LK3216220M-T - Taiyo Yuden Co., Ltd.

232 TAIYOYUDEN CO.,LTD.

QStandard Products

KM10

MM20

1608f0603g1.6P0.8

2125f0805g2.0P1.25

3216f1206g3.2P1.6

YInternal printed coil structure creates a closed magnetic circuit which acts

as a magnetic shield eliminating crosstalk, thus permitting higher mount-

ing densities.

YMultilayer block structure yields higher reliability.

Any general circuit of portable equipment in which compact size and high

mounting densities are required.

APPLICATIONS

ORDERING CODE

MULTILAYER CHIP INDUCTORS

LK SERIES

FEATURES

OPERATING TEMP. K40V85C

3216R10M_TZ

Multilayer chip inductors

Type

Nominal InductancehAHi

Inductance Tolerances h%i

Internal code

External Dimensions

fLPWghmmi

Packaging

KT Tape & Reel

Q=Blank space

example

47N 0.047

R10 0.1

1R0 1

100 10

*R=decimal point

*N=0.0fnH typeg

654321

233

FERRITE PRODUCTS

TAIYOYUDEN CO.,LTD.

EXTERNAL DIMENSIONS

LK1608 LK2125 LK3216

AVAILABLE INDUCTANCE RANGE

Inductance[AH]

Type

Range 0.047 0.0470.047

33 33

EEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEEE

0.1

P.234 P.236 P.260 P.262 P.270

Selection Guide

P.8

Inductance Imax[mA]Rdcmax[E]Imax[mA]Rdcmax[E]Imax[mA]Rdcmax[E]

0.1AH 50 0.50 250 0.30 250 0.25

1AH 25 0.60 50 0.40 100 0.40

10AH 5 2.55 15 1.15 25 1.00

Examples

UnitDmmfinchg

Part Numbers Electrical Characteristics Packaging Reliability Data Precautions

Imax[mA]Rdcmax[E]

50 0.50

25 0.60

Imax[mA]Rdcmax[E]

250 0.30

50 0.40

Imax[mA]Rdcmax[E]

