FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9
February 2011
FOD3182
3A Output Current, High Speed MOSFET Gate Driver
Optocoupler
Features
■
High noise immunity characterized by 50kV/µs (Typ.)
common mode rejection @ V
CM
= 2,000V
■
Guaranteed operating temperature range of
-40°C to +100°C
■
3A peak output current
■
Fast switching speed
– 210ns max. propagation delay
– 65ns max pulse width distortion
■
Fast output rise/fall time
– Offers lower dynamic power dissipation
■
250kHz maximum switching speed
■
Wide V
DD
operating range: 10V to 30V
■
Use of P-Channel MOSFETs at output stage
enables output voltage swing close to the supply rail
(rail-to-rail output)
■
5000Vrms, 1 minute isolation
■
Under voltage lockout protection (UVLO) with
hysteresis – optimized for driving MOSFETs
■
Minimum creepage distance of 8.0mm
■
Minimum clearance distance of 10mm to 16mm
(option TV or TSV)
■
Minimum insulation thickness of 0.5mm
■
UL and VDE*
■
1,414 peak working insulation voltage (V
IORM
)
*Requires ‘V’ ordering option
Applications
■
Plasma Display Panel
■
High performance DC/DC convertor
■
High performance switch mode power supply
■
High performance uninterruptible power supply
■
Isolated Power MOSFET gate drive
Description
The FOD3182 is a 3A Output Current, High Speed
MOSFET Gate Drive Optocoupler. It consists of a
aluminium gallium arsenide (AlGaAs) light emitting diode
optically coupled to a CMOS detector with PMOS and
NMOS output power transistors integrated circuit power
stage. It is ideally suited for high frequency driving of
power MOSFETS used in Plasma Display Panels
(PDPs), motor control inverter applications and high
performance DC/DC converters.
The device is packaged in an 8-pin dual in-line housing
compatible with 260°C reflow processes for lead free
solder compliance.
Functional Block Diagram Package Outlines
8
8
1
8
1
1
8
1
1
2
3
4
8
7
6
5
NC
ANODE
CATHODE
NC
VDD
VO2
VO1
VSS
Note:
A 0.1µF bypass capacitor must be connected between pins 5 and 8.
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 2
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Truth Table
Pin Definitions
LED
V
DD
–
V
SS
“Positive Going”
(Turn-on)
V
DD
–
V
SS
“Negative Going”
(Turn-off) V
O
Off 0V to 30V 0V to 30V Low
On 0V to 7.4V 0V to 7V Low
On 7.4V to 9V 7V to 8.5V Transition
On 9V to 30V 8.5V to 30V High
Pin # Name Description
1NCNot Connected
2 Anode LED Anode
3 Cathode LED Cathode
4NCNot Connected
5V
SS
Negative Supply Voltage
6V
O2
Output Voltage 2 (internally connected to V
O1
)
7V
O1
Output Voltage 1
8V
DD
Positive Supply Voltage
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 3
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Safety and Insulation Ratings
As per DIN EN/IEC 60747-5-2. This optocoupler is suitable for “safe electrical insulation” only within the safety
limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol Parameter Min. Typ. Max. Unit
Installation Classifications per DIN VDE 0110/1.89 Table 1
For Rated Mains Voltage < 150Vrms I–IV
For Rated Mains Voltage < 300Vrms I–IV
For Rated Mains Voltage < 450Vrms I–III
For Rated Mains Voltage < 600Vrms I–III
For Rated Mains Voltage < 1000Vrms (Option T, TS) I–III
Climatic Classification 40/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
