Description
The HSDL-3003 is a small form factor enhanced
infrared (IR) transceiver module that provides the
capability of (1) interface between logic and IR
signals for through-air, serial, half-duplex IR data
link, and (2) IR remote control transmission
operating at the optimum 940 nm wavelength for
universal remote control applications.
For IR data communication, the HSDL-3003
provides the flexibility of low power SIR
applications and remote control applications with
no external components needed for the selection of
the type of application. The transceiver is compliant
to IrDA® Physical Layer Specification Version
1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s (SIR)
and it is IEC 825-Class 1 Eye Safe.
The HSDL-3003 has very low idle current and can
be shutdown completely to achieve very low power
consumption. In the shutdown mode, the PIN diode
will be inactive and thus producing very little
photocurrent even under very bright ambient light.
Such features are ideal for battery operated hand-
held products such as PDAs and mobile phones.
General Features
• Guaranteed temperature performance, –20° to 70°C
– Critical parameters are guaranteed over
temperature and supply voltage
• Low power consumption
• Small module size
– Height: 2.70 mm
– Width: 8.00 mm
– Depth: 2.95 mm
• Minimum external components
– Integrated single-biased LED resistor
– Direct interoperability to MPU
– Programmable Txd features
– Integrated remote control FET
• Withstands >100 mVp-p power supply ripple typically
•V
CC supply 2.4 to 3.6 volts
• Integrated EMI shield
• Designed to accommodate light loss with cosmetic
windows
• IEC 825-Class 1 eye safe
• Lead-free and RoHS compliant
Remote Control Features
• Wide angle and high radiant intensity
• Spectrally suited to remote control transmission function
at 940 nm typically
• Typical link distance up to 8 meters
IrDA® Data Features
• Fully compliant to IrDA® Physical Layer Specification 1.4
low power from 9.6 kbit/s to 115.2 kbit/s (SIR)
– Excellent nose-to-nose operation
– Link distance up to 50 cm typically
• Complete shutdown for TxD_IrDA, RxD_IrDA, and PIN
diode
• Low power consumption
– Low idle current, 50 µA typically
– Low shutdown current, 10 nA typically
• LED stuck-high protection
Applications
• Mobile data communication and universal remote
control transmission
– Personal digital assistants (PDAs)
– Mobile phones
HSDL-3003
IrDA® Data Compliant Low Power
115.2 kbit/s with Remote Control
Infrared Transceiver
Data Sheet
CAUTION: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation, which may be induced by ESD.
2
Order Information
Part Number Packaging Type Package Quantity
HSDL-3003-021 Tape and Reel Front View 2500
HSDL-3003-001 Tape and Reel Front View 500
Marking Information
The unit is marked with a number
‘2’ and ‘YWWLL’ on the shield for
front option.
Y = year
WW = work week
LL = lot information
Figure 1. Functional block diagram of low power IrDA link distance and remote control.
87654321
REAR VIEW
V
CC
IR_LED
CX1
SHIELD
CX2
RxD_IrDA (4)
V
CC
(6) GND (8)
RC_BUFFER
IR_BUFFER
GND
RC_LED
RC/IR
TRANSMITTER
SELECT
OUTPUT
BUFFER
SD (5)
TxD_RC (7)
TxD_IrDA (3)
LEDA (1)
VLED
TRANSMITTER
EYE
SAFETY
-IR
EYE
SAFETY
-RC
PRE AMP
DETECTOR
VOLTAGE/
CURRENT
REFERENCE
BLOCK
RECEIVER
PHOTO-
DETECTOR
TRANSCEIVER IC
HSDL-3003 TRANSCEIVER MODULE
R1
SHUTDOWN
SHUTDOWN
CX3
3
I/O Pins Configuration Table
Pin Symbol I/O Description Notes
1 LEDA I IR and Remote Tied through external resistor, R1, to VLED from 2.4 to 4.5 Volt
Control LED Driver
2 N.C. – No Connection No Connection
3 TxD_IrDA I IrDA Transmitter Data Logic high turns on the IrDA LED. If held HIGH longer than
Input. Active High ~50 µs, the IrDA LED is turned off. TxD_IrDA must be driven either
