Inductor for Power Lines (Power Inductor) Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) Series Standard Land Dimensions LQM18F/18P LQM21D/21F/21P LQM2MP LQM2HP LQM31P LQM32P LQH2MC LQH31C LQH32P LQH44P LQH5BP LQH55D/66S LQW15C_00 LQW15C_10 LQW18C c Part Number a b a b 2.2-2.6 c LQM18F Flow /18P Reflow 0.7 LQM21D/21F/21P 1.2 3.0-4.0 1.0 LQM2MP 0.8 2.4 1.8 LQM2HP 1.6 3.0 1.5 LQM31P 2.0 4.2-5.2 1.2 LQM32P 1.9 3.6 2.7 LQH2MC 0.8 2.6 1.0 LQH31C 1.0 4.5 1.5 LQH32P 1.3 3.8 2.0 LQH44P 1.3 4.4 3.0 LQH5BP 1.8 5.5 4.1 LQH55D/66S 2.0 8.0 3.5 LQW15C_00 0.4 1.4 0.6 LQW15C_10 0.4 1.4 0.66 LQW18C 0.7 2.2 1.0 1.8-2.0 0.7 1.4 LQH2HP 0.8 3.0 5.5 2.0 1.0 LQH32C 1.0 1.3 1.0 0.7 0.45 2.4 0.7 0.45 0.75 3.3 0.75 LQH3NP 1.15 1.0 1.15 3.3 7.5 3.0 1.5 LQH43C LQH43P 9 2. LQH55P 45 1.5 1.5 1.5 7 6. 6 1. Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator. Continued on the following page. Inductor for Power Lines (Power Inductor) Soldering and Mounting 2. Standard Soldering Conditions (1) Soldering method Chip inductor (Chip coils) can be flow or reflow soldered. Please contact Murata regarding other soldering methods. As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S, LQM32P, LQW15C/18C series, please use reflow soldering. Solder: Use Sn-3.0Ag-0.5Cu solder. Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine content exceeding 0.2wt%). Do not use water-soluble flux. The flux used for LQW15C/18C series should use the rosin-based flux that includes middle activator equivalent to 0.06wt% to 0.1wt% chlorine. For additional mounting methods, please contact Murata. (2) Soldering profile Temperature (C) "Flow Soldering profile (Sn-3.0Ag-0.5Cu solder) T3 T2 t2 Heating T1 Limit Profile Standard Profile Pre-heating t1 time (s) Standard Profile Pre-heating Series Heating Temp. (T1) Time. (t1) Temp. (T2) Time. (t2) LQM18F/18P LQM21D/21F/21P/2MP/2HP LQM31P LQH31C 150C 60s min. 250C 4 to 6s LQH32C LQH43C/43P 150C 60s min. 250C 4 to 6s Limit Profile Cycle of flow Heating Cycle of flow Temp. (T3) Time. (t2) 2 times max. 2653C 5s max. 2 times max. 2 times max. 2653C 5s max. 1 times "Reflow Soldering profile (Sn-3.0Ag-0.5Cu solder) Temperature (C) T4 T2 T1 T3 180 150 Limit Profile Pre-heating t1 Standard Profile t2 9030s time (s) Standard Profile Temp. (T1) Time. (t1) Peak temperature (T2) LQM18F/18P LQM21D/21F/21P/2MP/2HP LQM31P/32P LQH2MC, LQH2HP LQH31C LQH3NP/32P/43P/44P/5BP/55P LQW15C/18C 220C 30 to 60s 2453C LQH32C LQH43C LQH55D, LQH66S 220C 30 to 60s 2453C Series Heating Limit Profile Temp. (T3) Time. (t2) Peak temperature (T4) 2 times max. 230C 60s max. 260C/10s 2 times max. 2 times max. 230C 60s max. 260C/10s 1 time Cycle of reflow Heating Cycle of reflow Continued on the following page. Inductor for Power Lines (Power Inductor) Soldering and Mounting (3) Reworking with Soldering Iron Preheating at 150C for 1 minute is required. Do not directly touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows: Soldering iron power output: 80W max. Temperature of soldering iron tip: 350C Diameter of soldering iron end: 3.0mm max. Soldering time: within 3 s 3. Mounting Instructions (1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and electrode leaching. Solder Resist Land c d (2) Magnetic Coupling Since some chip inductors (chip coils) are constructed like an open magnetic circuit, narrow spacing between inductors (coils) may cause magnetic coupling. LQM, LQH66S and LQH_P series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip inductors (chip coils). (3) PCB Warping PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. Magnetic Coupling Products should be located in the sideways direction (Length: a<b) to the mechanical stress. a b Poor example Good example except LQH3NP/44P/5BP The electrode part of the product should be located like the picture to the mechanical stress. electrode Poor example electrode Good example LQH3NP/44P/5BP Continued on the following page. Inductor for Power Lines (Power Inductor) (4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. " Guideline of solder paste thickness * LQW15C: 50 to 100m * LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P, LQH44P/5BP/55P: 100 to 150m * LQH31C/32C, LQH43C/43P, LQH55P, LQH66S: 200 to 300m (5) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the adhesive in accordance with the conditions shown in chart. Soldering and Mounting LQH_C/D/H/N/P LQH_S LQM LQW_C LQH_C/H/M/N Part Number LQM Typical Application Amount (in:mg) IR-100 LQM18F/18P 0.06-0.07 LQM21D/21F/21P/2MP 0.20-0.25 LQM2HP/31P 0.25-0.30 LQH31C 0.20-0.25 LQH32C 0.27-0.35 LQH43C 0.60-0.80 4. Cleaning The following conditions should be observed when cleaning chip inductors (chip coils): (1) Cleaning Temperature: 60C max. (40C max. for alcohol cleaning agents) (2) Ultrasonic Output: 20W/l max. Duration: 5 minutes max. Frequency: 28 to 40kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. (a) Alcohol cleaning agents Isopropyl alcohol (IPA) (b) Aqueous cleaning agents Pine Alpha ST-100S LQH66S series: Aqueous agents should not be used because they may cause quality deterioration or damage to appearance. (4) Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agents have been removed with deionized water. For additional cleaning methods, please contact Murata.