CTI Comparative Tracking Index 175
V
PR
Input to Output Test Voltage, Method b,
V
IORM
x 1.875 = V
PR
, 100% Production Test with
tm = 1 sec., Partial Discharge < 5pC
2651
Input to Output Test Voltage, Method a,
V
IORM
x 1.5 = V
PR
, Type and Sample Test with
tm = 60 sec.,Partial Discharge < 5 pC
2121
V
IORM
Max Working Insulation Voltage 1,414 V
peak
V
IOTM
Highest Allowable Over Voltage 6000 V
peak
External Creepage 8 mm
External Clearance 7.4 mm
External Clearance (for Option T or TS - 0.4” Lead Spacing) 10.16 mm
Insulation Thickness 0.5 mm
Safety Limit Values – Maximum Values Allowed in the
Event of a Failure
T
Case
Case Temperature 150 °C
I
S,INPUT
Input Current 25 mA
P
S,OUTPUT
Output Power (Duty Factor
≤
2.7%) 250 mW
R
IO
Insulation Resistance at T
S
, V
IO
= 500V 10
9
Ω
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 4
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise specified)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Value Units
T
STG
Storage Temperature -40 to +125 °C
T
OPR
Operating Temperature -40 to +100 °C
T
J
Junction Temperature -40 to +125 °C
T
SOL
Lead Solder Temperature – Wave solder
(Refer to Reflow Temperature Profile, pg. 22)
260 for 10 sec. °C
I
F(AVG)
Average Input Current
(1)
25 mA
I
F(tr, tf)
LED Current Minimum Rate of Rise/Fall 250 ns
V
R
Reverse Input Voltage 5 V
I
OH(PEAK)
“High” Peak Output Current
(2)
3A
I
OL(PEAK)
“Low” Peak Output Current
(2)
3A
V
DD
– V
SS
Supply Voltage -0.5 to 35 V
V
O(PEAK)
Output Voltage 0 to V
DD
V
P
O
Output Power Dissipation
(4)
250 mW
P
D
Total Power Dissipation
(5)
295 mW
Symbol
Parameter
Value Units
V
DD
– V
SS
Power Supply 10 to 30 V
I
F(ON)
Input Current (ON) 10 to 16 mA
V
F(OFF)
Input Voltage (OFF) -3.0 to 0.8 V
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 5
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Electrical-Optical Characteristics (DC)
Apply over all recommended conditions, typical value is measured at V
DD
= 30V, V
SS
= 0V, T
A
= 25°C,
unless otherwise specified.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
OH
High Level Output Current V
OH
= (V
DD
– V
SS
– 1V) 0.5 0.9 A
V
OH
= (V
DD
– V
SS
– 6V) 2.5
I
OL
Low Level Output Current V
OL
= (V
DD
– V
SS
+ 1V) 0.5 1 A
V
OL
= (V
DD
– V
SS
+ 6V) 2.5
V
OH
High Level Output Voltage
(5)(6)
I
O
= -100mA V
DD
– 0.5 V
V
OL
Low Level Output Voltage
(5)(6)
I
O
= 100mA V
SS
+ 0.5 V
I
DDH
High Level Supply Current Output Open,
I
F
= 10 to 16mA
2.6 4.0 mA
I
DDL
Low Level Supply Current Output Open,
V
F
= -3.0 to 0.8V
2.5 4.0 mA
I
FLH
Threshold Input Current Low to
High
I
O = 0mA, VO > 5V 3.0 7.5 mA
VFHL Threshold Input Voltage High to Low IO = 0mA, VO < 5V 0.8 V
VFInput Forward Voltage IF = 10mA 1.1 1.43 1.8 V
∆VF/T
ATemperature Coefficient of Forward
Voltage
IF = 10mA -1.5 mV/°C
VUVLO+ UVLO Threshold VO > 5V, IF = 10mA 7 8.3 9 V
VUVLO– VO < 5V, IF = 10mA 6.5 7.7 8.5 V
UVLOHYST UVLO Hysteresis 0.6 V
BVRInput Reverse Breakdown Voltage IR = 10µA 5 V
CIN Input Capacitance f = 1MHz, VF = 0V 25 pF
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 6
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Switching Characteristics
Apply over all recommended conditions, typical value is measured at VDD = 30V, VSS = 0V, TA = 25°C,
unless otherwise specified.
