Features
Fully RoHS Compliant
Diagnostic features per SFF-8472 “Diagnostic Moni-
toring Interface for Optical Transceivers”
Real time monitoring of:
– Transmitted optical power
– Received optical power
– Laser bias current
– Temperature
– Supply voltage
Wide temperature and supply voltage operation
(-10°C to 85°C) (3.3 V ± 10%)
Transceiver speci cations per SFP (SFF-8074i) Multi-
Source Agree-ment and SFF-8472 (revision 9.3)
– 4.25 GBd Fibre Channel operation for
FC-PI 400-M5-SN-I and 400-M6-SN-I
– 2.125 GBd Fibre Channel operation for
FC-PI 200-M5-SN-I and 200-M6-SN-I
– 1.0625 GBd Fibre Channel operation for
FC-PI 100-M5-SN-I and 100-M6-SN-I
Link lengths at 4.25 GBd:
– 150 m with 50 μm MMF, 70 m with 62.5 μm MMF
Link lengths at 2.125 GBd:
– 300 m with 50 μm MMF, 150 m with 62.5 μm MMF
Link lengths at 1.0625 GBd:
– 500 m with 50 μm MMF, 300 m with 62.5 μm MMF
LC Duplex optical connector interface conforming to
ANSI TIA/EIA604-10 (FOCIS 10)
850 nm Vertical Cavity Surface Emitting Laser (VCSEL)
source technology
IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
Compatible with Gigabit Ethernet
AFBR-57R5APZ
Digital Diagnostic SFP, 850 nm, 4.25/2.125/1.0625 GBd,
RoHS Compliant Optical Transceiver
Data Sheet
Description
Avago’s AFBR-57R5APZ optical transceiver supports
high-speed serial links over multimode optical ber at
signaling rates up to 4.25 Gb/s. Compliant with Small
Form Pluggable (SFP) Multi Source Agreement (MSA)
mechanical and electrical speci cations for LC Duplex
transceivers, ANSI Fibre Channel FC-PI, FC-PI-2 and com-
patible with IEEE 802.3 for gigabit applications. The part
is electrically interoperable with SFP conformant devices.
As an enhancement to the conventional SFP interface
de ned in SFF-8074i, the AFBR-57R5APZ is compliant to
SFF-8472 (digital diagnostic interface for optical trans-
ceivers). Using the 2-wire serial interface de ned in the
SFF-8472 MSA, the AFBR-57R5APZ provides real time
temperature, supply voltage, laser bias current, laser
average output power and received input power. This
information is in addition to conventional SFP base data.
The digital diagnostic interface also adds the ability to
disable the transmitter (TX_DISABLE), monitor for Trans-
mitter Faults (TX_FAULT), and monitor for Receiver Loss
of Signal (RX_LOS).
Applications
Fibre channel systems
– Director class switches
– Fabric switches
– HBA cards
Disk and tape drive arrays
Related Products
AFBR-59R5LZ: 850 nm +3.3 V LC SFF 2x7 for
4.25/2.125/1.0625 GBd Fibre Channel
AFBR-57R5APZ
850nm LASER PROD
21CRF(J) CLASS1
SINGAPORE 0446
SN: AJ0446CD1C
PPOC-4102-DIn2
2
Installation
The AFBR-57R5APZ can be installed in any SFF-8074i
compliant Small Form Pluggable (SFP) port regardless of
host equipment operating status. The AFBR-57R5APZ is
hot-pluggable, allowing the module to be installed while
the host system is operating and on-line. Upon insertion,
the transceiver housing makes initial contact with the
host board SFP cage, mitigating potential damage due
to Electro-Static Discharge (ESD).
Digital Diagnostic Interface and Serial Identi cation
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conven-
tional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diag nostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diag-
nostic information provides the opportunity for Predic-
tive Failure Identi cation, Com pliance Prediction, Fault
Isolation and Component Monitoring.
The I2C accessible memory page address 0xB0 is used
internally by SFP for the test and diagnostic purposes
and it is reserved.
Predictive Failure Identi cation
The AFBR-57R5APZ predictive failure feature allows a
host to identify potential link problems before system
performance is impacted. Prior identi cation of link
problems enables a host to service an application via
“fail over” to a redundant link or replace a suspect device,
maintaining system uptime in the process. For applica-
tions where ultra-high system uptime is required, a digital
SFP provides a means to monitor two real-time laser
metrics asso ciated with observing laser degradation and
predicting failure: average laser bias current (Tx_Bias) and
average laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-57R5APZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of
a cable plant and remote transmitter. When operating
out of requirements, the link cannot guarantee error free
transmission.
Fault Isolation
The fault isolation feature allows a host to quickly
pinpoint the location of a link failure, minimizing
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial
to speeding service of an installation. AFBR-57R5APZ
real-time monitors of Tx_Bias, Tx_Power, Vcc, Temperature
and Rx_Power can be used to assess local transceiver
current operating conditions. In addition, status ags
Tx_Disable and Rx Loss of Signal (LOS) are mirrored in
memory and available via the two-wire serial interface.
