IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (850 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4255 gema OS-PCN-2009-021-A2 acc. to OS-PCN-2009-021-A2 Wesentliche Merkmale Features * Infrarot LED mit sehr hoher Ausgangsleistung * Kurze Schaltzeiten * High Power Infrared LED * Short switching times Anwendungen Applications * Infrarotbeleuchtung fur Kameras * IR-Datenubertragung * Sensorik * Infrared Illumination for cameras * IR Data Transmission * Optical sensors Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung1) (IF = 100 mA, tp = 20 ms) Radiant Intensity Grouping1) Ie (mW/sr) SFH 4255 Q65110A2467 >10 (typ. 20) 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2012-03-08 1 SFH 4255 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Vorwartsgleichstrom Forward current IF 100 mA Stostrom, tp = 200 s, D = 0 Surge current IFSM 1 A Verlustleistung Power dissipation Ptot 180 mW 450 K/W 200 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA peak 860 nm Schwerpunkt-Wellenlange der Strahlung Centroid wavelength IF = 100 mA centroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 30 nm Abstrahlwinkel Half angle 60 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 2012-03-08 2 SFH 4255 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 12 ns VF VF 1.5 (< 1.8) 2.4 (< 3.0) V V Sperrstrom Reverse current IR not designed for A reverse operation Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e typ 60 mW Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 0.7 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2012-03-08 3 SFH 4255 Strahlstarke Ie in Achsrichtung1) gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values SFH 4255-R SFH 4255-S Einheit Unit Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 10 20 16 32 mW/sr mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 25 s Ie typ 120 190 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one bin in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 2012-03-08 0.8 0.6 0.4 0 20 40 60 80 4 100 120 SFH 4255 Relative Spectral Emission Irel = f () Radiant Intensity Single pulse, tp = 25 s OHF04132 100 Ie = f (IF) Ie 100 mA OHL01715 101 Ie I rel % 10 OHR00883 120 F I e (100 mA) 80 Max. Permissible Forward Current IF = f (TA), RthJA = 450 K/W mA 100 0 80 5 R thjA = 450 K/W 60 10 60 -1 5 40 40 10-2 20 0 700 20 5 750 800 10-3 0 10 nm 950 850 0 5 10 1 5 10 2 IF Forward Current IF = f (VF) Single pulse, tp = 100 s IF Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter OHL01713 0 10 A IF 1.2 A OHF02506 t tP D = TP 1.0 10 -1 IF T D= 0.005 0.01 0.02 0.033 0.05 0.1 0.2 0.5 1 0.8 5 0.6 10 -2 5 0.4 10 -3 5 10 -4 mA 10 3 0.2 0 0.5 1 1.5 2 2.5 V 3 VF 2012-03-08 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp 5 0 20 40 60 80 100 C 120 TA SFH 4255 Mazeichnung Package Outlines 1.1 (0.043) (2.85 (0.112)) 0.9 (0.035) Anode (1.4 (0.055)) (R1) 4.2 (0.165) 3.8 (0.150) 3.8 (0.150) 3.4 (0.134) (2.9 (0.114)) Cathode marking 2.54 (0.100) spacing (0.3 (0.012)) Cathode 0.7 (0.028) 4.2 (0.165) 3.8 (0.150) 2.4 (0.094) 2.8 (0.110) (2.4 (0.094)) C A GPLY6880 Mae in mm (inch) / Dimensions in mm (inch). Gehause / Package SIDELED(R), klarer Verguss / SIDELED(R), clear resin Anschlussbelegung Pin configuration siehe Zeichnung see drawing 2012-03-08 6 SFH 4255 Empfohlenes Lotpaddesign Recommended Solder Pad Design 3.0 (0.118) 3.7 (0.146) 1.2 (0.047) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area > 16 mm 2 Lotstopplack Solder resist OHLPY965 Mae in mm (inch) / Dimensions in mm (inch). 2012-03-08 7 SFH 4255 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020D.01) (acc. to J-STD-020D.01) OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 s 300 250 t Profileigenschaften Profile Feature Bleifreier Aufbau / Pb-Free Assembly (SnAgCu) ) Aufheizrate zum Vorwarmen* / Ramp-up rate to preheat*) Zeit ts von TSmin bis TSmax / Time ts from TSmin to TSmax Aufheizrate zur Spitzentemperatur*) / Ramp-up rate to peak*) Empfehlung / Recommendation Grenzwerte / Max. Ratings 2K/s 3K/s 100 s min. 60 s max. 120 s 2K/s 3K/s 25 C to 150 C 150 C to 200 C 180 C to TP Liquidustemperatur TL / Liquidus temperature TL 217 C Zeit tL uber TL / Time tL above TL 80 s max. 100 s Spitzentemperatur TP / Peak temperature TP 245 C max. 260 C Verweilzeit tP innerhalb des spezifizierten Spitzentemperaturbereichs TP - 5 K / Time tP within the specified peak temperature range TP - 5 K 20 s min. 10 s max. 30 s Abkuhlrate*) / Ramp-down rate*) 3K/s 6 K / s maximum TP to 100 C Zeitspanne von 25 C bis zur Spitzentemperatur / Time from 25 C to peak temperature max. 8 min. Alle Temperaturen beziehen sich auf die Bauteilmitte, jeweils auf der Bauteiloberseite gemessen / All temperatures refer to the center of the package, measured on the top of the package * Steigungsberechnung T/t: t max. 5 s; erfullt uber den gesamten Temperaturbereich / slope calculation T/t: t max. 5 s; fulfillment for the whole T-range 2012-03-08 8 SFH 4255 Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2012-03-08 9