Isolation Characteristics
*Typical values at TA = 25°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
tPLH Propagation Delay Time to High Output Level(7) IF = 10mA,
Rg = 10Ω,
f = 250kHz,
Duty Cycle = 50%,
Cg = 10nF
50 120 210 ns
tPHL Propagation Delay Time to Low Output Level(7) 50 145 210 ns
PWD Pulse Width Distortion(8) 35 65 ns
PDD
(tPHL – tPLH)
Propagation Delay Difference Between Any
Two Parts(9)
-90 90 ns
trRise Time CL = 10nF,
Rg = 10Ω
38 ns
tfFall Time 24 ns
tUVLO ON UVLO Turn On Delay 2.0 µs
tUVLO OFF UVLO Turn Off Delay 0.3 µs
| CMH | Output High Level Common Mode Transient
Immunity(10) (11)
TA = +25°C,
If = 7mA to 16mA,
VCM = 2kV,
VDD = 30V
35 50 kV/µs
| CML | Output Low Level Common Mode Transient
Immunity(10) (12)
TA = +25°C,
Vf = 0V,
VCM = 2kV,
VDD = 30V
35 50 kV/µs
Symbol Parameter Test Conditions Min. Typ.* Max. Unit
VISO Withstand Isolation Voltage(13) (14) TA = 25°C,
R.H. < 50%, t = 1min.,
II-O ≤ 10µA
5000 Vrms
RI-O Resistance (input to output)(14) VI-O = 500V 1011 Ω
CI-O Capacitance (input to output) Freq. = 1MHz 1 pF
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 7
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Notes:
1. Derate linearly above +79°C free air temperature at a rate of 0.37mA/°C.
2. Maximum pulse width = 10µs, maximum duty cycle = 11%.
3 Derate linearly above +79°C, free air temperature at the rate of 5.73mW/°C.
4. No derating required across operating temperature range.
5. In this test, VOH is measured with a dc load current of 100mA. When driving capacitive load VOH will approach VDD
as IOH approaches zero amps.
6. Maximum pulse width = 1ms, maximum duty cycle = 20%.
7. tPHL propagation delay is measured from the 50% level on the falling edge of the input pulse to the 50% level of the
falling edge of the VO signal. tPLH propagation delay is measured from the 50% level on the rising edge of the input
pulse to the 50% level of the rising edge of the VO signal.
8. PWD is defined as | tPHL – tPLH | for any given device.
8. The difference between tPHL and tPLH between any two FOD3182 parts under same operating conditions, with
equal loads.
10. Pin 1 and 4 need to be connected to LED common.
11. Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode pulse
VCM to assure that the output will remain in the high state (i.e. VO > 15V).
12. Common mode transient immunity in a low state is the maximum tolerable dVCM/dt of the common mode pulse,
VCM, to assure that the output will remain in a low state (i.e. VO < 1.0V).
13. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000Vrms,
60Hz for 1 second (leakage detection current limit II-O < 10µA).
14. Device considered a two-terminal device: pins on input side shorted together and pins on output side shorted
together.
