3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 1 of 12
5Z3030AW55DBZ1N2
◆Outline(L*W*H): 3.05*3.0*0.7 mm
◆High flux efficiency & offer a middle power 0.5W
◆Good thermal dissipation & optical uniformity
Table of Contents
Product Code Method ----------------------------------------2
Maximum Rating----------------------------------------------2
Typical Product Characteristics-----------------------------3
Range of Bins--------------------------------------------------3
Color Coordinate Comparison-------------------------------4
Electronic-optical Characteristics---------------------------5
Dimensions-----------------------------------------------------6
Reflow Profile-------------------------------------------------7
Test Circuit and Handling Precautions---------------------8
Packing-----------------------------------------------------------9
Precautions-----------------------------------------------------11
Test Items and Results of Reliability-----------------------12
Features
Forward current: ≦150mA
Typical view angle 50% Iv: 120°
RoHS and REACH-compliant
Lens color: yellowish
MSL 2a qualified according to JEDEC
J-STD20D
ESD Level 6KV(HBM)
Reliability Test: AEC Q-101 qualified
Applications
Indoor signage display applications
Indoor decorating and entertainment design
Flat backlight for LCD. Switch and symbol
Automotive electronics
Special applications
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 2 of 12
Product Code Method
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5 - Z - 3030 - A - W55D - B - Z - 1 - N - 2
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩
①
②
③
⑤
⑥
Process
Type
Category
Lead
Frame Size
Dice Wavelength
&Luminous Rank
COB or Bracket
Module Code
5: special product
Z: SMD
Power LED
3030:
3.05*3.0mm
Wxxx: white
B: article mode
⑦
⑧
⑨
⑩
CRI or Zener
Assembly Code
Process Code
Spectral
Condition Code
Z: Zener
1: company code for
different meaning
N: PLCC procedure
2: 150mA for test
Maximum Rating(Ta=25℃)
------------------------------------------------------------------------------------------------------------------------------------
Characteristics
Symbol
Rating
Unit
DC forward current
IF
150
mA
Pulse forward current*3
IPF
240
mA
Reverse voltage
VR
5
V
Junction temperature
TJ
125
oC
Operating temperature range
TOP
-40-105
oC
Storage temperature range
TSTG
-40-105
oC
Soldering temperature*4
TSD
260
oC
Thermal Resistance Junction/
Solder Point
Rth
50
℃/W
Notes 1: There is no maximum or typical voltage parameter
2: For other ambient, limited setting of current will be depended on de-rating curves.
3: Duty 1/10, pulse width 0.1ms
4: The maximum of soldering time is 5 seconds in TSD
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 3 of 12
Typical Product Characteristics (Ta=25℃)
------------------------------------------------------------------------------------------------------------------------------------
Characteristics
Symbol
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
VF
2.8
-
3.8
V
IF=150mA
Reverse Current
IR
-
-
10
μA
VR=5V
Luminous Lumen
Φ
30
38
-
lm
IF=150mA
View Angle
2θ1/2
-
120
-
deg
IF=150mA
Color Coordinate
x
-
0.556
-
-
IF=150mA
y
-
0.424
-
-
Notes: 1. Measurement Errors:
Forward Voltage: ±0.1V, Luminous Lumen: ±10%Φ, View Angle: ±5%, Color Coordinate (x, y) ± 0.006
2. Electrical-Optical characteristics (Ta=25℃)
Range of Bins
------------------------------------------------------------------------------------------------------------------------------------
1). Forward Voltage Bins (IF=150mA)
Bin Code
Min. VF (V)
Max. VF (V)
B
2.8
2.9
C
2.9
3.0
D
3.0
3.1
E
3.1
3.2
F
3.2
3.3
G
3.3
3.4
H
3.4
3.5
I
3.5
3.6
J
3.6
3.7
K
3.7
3.8
2). Luminous Lumen Bins (IF=150mA)
Bin Code
Min. Φ(lm)
Max. Φ(lm)
21
30
35
22
35
40
23
40
45
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 4 of 12
Color Coordinate Comparison
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Color Rank
BIN
x
y
BIN
x
y
BIN
x
y
Y1
0.56
0.44
Y2
0.5745
0.4253
Y3
0.5908
0.409
0.5375
0.4174
0.5566
0.4076
0.578
0.3972
0.5566
0.4076
0.578
0.3972
0.5933
0.3896
0.5745
0.4253
0.5908
0.409
0.61
0.3896
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 5 of 12
Electronic-Optical Characteristics
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1).Relative Spectral Distribution 2).Typical Spatial Distribution
3).Relative Luminous Flux .Current 4).Relative Luminous Flux .Ambient Temperature
5). Electrical Characteristics 6).Forward Voltage Temperature
7). Chromaticity Coordinate and Temperature 8).Thermal Design
Relative luminous Intensity(%)
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 6 of 12
Dimensions
------------------------------------------------------------------------------------------------------------------------------------