250 0.25

100 0.40

Type L W T e

LK1608 1.6M0.15 0.8M0.15 0.8M0.15 0.3M0.2

f0603g

f0.063M0.006gf0.031M0.006gf0.031M0.006gf0.012M0.008g

2.0J0.3 0.85M0.2

LK2125 K0.1 1.25M0.2 1.25M0.2 0.5M0.3

f0805g

f0.079J0.012 gf0.049M0.008gf0.033M0.008gf0.020M0.012g

K0.004 f0.049M0.008g

0.6M0.2

LK3216 3.2M0.2 1.6M0.2 1.1M0.3 0.5M0.3

f1206g

f0.126M0.008gf0.063M0.008gf0.024M0.008gf0.020M0.012g

f0.043M0.012g

5 2.55 15 1.15 25 1.00

etc

234 TAIYOYUDEN CO.,LTD.

LK 2125 47NM 0.047 15 320 0.20 300 50

LK 2125 68NM 0.068 M20L15 280 0.20 300 50

LK 2125 82NM 0.082 15 255 0.20 300 50

LK 2125 R10G0.10 20 235 0.30 250 25

LK 2125 R12G0.12 20 220 0.30 250 25

LK 2125 R15G0.15 20 200 0.40 250 25 0.85M0.2

LK 2125 R18G0.18 20 185 0.40 250 25 f0.033M0.008g

LK 2125 R22G0.22 20 170 0.50 250 25

LK 2125 R27G0.27 20 150 0.50 250 25

LK 2125 R33G0.33 20 145 0.55 250 25

LK 2125 R39G0.39 25 135 0.65 200 25

LK 2125 R47G0.47 25 125 0.65 200 25

LK 2125 R56G0.56 25 115 0.75 150 25 1.25M0.2

LK 2125 R68G0.68 25 105 0.80 150 25 f0.049M0.008g

LK 2125 R82G0.82 25 100 1.00 150 25

LK 2125 1R0G1.0 M10L45 75 0.40 50 10

LK 2125 1R2G1.2 M20L45 65 0.50 50 10 0.85M0.2

LK 2125 1R5G1.5 45 60 0.50 50 10

LK 2125 1R8G1.8 45 55 0.60 50 10 f0.033M0.008g

LK 2125 2R2G2.2 45 50 0.65 30 10

LK 2125 2R7G2.7 45 45 0.75 30 10

LK 2125 3R3G3.3 45 41 0.80 30 10

LK 2125 3R9G3.9 45 38 0.90 30 10

LK 2125 4R7G4.7 45 35 1.00 30 10

LK 2125 5R6G5.6 50 32 0.90 15 4

LK 2125 6R8G6.8 50 29 1.00 15 4

LK 2125 8R2G8.2 50 26 1.10 15 4 1.25M0.2

LK 2125 100G10 50 24 1.15 15 2 f0.049M0.008g

LK 2125 120G12 50 22 1.25 15 2

LK 2125 150M 15 30 19 0.80 5 1

LK 2125 180M 18 30 18 0.90 5 1

LK 2125 220M 22 M20L30 16 1.10 5 1

LK 2125 270M 27 30 14 1.15 5 1

LK 2125 330M 33 30 13 1.25 5 0.4

LK 1608 47NM 0.047 10 260 0.30 50 50

LK 1608 68NM 0.068 M20L10 250 0.30 50 50

LK 1608 82NM 0.082 10 245 0.30 50 50

LK 1608 R10G0.10 15 240 0.50 50 25

LK 1608 R12G0.12 15 205 0.50 50 25

LK 1608 R15G0.15 15 180 0.60 50 25

LK 1608 R18G0.18 15 165 0.60 50 25

LK 1608 R22G0.22 15 150 0.80 50 25

LK 1608 R27G0.27 15 136 0.80 50 25

LK 1608 R33G0.33 15 125 0.85 35 25

LK 1608 R39G0.39 15 110 1.00 35 25

LK 1608 R47G0.47 15 105 1.35 35 25

LK 1608 R56G0.56 15 95 1.55 35 25

LK 1608 R68G0.68 15 80 1.70 35 25

LK 1608 R82G0.82 15 75 2.10 35 25

LK 1608 1R0G1.0 M10L35 70 0.60 25 10 0.8M0.15

LK 1608 1R2G1.2 M20L35 60 0.80 25 10

LK 1608 1R5G1.5 35 55 0.80 25 10 f0.031M0.006g

LK 1608 1R8G1.8 35 50 0.95 25 10

LK 1608 2R2G2.2 35 45 1.15 15 10

LK 1608 2R7G2.7 35 40 1.35 15 10

LK 1608 3R3G3.3 35 38 1.55 15 10

LK 1608 3R9G3.9 35 36 1.70 15 10

LK 1608 4R7G4.7 35 33 2.10 15 10

LK 1608 5R6G5.6 35 22 1.55 5 4

LK 1608 6R8G6.8 35 20 1.70 5 4

LK 1608 8R2G8.2 35 18 2.10 5 4

LK 1608 100G10 35 17 2.55 5 2

LK 1608 120G12 35 15 2.75 5 2

LK 1608 150M 15 20 14 1.70 1 1

LK 1608 180M 18 20 13 1.85 1 1

LK 1608 220M 22 M20L20 11 2.10 1 1

LK 1608 270M 27 20 10 2.75 1 1

LK 1608 330M 33 20 9 2.95 1 1

PART NUMBERS

Inductance

hAHiInductance

tolerance fmin.g

Self resonant

frequency

[MHz]fmin.g

Resistance

hEifmax.g

Rated current

hmAi

fmax.g

Measuring

frequency

hMHzi

Thickness

hmmi

finchg

Ordering code

Inductance

hAHiInductance

tolerance

Self resonant

frequency

[MHz]fmin.g

Resistance

hEifmax.g

Rated current

hmAi

fmax.g

Measuring

frequency

hMHzi

Thickness

hmmi

finchg

Ordering code

fmin.g

LK1608

LK2125

YG Please specify the Inductance tolerance code (K or M).

235

FERRITE PRODUCTS

TAIYOYUDEN CO.,LTD.