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 8
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves
Fig. 2 Output High Voltage Drop vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
(V
OH
- V
DD
) – HIGH OUTPUT VOLTAGE DROP (V)
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
TA
– AMBIENT TEMPERATURE (°C)
Fig. 1 Output High Voltage Drop vs. Output High Current
0 0.5 1.0 1.5 2.0 2.5
(V
OH
- V
DD
) – HIGH OUTPUT VOLTAGE DROP (V)
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.-0
-3.5
IOH
– OUTPUT HIGH CURRENT (A)
V
DD
= 15V to 30V
V
SS
= 0V
I
F
= 10mA to 16mA
I
O
= -100mA
Fig. 6 Output Low Voltage vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
V
OL
– OUTPUT LOW VOLTAGE (V)
0.30
0.25
0.20
0.15
0.10
0.05
0
TA
– AMBIENT TEMPERATURE (°C)
V
DD
= 15V to 30V
V
SS
= 0V
V
F
= -3V to 0.8V
I
O
= 100mA
Fig. 3 Output High Current vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
OH
– OUTPUT HIGH CURRENT (A)
8
6
4
2
0
TA
– AMBIENT TEMPERATURE (°C)
Frequency = 200Hz
Duty Cycle = 0.2%
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
Frequency = 200Hz
Duty Cycle = 0.1%
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
V
SS
= 0V
T
A
=100°C
T
A
= 25°C
T
A
= -40°C
Fig. 5 Output Low Voltage vs. Output Low Current
0 0.5 1.0 1.5 2.0 2.5
V
OL
– OUTPUT LOW VOLTAGE (V)
4
3
2
1
0
IOL
– OUTPUT LOW CURRENT (A)
Frequency = 200Hz
Duty Cycle = 99.9%
V
F
(off) = 0.8V
V
DD
= 15V to 30V
V
SS
= 0V
T
A
=100°C
T
A
= 25°C
T
A
= -40°C
V
O
= 6V
V
O
= 3V
Fig. 4 Output High Current vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
OH
– OUTPUT HIGH CURRENT (A)
8
6
4
2
0
TA
– AMBIENT TEMPERATURE (°C)
Frequency = 100Hz
Duty Cycle = 0.5%
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
V
O
= 6V
V
O
= 3V
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 9
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves (Continued)
Fig. 7 Output Low Current vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
OL
– OUTPUT LOW CURRENT (A)
8
6
4
2
0
TA
– AMBIENT TEMPERATURE (°C)
Frequency = 200Hz
Duty Cycle = 99.8%
V
F
= 0.8V
V
DD
= 15V to 30V
V
O
= 6V
V
O
= 3V
Fig. 8 Output Low Current vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
OL
– OUTPUT LOW CURRENT (A)
8
6
4
2
0
TA
– AMBIENT TEMPERATURE (°C)
Frequency = 100Hz
Duty Cycle = 99.5%
V
F
= 0.8V
V
DD
= 15V to 30V
V
O
= 6V
V
O
= 3V
Fig. 9 Supply Current vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
DD
– SUPPLY CURRENT (mA)
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
TA
– AMBIENT TEMPERATURE (°C)
V
DD
= 15V to 30V
V
SS
= 0V
I
F
= 0mA (for I
DDL
)
I
F
= 10mA (for I
DDH
)
IDDH(30V)
IDDL(30V)
IDDH(15V)
IDDL(15V)
IDDH
IDDL
Fig. 11 Low-to-High Input Current Threshold
vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
I
FLH
– LOW-to-HIGH INPUT CURRENT THRESHOLD (mA)
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
TA
– AMBIENT TEMPERATURE (°C)
V
DD
= 15V to 30V
V
SS
= 0V
Output = Open
Fig. 10 Supply Current vs. Supply Voltage
15 20 25 30
I
DD
– SUPPLY CURRENT (mA)
3.6
3.2
2.8
2.4
2.0
VDD
– SUPPLY VOLTAGE (V)
I
F
= 0mA (for I
DDL
)
I
F
= 10mA (for I
DDH
)
V
SS
= 0V
T
A
= 25°C
Fig. 12 Propagation Delay vs. Supply Voltage
15 18 21 24 27 30
t
P
– PROPAGATION DELAY (ns)
250
200
150
100
50
VDD
– SUPPLY VOLTAGE (V)
I
F
= 10mA to 16mA
T
A
= 25°C
R
G
= 10Ω
C
G
= 10nF
Duty Cycle = 50%
Frequency = 250kHz
