Detailed Description
8.1 Overview
The LM2665 CMOS charge-pump voltage converter operates as a voltage doubler for an input voltage in the
range of 2.5 V to 5.5 V. Two low-cost capacitors and a diode (needed during start-up) are used in this circuit to
provide up to 40 mA of output current. The LM2665 can also work as a voltage divider to split a voltage in the
range of 1.8 V to 11 V in half.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Circuit Description
The LM2665 contains four large CMOS switches which are switched in a sequence to double the input supply
voltage. Energy transfer and storage are provided by external capacitors. Figure 10 illustrates the voltage
conversion scheme. When S2and S4are closed, C1charges to the supply voltage V+. During this time interval,
switches S1and S3are open. In the next time interval, S2and S4are open; at the same time, S1and S3are
closed, the sum of the input voltage V+ and the voltage across C1gives the 2-V+ output voltage when there is no
load. The output voltage drop when a load is added is determined by the parasitic resistance (RDS(on) of the
MOSFET switches and the ESR of the capacitors) and the charge transfer loss between capacitors. Details are
discussed in Application and Implementation.
Figure 10. Voltage Doubling Principle
8.4 Device Functional Modes
8.4.1 Shutdown Mode
A shutdown (SD) pin is available to disable the device and reduce the quiescent current to 1 µA. In normal
operating mode, the SD pin is connected to ground. The device can be brought into the shutdown mode by
applying to the SD pin a voltage greater than 40% of the V+ pin voltage.
9
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers must
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM2665 provides a simple and efficient means of creating an output voltage level equal to twice that of the
input voltage. Without the need of an inductor, the application solution size can be reduced versus the magnetic
DC-DC converter solution.
9.2 Typical Applications
9.2.1 Voltage Doubler
The main application of the LM2665 is to double the input voltage. The range of the input supply voltage is 2.5 V
to 5.5 V.
Figure 11. Voltage Doubler
9.2.1.1 Design Requirements
Example requirements for LM2665 device applications:
DESIGN PARAMETER EXAMPLE VALUE
Input voltage range 2.5 V to 5.5 V
Output current 0 mA to 40 mA
Boost switching frequency 80 kHz
4176 = 4176 KBA=? D ./2665
0QI>AN KB &ARE?AO
8
4+22.' =
+.
&15% × %2
+ 2 × +.× '54%2
4176 2459 +
2
&15% × %
1
+ 4'54%1+ '54%2
10
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9.2.1.2 Detailed Design Requirements
9.2.1.2.1 Positive Voltage Doubler
The output characteristics of this circuit can be approximated by an ideal voltage source in series with a
resistance. The voltage source equals 2 V+. The output resistance ROUT is a function of the ON resistance of the
internal MOSFET switches, the oscillator frequency, the capacitance and equivalent series resistance (ESR) of
C1and C2. Since the switching current charging and discharging C1is approximately twice as the output current,
the effect of the ESR of the pumping capacitor C1will be multiplied by four in the output resistance. The output
capacitor C2is charging and discharging at a current approximately equal to the output current, therefore, its
ESR only counts when in the output resistance. A good approximation of ROUT is:
where
• RSW is the sum of the ON resistance of the internal MOSFET switches shown in Figure 10. (1)
The peak-to-peak output voltage ripple is determined by the oscillator frequency, the capacitance and ESR of the
output capacitor C2:
(2)
High capacitance, low-ESR capacitors can reduce both the output resistance and the voltage ripple.
The Schottky diode D1is only needed for start-up. The internal oscillator circuit uses the OUT pin and the GND
pin. Voltage across OUT and GND must be larger than 1.8 V to insure the operation of the oscillator. During
start-up, D1is used to charge up the voltage at the OUT pin to start the oscillator; also, it protects the device from
turning-on its own parasitic diode and potentially latching-up. Therefore, the Schottky diode D1must have
enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to
prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most
applications. If the input voltage ramp is less than 10 V/ms, a smaller Schottky diode like MBR0520LT1 can be
used to reduce the circuit size.
9.2.1.2.2 Capacitor Selection
As discussed in Positive Voltage Doubler, the output resistance and ripple voltage are dependent on the
capacitance and ESR values of the external capacitors. The output voltage drop is the load current times the
output resistance, and the power efficiency is:
where
• IQ(V+) is the quiescent power loss of the IC device; and
• IL2Rout is the conversion loss associated with the switch on-resistance, the two external capacitors and their
ESRs. (3)
The selection of capacitors is based on the specifications of the dropout voltage (which equals IOUT ROUT), the
output voltage ripple, and the converter efficiency. Low ESR capacitors are recommended to maximize efficiency,
reduce the output voltage drop and voltage ripple.