LK 3216 47NM 0.047 M20L20 320 0.15 300 50

LK 3216 68NM 0.068 20 280 0.25 300 50

LK 3216 R10G0.10 20 235 0.25 250 25

LK 3216 R12G0.12 20 220 0.30 250 25 0.6M0.2

LK 3216 R15G0.15 20 200 0.30 250 25

LK 3216 R18G0.18 20 185 0.40 250 25 f0.024M0.008g

LK 3216 R22G0.22 20 170 0.40 250 25

LK 3216 R27G0.27 20 150 0.50 250 25

LK 3216 R33G0.33 20 145 0.60 250 25

LK 3216 R39G0.39 25 135 0.50 200 25

LK 3216 R47G0.47 25 125 0.60 200 25 1.1M0.3

LK 3216 R56G0.56 25 115 0.70 150 25

LK 3216 R68G0.68 25 105 0.80 150 25 f0.043M0.012g

LK 3216 R82G0.82 25 100 0.90 150 25

LK 3216 1R0G1.0 M10L45 75 0.40 100 10 0.6M0.2

LK 3216 1R2G1.2 M20L45 65 0.50 100 10 f0.024M0.008g

LK 3216 1R5G1.5 45 60 0.50 50 10

LK 3216 1R8G1.8 45 55 0.50 50 10

LK 3216 2R2G2.2 45 50 0.60 50 10

LK 3216 2R7G2.7 45 45 0.60 50 10

LK 3216 3R3G3.3 45 41 0.70 50 10

LK 3216 3R9G3.9 45 38 0.80 50 10

LK 3216 4R7G4.7 45 35 0.90 50 10

LK 3216 5R6G5.6 50 32 0.70 25 4 1.1M0.3

LK 3216 6R8G6.8 50 29 0.80 25 4

LK 3216 8R2G8.2 50 26 0.90 25 4 f0.043M0.012g

LK 3216 100G10 50 24 1.00 25 2

LK 3216 120G12 50 22 1.05 15 2

LK 3216 150M 15 35 19 0.70 5 1

LK 3216 180M 18 35 18 0.70 5 1

LK 3216 220M 22 M20L35 16 0.90 5 1

LK 3216 270M 27 35 14 0.90 5 1

LK 3216 330M 33 35 13 1.05 5 0.4

PART NUMBERS

LK3216

Inductance

hAHiInductance

tolerance fmin.g

Self resonant

frequency

[MHz]fmin.g

Resistance

hEifmax.g

Rated current

hmAi

fmax.g

Measuring

frequency

hMHzi

Thickness

hmmi

finchg

Ordering code

YG Please specify the Inductance tolerance code (K or M).

236 TAIYOYUDEN CO.,LTD.

ELECTRICAL CHARACTERISTICS

DC Bias characteristicsfMeasured by HP4194Ag

Temperature characteristicsfMeasured by HP4275Ag

Q-vs-Frequency characteristicsfMeasured by HP4195AJ41951Ag

260

PACKAGING

TAIYOYUDEN CO.,LTD.

LK 1608

LK 3216

BK 1005

BK 1608

HK 1005

HK 1608

LK 2125

LK 3216

BK 2125

BK 3216

HK 2125

2Taping material

LK1608f0603g0.8 4000 E

f0.031g

0.85 E4000

LK2125f0805gf0.033g

1.25 E2000

f0.049g

0.6 4000 E

LK3216f1206gf0.024g

1.1 E2000

f0.043g

HK1005f0402g0.5 10000 E

f0.020g

HK1608f0603g0.8 4000 E

f0.031g

0.85 E4000

HK2125f0805gf0.033g

1.0 E3000

f0.039g

BK1005f0402g0.5 10000 E

f0.020g

BK1608f0603g0.8 4000 E

f0.031g

0.85 E4000

BK2125f0805gf0.033g

1.25 E2000

f0.049g

BK3216f1206g0.8 E4000

f0.031g

1Standard Quantity

FTape & Reel Packaging

[pcs]

Standard Quantity

Paper Tape Embossed Tape

Type Thickness

[mm]

finchg

261

PACKAGING

FERRITE PRODUCTS

TAIYOYUDEN CO.,LTD.

4LEADER AND BLANK PORTION

5Reel Size

3Taping Dimensions

Type Chip cavity

Insertion Pitch

Tape Thickness

Chip Thickness

ABFT

LK1608f0603g

0.8 1.0M0.2 1.8M0.2

f0.031gf0.039M0.008gf0.071M0.008g

LK3216f1206g

0.6 2.0M0.2 3.6M0.2

f0.024gf0.079M0.008gf0.142M0.008g

HK1005f0402g

0.5 0.65M0.1 1.15M0.1

f0.020gf0.026M0.004gf0.045M0.004g

HK1608f0603g

0.8 1.0M0.2 1.8M0.2

f0.031gf0.039M0.008gf0.071M0.008g

BK1005f0402g

0.5 0.65M0.1 1.15M0.1

f0.020gf0.026M0.004gf0.045M0.004g

BK1608f0603g

0.8 1.0M0.2 1.8M0.2

f0.031gf0.039M0.008gf0.071M0.008g

max.

Tape Thickness

Insertion Pitch

0.85 1.5

LK2125f0805gf0.033g1.5M0.2 2.3M0.2 4.0M0.1

f0.059g

0.3

1.25

f0.059M0.008gf0.091M0.008gf0.157M0.004g

2.0

f0.012g

f0.049g

f0.079g

LK3216f1206g1.1 2.0M0.2 3.6M0.2 4.0M0.1 2.0 0.3

f0.043gf0.079M0.008gf0.142M0.008gf0.157M0.004gf0.079gf0.012g

0.85 1.5

HK2125f0805gf0.033g1.5M0.2 2.3M0.2 4.0M0.1

f0.059g

0.3

1.0

f0.059M0.008g f0.091M0.008g f0.157M0.004g

2.0

f0.012g

f0.039g

f0.079g

0.85 1.5

BK2125f0805gf0.033g1.5M0.2 2.3M0.2 4.0M0.1

f0.059g

0.3

1.25

f0.059M0.008g f0.091M0.008g f0.157M0.004g

2.0

f0.012g

f0.049g

f0.079g

BK3216f1206g0.8 1.9M0.1 3.5M0.1 4.0M0.1 1.4 0.3

f0.031g

f0.075M0.004g f0.138M0.004g f0.157M0.004g

f0.055g

f0.012g

Type

Chip cavity

Chip Thickness

Embossed Tape (0.312 inches wide)

Paper tape (0.312 inches wide)

6Top tape strength

The top tape requires a peel-off force of 0.1V0.7N in the direction of

the arrow as illustrated below.