t
PHL
t
PLH
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 10
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves (Continued)
Fig. 14 Propagation Delay vs. Ambient Temperature
-40 -20 0 20 40 60 80 100
t
P
– PROPAGATION DELAY (ns)
450
350
250
150
50
TA
– AMBIENT TEMPERATURE (°C)
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
R
G
= 10Ω
C
G
= 10nF
Duty Cycle = 50%
Frequency = 250kHz
Fig. 13 Propagation Delay vs. LED Forward Current
681012 14 18
t
P
– PROPAGATION DELAY (ns)
250
200
150
100
50
IF
– FORWARD LED CURRENT (mA)
V
DD
= 15V to 30V
T
A
= 25°C
R
G
= 10Ω
C
G
= 10nF
Duty Cycle = 50%
Frequency = 250kHz
t
PHL
t
PLH
Fig. 15 Propagation Delay vs. Series Load Resistance
01020304050
t
P
– PROPAGATION DELAY (ns)
450
350
250
150
50
RG
– SERIES LOAD RESISTANCE (Ω)
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
C
G
= 10nF
Duty Cycle = 50%
Frequency = 250kHz
t
PHL
t
PLH
Fig. 16 Propagation Delay vs. Series Load Capacitance
020406080100
t
P
– PROPAGATION DELAY (ns)
450
350
250
150
50
100
10
1
0.1
0.01
0.001
CG
– SERIES LOAD CAPACITANCE (nF)
Fig. 18 Input Forward Current vs. Forward Voltage
0.6 0.8 1.0 1.2 1.4 1.6 1.8
I
F
– FORWARE CURRENT (mA)
VR
– FORWARE VOLTAGE (V)
I
F
= 10mA to 16mA
V
DD
= 15V to 30V
R
G
= 10Ω
Duty Cycle = 50%
Frequency = 250kHz
t
PHL
t
PLH
t
PHL
t
PLH
Fig. 17 Transfer Characteristics
0123 45
V
O
– OUTPUT VOLTAGE (V)
35
30
25
20
15
10
5
0
IF
– FORWARD LED CURRENT (mA)
V
DD
= 30V
T
A
= 25°C
T
A
=100°C 25°C -40°C
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 11
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Typical Performance Curves (Continued)
Fig. 19 Under Voltage Lockout
051015 20
VO
– OUTPUT VOLTAGE (V)
20
18
16
14
12
10
8
6
4
2
0
(VDD – VSS)
– SUPPLY VOLTAGE (V)
(8.30V)
(7.80)
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 12
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Test Circuit
Figure 20. IOL Test Circuit
Figure 21. IOH Test Circuit
+
+
Power Supply
VDD = 10V to 30V
Power Supply
V = 6V
1
2
PW = 4.99ms
Period = 5ms
ROUT = 50Ω
R2
100Ω
Frequency = 200Hz
Duty Cycle = 99.8%
VDD = 10V to 30V
VSS = 0V
VF(OFF) = -3.0V to 0.8V
C1
0.1µF
Pulse-In
LED-IFmon
Pulse Generator
Test Conditions:
3
4
8
7
6
5
To Scope
V
OL
R1
100Ω
C2
47µF
+
C3
0.1µF
D1 C4
47µF
+
Iol
1
2
PW = 10µs
Period = 5ms
ROUT = 50Ω
R2
100Ω
Frequency = 200Hz
Duty Cycle = 0.2%
VDD = 10V to 30V
VSS = 0V
IF = 10mA to 16mA
C1
0.1µF
Pulse-In
LED-IFmon
Pulse Generator
Test Conditions:
3
4
8
7
6
5
Power Supply
VDD = 10V to 30V
+
+
–
Power Supply
V = 6V
To Scope
V
OH
R1
100Ω
C2
47µF
+
C3
0.1µF
D1
Current
Probe
Ioh C4
47µF
+
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 13
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Test Circuit (Continued)
Figure 22. VOH Test Circuit
Figure 23. VOL Test Circuit
1
2
IF = 10 to 16mA
VO
3
4
8
7
6
5
0.1µF
100mA
VDD = 10 to 30V
+
–
1
2
VO
3
4
8
7
6
5
0.1µF
100mA
VDD = 10 to 30V
+
–
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 14
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Test Circuit (Continued)
Figure 24. IDDH Test Circuit
Figure 25. IDDL Test Circuit
1
2
IF = 10 to 16mA
VO
3
4
8
7
6
5
0.1µF
VDD = 30V
+
–
1
2
VF = -0.3 to 0.8V
VO
3
4
8
7
6
5
0.1µF
VDD = 30V
+
–
+
–
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 15
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Test Circuit (Continued)