9.2.1.2.3 Paralleling Devices
Any number of LM2665 devices can be paralleled to reduce the output resistance. Each device must have its
own pumping capacitor C1, while only one output capacitor COUT is needed as shown in Figure 12. The
composite output resistance is:
(4)
11
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Figure 12. Lowering Output Resistance By Paralleling Devices
9.2.1.2.4 Cascading Devices
Cascading the LM2665 devices is an easy way to produce a greater voltage (a two-stage cascade circuit is
shown in Figure 13).
The effective output resistance is equal to the weighted sum of each individual device:
ROUT = 1.5 ROUT_1 + ROUT_2 (5)
Note that the increasing of the number of cascading stages is pracitically limited since it significantly reduces the
efficiency, increases the output resistance and output voltage ripple.
Figure 13. Increasing Output Voltage By Cascading Devices
9.2.1.2.5 Regulating VOUT
It is possible to regulate the output of the LM2665 by use of a low dropout regulator (such as LP2980-5.0). The
whole converter is depicted in Figure 14.
A different output voltage is possible by use of LP2980-3.3, LP2980-3.0, or LP2980-ADJ.
Note that the following conditions must be satisfied simultaneously for worst-case design:
2VIN_MIN > VOUT_MIN + VDROP_MAX (LP2980) + IOUT_MAX × ROUT_MAX (LM2665) (6)
2VIN_MAX < VOUT_MAX +VDROP_MIN (LP2980) + IOUT_MIN × ROUT_MIN (LM2665) (7)
12
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Figure 14. Generate a Regulated 5-V from 3-V Input Voltage
9.2.1.3 Application Curve
Figure 15. Efficiency vs Load Current
9.2.2 Splitting V+ In Half
Another interesting application shown in Splitting Vin in Half is using the LM2665 as a precision voltage divider.
This circuit can be derived from the voltage doubler by switching the input and output connections. In the voltage
divider, the input voltage applies across the OUT pin and the GND pin (which are the power rails for the internal
oscillator), therefore no start-up diode is needed. Also, since the off-voltage across each switch equals VIN/2, the
input voltage can be raised to 11 V.
Figure 16. Application Circuit for Splitting Voltage
10 Power Supply Recommendations
The LM2665 is designed to operate from as an inverter over an input voltage supply range between 2.5 V and
5.5 V when the LV pin is grounded. This input supply must be well regulated and capable to supply the required
input current. If the input supply is located far from the device, additional bulk capacitance may be required in
addition to the ceramic bypass capacitors.
V+
GND
LM2665
CAP-
CAP+
OUT
SD
13
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11 Layout
11.1 Layout Guidelines
The high switching frequency and large switching currents of the LM2665 make the choice of layout important.
Use the following steps as a reference to ensure the device is stable and maintains proper LED current
regulation across its intended operating voltage and current range.
• Place CIN on the top layer (same layer as the LM2665) and as close to the device as possible. Connecting
the input capacitor through short, wide traces to both the V+ and GND pins reduces the inductive voltage
spikes that occur during switching which can corrupt the V+ line.
• Place COUT on the top layer (same layer as the LM2665) and as close as possible to the OUT and GND pin.
The returns for both CIN and COUT must come together at one point, as close to the GND pin as possible.
Connecting COUT through short, wide traces reduce the series inductance on the OUT and GND pins that can
corrupt the VOUT and GND lines and cause excessive noise in the device and surrounding circuitry.
• Place C1 on the top layer (same layer as the LM2665 device) and as close to the device as possible.
Connect the flying capacitor through short, wide traces to both the CAP+ and CAP– pins.
11.2 Layout Example
Figure 17. Typical Layout for LM2665
14
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2665M6 NRND SOT-23 DBV 6 1000 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 S04A
LM2665M6/NOPB ACTIVE SOT-23 DBV 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 S04A
LM2665M6X NRND SOT-23 DBV 6 3000 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 S04A
LM2665M6X/NOPB ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 S04A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2665M6 SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2665M6/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2665M6X SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM2665M6X/NOPB SOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2665M6 SOT-23 DBV 6 1000 210.0 185.0 35.0
LM2665M6/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LM2665M6X SOT-23 DBV 6 3000 210.0 185.0 35.0
LM2665M6X/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
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PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
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EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/B 03/2018
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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