Unit : mm (inch)

4.0M0.1 1.1max

2.0M0.05 0.8max

4.0M0.1 1.1max

2.0M0.05 0.8max

4.0M0.1 1.1max

f0.157M0.004g

f0.043maxg

f0.079M0.002g

f0.031maxg

f0.157M0.004g

f0.043maxg

f0.079M0.002g

f0.031maxg

f0.157M0.004g

f0.043maxg

263

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RELIABILITY DATA 1/4

Item

Specified Value

Test Methods and Remarks

1.Operating

Temperature

Range

2.Storage Tem-

perature Range

3.Rated Current

4.Impedance

5. Inductance

6.Q

LK3216 HK2125HK1608

K40 to J85C

LK1608 LK2125 HK1005

K55 to J125C

K40 to J85C

K55 to J125C

K40 to J85C

BK2125 BK3216BK1005 BK1608

200mA

60 to 1000E

M25L

150

1000mA

15 to 2500E

M25L

1 to 50mA

BK1005 Series:

Measuring frequency: 100M1MHz

Measuring equipment: HP4291A

Measuring jig: 16192A

BK1608, 2125 Series:

Measuring frequency: 100M1MHz

Measuring equipment: HP4291A, 4195A

Measuring jig: 16092A or 16192A (HW)

BK3216 Series:

Measuring frequency: 100M1MHz

Measuring equipment: HP4291A,4195A

Measuring jig: 16192A

LK Series:

Measuring frequency: 1 to 50 MHz (LK1608)

Measuring frequency: 0.4 to 50MHz (LK2125,3216)

Measuring equipment, jig:

HP4194A + 16085B + 16092A (or its equivalent)

HP4195A + 41951 -61001 + 16092A (or its equivalent)

Measuring current:

1mA rms (0.047 to 4.7AH)

0.1mA rms (5.6 to 33AH)

HK Series:

Measuring frequency: 100MHz (HK1005)

Measuring frequency: 50 / 100MHz (HK1608, 2125)

Measuring equipment, jig:

HP4291A + 16193A (HK1005)

HP4195A + 16092A + in-house made jig

(HK1608, 2125)

LK Series:

Measuring frequency: 1 to 50 MHz (LK1608)

Measuring frequency: 0.4 to 50MHz (LK2125,3216)

Measuring equipment, jig:

HP4194A + 16085B + 16092A (or its equivalent)

HP4195A + 41951 -61001 + 16092A

(or its equivalent)

Measuring current:

1mA rms (0.047 to 4.7AH)

0.1mA rms (5.6 to 33AH)

HK Series:

Measuring frequency: 100MHz (HK1005)

Measuring frequency: 50 / 100MHz (HK1608

2125)

Measuring equipment, jig:

HP4291A + 16193A(HK1005)

HP4195A + 16092A + in-house made jig

(HK1608, 2125)

BB BB BB

5 to 300mA

Multilayer chip inductors and beads

50 ,100mA

68 to 1000E

M25L

100 to

1000mA

22 to 2500E

M25L

0.047 to

33.0AH:

M20%

0.10 to

12.0AH:

M10%

10 to 35

min.

0.047 to

33.0AH:

M20%

0.10 to

12.0AH:

M10%

BBBB BBBB BB

1.0 to 5.6nH:

M0.3nH,

6.8 to 120nH:

M5L,

3.3 to

120nH:M10L

15 to 50

min.

0.047 to

33.0AH:

M20%

0.10 to

12.0AH:

M10%

min.

1.0 to 5.6nH:

M0.3nH

6.8 to 220nH:

M5%

3.3 to 220nH:

M10%

min.

1.5 to 5.6nH:

M0.3nH

6.8 to 470nH:

M5%

3.3 to 470nH:

M10%

10 to 18

min.

BB BB BB

K55 to J125C

100 to

300mA

300mA DC

* Definition of rated current : In the BK Series, the rated current is the value of current at which the temperature of the element is increased by 20C.

In the LK and HK Series, the rated current is either the DC value at which the initial L value is decreased by 5% with the application of DC bias, or the value of current

at which the temperature of the element is increased by 20C.

min.

265

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RELIABILITY DATA 2/4

Item

Specified Value

Test Methods and RemarKs

0.15 to 1.05E

max.

13 to 320MHz

min.

mechanical

damage.

BK1005 HK2125HK1608

LK3216

BK2125 BK3216 LK1608 LK2125

0.15 to 0.85E

max.

0.25 to 1.5E

max.

7.DC Resistance

Self Resonance

Frequency(SRF)

9.Temperature

Characteristic

10. Resistance to

Flexure of

Substrate

0.05 to 0.8E

max.

0.3 to 2.95E

max.

9 to 260MHz

min.

mechanical

damage.