Component Monitoring
Component evaluation is a more casual use of the
AFBR-57R5APZ real-time monitors of Tx_Bias, Tx_Power,
Vcc, Temperature and Rx_Power. Potential uses are as
debugging aids for system installation and design, and
transceiver parametric evaluation for factory or eld
quali cation. For example, temperature per module can
be observed in high density applications to facilitate
thermal evaluation of blades, PCI cards and systems.
3
Figure 1. Transceiver functional diagram.
LIGHT FROM FIBER
LIGHT TO FIBER
PHOTO-DETECTOR
RECEIVER
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD– (RECEIVE DATA)
Rx LOSS OF SIGNAL
VCSEL
TRANSMITTER
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD– (TRANSMIT DATA)
TX_FAULT
ELECTRICAL INTERFACE
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
CONTROLLER & MEMORY
OPTICAL INTERFACE
Transmitter Section
The transmitter section includes consists of the Transmit-
ter Optical SubAssembly (TOSA) and laser driver circuitry.
The TOSA, containing an 850 nm VCSEL (Vertical Cavity
Surface Emitting Laser) light source, is located at the
optical interface and mates with the LC optical connector.
The TOSA is driven by a custom IC which uses the
incoming di erential high speed logic signal to modulate
the laser diode driver current. This Tx laser driver circuit
regulates the optical power at a constant level provided
the incoming data pattern is dc balanced (8B/10B code,
for example).
Transmit Disable (Tx_Disable)
The AFBR-57R5APZ accepts a TTL and CMOS compat-
ible transmit disable control signal input (pin 3) which
shuts down the transmitter optical output. A high signal
implements this function while a low signal allows
normal transceiver operation. In the event of a fault (e.g.
eye safety circuit activated), cycling this control signal
resets the module as depicted in Figure 4. An internal
pull up resistor disables the transceiver transmitter until
the host pulls the input low. Host systems should allow
a 10 ms interval between successive assertions of this
control signal. Tx_Disable can also be asserted via the
two-wire serial interface (address A2h, byte 110, bit 6)
and monitored (address A2h, byte 110, bit 7).
The contents of A2h, byte 110, bit 6 are logic OR’d with
hardware Tx_Disable (pin 3) to control transmitter
operation.
Transmit Fault (Tx_Fault)
A catastrophic laser fault will activate the transmitter
signal, TX_FAULT, and disable the laser. This signal is
an open collector output (pull-up required on the host
board). A low signal indicates normal laser operation
and a high signal indicates a fault. The TX_FAULT will
be latched high when a laser fault occurs and is cleared
by toggling the TX_DISABLE input or power cycling the
transceiver. The transmitter fault condition can also be
monitored via the two-wire serial interface (address A2,
byte 110, bit 2).
Eye Safety Circuit
The AFBR-57R5APZ provides Class 1 (single fault tolerant)
eye safety by design and has been tested for compliance
with the requirements listed in Table 1. The eye safety
circuit continuously monitors the optical output power
level and will disable the transmitter upon detecting an
unsafe condition beyond the scope of Class 1 certi ca-
tion. Such unsafe conditions can be due to inputs from
the host board (Vcc uctuation, unbalanced code) or a
fault within the transceiver.
Receiver Section
The receiver section includes the Receiver Optical Sub-
Assembly (ROSA) and the ampli cation/quantization
circuitry. The ROSA, containing a PIN photodiode and
custom transimpedance amplifier, is located at the
optical interface and mates with the LC optical connector.
The ROSA output is fed to a custom IC that provides post-
ampli cation and quantization.
4
Receiver Loss of Signal (Rx_LOS)
The post-amplification IC also includes transition
detection circuitry which monitors the ac level of
incoming optical signals and provides a TTL/CMOS
compatible status signal to the host (pin 8). An adequate
optical input results in a low Rx_LOS output while a high
Rx_LOS output indicates an unusable optical input. The
Rx_LOS thresholds are factory set so that a high output
indicates a de nite optical fault has occurred. Rx_LOS
can also be monitored via the two-wire serial interface
(address A2h, byte 110, bit 1).
Functional Data I/O
The AFBR-57R5APZ interfaces with the host circuit board
through twenty I/O pins (SFP electrical connector) iden-
ti ed by function in Table 2. The board layout for this
interface is depicted in Figure 6.
The AFBR-57R5APZ high speed transmit and receive
interfaces require SFP MSA compliant signal lines on
the host board. To simplify board requirements, biasing
resistors and ac coupling capacitors are incorporated into
the SFP transceiver module (per SFF-8074i) and hence are
not required on the host board. The Tx_Disable, Tx_Fault,
and Rx_LOS lines require TTL lines on the host board (per
SFF-8074i) if used. If an application chooses not to take
advantage of the functionality of these pins, care must
be taken to ground Tx_Disable (for normal operation).
