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FEATURES
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G06SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
•Available in the Texas Instruments • ± 24-mA Output Drive at 3.3 VNanoFree™ Package
•I
off
Supports Partial-Power-Down Mode•Supports 5-V V
CC
Operation Operation•Input and Open-Drain Output Accept •Latch-Up Performance Exceeds 100 mA PerVoltages up to 5.5 V JESD 78, Class II•Max t
pd
of 4 ns at 3.3 V •ESD Protection Exceeds JESD 22•Low Power Consumption, 10- µA Max I
CC
– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)
This single inverter buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs toimplement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2000–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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SN74LVC1G06
SINGLE INVERTER BUFFER/DRIVERWITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC1G06YZPR _ _ _CT_0.23-mm Large Bump – YZP (Pb-free)NanoFree™ – WCSP (DSBGA) _ _ _ _Reel of 3000 SN74LVC1G06YZVR0.23-mm Large Bump – YZV (Pb-free) CTReel of 3000 SN74LVC1G06DBVR–40 °C to 85 °C
SOT (SOT-23) – DBV C06_Reel of 250 SN74LVC1G06DBVT
Reel of 3000 SN74LVC1G06DCKRSOT (SC-70) – DCK CT_Reel of 250 SN74LVC1G06DCKTSOT (SOT-553) – DRL Reel of 4000 SN74LVC1G06DRLR CT_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
FUNCTION TABLE
INPUT OUTPUTA Y
H LL H
LOGIC DIAGRAM (POSITIVE LOGIC)(DBV, DCK, DRL, YZP PACKAGE)
LOGIC DIAGRAM (POSITIVE LOGIC)(YZV PACKAGE)
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Absolute Maximum Ratings
(1)
SN74LVC1G06SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
–0.5 6.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADBV package 206DCK package 252θ
JA
Package thermal impedance
(4)
DRL package 142 °C/WYZP package 132YZV package 123T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
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Recommended Operating Conditions
(1)
Electrical Characteristics
SN74LVC1G06
SINGLE INVERTER BUFFER/DRIVERWITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
MIN MAX UNIT
Operating 1.65 5.5V
CC
Supply voltage VData retention only 1.5V
CC
= 1.65 V to 1.95 V 0.65 ×V
CC
V
CC
= 2.3 V to 2.7 V 1.7V
IH
High-level input voltage VV
CC
= 3 V to 3.6 V 2V
CC
= 4.5 V to 5.5 V 0.7 ×V
CC
V
CC
= 1.65 V to 1.95 V 0.35 ×V
CC
V
CC
= 2.3 V to 2.7 V 0.7V
IL
Low-level input voltage VV
CC
= 3 V to 3.6 V 0.8V
CC
= 4.5 V to 5.5 V 0.3 ×V
CC
V
I
Input voltage 0 5.5 VV
O
Output voltage 0 5.5 VV
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current 16 mAV
CC
= 3 V
24V
CC
= 4.5 V 32V
CC
= 1.8 V ±0.15 V, 2.5 V ±0.2 V 20∆t/ ∆v Input transition rise or fall rate V
CC
= 3.3 V ±0.3 V 10 ns/VV
CC
= 5 V ±0.5 V 5T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
OL
= 100 µA 1.65 V to 5.5 V 0.1I
OL
= 4 mA 1.65 V 0.45I
OL
= 8 mA 2.3 V 0.3V
OL
VI
OL
= 16 mA 0.43 VI
OL
= 24 mA 0.55I
OL
= 32 mA 4.5 V 0.55I
I
A input V
I
= 5.5 V or GND 0 to 5.5 V ±1µAI
off
V
I
or V
O
= 5.5 V 0 ±10 µAI
CC
V
I
= 5.5 V or GND, I
O
= 0 1.65 V to 5.5 V 10 µA∆I
CC
One input at V
CC
– 0.6 V, Other inputs at V
CC
or GND 3 V to 5.5 V 500 µAC
i
V
I
= V
CC
or GND 3.3 V 4 pFC
o
V
O
= V
CC
or GND 3.3 V 5 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25 °C.
4
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Switching Characteristics
Operating Characteristics
SN74LVC1G06SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
±0.15 V ±0.2 V ±0.3 V ±0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 2.2 6.5 1.1 4 1.2 4 1 3 ns
T
A
= 25 °C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP TYP
C
pd
Power dissipation capacitance f = 10 MHz 3 3 4 6 pF
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PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at VLOAD
(see Note B)
VOL
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VLOAD/2 − V∆
≈0 V
VI
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
3 V
VCC
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
tr/tf
≤ 2 ns
≤ 2 ns
≤ 2.5 ns
≤ 2.5 ns
INPUT
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
TEST S1
VLOAD/2
SN74LVC1G06
SINGLE INVERTER BUFFER/DRIVERWITH OPEN-DRAIN OUTPUT
SCES295T – JUNE 2000 – REVISED JANUARY 2007
(OPEN DRAIN)
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LVC1G06DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKT ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DRLR ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G06YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
SN74LVC1G06YZVR ACTIVE DSBGA YZV 4 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2008
Addendum-Page 1
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G06 :
•Enhanced Product: SN74LVC1G06-EP
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 8-Dec-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC1G06DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G06DBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC1G06DCKT SC70 DCK 5 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC1G06DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC1G06DRLR SOT DRL 5 4000 180.0 9.2 1.78 1.78 0.69 4.0 8.0 Q3
SN74LVC1G06YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
SN74LVC1G06YZVR DSBGA YZV 4 3000 180.0 8.4 1.02 1.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Oct-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC1G06DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
SN74LVC1G06DBVT SOT-23 DBV 5 250 180.0 180.0 18.0
SN74LVC1G06DCKR SC70 DCK 5 3000 205.0 200.0 33.0
SN74LVC1G06DCKR SC70 DCK 5 3000 180.0 180.0 18.0
SN74LVC1G06DCKR SC70 DCK 5 3000 202.0 201.0 28.0
SN74LVC1G06DCKT SC70 DCK 5 250 205.0 200.0 33.0
SN74LVC1G06DCKT SC70 DCK 5 250 180.0 180.0 18.0
SN74LVC1G06DRLR SOT DRL 5 4000 202.0 201.0 28.0
SN74LVC1G06YZPR DSBGA YZP 5 3000 220.0 220.0 34.0
SN74LVC1G06YZVR DSBGA YZV 4 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Oct-2009
Pack Materials-Page 2
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