MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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1. INTRODUCTION
MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic condensers are used.
CCE's GHQ series MLCC is used at high frequencies generally have a small temperature coefficient of capacitance,
typical within the ±30ppm/°C required for NP0 (C0G) classification and have excellent conductivity internal electrode.
Thus, CCE GHQ series MLCC will be with the feature of low ESR and high Q characteristics.
4. HOW TO ORDER
GHQ
04 CG
100 G 50 N T
Series
GHQ=High Q/
Low ESR
Size
04=0402 (1005)
10=0603 (1608)
21=0805 (2012)
Dielectric
CG=NP0
(C0G)
Capacitance
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
eg.:
R47=0.47pF
0R5=0.5pF
1R0=1.0pF
100=10x10
0
=10pF
Tolerance
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
Rated voltage
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
16=16 VDC
25=25 VDC
50=50 VDC
100=100 VDC
Termination
N=Ag/Ni/Sn
Packaging
T=7” reeled
TD= 13” reeled
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a. Mobile telecommunication: Mobile phone, WLAN.
b. RF module: Power amplifier, VCO.
c. Tuners.
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric NP0
Size 0402, 0603,0805
Capacitance*
0402: 0.1pF to 470pF
0603: 0.5pF to 3300pF
0805: 0.5pF to 150pF
Capacitance tolerance
Cap≤5pF: B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 16V, 25V, 50V, 100V
Q* Cap<30pF: Q≥400+20C
Cap≥30pF: Q≥1000
Insulation resistance at Ur ≥10GΩ
Operating temperature -55 to +125°C
Capacitance change ±30ppm
ESR
Cap<2.2pF: ≤1000mΩ@900±100MHz
2.2pF≤Cap≤470pF: ≤500mΩ@900±100MHz
Cap>470pF: ≤500mΩ@60±10MHz
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Size
Inch (mm) L (mm) W (mm) T (mm)/Symbol M
B
(mm)
0402 (1005) 1.00±0.05 0.50±0.05 0.50±0.05 N 0.25
+0.05/-0.10
0603 (1608) 1.60±0.10 0.80±0.10 0.80±0.07 S 0.40±0.15
0805 (2012) 2.00±0.15
1.25±0.10 0.60±0.10
A 0.50±0.20
# 0402 size : Reflow soldering only.
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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7. CAPACITANCE RANGE
DIELECTRIC NP0
SIZE 0402 0603 0805
RATED VOLTAGE (VDC)
16 25 50 16 25 50 100 50 100
0.1pF (0R1)
N N N
0.2pF (0R2)
N N N
0.3pF (0R3)
N N N
0.4pF (0R4)
N N N
0.5pF (0R5)
N N N S S S S A A
0.6pF (0R6)
N N N S S S S A A
0.7pF (0R7)
N N N S S S S A A
0.8pF (0R8)
N N N S S S S A A
0.9pF (0R9)
N N N S S S S A A
1.0pF (1R0)
N N N S S S S A A
1.2pF (1R2)
N N N S S S S A A
1.5pF (1R5)
N N N S S S S A A
1.8pF (1R8)
N N N S S S S A A
2.2pF (2R2)
N N N S S S S A A
2.7pF (2R7)
N N N S S S S A A
3.3pF (3R3)
N N N S S S S A A
3.9pF (3R9)
N N N S S S S A A
4.7pF (4R7)
N N N S S S S A A
5.6pF (5R6)
N N N S S S S A A
6.8pF (6R8)
N N N S S S S A A
8.2pF (8R2)
N N N S S S S A A
10pF (100)
N N N S S S S A A
12pF (120)
N N N S S S S A A
15pF (150)
N N N S S S S A A
18pF (180)
N N N S S S S A A
22pF (220)
N N N S S S S A A
27pF (270)
N N N S S S S A A
33pF (330)
N N N S S S S A A
39pF (390)
N N N S S S S A A
47pF (470)
N N N S S S S A A
56pF (560)
N N N S S S S A A
68pF (680)
N N N S S S S A A
82pF (820)
N N N S S S S A A
100pF (101)
N N N S S S S A A
120pF (121)
N N N S S S S A A
150pF (151)
N N N S S S S A A
180pF (181)
N N N S S S S
220pF (221)
N N N S S S S
270pF (271)
N N S S S S
330pF (331)
N N S S S S
390pF (391)
N N S S S S
470pF (471)
N N S S S S
560pF (561)
S S S
680pF (681)
S S S
820pF (821)
S S S
1,000pF (102)
S S S
1,200pF (122)
X
1,500pF (152)
X
1,800pF (182)
X
2,200pF (222)
X
2,700pF (272)
X
Capacitance
3,300pF (332)
X
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact Calchip local representative.