HIGH or LOW. Do not leave the pin floating
4 RxD_IrDA O IrDA Receiver Data Output is at LOW pulse response when light pulse is seen
Output. Active Low
5 SD I Shutdown. Active High Complete shutdown TxD_IrDA, RxD_IrDA, and PIN diode. Do not
leave the pin floating
6V
CC I Supply Voltage Regulated, 2.4 to 3.6 Volt
7 TxD_RC I Remote Control Logic high turns on the RC LED. If held HIGH longer than ~50 µs,
Transmission Input. the RC LED is turned off. TxD_RC must be driven either HIGH or
Active High LOW. Do not leave the pin floating
8 GND I Connect to System Tie this pin to system ground
Ground
– Shield – EMI Shield Tie to system ground via a low inductance trace. For best
performance, do not tie it to the HSDL-3003 GND pin directly
Recommended Application Circuit Components
Component Recommended Value
R1 1.8 Ω ± 5%, 0.25 Watt for 2.4 ≤ VLED ≤ 2.7 V
2.7 Ω ± 5%, 0.25 Watt for 2.7 ≤ VLED ≤ 3.3 V
3.3 Ω ± 5%, 0.25 Watt for 3.0 ≤ VLED ≤ 3.6 V
4.7 Ω ± 5%, 0.25 Watt for 3.6 ≤ VLED ≤ 4.5 V
CX1[1] 0.47 µF ± 20%, X7R Ceramic
CX2[2] 6.8 µF ± 20%, Tantalum
CX3 6.8 µF ± 20%, Tantalum
Notes:
1. CX1 must be placed within 0.7 cm of HSDL-3003 to obtain optimum noise immunity.
2. The supply rejection performance can be enhanced by including CX2, as shown in Figure 1, in
environment with noisy power supplies.
4
Figure 2.
DRIVE
IrDA LED
DRIVE
RC LED
DRIVE
IrDA LED
SHUTDOWN
SHUTDOWN
(ACTIVE HIGH)
TxD_IrDA
(ACTIVE HIGH)
TxD_RC
(GND)
RESET
tC
t
TL
RC
MODE
tB
tA
tC
• • • • • •• • •
Different Remote Control
Configurations for HSDL-3003
The HSDL-3003 can operate in
the single-TXD programmable
mode or the two-TXD direct
transmission mode.
Single-TXD Programmable
Mode
In the single-TXD programmable
mode, only one input pin
(TxD_IrDA input pin) is used to
turn on either the 875 nm LED or
the 940 nm LEDs while the
TxD_RC input pin is grounded.
The transceiver is in default mode
(IrDA) when powered up. User
needs to apply the following
programming sequence to both
the TxD_IrDA and SD inputs to
enable the transceiver to operate
in either the IrDA or remote
control mode.
Two-TXD Direct
Transmission Mode
In the two-TXD direct
transmission mode, the 875 nm
LED and the 940 nm LEDs are
turned on separately by two
different input pins. The
TxD_IrDA input pin is used to
turn on the 875 nm LED while
the TxD_RC input pin is used to
turn on the 940 nm LEDs.
Please refer to the Transceiver
I/O truth table for more details.
Transceiver Control I/O Truth Table for Two-TXD Direct
Transmission Mode
SD TXD_IrDA TXD_RC IrDA LED RC LEDs Remarks
0 0 0 OFF OFF IR Rx enabled. Idle mode
0 0 1 OFF ON Remote control operation
0 1 0 ON OFF IrDA Tx operation
0 1 1 DIM ON Not recommended
1 0 0 OFF OFF Shutdown mode*
* The shutdown condition will set the transceiver to the default mode (IrDA).
5
Absolute Maximum Ratings at TA = 25°C
For implementations where case to ambient thermal resistance is ≤ 50°C/W
Parameter Symbol Min. Max. Units Conditions
Storage Temperature TS-40 100 °C
Operating Temperature TA-20 70 °C
LED Supply Voltage VLED 06 V
Supply Voltage VCC 06 V
Output Voltage: RxD VO06 V
Total LED Current Pulse Amplitude IVLED 580 mA ≤ 90 µs Pulse Width
≤ 20% Duty Cycle
IR LED Current Pulse Amplitude (IVLED)IR 280 mA ≤ 90 µs Pulse Width
≤ 20% Duty Cycle
RC LED Current Pulse Amplitude (IVLED)RC 580 mA ≤ 90 µs Pulse Width
≤ 20% Duty Cycle
Recommended Operating Conditions
Parameter Symbol Min. Max. Units Conditions
Operating Temperature TA-20 70 °C
Supply Voltage VCC 2.4 3.6 V
LED Supply Voltage VLED 2.4 4.5 V
Logic Input Voltage Logic High VIH 2/3 VCC VCC V
for TxD_IrDA, TxD_RC Logic Low VIL 0 1/3 VCC V
Receiver Input Logic High EIH 0.0081 500 mW/cm2For in-band signals ≤ 115.2 kbit/s[3]
Irradiance Logic Low EIL 0.3 µW/cm2For in-band signals[3]
