SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D - DECEMBER 1982 - REVISED AUGUST 2003 D D D Wide Operating Voltage Range of 2 V to 6 V High-Current 3-State Outputs Drive Bus Lines Directly or Up To 15 LSTTL Loads Low Power Consumption, 80-A Max ICC D D D Typical tpd = 12 ns 6-mA Output Drive at 5 V Low Input Current of 1 A Max SN54HC245 . . . J OR W PACKAGE SN74HC245 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 A2 A1 DIR VCC OE 1 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND SN54HC245 . . . FK PACKAGE (TOP VIEW) description/ordering information These octal bus transceivers are designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. ORDERING INFORMATION PACKAGE TA PDIP - N SN74HC245N Tube of 25 SN74HC245DW Reel of 2000 SN74HC245DWR SOP - NS Reel of 2000 SN74HC245NSR HC245 SSOP - DB Reel of 2000 SN74HC245DBR HC245 Tube of 70 SN74HC245PW Reel of 2000 SN74HC245PWR Reel of 250 SN74HC245PWT CDIP - J Tube of 20 SNJ54HC245J SNJ54HC245J CFP - W Tube of 85 SNJ54HC245W SNJ54HC245W LCCC - FK Tube of 55 SNJ54HC245FK TSSOP - PW -55 C to 125 -55C 125C C TOP-SIDE MARKING Tube of 20 SOIC - DW 85C C -40C -40 C to 85 ORDERABLE PART NUMBER SN74HC245N HC245 HC245 SNJ54HC245FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D - DECEMBER 1982 - REVISED AUGUST 2003 FUNCTION TABLE INPUTS OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D - DECEMBER 1982 - REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC245 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO t/v t/ v Low-level input voltage NOM MAX 2 5 6 MAX 2 5 6 3.15 3.15 4.2 4.2 0 UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.5 0 Output voltage MIN 1.5 VCC = 4.5 V VCC = 6 V Input voltage SN74HC245 MIN 0 VCC VCC 0 1000 1000 500 500 V V V ns VCC = 6 V 400 400 TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS ICC Ci A or B DIR or OE MIN MAX SN74HC245 MIN MAX UNIT 1.9 1.998 1.9 1.9 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = -6 mA IOH = -7.8 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 A A 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 6V 0.01 0.5 10 5 A 8 160 80 A 10 10 10 pF VI = VCC or 0 VO = VCC or 0 VI = VCC or 0, SN54HC245 2V VI = VIH or VIL DIR or OE TA = 25C TYP MAX 4.5 V IOL = 6 mA IOL = 7.8 mA II IOZ MIN IOH = -20 A A VI = VIH or VIL VOL VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 * DALLAS, TEXAS 75265 V V 3 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D - DECEMBER 1982 - REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25C TYP MAX SN54HC245 SN74HC245 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 40 105 160 130 tpd A or B B or A 4.5 V 15 21 32 26 6V 12 18 27 22 ten OE tdis OE tt A or B A or B A or B MIN MIN MAX MIN MAX 2V 125 230 340 290 4.5 V 23 46 68 58 6V 20 39 58 49 2V 74 200 300 250 4.5 V 25 40 60 50 6V 21 34 51 43 2V 20 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) TA = 25C MIN TYP MAX SN54HC245 SN74HC245 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 54 135 200 170 tpd A or B B or A 4.5 V 18 27 40 34 ten tt OE A or B A or B MIN MAX MIN MAX 6V 15 23 34 29 2V 150 270 405 335 4.5 V 31 54 81 67 6V 25 46 69 56 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 UNIT ns ns ns operating characteristics, TA = 25C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance per transceiver POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 40 UNIT pF SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D - DECEMBER 1982 - REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC PARAMETER Test Point From Output Under Test tPZH S1 ten RL CL (see Note A) 1 k tPZL tPHZ tdis S2 RL tPLZ tpd or tt 1 k -- LOAD CIRCUIT CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF VCC Input 50% 50% 0V tPLH In-Phase Output 50% 10% tPHL 90% VOH 50% 10% V OL tf 90% tr tPHL Out-of-Phase Output 90% tPLH 50% 10% 50% 10% 90% VOH VOL tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL Output Waveform 1 (See Note B) tPLZ 10% tPZH Input 50% 10% 90% VCC 90% 50% 10% 0 V tr Output Waveform 2 (See Note B) VCC VCC 50% VOL tPHZ 50% 90% VOH 0 V tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 5962-8408501VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type 5962-8408501VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 84085012A ACTIVE LCCC FK 20 1 TBD 8408501RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type 8408501SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type JM38510/65503BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type JM38510/65503BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SN54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SN74HC245DBLE OBSOLETE SSOP DB 20 SN74HC245DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245N ACTIVE PDIP N 20 CU NIPDAU N / A for Pkg Type TBD POST-PLATE N / A for Pkg Type Call TI Call TI 20 Pb-Free (RoHS) TBD Call TI 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC245N3 OBSOLETE PDIP N 20 SN74HC245NE4 ACTIVE PDIP N 20 SN74HC245NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWLE OBSOLETE TSSOP PW 20 SN74HC245PWR ACTIVE TSSOP PW 20 TBD 2000 Green (RoHS & no Sb/Br) Addendum-Page 1 Call TI CU NIPDAU Call TI Call TI Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HC245PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC245PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC245FK ACTIVE LCCC FK 20 1 TBD SNJ54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54HC245W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1 SN74HC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74HC245NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HC245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC245DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74HC245DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74HC245DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74HC245NSR SO NS 20 2000 346.0 346.0 41.0 SN74HC245PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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