0.2 to 1.25E

max.

13 to 320MHz

min.

mechanical

damage.

0.12 to 1.60E

max.

600 to 10000

MHz min.

Inductance

change:

Within M10%

mechanical

damage.

0.05 to 1.5E

max.

400 to 10000

MHz min.

Inductance

change:

Within M10%

mechanical

damage.

BK Series: DC resistance between electrodes

LK, HK Series:

Measuring equipment: VOAC-7412

(made by Iwasaki Tsushinki)

YVOACK7512fHK1608, 2125g

LK Series:

Measuring equipment: HP4195A

Measuring jig: 41951 - 69001 + 16092A

(or its equivalent)

HK Series:

Measuring equipment: HP8719C

YHP8753DfHK2125g

HK Series:

Temperature range: -30 to +85C

Reference temperature: +20C

Warp: 2mm

Testing board: glass epoxy-resin substrate

Thickness: 0.8mm

BK1608 HK1005

0.05 to 1.8E

max.

0.10 to 1.5E

max.

200 to 4000

MHz min.

Inductance

change:

Within M10%

mechanical

damage.

mechanical

damage.

BB BB BB

BB BB BB BB BB BB

BB BB BB

Multilayer chip inductors and beads

267

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RELIABILITY DATA 3/4

Item

Specified Value

Test Methods and Remarks

LK3216

BK1005 HK2125HK1005

At least 75% of terminal electrode

is covered by new solder.

No mechanical damage.

Remaining terminal electrode:

70% min.

No mechanical damage.

Inductance change: Within M10%

Q change: Within M30%

BK2125 BK3216 LK1608 LK2125

At least 75% of terminal electrode

is covered by new solder.

No mechanical damage.

Remaining terminal electrode:

70% min.

No mechanical damage.

Inductance change: Within M10%

Q change: Within M20%

HK1608

BK1608

At least 75% of terminal electrode is covered

by new solder.

Appearance: No significant abnormality

Impedance change: Within M30%

Appearance: No significant abnormality

Impedance change: Within M30%

11.Solderability

12.Resistance to

Soldering

13.Thermal Shock

BK Series:

Solder temperature: 230M5C

Duration: 4M1 sec.

Immersion speed: 25mm/sec.

LK, HK Series:

Solder temperature: 230M5C

Duration: 4M1 sec.

Preheating temperature: 150 to 180C

Preheating time: 2 to 3 min.

Flux: Immersion into methanol solution with

colophony for 3 to 5 sec.

BK Series:

Solder temperature: 260M5C

Duration: 10M0.5 sec.

Preheating temperature: 150C

Preheating time: 3 min.

Immersion speed: 25 mm/sec.

Recovery: 2 to 3 hrs of recovery under the stan

dard condition after the test. (See Note 1)

LK, HK Series:

Solder temperature: 260M5C

Duration: 10M0.5 sec.

Preheating temperature: 150 to 180C

Preheating time: 2 to 3 min.

Flux: Immersion into methanol solution with

colophony for 3 to 5 sec.

BK Series:

Conditions for 1 cycle

step 1: -55 C 30M3 min.

step 2: Room temperature 10 to 15 min.

step 3: +125 C 30M3 min.

step 4: Room temperature 10 to 15 min.

Number of cycles: 5

Recovery: 2 to 3 hrs of recovery under the stan

dard condition after the test. (See Note 1)

LK Series:

Conditions for 1 cycle / step 1: -25C, 60 min.

step 2: +85C, 60 min.

HK1608, 2125 Series:

Conditions for 1 cycle / step 1: -40C, 60 min.

step 2: +85C, 60 min.

HK1005 Series:

Conditions for 1 cycle / step 1: -55C, 60 min.

step 2: +125C, 60 min.

Number of cycles: 100

(Note 1) When there are questions concerning

mesurement resultDmeasurement shall be made

after 48M2 hrs of recovery under

the standard condition.

Multilayer chip inductors and beads

269

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RELIABILITY DATA 4/4

Item

Specified Value

Test Methods and RemarKs

LK3216

BK1005 BK1608 BK2125

14. Damp Heat

fSteady stateg

15.Loading under

Damp Heat

16.Loading at

High

Temperature

BK3216 LK1608 LK2125

No mechanical damage.

Inductance change: Within M10%

Q change: Within M30%

mechanical

damage.

Inductance

change:

0.047 to

12.0AH:

Within

M10%

15.0 to 33.0

Within

M15%

Q change:

Within

M30%

mechanical

damage.

Inductance

change:

0.047 to 12.0

AH:

Within

M10%

15.0 to 33.0

AH:

Within

M15%

Q change:

Within M30%

No mechanical damage.

Inductance change: Within M10%

Q change: Within M20%

No mechanical damage.

Inductance change: Within M10%

Q change: Within M20%

No mechanical damage.

Inductance change: Within M10%

Q change: Within M20%

No mechanical damage.