Receiver Data Rate 9.6 115.2 kbit/s
6
Electrical and Optical Specifications
Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC at
3.0 V unless otherwise noted.
Parameter Symbol Min. Typ. Max. Units Conditions
Infrared (IrDA) Receiver
Viewing Angle 2θ1/2 30 °
Peak Sensitivity Wavelength λP875 nm
RxD_IrDA Logic High VOH VCC - 0.2 VCC VI
OH = -200 µA, EI ≤ 0.3 µW/cm2
Output Voltage Logic Low VOL 0 0.4 V
RxD_IrDA Pulse Width (SIR)[4] tRPW 1 2.3 7.5 µsθ1/2 ≤ 15°, CL= 9 pF
RxD_IrDA Rise & Fall Times tr, tf 30 100 ns CL= 9 pF
Receiver Latency Time[5] tL26 50 µs EI = 9.0 µW/cm2
Receiver Wake Up Time[6] tRW 75 200 µs EI = 10 mW/cm2
Infrared (IrDA) Transmitter
IR Radiant Intensity IEH 4 13 mW/sr IVLEDA = 100 mA, θ1/2 ≤ 15°,
TxD_IrDA ≥ VIH, TA = 25°C
IR Viewing Angle 2θ1/2 30 60 °
IR Peak Wavelength λP875 nm
TxD_IrDA High VIH 2/3 VCC VCC V
Logic Levels Low VIL 0 1/3 VCC V
TxD_IrDA High IH0.02 1 µAV
I ≥ VIH
Input Current Low IL-0.02 1 µA0 ≤ VI ≤ VIL
LED Current Shutdown IVLED 0.02 10 µAV
I (SD) ≥ VIH
Wake Up Time[7] tTW 180 500 ns
Data setup time tA 25 ns
Data pulsewidth tB 25 ns
Programming time tC 75 ns
Optical Pulse Width tPW(SIR) 1.41 1.6 µst
PW(TXD) = 1.6 µs at 115.2 kbit/s
(SIR)
Maximum Optical tPW(Max) 120 µs
Pulse Width[8]
TxD Rise & Fall Times tr, tf 600 ns
(Optical)
LED Anode On-State Voltage VON (LEDA) 2.4 V IVLEDA = 100 mA, VI (TxD) ≥ VIH
Remote Control (RC) Transmitter
RC Radiant Intensity IEH 15[9] 36 mW/sr IVLEDA = 400 mA, θ1/2 ≤ 15°,
TxD_RC ≥ VIH, TA = 25°C
RC Viewing Angle 2θ1/2 30 60 °
RC Peak Wavelength λP940 nm
TxD_RC Logic High VIH 2/3 VCC VCC V
Levels Low VIL 0 1/3 VCC V
TxD_RC Input High IH0.02 1 µAV
I ≥ VIH
Current Low IL-0.02 1 µA0 ≤ VI ≤ VIL
Maximum Optical Pulse tPW(Max) 120 µs
Width [8]
LEDA Voltage VON (LEDA) 1.65 2.3 V ILEDA = 400 mA, VI(TxD) ≥ VIH
7
Transceiver
Parameters Symbol Min. Typ. Max. Units Conditions
Input Current High IH0.01 1 µAV
I ≥ VIH
Low IL-1 -0.02 1 µA0 ≤ VI ≤ VIL
Supply Current Shutdown ICC1 0.01 1 µAV
SD ≥ VCC - 0.5, TA = 25°C
Idle (Standby) ICC2 50 100 µAV
I(TxD) ≤ VIL, EI = 0
Active ICC3 300 µAV
I(TxD) ≥ VIL, EI = 10 mW/cm2
Notes:
3. An in-band optical signal is a pulse/sequence where the peak wavelength, λP, is defined as 850 nm ≤ λP ≤ 900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4.