Figure 2 depicts the recom mended interface circuit to
link the AFBR-57R5APZ to supporting physical layer ICs.
Timing for MSA compliant control signals implemented
in the transceiver are listed in Figure 4.
Application Support
An Evaluation Kit and Reference Designs are available to
assist in evaluation of the AFBR-57R5APZ. Please contact
your local Field Sales representative for availability and
ordering details.
Ordering Information
Please contact your local eld sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Avago
Technologies’ WEB page at www.avagotech.com or contact
Avago Technologies Semiconductor Products Customer
Response Center at 1-800-235-0312. For information
related to SFF Committee documentation visit www.
s committee.org.
Caution
There are no user serviceable parts nor maintenance
requirements for the AFBR-57R5APZ. All mechanical
adjustments are made at the factory prior to shipment.
Tampering with, modifying, misusing or improp-
erly handling the AFBR-57R5APZ will void the product
warranty. It may also result in improper operation
and possibly overstress the laser source. Performance
degrada tion or device failure may result. Connection of
the AFBR-57R5APZ to a light source not compliant with
ANSI FC-PI or IEEE 802.3 speci cations, operating above
maximum operating conditions or in a manner inconsis-
tent with it’s design and function may result in exposure
to hazardous light radiation and may constitute an act
of modifying or manufacturing a laser product. Persons
performing such an act are required by law to re-certify
and re-identify the laser product under the provisions of
U.S. 21 CFR (Subchapter J) and TUV.
Regulatory Compliance
The AFBR-57R5APZ complies with all applicable laws
and regulations as detailed in Table 1. Certi cation level
is dependent on the overall con guration of the host
equipment. The transceiver performance is o ered as a
gure of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-57R5APZ is compatible with ESD levels found
in typical manufacturing and operating environments
as described in Table 1. In the normal handling and
operation of optical transceivers, ESD is of concern in two
circumstances.
The rst case is during handling of the transceiver prior
to insertion into an SFP compliant cage. To protect the
device, it’s important to use normal ESD handling pre-
cautions. These include use of grounded wrist straps,
work-benches and floor wherever a transceiver is
handled.
The second case to consider is static discharges to the
exterior of the host equipment chassis after installation.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
system level ESD requirements.
5
Table 1. Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD) MIL-STD-883C Class 1 (> 2000 Volts)
to the Electrical Pins Method 3015.4
Electrostatic Discharge (ESD) Variation of IEC 61000-4-2 Typically, no damage occurs with 25 kV when
to the Duplex LC Receptacle the duplex LC connector receptacle is
contacted by a Human Body Model probe.
GR1089 10 contacts of 8 kV on the electrical faceplate
with device inserted into a panel.
Electrostatic Discharge (ESD) Variation of IEC 801-2 Air discharge of 15 kV (min.) contact to
to the Optical Connector connector without damage.
Electromagnetic Interference FCC Class B System margins are dependent on customer
(EMI) CENELEC EN55022 Class B board and chassis design.
(CISPR 22A)
VCCI Class 1
Immunity Variation of IEC 61000-4-3 Typically shows no measurable e ect from
a 10 V/m eld swept from 10 MHz to 1 GHz.
Laser Eye Safety and US FDA CDRH AEL Class 1 CDRH certi cation # 9720151-55
Equipment Type Testing US21 CFR, Subchapter J per TUV le # 72042669
Paragraphs 1002.10
and 1002.12
(IEC) EN60825-1: 1994 + A11 + A2
(IEC) EN60825-2: 1994 + A1
(IEC) EN60950: 1992 + A1 + A2 +
A3 + A4 + A11
Component Recognition Underwriters Laboratories and UL File # E173874
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment including Electrical
Business Equipment
RoHS Compliance Less than 1000 ppm of cadmium, lead, mercury,
hexavalent chromium, polybrominated biphe
nyls, and polybrominated biphenyl ethers.
BAUART
GEPRUFT
TYPE
APPROVED
TUV
Rheinland
Product Safety
¨
¨
Electromagnetic Interference (EMI)
Equipment incorporating gigabit transceivers is typically
subject to regulation by the FCC in the United States,
CENELEC EN55022 (CISPR 22) in Europe and VCCI
in Japan. The AFBR-57R5APZ’s compliance to these
standards is detailed in Table 1. The metal housing and
shielded design of the AFBR-57R5APZ minimizes the EMI
challenge facing the equipment designer.
EMI Immunity (Susceptibility)
Due to its shielded design, the EMI immunity of the AFBR-
57R5APZ exceeds typical industry standards.
Flammability
The AFBR-57R5APZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 ame retardant plastic.
6
Figure 2. Typical application con guration.
Figure 3. Recommended power supply lter.