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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8. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size Thickness (mm)/Symbol 7” reel 13” reel
0402 0.50±0.05 N 10K 20K
0603 0.80±0.07 S 4K 15K
0805 0.60±0.10 A 4k 15k
Unit: pieces
9. ELECTRICAL CHARACTERISTICS
◙ Q factor specification vs. Specific frequency
◙ Q factor specification vs. Specific frequency
Q value criteria vs. Specific frequency
GHQ series, 0402
1
10
100
1000
10000
0.1 1 10 100
Capacitance (pF)
Q
Minimum (Solid line)
Typical (Broken line)
1GHz
500MHz
100MHz
Fig. 2 Q factor specification vs. Specific frequency for 0402
Q value criteria vs. Specific frequency
GHQ series, 0603
1
10
100
1000
10000
0.1 1 10 100
Capacitance (pF)
Q
Minimum (Solid line)
Typical (Broken line)
1GHz 500MHz
100MHz
Fig. 3 Q factor specification vs. Specific frequency for 0603
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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◙ Typical ESR vs. Frequency
◙ Typical Impedance vs. Frequency
◙ SRF vs. Capacitance
0402 "GHQ" series
0.01
0.1
1
100 1,000 10,000
Frequency (MHz)
ESR (ohm)
1pF
5pF
10pF
100pF
Fig. 4 ESR vs. Frequency 0402
0603 "GHQ" series
0.01
0.1
1
10
100 1,000 10,000
Frequency (MHz)
ESR (ohm)
1pF
4.7pF
10pF
68pF
Fig. 5 ESR vs. Frequency 0603
0402 "GHQ" series
0.1
1
10
100
1000
10000
100000
10 100 1,000 10,000
Frequency (MHz)
Impedance (ohm)
1pF
4.7pF
10pF
100pF
Fig. 6 Impedance vs. Frequency 0402
0603 "GHQ" series
0.1
1
10
100
1000
10000
100000
10 100 1,000 10,000
Frequency (MHz)
Impedance (ohm)
1pF
4.7pF
10pF
68pF
Fig. 7 Impedance vs. Frequency 0603
100
1,000
10,000
1 10 100
Capacitance (pF)
Series Reasonant Frequency (MHz)
0402
0603
Fig. 8 SRF vs. Capacitance
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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APPENDIXES
◙ Tape & reel dimensions
Fig. 10 The dimension of reel
Fig. 9 The dimension of paper tape
Size 0402, 0603,0805
Reel size
7” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0
A 178.0±0.10 330.0±1.0
N 60.0+1.0/-0 100±1.0
Size 0402 0603 0805
Thickness N S A
A
0
0.62±0.05
1.02±0.05
1.50±0.10
B
0
1.12±0.05
1.82±0.05
2.30±0.10
T 0.60±0.05
0.95±0.05
0.75±0.05
K
0
- - -
W 8.00±0.10
8.00±0.10
8.00±0.10
P
0
4.00±0.10
4.00±0.10
4.00±0.10
10xP
0
40.0±0.10
40.0±0.10
40.0±0.10
P
1
2.00±0.05
4.00±0.10
4.00±0.10
P
2
2.00±0.05
2.00±0.05
2.00±0.05
D
0
1.55±0.05
1.55±0.05
1.55±0.05
D
1
- - -
E 1.75±0.05
1.75±0.05
1.75±0.05
F 3.50±0.05
3.50±0.05
3.50±0.05
MULTILAYER CERAMIC CAPACITORS
High Q/Low ESR Series (GHQ)
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◙ Constructions
◙ Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. Don’t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization
of electrode, which easily be resulted in poor soldering.
b. To store products on the shelf and avoid exposure to moisture.
c. Don’t expose products to excessive shock, vibration, direct sunlight and so on.
◙ Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature
and concentration of N
2
within oven are recommended.
No. Name NP0
1
Ceramic material BaTiO
3
based
2
Inner electrode AgPd alloy
3
Inner layer Ag
4
Middle layer Ni
5
Termination
Outer layer Sn (Matt)
Fig. 11 The construction of MLCC
Fig. 12 Recommended IR reflow soldering profile for SMT process
with SnAgCu series solder paste.
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
4℃
℃℃
℃/ sec max
Over 60sec at least by
natural cooling
Fig. 13 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
Calchip Electronics, INC. Phone: (215) 942-8900
www.calchipelectronics.com Fax: (215) 942-6400