4. For in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 µW/cm2 ≤ EI ≤ 500 mW/cm2.
5. Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity.
6. Receiver Wake Up Time is measured from VCC power ON to valid RxD_IrDA output.
7. Transmitter Wake Up Time is measured from VCC power ON to valid light output in response to a TxD_IrDA pulse.
8. The Optical PW is defined as the maximum time which the IrDA/RC LED will turn on, this is to prevent the long Turn On time for the IrDA and
RC LED.
9. This Limits is Production Test Limits.
Figure 3. Typical 875 nm LED VLEDA vs. ILEDA at
room temperature.
Figure 5. Typical 940 nm LED VLEDA vs. ILEDA at room
temperature performance.
Figure 4. Typical 875 nm LED radiant intensity vs. ILED current
at room temperature.
Figure 6. Typical 940 nm LED radiant intensity vs. ILED
current at room temperature.
ILEDA (A)
0.40
VLEDA (V)
0.10
0
1.5 4.0
0.20
2.0
0.25
0.05
3.0
0.35
3.52.5
0.15
0.30
ILEDA (A)
0.8
VLEDA (V)
0.2
0
1.0 2.0
0.4
1.2
0.5
0.1
1.6
0.7
1.81.4
0.3
0.6
RADIANT INTENSITY (mW/Sr)
50
ILEDA CURRENT (A)
40
0.4
00 0.2 0.7
15
0.1 0.3 0.5
25
5
10
20
35
45
0.6
30
RADIANT INTENSITY (mW/Sr)
40
ILED CURRENT (A)
10
00 0.3
20
0.05
25
5
0.15
35
0.20.1
15
30
0.25
8
Figure 7. RXD output waveform.
Figure 11. Transmitter wakeup time definition.
Figure 10. Receiver wakeup time definition.
Figure 9. TXD “Stuck ON” protection.
Figure 8. LED optical waveform.
t
f
V
OH
90%
50%
10%
V
OL
t
pw
t
r
tf
LED OFF
90%
50%
10%
LED ON
tpw
tr
tpw (MAX.)
TXD
LED
RX
LIGHT
tRW
RXD
SD
TX
LIGHT
tTW
TXD
SD
9
HSDL-3003 Package Outline (With Integrated EMI Shield)
Figure 12. Package outline drawing.
0.50
;;
;;
;
;
;;
;;
;
;
;
;
;
;;
;
;
;
;;
0.60
PITCH 0.95
2.95
2.90
8.00
5.101.20 1.20
1.425
2.70
12 34 5 6
2.102.70
0.425
1.025
78
4.00
MOUNTING CENTER
R 1.03 R 1.10
COPLANARITY:
+0.05 TO -0.15 mm
0.95
0.80
0.70
RECEIVEREMITTER
1 VLEDA
2 NC
3 TXD IRDA
4 RXD
5 SD
6 V
CC
7 TXD RC
8 GND
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (mm).
2. DIMENSION TOLERANCE IS 0.2 mm
UNLESS OTHERWISE SPECIFIED.
10
HSDL-3003 Tape and Reel Dimensions
Figure 13. Tape and reel dimensions.
16.40 + 2.00
0
BC
2.0 ± 0.50
8.00
± 0.10
4.0 ± 0.1
16.0 ± 0.3
1.75 ± 0.10
1.55 ± 0.05
0.40 ± 0.10
3.00 ± 0.10
POLARITY
PARTS
MOUNTED
LEADER
(40 mm MIN.)
EMPTY
(40 mm MIN.)
2.0 ± 0.1
PROGRESSIVE DIRECTION
"B" "C" QUANTITY
PIN 8: GND
PIN 1: VLED
7.5 ± 0.1
R 1.0
2.0 ± 0.50
DIA. 13.0 ± 0.50
21.0
± 0.80
LABEL
DETAIL A
DETAIL A
330 80 2500
8.30 ± 0.10
5.00° (MAX.)
3.25 ± 0.10
5°(MAX.) MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE
MATERIAL OF COVER TAPE: PVC
METHOD OF COVER: HEAT ACTIVATED ADHESIVE
UNIT: mm
EMPTY
(40 mm MIN.)
