Ch1_In 16
1
Ch2_In 15
2
Ch3_In 14
3
Ch4_In 13
4
Ch5_In 12
5
Ch6_In 11
6
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch5_Out
Ch6_Out
Ch7_In 10
7
Ch8_In
GND
98
Ch7_Out
Ch8_Out
TPD8F003
3.3 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
Ch1_In 12
1
Ch2_In 11
2
Ch3_In 10
3
Ch4_In 9
4
Ch5_In 8
5
Ch6_In 7
6
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
Ch5_Out
Ch6_Out
GND
TPD6F003
2.5 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
Ch1_In 8
1
Ch2_In 7
2
Ch3_In 6
3
Ch4_In 5
4
Ch1_Out
Ch2_Out
Ch3_Out
Ch4_Out
GND
TPD4F003
1.7 mm x 1.35 mm x 0.75 mm
(0.4-mm pitch)
TPD4F003, TPD6F003, TPD8F003
www.ti.com
SLLS907D –AUGUST 2008–REVISED JANUARY 2010
FOUR-, SIX-, AND EIGHT-CHANNEL EMI FILTERS WITH INTEGRATED ESD PROTECTION
Check for Samples: TPD4F003,TPD6F003,TPD8F003
1FEATURES
• Four-, Six-, and Eight-Channel EMI Filtering for • Space-Saving DQD Packages and
Data Ports Flow-Through Pin Mapping Provide Optimum
Filter Performance
• –3 dB Bandwidth 200 MHz
• Greater than 25dB attenuation at 1 GHz APPLICATIONS
• Robust ESD Protection Exceeds IEC61000-4-2 • LCD Display Interfaces
(Level 4) • Cell Phones
– ±15-kV Human-Body Model (HBM) • SVGA Video Connections
– ±12-kV IEC 61000-4-2 Contact Discharge • Personal Digital Assistants (PDAs)
– ±20-kV IEC 61000-4-2 Air-Gap Discharge
• Pi-Style (C-R-C) Filter Configuration
(R = 100 Ω, CTOTAL = 17 pF)
• Low 10-nA Leakage Current
DQD PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
The TPD4F003, TPD6F003, and TPD8F003 are 4-, 6-, and 8-channel EMI filters in space-saving 0.4-mm pitch
DQD packages. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection.
Because of its small package and easy-to-use pin assignments, the TPDxF003 filters ar suitable for a wide array
of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. In particular, these
filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display, keypad, and memory
interfaces.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2008–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
100 Ω
GND
Ch_In Ch_Out
8.5 pF 8.5 pF
TPD4F003, TPD6F003, TPD8F003
SLLS907D –AUGUST 2008–REVISED JANUARY 2010
www.ti.com
The TPDxF003 are highly integrated device designed to suppress EMI/RFI noise in all systems subjected to
electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to
the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4).
The TPDxF003 is specified for –40°C to 85°C operation.
ORDERING INFORMATION ORDERABLE
TAPACKAGE(1) (2) PACKAGE DIMENSION TOP-SIDE MARKING
PART NUMBER
Length = 1.7 mm, Width = 1.35 mm, TPD4F003DQDR 5RS
Pitch = 0.4 mm, Height = 0.75 mm
Length = 2.5 mm, Width = 1.35 mm,
–40°C to 85°C 0.4-mm pitch SON TPD6F003DQDR 47S
Pitch = 0.4 mm, Height = 0.75 mm
Length = 3.3 mm, Width = 1.35 mm, TPD8F003DQDR 5US
Pitch = 0.4 mm, Height = 0.75 mm
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
EQUIVALENT SCHEMATIC REPRESENTATION
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VIO IO to GND 6 V
Tstg Storage temperature range –65 150 °C
TJJunction temperature 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA= –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VBR DC breakdown voltage IIO = 10 mA 6 V
R Resistance 85 100 115 Ω
C Capacitance (C1 or C2) VIO = 2.5 V 8.5 pF
IIO Channel leakage current VIO = 3.3 V 10 nA
fCCut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω200 MHz
(1) Typical values are at TA= 25°C.
2Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
-40
-20
0
20
40
60
80
100
120
140
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
Ch_In Ch_Out
-40
-20
0
20
40
60
80
100
120
140
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
Ch_In Ch_Out
-140
-120
-100
-80
-60
-40
-20
0
20
40
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
Ch_In Ch_Out
-140
-120
-100
-80
-60
-40
-20
0
20
40
0 25 50 75 100 125 150 175 200
Time (ns)
Amplitude (V)
Ch_In Ch_Out
TPD4F003, TPD6F003, TPD8F003
www.ti.com
SLLS907D –AUGUST 2008–REVISED JANUARY 2010
ESD PROTECTION TYP UNIT
Human-Body Model (HBM) ±15 kV
IEC 61000-4-2 Contact Discharge ±12 kV
IEC 61000-4-2 Air-Gap Discharge ±20 kV
TYPICAL CHARACTERISTCS
IEC Clamping Waveforms
(clamp voltage measured both at Ch_Out and Ch_In)
Figure 1. With 8 kV Contact ESD Stress at Ch_Out Figure 2. With 12 kV Contact ESD Stress at Ch_Out
Figure 3. With -8 kV Contact ESD Stress at Ch_Out Figure 4. With -12 kV Contact ESD Stress at Ch_Out
Copyright © 2008–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
1.00E+06 1 .00E+07 1.00E+08 1. 00E+09 1.00E+10
Frequency (Hz)
Insertion Loss (dB)
TPD8F003 TPD6F003 TP D4F003
TPD8F003
3dB drop/Bias of 0.0V
-3dB = 1 98MHz
Pea k/Freq/Db = 2 .57/45 GHz/dB
TPD6F003
3dB drop/Bias of 0.0V
-3dB = 1 97MHz
Pea k/Freq/Db = 2 .30/47 GHz/dB
TPD4F003
3dB drop/Bias of 0.0V
-3dB = 1 97MHz
Pea k/Freq/Db = 2 .25/45 GHz/dB
-0.001
-0.0008
-0.0006
-0.0004
-0.0002
0
0.0002
0.0004
0.0006
0.0008
0.001
-4 -2 0 2 4 6 8
Voltage (V)
Current (mA)
-110
-105
-100
-95
-90
-85
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10
Frequency (Hz)
Crosstalk (dB)
Adjacent Signal Pair Farthest Signal Pair
-110
-105
-100
-95
-90
-85
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10
Frequency (Hz)
Crosstalk (dB)
Adjacent Signal pair Farthest Signal Pair
TPD4F003, TPD6F003, TPD8F003
SLLS907D –AUGUST 2008–REVISED JANUARY 2010
www.ti.com
Figure 5. Frequency Response Figure 6. DC Voltage-Current Sweep Across Input/Output Pins
Channel-to-Channel Crosstalk
Figure 7. TPD4F003 Figure 8. TPD6F003
Figure 9. TPD8F003
4Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4F003 TPD6F003 TPD8F003
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPD4F003DQDR ACTIVE WSON DQD 8 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPD6F003DQDR ACTIVE WSON DQD 12 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPD8F003DQDR ACTIVE WSON DQD 16 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Mar-2010
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPD4F003DQDR WSON DQD 8 3000 180.0 8.4 1.65 2.0 0.95 4.0 8.0 Q1
TPD6F003DQDR WSON DQD 12 3000 180.0 8.4 1.68 2.79 0.91 4.0 8.0 Q1
TPD8F003DQDR WSON DQD 16 3000 330.0 12.4 1.65 3.6 0.95 4.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jun-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPD4F003DQDR WSON DQD 8 3000 202.0 201.0 28.0
TPD6F003DQDR WSON DQD 12 3000 202.0 201.0 28.0
TPD8F003DQDR WSON DQD 16 3000 358.0 335.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Jun-2012
Pack Materials-Page 2
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