Figure 26. IFLH Test Circuit
Figure 27. VFHL Test Circuit
Figure 28. UVLO Test Circuit
1
2
VO > 5V
3
4
8
7
6
5
0.1µF
IF
VDD = 10 to 30V
+
–
1
2
VF = –0.3 to 0.8V
VO
3
4
8
7
6
5
0.1µF
VDD = 10 to 30V
+
–
+
–
1
2
VO = 5V
3
4
8
7
6
5
0.1µF
10V or 30V
VDD Ramp
+
–
IF = 10mA
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 16
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Test Circuit (Continued)
Figure 29. tPHL, tPLH, tr and tf Test Circuit and Waveforms
Figure 30. CMR Test Circuit and Waveforms
VO
Probe
F = 250kHz
DC = 50%
IF
VOUT
tPLH
Cg = 10nF
Rg = 10Ω
50Ω
1
2
3
4
8
7
6
5
0.1µF
VDD = 10 to 30V
+
–+
–
trtf
90%
50%
10%
tPHL
1
2
A
B
VO
3
4
8
7
6
5
0.1µF
VDD = 30V
VCM = 2,000V
IF
+
–
5V +
–
∆t
VCM
VO
Switch at A: IF = 10mA
Switch at B: IF = 0mA
VOH
VOVOL
0V
+ –
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 17
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Package Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Through Hole
Surface Mount – 0.3" Lead Spacing (Option S)
Note:
1. All dimensions are in millimeters.
2. Dimensions are exclusive of burrs, mold fash, and tie bar extrusion.
0.4" Lead Spacing (Option T)
9.40–9.91
Pin 1
6.35–6.86
5.08
MAX
3.05–3.90
(0.78)
2.54 BSC 7.62 TYP
0.20–0.40
0.41–0.56
3.68–3.94 1.14–1.78
0.51 MIN
9.40–9.91
Pin 1
6.35–6.86
15.0° MAX
10.16 TYP
0.20–0.40
5.08
MAX
(0.78)
2.54 BSC
0.41–0.56
3.68–3.94 1.14–1.78
0.51 MIN 3.05–3.90
9.40–9.91
Pin 1
6.35–6.86
(1.54)
(1.78)
(7.49)
(0.76)
(2.54)
(10.54)
Recommended Land Pattern
(Option S)
5.08
MAX
(0.78)
(0.41–0.56)
8.00 MIN
10.30 MAX
2.54 BSC
3.68–3.94 1.14–1.78
0.20–0.40
0.40 MIN
Both sides
0.51 MIN
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 18
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Package Dimensions (Continued)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Note:
1. All dimensions are in millimeters.
2. Dimensions are exclusive of burrs, mold fash, and tie bar extrusion.
Surface Mount – 0.4" Lead Spacing (Option TS)
(1.54)
(1.78)
(9.96)
(0.76)
(2.54)
(13.00)
Recommended Land Pattern
(Option S)
10.16
0.20–0.40
0.40 MIN
Both sides
12.60 MAX
7.62 TYP
9.40–9.91
1.50
ø1.00 TYP
6.35–6.86
5.08
MAX
(0.78)
2.54 TYP
3.68–3.94 1.14–1.78
0.51 MIN
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 19
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Ordering Information
Marking Information
Part Number Package Packing Method
FOD3182 DIP 8-Pin Tube (50 units per tube)
FOD3182S SMT 8-Pin (Lead Bend) Tube (50 units per tube)
FOD3182SD SMT 8-Pin (Lead Bend) Tape and Reel (1,000 units per reel)
FOD3182V DIP 8-Pin, IEC60747-5-2 option Tube (50 units per tube)
FOD3182SV SMT 8-Pin (Lead Bend), DIN EN/IEC 60747-5-2 option Tube (50 units per tube)
FOD3182SDV SMT 8-Pin (Lead Bend), DIN EN/IEC 60747-5-2 option Tape and Reel (1,000 units per reel)
FOD3182TV DIP 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tube (50 units per tube)
FOD3182TSV SMT 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tube (50 units per tube)
FOD3182TSR2 SMT 8-Pin, 0.4” Lead Spacing Tape and Reel (700 units per reel)
FOD3182TSR2V SMT 8-Pin, 0.4” Lead Spacing, DIN EN/IEC 60747-5-2 option Tape and Reel (700 units per reel)
1
2
6
43 5
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with
DIN EN/IEC 60747-5-2 option – See order entry table)