1.50 ± 0.10
AA
SECTION A-A
B
B
SECTION B-B
11
Moisture Proof Packaging
All HSDL-3003 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
This part is compliant to JEDEC
Level 4. Package Temp. Time
In reels 60°C≥ 48 hours
In bulk 100°C≥ 4 hours
125°C≥ 2 hours
150°C≥ 1 hour
Baking should only be done once.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Recommended
Storage Conditions
Storage Temperature 10°C to 30°C
Relative Humidity below 60% RH
Time from Unsealing to
Soldering
After removal from the bag, the
parts should be soldered within
two days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
Figure 15. Baking conditions chart.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT
LESS THAN 25°C,
AND LESS THAN
60% RH?
PACKAGE IS
OPENED MORE
THAN 72 HOURS?
PERFORM RECOMMENDED
BAKING CONDITIONS
NO BAKING
IS NECESSARY
YES
NO
YES
NO
12
Recommended Reflow Profile
Figure 16. Reflow graph.
0
t-TIME (SECONDS)
T – TEMPERATURE – (°C)
230
200
160
120
80
50 150100 200 250 300
180
220
255
P1
HEAT
UP
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
P4
COOL
DOWN
25
R1
R2
R3 R4
R5
60 sec.
MAX.
ABOVE
220°C
MAX. 260°C
The reflow profile is a straight-
line representation of a nominal
temperature profile for a con-
vective reflow solder process.
The temperature profile is divided
into four process zones, each
with different ∆T/∆time tempera-
ture change rates. The ∆T/∆time
rates detailed in the above table.
The temperatures are measured
at the component to printed
circuit board connections.
In process zone P1, the PC
board and I/O pins are heated to
a temperature of 160°C to
activate the flux in the solder
paste. The temperature ramp up
rate, R1, is limited to 4°C per
second to allow for even heating
of both the PC board and
HSDL-3003 I/O pins.
Process Symbol ∆T Maximum ∆T/∆time
Heat Up P1, R1 25°C to 160°C4°C/s
Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s
Solder Reflow P3, R3 200°C to 255°C (260°C at 10 seconds max.) 4°C/s
P3, R4 255°C to 200°C–6°C/s
Cool Down P4, R5 200°C to 25°C–6°C/s
Process zone P2 should be of
sufficient time duration (60 to
–120 seconds) to dry the solder
paste. The temperature is raised
to a level just below the liquidus
point of the solder, usually
200°C (392°F).
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255°C (491°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescence of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell time
of 60 seconds, the intermetallic
growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200°C (392°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool
down after solder freeze. The cool
down rate, R5, from the liquidus
point of the solder to 25°C (77°F)
should not exceed –6°C per
second maximum. This limitation
is necessary to allow the PC board
and transceiver’s castellation I/O
pins to change dimensions evenly,
putting minimal stresses on the
HSDL-3003.
13
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil
Figure 17. Stencil and PCBA.
1.1 Recommended Land Pattern
Figure 18. Land pattern (front view).
METAL STENCIL
FOR SOLDER PASTE
PRINTING
LAND
PATTERN
PCBA
STENCIL
APERTURE
SOLDER
MASK
0.60
1.25
1.75
1.35
0.475
1.425
2.375
3.325
C
L
MOUNTING
CENTER SHIELD SOLDER PAD
2.05
0.775
0.10
FIDUCIAL
Figure 19. Land pattern (top view).
MOUNTING CENTER
0.91
4.0
1.6
0.475
1.425
0.35
2.375
0.6
0.575
1.275
14
Figure 20. Solder stencil aperture.
1.2 Recommended Metal
Solder Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inch) or a
0.127 mm (0.005 inch) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 3.05 mm x 1.1 mm as per land
pattern. Aperture size(mm)
Stencil thickness, t (mm) length, l width, w
0.152 mm 2.60 ± 0.05 0.55 ± 0.05
0.127 mm 3.00 ± 0.05 0.55 ± 0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keepout is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is 0.2
mm.
It is recommended that two
fiducial crosses be placed at mid-
length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
Figure 21. Adjacent land keepout and solder mask areas.
APERTURES AS PER
LAND DIMENSIONS
l
w
t
0.2
3.0
10.1
3.85
SOLDER MASK
UNITS: mm
15
Appendix B:
PCB Layout Suggestion
The following PCB layout
guidelines should be followed to
obtain a good PSRR and EM
immunity resulting in good
electrical performance. Things to
note:
1. The ground plane should be
continuous under the part, but
should not extend under the
shield trace.