12
12
Cathode
Cathode Mark
Notes: 1. All dimensions are in millimeters
2. Tolerance is ±0.1mm unless otherwise noted
3. Specifications are subject to change without notice.
Recommend Pad layout
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 7 of 12
Reflow Profile
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1. IR reflow soldering Profile for Lead Free solder
25℃
2-5℃/sec
10sec. max
2-5℃/sec
120sec.Max
50sec.max
0
50
100
150
200
250
300
050 100 150 200 250 300
sec
℃
1-5℃/sec
Pre heating 150-180℃
260℃ max
230℃ max
Time
temperature
Notes:
1. We recommend the reflow temperature 240℃ (±5℃).the maximum soldering temperature should be
limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be less than 3 times.
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 8 of 12
Test Circuit and Handling Precautions
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1. Test circuit
2. Handling precautions
2.1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big current
change (Burn out will happen).
2.2. Storage
1). It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature: 5℃~30℃(41℉~86℉)
2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened,
the products should be used within 4 weeks or they should be keeping to stored at ≦20%R.H. with
zip-lock sealed.
2.3. Baking
If the package has been opened for more than 4 weeks, it is recommended to bake the products with
the following instruction:
1). 60±3℃ X 6hrs and ＜5%RH, for reel
2). 125±3℃ X 2hrs, for single LED
It shall be normal to see slight color fading of carrier (light yellow) after baking in process
LED
V
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 9 of 12
Packing
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60±0.50
173±0.10
13±0.2
9±0.5
8.0±0.15
Labelposition
Unit:mm
4.0±0.10
4.0±0.10
2.0±0.05
1.55±0.05
5.25±0.10
0.20
0.10
1.0
Dimensions of Reel (Unit: mm)
Dimensions of Tape (Unit: mm)
Arrangement of Tape
Empty parts
(min.10)
Loaded Parts
(LED:4000Pcs)
Empty Parts
(min.40)
Feeding Direction
Conclusion Parts
(Min.40mm)
Introduction Parts
(Min.160mm)
Emboss Tape
Cover Tape
Notes:
1. Empty component pockets are sealed with top cover tape
2. The max loss number of SMD is 2pcs
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA
RS-481 specifications
4. 4,000pcs per reel
5. The remainder packing in multiples of 500pcs.
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 10 of 12
Packing
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.
Packaging specifications
Reel(4000pcs) Moisture-poof bag Label
inspection request form
Inner box(Max. 7 reels)
Label
Outer box(Max. 4 inner boxes)
Notes:
Reeled product (max.4,000) is packed in a sealed moisture-proof bag. Seven bags are packed in an
inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X
275 X 215 mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No.
and quantity number; also the total quantity number should be on inspection request form on outer box.
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 11 of 12
Precautions
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1. Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from other
electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well
set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the
LED fail to light up, light up now and then or other quality problems
2. How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in
case that improper position of collet will damage the gold wire inside the LED. Different collets fit for
different products, please refer to the following pictures cross out
3. Other points for attention
A. No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out
easy to break.
C. LED should be used as soon as possible when being taken out of the original package, and should
be stored in anti-moisture and anti-ESD package.
4. This usage and handling instruction is only for your reference.
Outer diameter of collet should be larger than the lighting area
Picture 1()
Picture 2(X)
3030 Series
Version: IS-2.0 NO.: BT-SMD-14080520 Page 12 of 12
Test Items and Results of Reliability
------------------------------------------------------------------------------------------------------------------------------
[
Note] USL*1: Upper Specification Level
LSL*2: Lower Specification Level
Test Item
Test Conditions
Duration/
Cycle
Number of
Damage
Reference
Normal Temperature Life
Ta＝23℃(±5℃)
IF=150mA
1008 hrs
0/22
JESD22 A-108
High Temperature Life
Ta＝85℃(±5℃)
IF=150mA
1008 hrs
0/22
JESD22 A-108
High Humidity Heat Life
Ta＝85℃(±5℃)
RH=85%
IF=150mA
1008 hrs
0/22
JESD22 A-108
Thermal shock
-45℃/30min~105℃
/30min
(±5℃)
1008 hrs
0/22
JESD22 A-104
Electrostatic Discharge (ESD)
Test
According to the
SPEC
3 cycles
0/22
AEC Q101-001
Low Temperature Storage
Ta=-40℃
1008 hrs
0/22
JESD22-A103D
High Temperature Storage
Ta=125℃
1008 hrs
0/22
JESD22-A103D
*Criteria for Judging
Item
Symbol
Condition
Criteria for Judgment of Pass
Min
Max
Forward Voltage
VF
IF=150mA
-
USL*1×1.1
Reverse Current
IR
VR= 5V
-
10μA
Luminous Lumen
Φ
IF=150mA
LSL*2×0.7
-