LQH43MN5R6K03L - Murata - Datasheet.Directory

1. Standard Land Pattern Dimensions

A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip

inductor (chip coil) electrode.

(in mm)

Standard Land DimensionsSeries

LQH44P

LQH5BP

LQH55D/66S

LQW15C_00

LQW15C_10

LQW18C

3.0

4.1

3.5

0.6

0.66

1.0

4.4

5.5

8.0

1.4

2.2

1.3

1.8

2.0

0.4

0.7

LQM21D/21F/21P

LQM2MP

LQM2HP

LQM31P

LQM32P

LQH2MC

LQH31C

LQH32P

LQM18F

/18P 0.7

1.0

1.8

1.5

1.2

2.7

1.0

1.5

2.0

2.2-2.6

1.8-2.0

3.0-4.0

2.4

3.0

4.2-5.2

3.6

2.6

4.5

3.8

0.7

1.2

0.8

1.6

2.0

1.9

0.8

1.0

1.3

LQM18F/18P

LQM21D/21F/21P

LQM2MP

LQM2HP

LQM31P

LQM32P

LQH2MC

LQH31C

LQH32P

LQH44P

LQH5BP

LQH55D/66S

LQW15C_00

LQW15C_10

LQW18C

LQH32C

LQH2HP

Part Number abc

Land Pattern

+ Solder Resist

Solder Resist

5.5

1.0

2.0

1.0

1.3 1.0

Flow

Reflow

LQH55P

2.9

6.7

1.6

45˚

7.5

1.5

3.0

1.5

1.5 1.5

LQH43C

LQH43P

2.4

0.75 0.75

3.3

1.0

1.15 1.15

0.45 0.45

0.7 0.7

3.3

LQH3NP

Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator.

Soldering and Mounting

Inductor for Power Lines (Power Inductor)

Continued on the following page.

1.4

3.0

0.8

2. Standard Soldering Conditions

(1) Soldering method

Chip inductor (Chip coils) can be flow or reflow soldered.

Please contact Murata regarding other soldering

methods.

As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S,

LQM32P, LQW15C/18C series, please use reflow

soldering.

Solder: Use Sn-3.0Ag-0.5Cu solder.

Flux: Use rosin-based flux, but not strongly acidic flux (with

chlorine content exceeding 0.2wt%).

Do not use water-soluble flux.

The flux used for LQW15C/18C series should use the

rosin-based flux that includes middle activator

equivalent to 0.06wt% to 0.1wt% chlorine.

For additional mounting methods, please contact Murata.

"Reflow Soldering profile

(Sn-3.0Ag-0.5Cu solder)

Series

Standard Profile Limit Profile

Temp. (T1) Time. (t1)

Heating

220°C 30 to 60s 245±3°C 2 times

max. 230°C 260°C/10s 2 times

max.

60s max.

Cycle

of reflow

Peak

temperature

(T2) Temp. (T3) Time. (t2)

Heating Cycle

of reflow

Peak

temperature

(T4)

150

180

Temperature (°C)

90±30s time (s)

Limit Profile

Standard Profile

Pre-heating

LQM18F/18P

LQM21D/21F/21P/2MP/2HP

LQM31P/32P

LQH2MC, LQH2HP

LQH31C

LQH3NP/32P/43P/44P/5BP/55P

LQW15C/18C

LQH32C

LQH43C

LQH55D, LQH66S

220°C 30 to 60s 245±3°C 2 times

max. 230°C 260°C/10s 1 time60s max.

(2) Soldering profile

"Flow Soldering profile

(Sn-3.0Ag-0.5Cu solder)

Series Pre-heating Standard Profile Limit Profile

Heating

Temp. (T1) Temp. (T2)

Time. (t1)

150°C 60s min. 250°C 4 to 6s 2 times

max. 5s max. 2 times

max.