2. The shield trace is a wide, low
inductance trace back to the
system ground. CX1, CX2 and
CX3 are optional supply filter
capacitors; they may be left out
if a clean power supply is used.
3. VLED can be connected to
either unfiltered or unregulated
power supply. If VLED and Vcc
share the same power supply,
CX3 need not be used and the
connections for CX1 and CX2
should be before the current
limiting resistor R1. In a noisy
environment, including
capacitor CX2 can enhance
supply rejection. CX1 is
generally a ceramic capacitor
of low inductance providing a
wide frequency response while
CX2 and CX3 are tantalum
capacitors of big volume and
fast frequency response. The
use of a tantalum capacitor is
more critical on the VLED line,
which carries a high current.
4. Preferably a multi-layered
board should be used to
provide sufficient ground
plane. Use the layer
underneath and near the
transceiver module as Vcc, and
sandwich that layer between
ground connected board
layers. Refer to the diagram
below for an example of a
four-layer board.
The area underneath the module
at the second layer, and 3 cm in
all directions around the module,
is defined as the critical ground
plane zone. The ground plane
should be maximized in this zone.
Top View
Refer to application note AN1114
or the Lite-On IrDA Data Link
Design Guide for details. The
layout below is based on a
two-layer PCB.
Bottom View
TOP LAYER
CONNECT THE METAL SHIELD AND MODULE
GROUND PIN TO BOTTOM GROUND LAYER.
LAYER 2
CRITICAL GROUND PLANE ZONE. DO NOT
CONNECT DIRECTLY TO THE MODULE
GROUND PIN.
LAYER 3
KEEP DATA BUS AWAY FROM CRITICAL
GROUND PLANE ZONE.
BOTTOM LAYER (GND)
16
TRANSCEIVER
MOD/
DE-MODULATOR
SPEAKER
RF INTERFACE
AUDIO INTERFACE
USER INTERFACE
MICROCONTROLLER
DSP CORE
ASIC
CONTROLLER
IR
MICROPHONE
MOBILE PHONE PLATFORM
RC
HSDL-3003
Figure 1. IR layout in mobile phone platform.
Appendix C:
General Application Guide for
the HSDL-3003 Infrared IrDA®
Compliant 115.2 Kb/s
Transceiver
Description
The HSDL-3003, a wide-voltage
operating range infrared
transceiver is a low-cost and small
form factor device that is designed
to address the mobile computing
market such as PDAs, as well as
small embedded mobile products
such as digital cameras and
cellular phones. It is spectrally
suited to universal remote control
transmission function at 940 nm
typically. It is fully compliant to
IrDA 1.4 low power specification
from 9.6 kb/s to 115.2 kb/s, and
supports most remote control
codes. The design of the HSDL-
3003 also includes the following
unique features:
•Spectrally suited to universal
remote control transmission
function at 940 nm typically.
•Low passive component count.
•Shutdown mode for low power
consumption requirement.
Selection of Resistor R1
Resistor R1 should be selected to
provide the appropriate peak
pulse LED current over different
ranges of Vcc as shown on page 3
under "Recommended Application
Circuit Components".
Interface to Recommended
I/O Chips
The HSDL-3003’s TXD data input
is buffered to allow for CMOS
drive levels. No peaking circuit or
capacitor is required. Data rate
from 9.6 kb/s up to 115.2 kb/s is
available at the RXD pin. The
TXD_RC, (pin 7), or the
TXD_IrDA, (pin 3), can be used
to send remote control codes.
The block diagrams below show
how the IrDA port fits into a
mobile phone and PDA platform.
17
PCMCIA
CONTROLLER
CPU
FOR EMBEDDED
APPLICATION
IR
RAM
ROM
TOUCH
PANEL
RS232C
DRIVER
COM
PORT
PDA PLATFORM
LCD
PANEL
RC
HSDL-3003
Figure 2. IR layout in PDA platform.
The link distance testing was
done using typical HSDL-3003
units with SMC’s FDC37C669
and FDC37N769 Super I/O
controllers. An IrDA link distance
of up to 70 cm was demonstrated.