1 μH
1 μH
0.1 μF
V
CC
R
SFP MODULE
10 μF
V
CC
T
0.1 μF 10 μF
3.3 V
HOST BOARD
0.1 μF
NOTE: INDUCTORS MUST HAVE LESS THAN 1 Ω SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.
LASER DRIVER
MODULE DETECT
LOSS OF SIGNAL
SCL
SDA
Tx_FAULT
Tx_DISABLE
TD+
Tx FAULT
Tx DIS
TD–
RD+
RD–
MOD_DEF2
MOD_DEF1
MOD_DEF0
GND,R
4.7 k to
10 kΩ50 Ω
50 Ω
4.7 k to 10 kΩ4.7 k to 10 kΩ
PROTOCOL IC
V
CC
,T
V
CC
,T
V
CC
,R
1 μH
1 μH
10 μF 0.1 μF
0.1 μF
10 μF 0.1 μF
3.3 V
3.3 V
SERDES IC
Rx LOS
GND,T
0.01 μF
0.01 μF
POST AMPLIFIER
100 Ω
4.7 k to 10 kΩ
100 Ω
6.8 kΩ
0.01 μF
V
CC
,R
0.01 μF
4.7 k to 10 kΩ
V
CC
,R
7
Notes:
1. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V.
2. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8 kΩ
resistor.
Low (0 – 0.8 V): Transmitter on
Between (0.8 V and 2.0 V): Unde ned
High (2.0 – Vcc max) or OPEN: Transmitter Disabled
3. The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kΩ resistor on the host board.
Mod-Def 0 is grounded by the module to indicate the module is present
Mod-Def 1 is serial clock line (SCL) of two wire serial interface
Mod-Def 2 is serial data line (SDA) of two wire serial interface
4. RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7 k – 10 kΩ resistor on the host board. When high,
this output indicates the received optical power is below the worst case receiver sensitivity (as de ned by the standard in use). Low indicates
normal operation. In the low state, the output will be pulled to < 0.8 V.
5. RD-/+ designate the di erential receiver outputs. They are AC coupled 100 Ω di erential lines which should be terminated with 100 Ω di er-
ential at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these
lines will be between 600 and 1600 mV di erential (300 – 800 mV single ended) when properly terminated.
6. VccR and VccT are the receiver and transmitter power supplies. They are de ned at the SFP connector pin. The maximum supply current is 300
mA and the associated in-rush current will typically be no more than 30 mA above steady state after 2 microseconds.
7. TD-/+ designate the di erential transmitter inputs. They are AC coupled di erential lines with 100 Ω di erential termination inside the module.
The AC coupling is done inside the module and is not required on the host board. The inputs will accept di erential swings of 400 – 2400 mV
(200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV di erential (250 – 600 mV single ended) be
used for best EMI performance.
Table 2. Pin Description
Pin Name Function/Description Notes
1 VeeT Transmitter Ground
2 TX_FAULT Transmitter Fault Indication – High indicates a fault condition Note 1
3 TX_DISABLE Transmitter Disable – Module electrical input disables on high or open Note 2
4 MOD-DEF2 Module De nition 2 – Two wire serial ID interface data line (SDA) Note 3
5 MOD-DEF1 Module De nition 1 – Two wire serial ID interface clock line (SCL) Note 3
6 MOD-DEF0 Module De nition 0 – Grounded in module (module present indicator) Note 3
7 N.C.
8 RX_LOS Loss of Signal – High indicates loss of received optical signal Note 4
9 VeeR Receiver Ground
10 VeeR Receiver Ground
11 VeeR Receiver Ground
12 RD- Inverse Received Data Out Note 5
13 RD+ Received Data Out Note 5
14 VeeR Receiver Ground
15 VccR Receiver Power + 3.3 V Note 6
16 VccT Transmitter Power + 3.3 V Note 6
17 VeeT Transmitter Ground
18 TD+ Transmitter Data In Note 7
19 TD- Inverse Transmitter Data In Note 7
20 VeeT Transmitter Ground
8
Table 3. Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Unit Notes
Storage Temperature TS -40 100 C Note 1, 2
Case Operating Temperature TC -40 100 C Note 1, 2
Relative Humidity RH 5 95 % Note 1
Supply Voltage VccT, R -0.5 3.8 V Note 1, 2, 3
Low Speed Input Voltage VIN -0.5 Vcc+0.5 V Note 1
Notes;
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for speci c reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not di er by more than 0.5 V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Parameter Symbol Minimum Maximum Unit Notes
Case Operating Temperature TC -10 85 °C Note 1, 2
Supply Voltage VccT, R 2.97 3.63 V Note 2
Data Rate 1.0625 4.25 Gb/s Note 2
Notes:
1. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
thermal design.
2. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
AC Electrical Characteristics
Power Supply Noise Rejection (peak-peak) PSNR 100 mV Note 1
DC Electrical Characteristics
Module Supply Current ICC 210 mA
Power Dissipation PDISS 765 mW
Low Speed Outputs: VOH 2.0 VccT,R+0.3 V Note 2
Transmit Fault (TX_FAULT), Loss of Signal VOL 0.8 V
(RX_LOS), MOD-DEF 2
Low Speed Inputs: VIH 2.0 Vcc V Note 3
Transmit Disable (TX_DIS), V
IL 0 0.8 V
MOD-DEF 1, MOD-DEF2
Notes:
1. Filter per SFP speci cation is required on host board to remove 10 Hz to 2 MHz content.
2. Pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V.
3. Mod-Def1 and Mod-Def2 must be pulled up externally with a 4.7 k – 10 kΩ resistor on the host board to 3.3 V.
9
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
High Speed Data Input: VI 400 2400 mV Note 1
Transmitter Di erential Input Voltage (TD +/-)
High Speed Data Output: Vo 600 1600 mV Note 2
Receiver Di erential Output Voltage (RD +/-)
Receiver Contributed Total Jitter TJ 0.26 UI Note 3
(4.25 Gb/s) 62 ps
Receiver Contributed Total Jitter TJ 0.26 UI Note 3
(2.125 Gb/s) 124 ps
Receiver Contributed Total Jitter TJ 0.22 UI Note 3
(1.0625 Gb/s) 205 ps
Receiver Electrical Output Rise & Fall Times tr, tf 50 150 ps Note 4
(20-80%)
Notes:
1. Internally AC coupled and terminated (100 Ohm di erential).
2. Internally AC coupled but requires an external load termination (100 Ohm di erential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contrib-
uted RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge)
from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the
actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their speci ed FC-PI maximum lim-
its with the worst case speci ed component jitter input.
4. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
10
Table 7. Transmitter Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
Modulated Optical Output Power (OMA) Tx,OMA 247 μW Note 1
(Peak-to-Peak) 4.25 Gb/s
Modulated Optical Output Power (OMA) Tx,OMA 196 μW Note 2
(Peak-to-Peak) 2.125 Gb/s
Modulated Optical Output Power (OMA) Tx,OMA 156 μW Note 3
(Peak-to-Peak) 1.0625 Gb/s
Average Optical Output Power Pout -9.0 dBm Note 4, 5
Center Wavelength C 830 860 nm
Spectral Width – rms ,rms 0.85 nm
Optical Rise/Fall Time (4.25 Gb/s) tr, tf 90 ps 20% - 80%
RIN 12 (OMA) RIN -118 dB/Hz
Transmitter Contributed Total Jitter (4.25 Gb/s) TJ 0.25 UI Note 6
60 ps
Transmitter Contributed Total Jitter (2.125 Gb/s) TJ 0.25 UI Note 6
120 ps
Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ 0.27 UI Note 6
252 ps
Pout TX_DISABLE Asserted POFF -35 dBm
Notes:
1. An OMA of 247 μW is approximately equal to an average power of –8 dBm, avg assuming an Extinction Ratio of 9 dB.
2. An OMA of 196 μW is approximately equal to an average power of –9 dBm, avg assuming an Extinction Ratio of 9 dB.
3. An OMA of 156 μW is approximately equal to an average power of –10 dBm, avg assuming an Extinction Ratio of 9 dB.
4. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power, max.
5. Into 50/125 μm (0.2 NA) multi-mode optical ber.
6. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed
RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from
the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their speci ed FC-PI maximum limits with
the worst case speci ed component jitter input.
11
Table 8. Receiver Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Min. Typ. Max. Unit Notes
Input Optical Power [Overdrive] PIN 0 dBm, avg
Input Optical Modulation Amplitude OMA 61 μW, OMA Notes 1, 2
(Peak-to-Peak) 4.25 Gb/s [Sensitivity]
Input Optical Modulation Amplitude OMA 49 μW, OMA Notes 1, 3
(Peak-to-Peak) 2.125 Gb/s [Sensitivity]
Input Optical Modulation Amplitude OMA 31 μW, OMA Notes 1, 4
(Peak-to-Peak) 1.0625 Gb/s [Sensitivity]
Stressed Receiver Sensitivity 138 μW, OMA 50/125 μm ber, Note 5
(OMA) 4.25 Gb/s 148 μW, OMA 62.5/125 μm ber, Note 5
Stressed Receiver Sensitivity 96 μW, OMA 50/125 μm ber, Note 6
(OMA) 2.125 Gb/s 109 μW, OMA 62.5/125 μm ber, Note 6
Stressed Receiver Sensitivity 55 μW, OMA 50/125 μm ber, Note 7
(OMA) 1.0625 Gb/s 67 μW, OMA 62.5/125 μm ber, Note 7
Return Loss 12 dB
Loss of Signal – Assert PA 27.5 μW, OMA
-30 -17.5 dBm, avg Note 8
Loss of Signal - De-Assert PD 31 μW, OMA
-17.0 dBm, avg Note 8
Loss of Signal Hysteresis PD - PA 0.5 dB
Notes:
1. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
2. An OMA of 61 μW is approximately equal to an average power of –14 dBm, avg with an Extinction Ratio of 9 dB.
3. An OMA of 49 μW is approximately equal to an average power of –15 dBm, avg with an Extinction Ratio of 9 dB.
4. An OMA of 31 μW is approximately equal to an average power of –17 dBm, avg with an Extinction Ratio of 9 dB.
5. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.67 dB for 50 μm ber and 2.14 dB for 62.5 μm ber. Stressed receiver DCD
component min. (at TX) is 20 ps.
6. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.26 dB for 50 μm ber and 2.03 dB for 62.5 μm ber. Stressed receiver DCD
component min. (at TX) is 40 ps.
7. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 0.96 dB for 50 μm ber and 2.18 dB for 62.5 μm ber. Stressed receiver
DCD component min. (at TX) is 80 ps.
8. These average power values are speci ed with an Extinction Ratio of 9 dB. The loss of signal circuitry responds to valid 8B/10B encoded peak
to peak input optical power, not average power.
12
Table 9. Transceiver SOFT DIAGNOSTIC Timing Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Maximum Unit Notes
Hardware TX_DISABLE Assert Time t_o 10 μs Note 1
Hardware TX_DISABLE Negate Time t_on 1 ms Note 2
Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3
Hardware TX_FAULT Assert Time t_fault 100 μs Note 4
Hardware TX_DISABLE to Reset t_reset 10 μs Note 5
Hardware RX_LOS DeAssert Time t_loss_on 100 μs Note 6
Hardware RX_LOS Assert Time t_loss_o 100 μs Note 7
Software TX_DISABLE Assert Time t_o _soft 100 ms Note 8
Software TX_DISABLE Negate Time t_on_soft 100 ms Note 9
Software Tx_FAULT Assert Time t_fault_soft 100 ms Note 10
Software Rx_LOS Assert Time t_loss_on_soft 100 ms Note 11
Software Rx_LOS De-Assert Time t_loss_o _soft 100 ms Note 12
Analog parameter data ready t_data 1000 ms Note 13
Serial bus hardware ready t_serial 300 ms Note 14
Write Cycle Time t_write 10 ms Note 15
Serial ID Clock Rate f_serial_clock 400 kHz
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
8. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
9. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
10. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
11. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
12. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
13. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
14. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
15. Time from stop bit to completion of a 1-8 byte write command.
13
Table 10. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Min. Units Notes
Transceiver Internal Temperature TINT ±3.0 °C Temperature is measured internal to the transceiver.
Accuracy Valid from = -10°C to 85°C case temperature.
Transceiver Internal Supply VINT ±0.1 V Supply voltage is measured internal to the transceiver
Voltage Accuracy and can, with less accuracy, be correlated to
voltage at the SFP Vcc pin. Valid over 3.3 V ± 10%.
Transmitter Laser DC Bias Current IINT ±10 % IINT is better than ±10% of the nominal value.
Accuracy
Transmitted Average Optical PT ±3.0 dB Coupled into 50/125 μm multi-mode ber. Valid from
Output Power Accuracy 100 μW to 500 μW, avg.
Received Average Optical Input PR ±3.0 dB Coupled from 50/125 μm multi-mode ber. Valid from
Power Accuracy 31 μW to 500 μW, avg.
Figure 4. Transceiver timing diagrams (module installed except where noted).
TX_FAULT
V
CC
T,R > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_init
TX_FAULT
V
CC
T,R > 2.97 V
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
TX_FAULT
V
CC
T,R > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_off
TX_FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
INSERTION
t_on
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
TX_FAULT
OCCURANCE OF FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
OPTICAL SIGNAL
LOS
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED t-loss-on & t-loss-off
t_loss_on
t_init*
t_reset
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t_loss_off
OCCURANCE
OF LOSS
14
Table 12. EEPROM Serial ID Memory Contents – Conventional SFP Memory (Address A0h)
Byte #
Decimal
Data
Hex Notes
Byte #
Decimal
Data
Hex Notes
0 03 SFP physical device 37 00 Hex Byte of Vendor OUI[4]
1 04 SFP function de ned by serial ID only 38 30 Hex Byte of Vendor OUI[4]
2 07 LC optical connector 39 D3 Hex Byte of Vendor OUI[4]
3 00 40 41 “A” - Vendor Part Number ASCII character
4 00 41 46 “F” - Vendor Part Number ASCII character
5 00 42 42 “B” - Vendor Part Number ASCII character
6 00 43 52 “R” - Vendor Part Number ASCII character
7 20 Intermediate distance (per FC-PI) 44 2D “-” - Vendor Part Number ASCII character
8 40 Shortwave laser without OFC (open ber
control)
45 35 “5” - Vendor Part Number ASCII character
9 0C Multi-mode 50 μm and 62.5 μm optical
media
46 37 “7” - Vendor Part Number ASCII character
10 15 100, 200 & 400 Mbytes/sec FC-PI speed[1] 47 52 “R” - Vendor Part Number ASCII character
