PC724V0NSZX Series PC724V0NSZX Series DIP 6 pin Large Input Current Photocoupler Description Agency approvals/Compliance PC724V0NSZX Series contains an IRED optically coupled to a phototransistor. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 20% to 80% at input current of 100mA. 1. Recognized by UL1577, file No. E64380 (as model No. PC724V) 2. Package resin : UL flammability grade (94V-0) Applications Features 1. Programmable controllers 2. Facsimiles 3. Telephones 1. 6 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. Large input current type (IF : MAX. 150mA) 4. High isolation voltage between input and output (Viso(rms) : 5.0kV) Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A04202EN Date Mar. 26. 2004 (c) SHARP Corporation PC724V0NSZX Series Internal Connection Diagram 1 1 6 2 5 2 3 4 3 4 5 6 Anode Cathode NC Emitter Collector NC Outline Dimensions (Unit : mm) 2. SMT Gullwing Lead-Form [ex. PC724V0NIPX] 1.20.3 0.6 PC724V 1 SHARP mark "S" 4 2 3 5 4 PC724V Date code Date code 1 Anode mark 2 3 Anode mark 0.5 7.620.3 7.120.5 7.620.3 3.50.5 0.5TYP. 3.50.5 7.12 2.90.5 6 2.540.25 Epoxy resin 0.350.25 5 0.260.1 6 6.50.5 SHARP mark "S" 1.20.3 0.60.2 0.2 6.50.5 1. Through-Hole [ex. PC724V0NSZX] 1.0+0.4 -0 Epoxy resin 1.0+0.4 -0 2.540.25 0.50.1 3.250.5 10.0+0 -0.5 : 0 to 13 Product mass : approx. 0.36g Sheet No.: D2-A04202EN 2 PC724V0NSZX Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * Mark P R S T U V W X A B C ** * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D repeats in a 20 year cycle Country of origin Japan Sheet No.: D2-A04202EN 3 PC724V0NSZX Series Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Ptot Total power dissipation Topr Operating temperature Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 150 1 6 230 35 6 80 160 320 -25 to +100 -55 to +125 5 260 (Ta=25C) Unit mA A V mW V V mA mW mW C C kV C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF Peak forward voltage VFM Reverse current IR Terminal capacitance Ct ICEO Collector dark current Collector-emitter breakdown voltage BVCEO Emitter-collector breakdown voltage BVECO Current transfer ratio IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Cf Floating capacitance fC Cut-off frequency Rise time tr Response time Fall time tf Conditions IF=100mA IFM=0.5A VR=4V V=0, f=1kHz VCE=20V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=100mA, VCE=2V IF=100mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100 -3dB VCE=5V, IC=2mA, RL=100 MIN. - - - - - 35 6 20 - 5x1010 - - - - TYP. 1.4 - - 30 - - - - 0.1 1x1011 0.6 100 4 3 MAX. 1.7 3.0 10 250 100 - - 80 0.2 - 1.0 - 18 18 (Ta=25C) Unit V V A pF nA V V mA V pF kHz s s Sheet No.: D2-A04202EN 4 PC724V0NSZX Series Model Line-up Lead Form Package Model No. Through-Hole SMT Gullwing Sleeve Taping 50pcs/sleeve 1 000pcs/reel PC724V0NSZX PC724V0NIZX PC724V0NIPX Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A04202EN 5 PC724V0NSZX Series Fig.2 Diode Power Dissipation vs. Ambient Temperature 200 300 150 250 230 Diode power dissipation P (mW) Forward current IF (mA) Fig.1 Forward Current vs. Ambient Temperature 100 50 0 -25 0 25 50 75 100 200 150 100 50 0 -25 125 0 Ambient temperature Ta (C) Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.3 Collector Power Dissipation vs. Ambient Temperature 500 Total power dissipation Ptot (mW) 200 Collector power dissipation PC (mW) 25 50 75 100 Ambient temperature Ta (C) 160 150 100 50 0 -25 0 25 50 75 100 400 320 300 200 100 0 -25 125 Ambient temperature Ta (C) Fig.5 Peak Forward Current vs. Duty Ratio 0 25 50 75 100 Ambient temperature Ta (C) Fig.6 Forward Current vs. Forward Voltage 1 000 10 Ta=25C Forward current IF (mA) Peak forward current IFM (mA) Pulse width100s Ta=25C 1 0.1 0.01 10-3 10-2 10-1 100 10 1 0 1 0.5 1 1.5 2 2.5 Forward voltage VF (V) Duty ratio Sheet No.: D2-A04202EN 6 PC724V0NSZX Series Fig.7 Current Transfer Ratio vs. Forward Current Fig.8 Collector Current vs. Collector-emitter Voltage 50 100 VCE=2V Ta=25C Ta=25C 40 Collector current IC (mA) 80 Current transfer ratio CTR (%) PC (MAX.) 45 60 40 IF=100mA 35 30 50mA 25 20 30mA 15 10 20 10mA 5 0 0 0.1 1 10 0 100 2 Fig.9 Collector Dark Current vs. Ambient Temperature Collector-emitter saturation voltage VCE (SAT) (V) Collector dark current ICEO (A) VCE=20V 10-7 -8 10-9 -10 10 0 25 50 8 10 Fig.10 Collector-emitter Saturation Voltage vs. Forward Current 10-6 -25 6 Collector-emitter voltage VCE (V) Forward current IF (mA) 10 4 75 100 10 Ta=25C 9 8 7 6 5 40mA 4 30mA 3 IC=1mA 2 5mA 1 20mA 10mA 0 0 20 Ambient temperature Ta (C) 40 60 80 100 Forward current IF (mA) Fig.11 Response Time vs. Load Resistance Fig.12 Test Circuit for Response Time 100 Response time (s) VCE=5V IC=2mA Ta=25C Input VCC Output Input tr 10 RD tf RL Output VCE 10% 90% td ts tr tf td ts 1 0.1 1 Please refer to the conditions in Fig.11 10 Load resistance RL (k) Sheet No.: D2-A04202EN 7 PC724V0NSZX Series Fig.13 Frequency Response Fig.14 Test Circuit for Frequency Response 10 VCE=5V IC=2mA Ta=25C 5 VCC Voltage gain Av (dB) RD RL Output 0 VCE -5 RL=10k 1k 100 -10 Please refer to the conditions in Fig.13 -15 -20 1 10 100 Frequency f (kHz) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A04202EN 8 PC724V0NSZX Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration. Recommended Foot Print (reference) 1.7 2.54 2.54 8.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A04202EN 9 PC724V0NSZX Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A04202EN 10 PC724V0NSZX Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A04202EN 11 PC724V0NSZX Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A04202EN 12 PC724V0NSZX Series Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G I 5 X. MA H H A B C E K Dimensions List A B 0.3 16.0 7.50.1 H I 0.1 10.4 0.40.05 C 1.750.1 J 4.20.1 D 12.00.1 K 7.80.1 E 2.00.1 F 4.00.1 (Unit:mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.51.5 e f 1.0 23 2.00.5 f a b (Unit : mm) c d 1.0 100 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A04202EN 13 PC724V0NSZX Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A04202EN 14 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Sharp Microelectronics: PC724V0NSZXF PC724V0NIPXF