Remote Control Operation
The HSDL-3003 is spectrally
suited to universal remote control
transmission function at 940 nm
typically. Remote control
applications are not governed by
any standards, owing to which
there are numerous remote
control codes in the market.
Each of these standards results in
receiver modules with different
sensitivities, depending on the
carrier frequencies and
responsivity to the incident light
wavelength.
Based on a survey of some
commonly used remote control
receiver modules, the irradiance
is found to be in the range of
0.05 ~ 0.07 mW/cm2. Based on
a typical irradiance of 0.05 mW/
cm2 and 0.075 mW/cm2 and
turning on the RC LED, a typical
link distance of 8 m and 7 m is
achieved typically.
18
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Z
IR TRANSPARENT WINDOW OPAQUE MATERIAL
OPAQUE MATERIAL IR TRANSPARENT WINDOW
;;
X
Y
Appendix D:
Window Designs for
HSDL-3003
To ensure IrDA compliance, some
constraints on the height and width
of the window exist. The minimum
dimensions ensure that the IrDA
In the figure above, X is the width
of the window, Y is the height of
the window, and Z is the distance
from the HSDL-3003 to the back
Module Depth Min Aperture Width Min Aperture Height
(Z, mm) (X, mm) (Y, mm)
0.5 11.45 4.20
1.0 11.75 4.45
1.5 12.00 5.00
2.0 12.50 5.25
3.0 13.50 6.30
4.0 15.15 8.40
5.0 15.65 9.45
cone angles are met without
vignetting. The maximum
dimensions minimize the effects of
stray light. The minimum size
corresponds to a cone angle of 30°
and the maximum size corresponds
to a cone angle of 60°.
of the window. Our simulations
result in the following tables and
graphs.
19
For module depth values that are
not shown on the table above, the
minimum X and Y values can be
interpolated. An example of this
interpolation for module depth of
0.8 mm is as follows:
Recommended Plastic Materials
Material # Light Transmission Haze Refractive Index
Lexan 141 88% 1% 1.586
Lexan 920A 85% 1% 1.586
Lexan 940A 85% 1% 1.586
Note: 920A and 940A are more flame retardant than 141.
Recommended Dye: Violet #21051 (IR transmissant above 625 nm)
Window Material
Almost any plastic material will
work as a window material.
Polycarbonate is recommended.
The surface finish of the plastic
should be smooth, without any
texture. An IR filter dye may be
used in the window to make it
look black to the eye, but the
total optical loss of the window
should be 10% or less for best
optical performance. Light loss
should be measured at 875 nm.
The recommended plastic
materials for use as a cosmetic
window are available from
General Electric Plastics.
Aperture width (X) vs. module depth.
APERTURE WIDTH (X) – mm
18
MODULE DEPTH (Z) – mm
14
4
002 6
6
135
10
2
X MIN.
4
8
12
16
APERTURE HEIGHT (Y) – mm
10
MODULE DEPTH (Z) – mm
8
4
002 6
4
135
6
2Y MIN.
1
3
5
7
9
Aperture height (Y) vs. module depth.
Xmin = x (11.75 – 11.45) + 11.45 = 11.63
0.8 – 0.5
1.0 – 0.5
Ymin = x (4.45 – 4.20) + 4.20 = 4.35
0.8 – 0.5
1.0 – 0.5
20
Shape of the Window
From an optics standpoint, the
window should be flat. This
ensures that the window will not
alter either the radiation pattern
of the LED, or the receive pattern
of the photodiode.
If the window must be curved for
mechanical or industrial design
reasons, place the same curve on
the back side of the window that
has an identical radius as the
front side. While this will not
completely eliminate the lens
effect of the front curved surface,
it will significantly reduce the
effects. The amount of change in
Curved Front and Back
(Second choice)
Curved Front, Flat Back
(Do not use)
Flat Window
(First choice)
the radiation pattern is dependent
upon the material chosen for the
window, the radius of the front
and back curves, and the distance
from the back surface to the
transceiver. Once these items are
known, a lens design can be
made which will eliminate the
effect of the front surface curve.
The following drawings show the
effects of a curved window on the
radiation pattern. In all cases,
the center thickness of the
window is 1.5 mm, the window is
made of polycarbonate plastic,
and the distance from the
transceiver to the back surface of
the window is 3 mm.
21
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Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.