11 01 Compatible with 8B/10B encoded data 48 35 “5” - Vendor Part Number ASCII character
12 2B 4300 MBit/sec nominal bit rate (4.25 Gbit/s) 49 41 “A” - Vendor Part Number ASCII character
13 00 50 50 “P” - Vendor Part Number ASCII character
14 00 51 5A “Z” - Vendor Part Number ASCII character
15 00 52 20 “ ” - Vendor Part Number ASCII character
16 0F 150 m of 50/125 μm ber @ 4.25GBit/sec[2] 53 20 “ ” - Vendor Part Number ASCII character
17 07 70 m of 62.5/125 μm ber @ 4.25GBit/sec[3] 54 20 “ ” - Vendor Part Number ASCII character
18 00 55 20 “ ” - Vendor Part Number ASCII character
19 00 56 20 “ ” - Vendor Part Number ASCII character
20 41 “A” - Vendor Name ASCII character 57 20 “ ” - Vendor Part Number ASCII character
21 56 “V” - Vendor Name ASCII character 58 20 “ ” - Vendor Part Number ASCII character
22 41 “A” - Vendor Name ASCII character 59 20 “ ” - Vendor Part Number ASCII character
23 47 “G” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength[5]
24 51 “O” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength[5]
25 20 “ ” - Vendor Name ASCII character 62 00
26 20 “ ” - Vendor Name ASCII character 63 Checksum for Bytes 0-62[6]
27 20 “ ” - Vendor Name ASCII character 64 00
28 20 “ ” - Vendor Name ASCII character 65 3A Hardware SFP TX_DISABLE, TX_FAULT, &
RX_LOS
29 20 “ ” - Vendor Name ASCII character 66 00
30 20 “ ” - Vendor Name ASCII character 67 00
31 20 “ ” - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters[7]
32 20 “ ” - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters[8]
33 20 “ ” - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Pwr Avg
34 20 “ ” - Vendor Name ASCII character 93 F0 A/W, Soft SFP TX_DISABLE, TX_FAULT, &
RX_LOS
35 20 “ ” - Vendor Name ASCII character 94 01 SFF-8472 Compliance to revision 9.3
36 00 95 Checksum for Bytes 64-94[6]
96 - 255 00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial
bit rate of 4.25 GBit/sec.
2. Link distance with 50/125 μm cable at 1.0625 GBit/sec is 500 m. Link distance at 2.125 GBit/sec is 300 m.
3. Link distance with 62.5/125 μm cable at 1.0625 GBit/sec is 300 m. Link distance with 62.5/125 μm cable at 2.125 GBit/sec is 150 m.
4. The IEEE Organizationally Unique Identi er (OUI) assigned to Avago Technologies is 00-30-D3 (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-57R5APZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-57R5APZ ASCII date code and will vary on a per date code basis.
15
Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte # Byte # Byte #
Decimal Notes Decimal Notes Decimal Notes
0 Temp H Alarm MSB[1] 26 Tx Pwr L Alarm MSB[4] 104 Real Time Rx Pwr
MSB
[5]
1 Temp H Alarm LSB[1] 27 Tx Pwr L Alarm LSB[4] 105 Real Time Rx Pwr LSB[5]
2 Temp L Alarm MSB[1] 28 Tx Pwr H Warning MSB[4] 106 Reserved
3 Temp L Alarm LSB[1] 29 Tx Pwr H Warning LSB[4] 107 Reserved
4 Temp H Warning MSB[1] 30 Tx Pwr L Warning MSB[4] 108 Reserved
5 Temp H Warning LSB[1] 31 Tx Pwr L Warning LSB[4] 109 Reserved
6 Temp L Warning MSB[1] 32 Rx Pwr H Alarm MSB[5] 110 Status/Control - See
Table 14
7 Temp L Warning LSB[1] 33 Rx Pwr H Alarm LSB[5] 111 Reserved
8 Vcc H Alarm MSB[2] 34 Rx Pwr L Alarm MSB[5] 112 Flag Bits - See Table 15
9 Vcc H Alarm LSB[2] 35 Rx Pwr L Alarm LSB[5] 113 Flag Bits - See Table 15
10 Vcc L Alarm MSB[2] 36 Rx Pwr H Warning MSB[5] 114 Reserved
11 Vcc L Alarm LSB[2] 37 Rx Pwr H Warning LSB[5] 115 Reserved
12 Vcc H Warning MSB[2] 38 Rx Pwr L Warning MSB[5] 116 Flag Bits - See Table 15
13 Vcc H Warning LSB[2] 39 Rx Pwr L Warning LSB[5] 117 Flag Bits - See Table 15
14 Vcc L Warning MSB[2] 40-55 Reserved 118-127 Reserved
15 Vcc L Warning LSB[2] 56-94 External Calibration Constants[6] 128-247 Customer Writeable
16 Tx Bias H Alarm MSB[3] 95 Checksum for Bytes 0-94[7] 248-255 Vendor Speci c
17 Tx Bias H Alarm LSB[3] 96 Real Time Temperature MSB[1]
18 Tx Bias L Alarm MSB[3] 97 Real Time Temperature LSB[1]
19 Tx Bias L Alarm LSB[3] 98 Real Time Vcc MSB[2]
20 Tx Bias H Warning MSB[3] 99 Real Time Vcc LS[2]
21 Tx Bias H Warning LSB[3] 100 Real Time Tx Bias MSB[3]
22 Tx Bias L Warning MSB[3] 101 Real Time Tx Bias LSB[3]
23 Tx Bias L Warning LSB[3] 102 Real Time Tx Power MSB[4]
24 Tx Pwr H Alarm MSB[4] 103 Real Time Tx Power LSB[4]
25 Tx Pwr H Alarm LSB[4]
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 μV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 μA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 μW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 μW.
