APTGT150SK120G
APTGT150SK120G – Rev 1 July, 2006
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Absolute maximum ratings
Symbol Parameter Max ratings Unit
VCES Collector - Emitter Breakdown Voltage 1200 V
TC = 25°C 220
IC Continuous Collector Current TC = 80°C 150
ICM Pulsed Collector Current TC = 25°C 350
A
VGE Gate – Emitter Voltage ±20 V
PD Maximum Power Dissipation TC = 25°C 690 W
RBSOA Reverse Bias Safe Operating Area Tj = 125°C 300A @ 1150V
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
Q1
G1
0/ VB US
OUT
E1
CR2
VBUS
VBUS OUT
0/VBUS
E1
G1
VCES = 1200V
IC = 150A @ Tc = 80°C
Applicatio
n
AC and DC motor control
Switched Mode Power Supplies
Features
Fast Trench + Field Stop IGBT® Technology
- Low voltage drop
- Low tail current
- Switching freque ncy up to 20 kHz
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- Avalanche energy rated
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
Low profile
RoHS Compliant
Buck chopper
Fast Trench + Field Stop IGBT®
Power Module
APTGT150SK120G
APTGT150SK120G – Rev 1 July, 2006
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All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
ICES Zero Gate Voltage Collector Current VGE = 0V, VCE = 1200V 350 µA
Tj = 25°C 1.7 2.1
VCE(sat) Collector Emitter Saturation Voltage VGE = 15V
IC = 150A Tj = 125°C 2.0 V
VGE(th) Gate Threshold Voltage VGE = VCE , IC = 3 mA 5.0 5.8 6.5 V
IGES Gate – Emitter Leakage Current VGE = 20V, VCE = 0V 400 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cies Input Capacitance 10.7
Coes Output Capacitance 0.56
Cres Reverse Transfer Capacitance
VGE = 0V
VCE = 25V
f = 1MHz 0.48
nF
Td(on) Tur n-o n Delay Ti me 280
Tr Rise Time 40
Td(off) Turn-off Delay Time 420
Tf Fall Time
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 75
ns
Td(on) Tur n-o n Delay Ti me 290
Tr Rise Time 45
Td(off) Turn-off Delay Time 520
Tf Fall Time
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 90
ns
Eon Tur n-on Switchi ng Energy Tj = 125°C 14
Eoff Turn-off Switching Energy
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2 Tj = 125°C 16
mJ
Chopper diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VRRM Maximum Peak Repetitive Reverse Voltage 1200 V
Tj = 25°C 250
IRM Maximum Reverse Leakage Current VR=1200V Tj = 125°C 600 µA
IF DC Forward Current Tc = 80°C 150 A
Tj = 25°C 1.6 2.1
VF Diode Forward Voltage IF = 150A Tj = 125°C 1.6 V
Tj = 25°C 170
trr Reverse Recovery Time Tj = 125°C 280 ns
Tj = 25°C 14
Qrr Reverse Recovery Charge Tj = 125°C 28 µC
Tj = 25°C 6
Er Reverse Recovery Energy
IF = 150A
VR = 600V
di/dt =2500A/µs
Tj = 125°C 11 mJ
APTGT150SK120G
APTGT150SK120G – Rev 1 July, 2006
www.microsemi
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Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT 0.18
RthJC Junction to Case Thermal Resistance Diode 0.30
°C/W
VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
TJ Operating junction temperature range -40 150
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque For terminals M5 2 3.5 N.m
Wt Package Weight 280 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com
APTGT150SK120G
APTGT150SK120G – Rev 1 July, 2006
www.microsemi
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Typical Performance Curve
Output Characteristics (VGE=15V)
TJ=25°C
TJ=125°C
0
50
100
150
200
250
300
01234
VCE (V)
IC (A)
Output Characteristics
VGE=15V
VGE=13V
VGE=17V
VGE=9V
0
50
100
150
200
250
300
01234
VCE (V)
IC (A)
TJ = 125°C
Transfert Characteristics
TJ=25°C
TJ=125°C
TJ=125°C
0
50
100
150
200
250
300
56789101112
VGE (V)
IC (A)
Energy losses vs Collector Current
Eon
Eoff
Er
0
4
8
12
16
20
24
28
32
0 50 100 150 200 250 300
IC (A)
E (mJ)
VCE = 600V
VGE = 15V
RG = 2.2
TJ = 125°C
Eon
Eon
Eoff
Er
2
6
10
14
18
22
26
30
34
024681012141618
Gate Resistance (ohms)
E (mJ)
VCE = 600V
VGE =15V
IC = 150A
TJ = 125°C
Switching Energy Losses vs Gate Resistance Reverse Bias Safe Operating Area
0
50
100
150
200
250
300
350
0 400 800 1200 1600
VCE (V)
IC (A)
VGE=15V
TJ=125°C
RG=2.2
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.04
0.08
0.12
0.16
0.2
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
IGBT
APTGT150SK120G
APTGT150SK120G – Rev 1 July, 2006
www.microsemi
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Forward Characteristic of diode
TJ=25°C
TJ=125°C
TJ=125°C
0
50
100
150
200
250
300
0 0.4 0.8 1.2 1.6 2 2.4
VF (V)
IF (A)
Hard
switching
ZCS
ZVS
0
10
20
30
40
50
60
0 40 80 120 160 200 240
IC (A)
Fmax, Operating Frequency (kHz)
VCE=600V
D=50%
RG=2.2
TJ=125°C
Tc=7C
Operating Frequency vs Collector Current
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Diode
M icros e mi re se rve s the rig ht to c ha nge , witho ut notice , the spe cificatio ns and i nfo rmatio n co nta ine d he rein
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