Inductance change:

Within M10%

Q change: Within M30%

No mechanical damage.

Inductance change:

Within M10%

Q change: Within M30%

HK2125HK1608HK1005

BK Series:

Temperature: 40M2C

Humidity: 90 to 95%RH

Duration: 500 hrs

Recovery: 2 to 3 hrs of recovery under the

standard condition after the removal from

test chamber.fSee Note1g

LK, HK Series:

Temperature: 40M2C (LK Series)

60M2C (HK Series)

Humidity: 90 to 95%RH

Duration: 500M12 hours

Recovery: 1 to 2 hrs of recovery under the

standard condition after the removal from

test chamber.

BK1005 Series:

Temperature: 40M2C (LK Series)

Humidity: 90 to 95%RH

Duration: 500 hrs

Applied current: Rated current

Recovery: 2 to 3 hrs of recovery under the standard

condition after the removal from test

chamber.fSee Note1g

LK, HK Series:

Temperature: 40M2C (LK Series)

60M2C (HK Series)

Humidity: 90 to 95%RH

Duration: 500M12 hrs

Applied current: Rated current

Recovery: 1 to 2 hrs of recovery under the standard

condition after the removal from test chamber.

BK Series:

Temperature: 125M3C

Applied current: Rated current

Duration: 500 hrs

Recovery: 2 to 3 hrs of recovery under the

standard condition after the removal from

test chamber.(See Note 1)

LK, HK Series:

Temperature: 85M2C (LK, HK Series)

: 125M2C (HK 1005)

Applied current: Rated current

Duration: 500M12 hrs

Recovery: 1 to 2 hrs of recovery under the

standard condition after the removal from

test chamber.

+24

Appearance: No significant abnormality

Impedance change: Within M30%

Appearance: No significant abnormality

Impedance change: Within M30%

mechanical

damage,

Inductance

changeD

withinM30L

Note on standard condition: "standard condition" referred to herein is defined as follows:

5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.

When there are questions concerning measurement results:

In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity,

and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."

(Note 1)

measurement shall be made after 48M2 hrs of re-

covery under the standard condition.

Multilayer chip inductors and beads

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Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads

1.1. Circuit Design SVerification of operating environment, electrical rating

and performance

1. A malfunction in medical equipment, spacecraft,

nuclear reactors, etc. may cause serious harm to

human life or have severe social ramifications. As

such, any inductors to be used in such equipment may

require higher safety and/or reliability considerations

and should be clearly differentiated from components

used in general purpose applications.

SOperating Current (Verification of Rated current)

1. The operating current for inductors must always be

lower than their rated values.

2. Do not apply current in excess of the rated value

because the inductance may be reduced due to the

magnetic saturation effect.

Technical considerationsStages Precautions

2. PCB Design SPattern configurations

(Design of Land-patterns)

1. When inductors are mounted on a PCB, the amount of

solder used (size of fillet) can directly affect inductor

performance. Therefore, the following items must be

carefully considered in the design of solder land pat-

terns:

(1) The amount of solder applied can affect the ability of

chips to withstand mechanical stresses which may lead

to breaking or cracking. Therefore, when designing

land-patterns it is necessary to consider the appropri-

ate size and configuration of the solder pads which in

turn determines the amount of solder necessary to form

the fillets.

(2) When more than one part is jointly soldered onto the

same land or pad, the pad must be designed so that

each component's soldering point is separated by sol-

der-resist.

1. The following diagrams and tables show some examples of recommended

patterns to prevent excessive solder amounts (larger fillets which extend above

the component end terminations). Examples of improper pattern designs are

also shown.

(1) Recommended land dimensions for a typical chip inductor land patterns for

PCBs

Type 1005 1608 2125 3216

L 1.0 1.6 2.0 3.2

W 0.5 0.8 1.25 1.6

A 0.45V0.55 0.6V0.8 0.8V1.2 1.8V2.5

B 0.40V0.50 0.6V0.8 0.6V1.2 0.6V1.5

C 0.45V0.55 0.6V0.8 0.9V1.6 1.2V2.0

Recommended land dimensions for reflow-soldering (unit: mm)

Type 1608 2125 3216

L 1.6 2.0 3.2

W 0.8 1.25 1.6

A0.8V1.0 1.0V1.4 1.8V2.5

B0.5V0.8 0.8V1.5 0.8V1.7

C0.6V0.8 0.9V1.2 1.2V1.6

Size Size

Excess solder can affect the ability of chips to withstand mechanical stresses.

Therefore, please take proper precautions when designing land-patterns.

Recommended land dimensions for wave-soldering (unit: mm)

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(2) Examples of good and bad solder application

Not recommended Recommended

2.PCB Design

Not recommended Recommended

Deflection of

the board

Mixed mounting

of SMD and

leaded compo-

nents

Component

placement close

to the chassis

Hand-soldering

of leaded com-

ponents near

mounted compo-

nents

Horizontal com-

ponent place-

ment

SPattern configurations

(Inductor layout on panelized [breakaway] PC boards)

1. After inductors have been mounted on the boards, chips

can be subjected to mechanical stresses in subsequent

manufacturing processes (PCB cutting, board inspec-

tion, mounting of additional parts, assembly into the

chassis, wave soldering the reflow soldered boards etc.)