265±3°C

Time. (t2)

Heating

Cycle

of flow Temp. (T3) Time. (t2)

Cycle

of flow

Temperature (°C)

Pre-heating

time (s)

Heating Limit Profile

Standard Profile

150°C 60s min. 250°C 4 to 6s 2 times

max. 5s max. 1 times

265±3°C

LQM18F/18P

LQM21D/21F/21P/2MP/2HP

LQM31P

LQH31C

LQH32C

LQH43C/43P

Continued on the following page.

Inductor for Power Lines (Power Inductor) Soldering and Mounting

(3) Reworking with Soldering Iron

Preheating at 150°C for 1 minute is required. Do not

directly touch the ceramic element with the tip of the

soldering iron. The reworking soldering conditions are as

follows:

Soldering iron power output: 80W max.

Temperature of soldering iron tip: 350°C

Diameter of soldering iron end: 3.0mm max.

Soldering time: within 3 s

3. Mounting Instructions

(3) PCB Warping

PCB should be designed so that products are not

subjected to the mechanical stress caused by warping

the board.

Poor example

except LQH3NP/44P/5BP

Products should be located in the sideways direction

(Length: a<b) to the mechanical stress.

Good example

Poor example

LQH3NP/44P/5BP

The electrode part of the product should be located

like the picture to the mechanical stress.

Good example

(1) Land Pattern Dimensions

Large lands reduce Q of the mounted chip. Also, large

protruding land areas (bordered by lines having

dimensions 'c' and 'd' shown) cause floating and

electrode leaching.

(2) Magnetic Coupling

Since some chip inductors (chip coils) are constructed

like an open magnetic circuit, narrow spacing between

inductors (coils) may cause magnetic coupling.

LQM, LQH66S and LQH_P series have a magnetically

shielded structure. The structure makes their coupling

coefficient smaller than that of conventional chip

inductors (chip coils).

Magnetic Coupling

Land Solder Resist

electrode

Continued on the following page.

Inductor for Power Lines (Power Inductor) Soldering and Mounting

LQH_C/H/M/N LQM

LQM18F/18P

LQM21D/21F/21P/2MP

LQM2HP/31P

LQH31C

LQH32C

LQH43C

0.06-0.07

0.20-0.25

0.25-0.30

0.20-0.25

0.27-0.35

0.60-0.80

(5) Amount of Adhesive

If too much adhesive is applied, then it may overflow into

the land or termination areas and yield poor solderability.

In contrast, if insufficient adhesive is applied, or if the

adhesive is not sufficiently hardened, then the chip may

become detached during flow soldering. Apply the

adhesive in accordance with the conditions shown in

chart.

Typical Application Amount (in:mg)

Part Number

IR-100

The following conditions should be observed when

cleaning chip inductors (chip coils):

(1) Cleaning Temperature: 60°C max. (40°C max. for

alcohol cleaning agents)

(2) Ultrasonic

Output: 20W/l max.

Duration: 5 minutes max.

Frequency: 28 to 40kHz

Care should be taken not to cause resonance of the

PCB and mounted products.

(3) Cleaning agent

The following cleaning agents have been tested on

individual components. Evaluation in complete assembly

should be done prior to production.

(a) Alcohol cleaning agents

Isopropyl alcohol (IPA)

(b) Aqueous cleaning agents

Pine Alpha ST-100S

LQH66S series: Aqueous agents should not be used

because they may cause quality deterioration or

damage to appearance.

(4) Ensure that flux residue is completely removed.

Component should be thoroughly dried after aqueous

agents have been removed with deionized water.

For additional cleaning methods, please contact Murata.

LQM

LQH_C/D/H/N/P LQH_S

(4) Amount of Solder Paste

Excessive solder causes electrode corrosion, while

insufficient solder causes low electrode bonding strength.

Adjust the amount of solder paste as shown on the right

so that solder is applied.

" Guideline of solder paste thickness

· LQW15C: 50 to 100μm

· LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P,

LQH44P/5BP/55P: 100 to 150μm

· LQH31C/32C, LQH43C/43P, LQH55P,

LQH66S: 200 to 300μm

4. Cleaning

LQW_C

Inductor for Power Lines (Power Inductor) Soldering and Mounting