6. Bytes 56-94 are not intended for use with AFBR-57R5APZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
16
Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Status/
Bit # Control Name Description Notes
7 TX_ DISABLE State Digital state of SFP TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) Note 1
6 Soft TX_ DISABLE Read/write bit for changing digital state of TX_DISABLE function Note 1, 2
5 Reserved
4 Reserved
3 Reserved
2 TX_FAULT State Digital state of the SFP TX_FAULT Output Pin (1 = TX_FAULT asserted) Note 1
1 RX_LOS State Digital state of the SFP RX_LOS Output Pin (1 = RX_LOS asserted) Note 1
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) Note 3
Notes:
1. The response time for soft commands of the AFBR-57R5APZ is 100 msec as speci ed by the MSA SFF-8472.
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input pin 3 ... either asserted will disable the SFP transmitter.
3. AFBR-57R5APZ meets the MSA SFF-8472 data ready timing of 1000 msec.
Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings
(Address A2h, Bytes 112, 113, 116, 117)
Byte Bit Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold
6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold
5 Vcc High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold
4 Vcc Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold
113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold
6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold
0-5 Reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold
6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold
5 Vcc High Warning Set when transceiver internal supply voltage exceeds high warning threshold
4 Vcc Low Warning Set when transceiver internal supply voltage exceeds low warning threshold
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold
117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold
6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold
0-5 Reserved
17
Figure 5. Module drawing
DEVICE SHOWN WITH
DUST CAP AND
BAIL DELATCH
AFBR-57R5APZ
850nm LASER PROD
21CRF(J) CLASS1
CHINA 0445
SN: A30445CD1C
PPOG-4402-Din2
55.3 r 0.2
8.5 r 0.1
13.4 r 0.1
6.25 r 0.05
TX RX
1.91
13.6
12.4 r 0.2
13.6
14.9 UNCOMPRESSED
0.55 UNCOMPRESSED
1.39 UNCOMPRESSED
AFBR-57R5APZ
850nm LASER PROD
21CRF(J) CLASS1
SINGAPORE 0446
SN: AJ0446CD1C
PPOC-4102-DIn2
+ 0.2
0
18
Figure 6. SFP host board mechanical layout
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.005 TYP.
0.06 L A S B S
10.53 11.93
20
10
11
PIN 1
20
10 11
PIN 1
0.8
TYP.
10.93
9.6
2x 1.55 ± 0.05
3.2
5
LEGEND
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT
AND TRACE KEEPOUT (EXCEPT
CHASSIS GROUND)
4. AREA DENOTES COMPONENT
KEEPOUT (TRACES ALLOWED)
DIMENSIONS ARE IN MILLIMETERS
4
3
2
1
1
26.8 5
11x 2.0
10
3x
41.3
42.3
B
10x ∅1.05 ± 0.01
16.25
REF. 14.25
11.08
8.58
5.68
2.0
11x
11.93
9.6
4.8
8.48
A
3.68
SEE DETAIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
10
3x
34.5
16.25
MIN. PITCH
YX
DETAIL 1
∅ 0.85 ± 0.05
PCB
EDGE
0.06 L A S B S
∅ 0.1 L A S B S
∅ 0.1 L X A S
∅ 0.1 L X A S
∅ 0.1 S X Y
Customer Manufacturing Processes
This module is pluggable and is not designed for aqueous wash, IR re ow, or wave soldering processes.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-3504EN
AV02-0881EN - September 12, 2012
Figure 7. SFP Assembly drawing
41.78 ± 0.5
3.5 ± 0.3
1.7 ± 0.9
Tcase REFERENCE POINT
PCB
10 REF
(to PCB)
0.4 ± 0.1
(below PCB)
10.4 ± 0.1
15.25 ± 0.1
16.25 ± 0.1 MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS
11.73 REF
CAGE ASSEMBLY
9.8 MAX.
15 MAX.