For this reason, planning pattern configurations and

the position of SMD inductors should be carefully per-

formed to minimize stress.

1-1. The following are examples of good and bad inductor layout; SMD inductors

should be located to minimize any possible mechanical stresses from board

warp or deflection.

Item

1-2. To layout the inductors for the breakaway PC board, it should be noted that

the amount of mechanical stresses given will vary depending on inductor

layout. An example below should be counted for better design.

1-3. When breaking PC boards along their perforations, the amount of mechani-

cal stress on the inductors can vary according to the method used. The

following methods are listed in order from least stressful to most stressful:

push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor

layout must also consider the PCB splitting procedure.

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Stages Precautions Technical considerations

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Technical considerationsStages Precautions

1. If the lower limit of the pick-up nozzle is low, too much force may be imposed

on the inductors, causing damage. To avoid this, the following points should

be considered before lowering the pick-up nozzle:

(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of

the PC board after correcting for deflection of the board.

(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.

(3)To reduce the amount of deflection of the board caused by impact of the pick-

up nozzle, supporting pins or back-up pins should be used under the PC board.

The following diagrams show some typical examples of good pick-up nozzle

placement:

Improper method Proper method

2. As the alignment pin wears out, adjustment of the nozzle height can cause

chipping or cracking of the inductors because of mechanical impact on the

inductors. To avoid this, the monitoring of the width between the alignment pin

in the stopped position, and maintenance, inspection and replacement of the

pin should be conducted periodically.

SSelection of Adhesives

1. Mounting inductors with adhesives in preliminary as-

sembly, before the soldering stage, may lead to de-

graded inductor characteristics unless the following

factors are appropriately checked; the size of land pat-

terns, type of adhesive, amount applied, hardening tem-

perature and hardening period. Therefore, it is impera-

tive to consult the manufacturer of the adhesives on

proper usage and amounts of adhesive to use.

1. Some adhesives may cause reduced insulation resistance. The difference

between the shrinkage percentage of the adhesive and that of the inductors

may result in stresses on the inductors and lead to cracking. Moreover, too

little or too much adhesive applied to the board may adversely affect compo-

nent placement, so the following precautions should be noted in the applica-

tion of adhesives.

(1)Required adhesive characteristics

a. The adhesive should be strong enough to hold parts on the board during the

mounting & solder process.

b. The adhesive should have sufficient strength at high temperatures.

c. The adhesive should have good coating and thickness consistency.

d. The adhesive should be used during its prescribed shelf life.

e. The adhesive should harden rapidly

f. The adhesive must not be contaminated.

g. The adhesive should have excellent insulation characteristics.

h. The adhesive should not be toxic and have no emission of toxic gasses.

3.Considerations for

automatic placement

SAdjustment of mounting machine

1. Excessive impact load should not be imposed on the

inductors when mounting onto the PC boards.

2. The maintenance and inspection of the mounter should

be conducted periodically.

Double-sided

mounting

Single-sided mounting

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3.Considerations for

automatic placement

4.Soldering SSelection of Flux

1. Since flux may have a significant effect on the perfor-

mance of inductors, it is necessary to verify the follow-

ing conditions prior to use;

(1)Flux used should be with less than or equal to 0.1 wt%

(Chlorine conversion method) of halogenated content.

Flux having a strong acidity content should not be ap-

plied.

(2)When soldering inductors on the board, the amount of

flux applied should be controlled at the optimum level.

(3)When using water-soluble flux, special care should be

taken to properly clean the boards.

SSoldering

Temperature, time, amount of solder, etc. are specified in

accordance with the following recommended conditions.

1-1. When too much halogenated substance (Chlorine, etc.) content is used to

activate the flux, or highly acidic flux is used, an excessive amount of resi-

due after soldering may lead to corrosion of the terminal electrodes or deg-

radation of insulation resistance on the surface of the Inductor.

1-2. Flux is used to increase solderability in flow soldering, but if too much is

applied, a large amount of flux gas may be emitted and may detrimentally

affect solderability. To minimize the amount of flux applied, it is recom-

mended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved by water content in

the air, the residue on the surface of Inductor in high humidity conditions

may cause a degradation of insulation resistance and therefore affect the

reliability of the components. The cleaning methods and the capability of the

machines used should also be considered carefully when selecting water-

soluble flux.

1-1. Preheating when soldering

Heating: Chip inductor components should be preheated to within 100 to

130C of the soldering. Cooling: The temperature difference between the

components and cleaning process should not be greater than 100 C.

Chip inductors are susceptible to thermal shock when exposed to rapid or

concentrated heating or rapid cooling. Therefore, the soldering process

must be conducted with a great care so as to prevent malfunction of the

components due to excessive thermal shock.