4Two digit year code, e.g., ‘11’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
3182
BYY
XXV
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 20
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Carrier Tape Specifications – Option S
Symbol Description Dimension in mm
WTape Width 16.0 ± 0.3
tTape Thickness 0.30 ± 0.05
P0Sprocket Hole Pitch 4.0 ± 0.1
D0Sprocket Hole Diameter 1.55 ± 0.05
E Sprocket Hole Location 1.75 ± 0.10
FPocket Location 7.5 ± 0.1
P22.0 ± 0.1
PPocket Pitch 12.0 ± 0.1
A0Pocket Dimensions 10.30 ±0.20
B010.30 ±0.20
K04.90 ±0.20
W1Cover Tape Width 13.2 ± 0.2
dCover Tape Thickness 0.1 max
Max. Component Rotation or Tilt 10°
R Min. Bending Radius 30
d
0
P
t2
D0
1
1
W
User Direction of Feed
0
K
B0
A0W
E
D
F
P
P
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 21
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Carrier Tape Specifications – Option TS
Symbol Description Dimension in mm
WTape Width 24.0 ± 0.3
tTape Thickness 0.40 ± 0.1
P0Sprocket Hole Pitch 4.0 ± 0.1
D0Sprocket Hole Diameter 1.55 ± 0.05
E Sprocket Hole Location 1.75 ± 0.10
FPocket Location 11.5 ± 0.1
P22.0 ± 0.1
PPocket Pitch 16.0 ± 0.1
A0Pocket Dimensions 12.80 ± 0.1
B010.35 ± 0.1
K05.7 ±0.1
W1Cover Tape Width 21.0 ± 0.1
dCover Tape Thickness 0.1 max
Max. Component Rotation or Tilt 10°
R Min. Bending Radius 30
d
0
P
t2
D0
1
1
W
User Direction of Feed
0
K
B0
A0W
E
D
F
P
P
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 22
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
Reflow Profile
Profile Freature Pb-Free Assembly Profile
Temperature Min. (Tsmin) 150°C
Temperature Max. (Tsmax) 200°C
Time (tS) from (Tsmin to Tsmax) 60–120 seconds
Ramp-up Rate (tL to tP) 3°C/second max.
Liquidous Temperature (TL) 217°C
Time (tL) Maintained Above (TL) 60–150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (tP) within 5°C of 260°C 30 seconds
Ramp-down Rate (TP to TL) 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Time (seconds)
Temperature (°C)
Time 25°C to Peak
260
240
220
200
180
160
140
120
100
80
60
40
20
0
TL
ts
tL
tP
TP
Tsmax
Tsmin
120
Preheat Area
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240 360
©2010 Fairchild Semiconductor Corporation www.fairchildsemi.com
FOD3182 Rev. 1.0.9 23
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,andis not
intended to be an exhaustive list of all such trademarks.
AccuPower™
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
DEUXPEED®
Dual Cool™
EcoSPARK®
EfficientMax™
ESBC™
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
Global Power ResourceSM
Green FPS™
Green FPS™e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
OptoHiT™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
PowerTrench
®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world,1mW/W/kWatatime™
SignalWise™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET®
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS®
SyncFET™
Sync-Lock™
®*
ThePower Franchise
®
TheRight Technology for Your Success™
TinyBoost™
TinyBuck™
TinyCalc™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILDíS WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failedapplications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technicalandproduct information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I51
FOD3182 — 3A Output Current, High Speed MOSFET Gate Driver Optocoupler