Technical considerationsStages Precaution

4/7

Figure 2125/3216 case sizes as examples

a 0.3mm min

b 100 V120 Am

c Area with no adhesive

When using adhesives to mount inductors on a PCB, inappropriate amounts of

adhesive on the board may adversely affect component placement. Too little

adhesive may cause the inductors to fall off the board during the solder process.

Too much adhesive may cause defective soldering due excessive flow of adhe-

sive on to the land or solder pad.

[Recommended conditions]

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Stages Precautions Technical considerations

4.Soldering Recommended conditions for soldering

[Reflow soldering]

Temperature profile

2. Because excessive dwell times can detrimentally affect solderability, sol-

dering duration should be kept as close to recommended times as pos-

sible.

[Wave soldering]

Temperature profile

Caution

1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of

the thickness of the inductor, as shown below:

Caution

1. Make sure the inductors are preheated sufficiently.

2. The temperature difference between the inductor and melted solder should

not be greater than 100 to 130C

3. Cooling after soldering should be as gradual as possible.

4. Wave soldering must not be applied to the inductors designated as for reflow

soldering only.

[Hand soldering]

Temperature profile

Caution

1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.

2. The soldering iron should not directly touch the inductor.

SCleaning conditions

1. When cleaning the PC board after the Inductors are all

mounted, select the appropriate cleaning solution ac-

cording to the type of flux used and purpose of the

cleaning (e.g. to remove soldering flux or other materi-

als from the production process.)

1. The use of inappropriate solutions can cause foreign substances such as flux

residue to adhere to the inductor, resulting in a degradation of the inductor's

electrical properties (especially insulation resistance).

5.Cleaning

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Technical considerationsStages Precautions

6/7

2. Cleaning conditions should be determined after verify-

ing, through a test run, that the cleaning process does

not affect the inductor's characteristics.

2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may

detrimentally affect the performance of the inductors.

(1)Excessive cleaning

In the case of ultrasonic cleaning, too much power output can cause

excessive vibration of the PC board which may lead to the cracking of the

inductor or the soldered portion, or decrease the terminal electrodes' strength.

Thus the following conditions should be carefully checked;

Ultrasonic output Below 20 w/b

Ultrasonic frequency Below 40 kHz

Ultrasonic washing period 5 min. or less

5.Cleaning

7. Handling SBreakaway PC boards (splitting along perforations)

1. When splitting the PC board after mounting inductors

and other components, care is required so as not to

give any stresses of deflection or twisting to the board.

2. Board separation should not be done manually, but by

using the appropriate devices.

SGeneral handling precautions

1. Always wear static control bands to protect against ESD.

2. Keep the inductors away from all magnets and mag-

netic objects.

3. Use non-magnetic tweezers when handling inductors.

4. Any devices used with the inductors (soldering irons,

measuring instruments) should be properly grounded.

5. Keep bare hands and metal products (i.e., metal desk)

away from chip electrodes or conductive areas that lead

to chip electrodes.

6. Keep inductors away from items that generate mag-

netic fields such as speakers or coils.

SMechanical considerations

1. Be careful not to subject the inductors to excessive

mechanical shocks.

(1) If inductors are dropped on the floor or a hard surface

they should not be used.

(2)When handling the mounted boards, be careful that

the mounted components do not come in contact with

or bump against other boards or components.

SApplication of resin coatings, moldings, etc. to the PCB

and components.

1. With some type of resins a decomposition gas or chemi-

cal reaction vapor may remain inside the resin during

the hardening period or while left under normal storage

conditions resulting in the deterioration of the inductor's

performance.

2. When a resin's hardening temperature is higher than

the inductor's operating temperature, the stresses gen-

erated by the excess heat may lead to inductor dam-

age or destruction.

3. Stress caused by a resin’s temperature generated ex-

pansion and contraction may damage inductors.

The use of such resins, molding materials etc. is not rec-

ommended.

6. Post cleaning processes

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8. Storage conditions 1. If the parts are stocked in a high temperature and humidity environment, prob-

lems such as reduced solderability caused by oxidation of terminal electrodes

and deterioration of taping/packaging materials may take place. For this rea-

son, components should be used within 6 months from the time of delivery. If

exceeding the above period, please check solderability before using the in-

ductors

SStorage

1. To maintain the solderability of terminal electrodes and

to keep the packaging material in good condition, care

must be taken to control temperature and humidity in

the storage area. Humidity should especially be kept

as low as possible.

Recommended conditions

Ambient temperature Below 40 C

Humidity Below 70% RH

The ambient temperature must be kept below 30 C. Even

under ideal storage conditions inductor electrode solder-

ability decreases as time passes, so inductors should be

used within 6 months from the time of delivery.

*The packaging material should be kept where no chlo-

rine or sulfur exists in the air.

Technical considerationsStages Precautions

Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads