MXT3020
reference manual
version 4.0
Order Number: 100107-04
Revision C of the MXT3020
July 1999
Copyright (c) 1999 by Maker Communications, Inc. All rights reserved.
Printed in the United States of America.
The information in this document is believed to be correct, however, the
information can change without notice. Maker Communications, Inc. disclaims
any responsibility for any consequences resulting from the use of the information
contained in this document.
The hardware, software, and the related documentation is provided with
RESTRICTED RIGHTS. Use, duplication, or disclosure by the U.S. Government
is subject to restrictions as set forth in subparagraph (c)(1) (ii) of The Rights in
Technical Data and Computer Program Product clause at DFARS 252.227-7013
or subparagraphs (c)(1) and (2) of the Commercial Computer Software-
Restricted Rights at 48 CFR 52.227-19, as applicable.
Contractor/manufacturer is:
Maker Communications, Inc.
73 Mount Wayte Avenue, Framin gham, MA 01702
CellMaker and BridgeMaker are registered trad emarks of Maker
Communicat ions , In c. Acces s Maker, High -In te nsit y C ommu nicat ions Processor ,
High-Intensity Communications Processing, PortMaker, Octave, and SimMaker
are trademarks of Maker Communications, Inc.
All other trademarks are owned by their respective companies.
This manual supercedes and obsoletes the following Maker Communications
publication:
100107-03 - MXT3020 Reference Manual, dated July 1998
100350-01 - MXT3020 Reference Manual, errata sheet, Sept/Oct 1998
MXT3020 Reference Manual Version 4.0 i
CONTENTS
Preface xi
Maker Products xii
Traffic Stream Processing Solutions xii
ATM Cell Processing Solutions xiii
Using this Manual xiv
Add itional Document Re ferences xiv
Organization of this man ual xvii
CHAPTER 1 Device Overview 1
Circ uit Interface 4
The Data Mover (Scatter/Gather) Units 5
Scatter and Gather Memory Interfaces 6
Port2 Interface 7
CHAPTER 2 Circuit Interface 9
Circuit Interface registers 11
Per-Link registers 11
Global registers 11
Link Configuration register 12
Added detail: Bits 12-10 – clock source control 15
Added detail: Bit 6 – link pair mode 19
Added detail: BSCE pin 21
Link Buffer Address counters 23
ii Versio n 4.0 MXT3020 Reference Manual
Link R x Buffer Address counter 23
Link Tx Buffer Address counter 24
Details of the Link Tx/Rx Buffer Address counters 25
Link Tri-state Control Address counter 27
An example of the tri-stat e cont rol pr o c ess 27
The tri- state enable control map 28
Summary of tri-stat e control operation 32
Link se rvice clock genera tion registers 33
Link Service Clock N register 34
Link Service Clock K register 35
Link Service Clock L count er 35
Link FTC counter 36
Link SRTS Value register 36
CI Tri-state C ontrol Base Address register 37
CI Configuration register 37
MAXDS0, MAXTBS, and MAXRBS and buffer sizing 40
CI Quiet Frame Base Address register 42
Quiet L ogi c 43
CI SRTS FTC register 45
CI SRTS Valid Stat us register 45
CI Status register 46
Interface Pins 47
CHAPTER 3 Data Mover Units and Task Buffer
RAMs 49
Lists and Task s 50
Activating the Data Mover Unit 51
Loadin g list blo cks 51
Loading the Task Buffer RAM 53
Data Mover Unit Instruction Set 54
Task Buffer Format 55
Channel Map Pointer 56
List Size 57
Fra m e N um ber 57
SAR Size 57
SAR Offset 57
Register 06 (write) - Addition al con trol bits 58
Register 06 (read) - Additional status bits 60
Data Mover Unit Registers 61
MXT3020 Reference Manual Version 4. 0 iii
Channel Map Pointer (CMP) 62
Instructio n Poin ter (IP) 63
Frame Counter (FC) 63
Transfer Counter (TC) 63
CRC Function Code (FNC) 63
HSCT Control Flags 63
Instructio n Segme n t (ISEG) 64
Immediate (CONST) 64
Command (CMD) 64
Task T imer (TKT) 65
Status (STA T) 65
MAPD and Fill 65
TT register 66
TVR register 66
CRC-10 [9:0] 66
Start of CRC-10 [5:0] 6 6
Address Generation 67
List Block Address Generation 67
List RAM Address Generation 6 7
Scatter/Gather Memory Address Generation 68
Task Buffer RAM Address Generation 71
Interface Pins 71
Examples of Scatter and Gather Operations 72
Scatter 72
Gather 73
Multicast 74
CHAPTER 4 Scatter and Gather Memory Interfaces 75
Scatter Memory Controller 76
Gather Memory Controller 77
Determining Scatter and Gath er Memory requirements 78
Scatter Memory 78
Gather Memory 78
Interface Pins 79
CHAPTER 5 Port2 Interf ace 81
MXT3020 addressing 82
MXT3020 address space 83
iv Version 4.0 MXT3020 Reference Manual
Interface Pins 86
CHAPTER 6 Register Reference 87
Channel Map Pointer (TBR and DMU) 89
CI Configuration register 90
CI Quiet Frame Base Address register 92
CI SRTS FTC register 93
CI SRTS Valid Status register 94
CI Status register 95
CI Tri-state C ontrol Base Address register 96
Command register 97
CRC-10 regis t er 98
Immediate and Control Flags register (TBR and DMU) 99
Instruction Pointer and Frame Counter 102
Link Configuration register 103
Link FTC counter 105
Link Rx Buffer Address counter 106
Link Service Clock K register 107
Link Se rvice Clock L counter 108
Link Service Clock N register 109
Link SRTS Value register 110
Link Tri-state Control Address counter 111
Link Tx Buffer Address counter 112
List Size and Frame Number 113
MAPD and FILL registers 114
SAR SDU registers 115
SAR Size and SAR Offset 116
TT and TVR registers 117
Status register 118
Task Timer register 119
Transfer Counter and Task Buffer Offset registers 120
CHAPTER 7 Interfacing Guidelines 123
Interfacing to Scatter/Gather Memory 124
Interfacing the MXT3020 to the MXT3010 126
MXT3020 Reference Manual Version 4. 0 v
Port2 Burst and Non -Burst Operat ion 127
The DMA2 instructions 128
Multiple MXT3020 implementation 1 30
Device selection code example 132
Scatter/Gather Task Buffer Busy flags 134
Quad MXT3020 layout cons id e r ations 135
Timing analysis of quad MXT3 020 on Port 2 136
PCB Design Concerns for quad MXT3020 137
Clock tree distribution 138
CHAPTER 8 Timing 139
MXT3020 ti ming - general informatio n 139
Definition of switching levels 139
Input clock details 140
Timing 141
Circ uit Interface 142
Port2 Interface timing 144
Scatter/Gather Memory Interface 149
Status Interface 153
SCSA Bus Timing 154
MVIP Bus Timing 157
MXT3020 As sistan ce to Non-burst Device s 158
MXT3020 reset timing 159
CHAPTER 9 Pin Information 161
MXT3020 pinout 162
MXT3020 si gnal descrip tions 163
JTA G /PLL Miscellaneous pin terminations 170
Pin Listing 171
CHAPTER 10 Electrical Parameters 177
MXT3020 maximum ratings and op eratin g conditions 178
DC electrica l characteristics 179
MXT3020 power sequencing 179
MXT3020 PLL conside ration s 180
vi Version 4.0 MXT3020 Re ference Manual
Overview 180
VDD_PLLVCC decoupling 180
General decoupling 181
Reference clock jitter 182
CHAPTER 11 Mechanical and Thermal Information 185
MXT3020 mechanical/thermal information 186
Storage co nditions 187
APPENDIX A Acronyms 189
APPENDIX B Registered Decoder PAL Source Code 191
MXT3020 Reference Manual Version 4.0 vii
List of Figures
Figure 1 T1/E1/ATM Interface Using the MXT3010 and MXT3020 2
Figure 2 Block diagram of the MXT3020 3
Figure 3 Link Configuration register bit assignments 12
Figure 4 SRTS support hardware 14
Figure 5 Configuration Uni-1 17
Figure 6 Configuration Uni-2 17
Figure 7 Configuration Uni-3 18
Figure 8 Configuration Uni-4 18
Figure 9 Configuration Bi-1 18
Figure 10 Configuration Bi-2 19
Figure 11 Configuration Bi-3 19
Figure 12 MXT3020 operating modes - eight link pairs 20
Figure 13 MXT3020 operating modes - ASER and BSER 21
Figure 14 Tri-state enable for the ASER pins 28
Figure 15 ASER and BSER tri-state enable bit usage (bidirectional) 29
Figure 16 ASER and BSER tri-state enable bit usage (unidirectional) 31
Figure 17 Link service clock generation registers 33
Figure 18 Quiet Frame Allocation Map 44
Figure 19 Pre-Scatter/Gather Task Buffer Register Format 55
Figure 20 Post-Scatter/Gather Task Buffer Register Format 56
Figure 21 DMU register set organization 62
Figure 22 Creation of 19-Bit Address (Uni) When DS0 = 24 or 32 69
Figure 23 Creation of 19-Bit Address (Uni) When DS0 = 64 69
Figure 24 Creation of 19-Bit Address (Uni) When DS0 = 96 or 128 69
Figure 25 Creation of 19-Bit Address (Bi) When DS0 = 24 or 32 70
Figure 26 Creation of 19-Bit Address (Bi) When DS0 = 64 70
Figure 27 Creation of 19-Bit Address (Bi) When DS0 = 96 or 128 70
Figure 28 Example of a Scatter Operation 72
Figure 29 Example of a Gather Operation 73
Figure 30 Example of an Mcast Operation 74
Figure 31 MXT3020 address space 83
Figure 32 Scatter Data Mover Unit Register Map 84
Figure 33 Gather Data Mover Unit Register Map 84
Figure 34 Circuit Interface per-link registers 85
Figure 35 Circuit Interface global and SRTS value registers 86
Figure 36 Schematic of MXT3020C to Scatter/Gather Memories 124
Figure 37 MXT3020 to MXT3010 interconnection schematic 126
Figure 38 Diagram of Port2 burst DMA instruction bits 128
Figure 39 Diagram of Port2 non-burst DMA instruction bits 129
Figure 40 Sche matic of circuit for interfac i ng quad MXT3020’s 131
viii Version 4.0 MXT3020 Refer ence Manual
Figure 41 Quad MXT3020 interconnect topology #1 135
Figure 42 Quad MXT3020 interconnect topology #2 135
Figure 43 Clock Distribution Circuit 138
Figure 44 Switching level voltages 139
Figure 45 Input clock waveform (pin FN) 1 40
Figure 46 Receive timing in unidirectional mode 143
Figure 47 Transmit timing in unidirectional mode 143
Figure 48 Receive/Transmit timing in bidirectional mode 143
Figure 49 Port2 burst write timing (1 halfword) 145
Figure 50 Port2 burst write timing (4 halfwords) 146
Figure 51 Port2 burst read timing (1 halfword) 147
Figure 52 Port2 burst read timing (2 halfwords) 148
Figure 53 Scatter/Gather Memory Halfword Write Timing 150
Figure 54 Scatter/Gather Memory Burst Write (Byte) Timing 151
Figure 55 Scatter/Gather Memory Burst Read (Byte/Halfword) Timing 152
Figure 56 Status interface timing 153
Figure 57 Computer telephony interface reference circuit 154
Figure 58 SCSA Bus Timing 155
Figure 59 SCSA Bus Timing 156
Figure 60 MVIP BUS Timing (2/4 MHz) 157
Figure 61 Timing for MXT3020 Assistance to Non-Burst Devices 158
Figure 62 MXT3020 Reset Timing 159
Figure 63 MXT3020 package/pin diagram 162
Figure 64 Ge nerat i ng a quie t VDD_PLLVCC 181
Figure 65 MXT3020 decoupling capacitor location 182
Figure 66 MXT3020 package/pin diagram - top view 186
Figure 67 MXT3020 package/pin diagram - side view 187
MXT3020 Reference Manual Version 4.0 ix
List of Tables
Table 1 Circuit Interface registers (for each link) 11
Table 2 Circuit Interface registers (global) 11
Table 3 Configurations for ACLK and BCLK 16
Table 4 MXT3020 link interface pins and signals 20
Table 5 Buffer size allocation 25
Table 6 Fram e Counte r / DS0 Counter 26
Table 7 Relation of buffer size to variable y 26
Table 8 Circuit Interface pins, per link 47
Table 9 Circuit Interface pins, common to all links 47
Table 10 Data Mover Unit Instructions 54
Table 11 Data Mover Unit Registers 61
Table 12 Relation of ISEG register to address ranges 64
Table 13 Data Mover Unit and Task Buffer RAM interface pins 71
Table 14 Scatter and Gather Memory Interface Pins 79
Table 15 Port2 Interface pins 86
Table 16 Scatter/Gather Memory control connections 125
Table 17 Port2 burst DMA instruction bit mapping 129
Table 18 Port2 non-burst DMA instruction bit mapping 129
Table 19 Scatter and Gather Task Buffer Busy flag wiring 134
Table 20 Synopsis of MXT3020 and MXT3010 timing requirements 136
Table 21 Simulated interconnect delay 136
Table 22 Input clock timing parameters (in nanoseconds) 140
Table 23 Circuit Interface timing 142
Table 24 Port2 Interface timing 144
Table 25 Scatter/Gather Memory Interface Timing Table 149
Table 26 Status interface timing table 153
Table 27 MXT3020 SCSA Bus Timing (2/4 MHz) 155
Table 28 MXT3020 SCSA Bus Timing (8 MHz) 156
Table 29 MXT3020 MVIP Bus Timing (2/4 MHz) 157
Table 30 MXT3020 Reset Timing 159
Table 31 Port 2 Interface Signal Description 164
Table 32 Scatter/Gather Memory Interface signal description 165
Table 33 Circuit Interface signal description 166
Table 34 Miscellaneous clock, control, and test signal descriptions 167
Table 35 Power and Ground pin descriptions 168
Table 36 Unused pin termination - specific pins 170
Table 37 U nused pin term ination - general pins 170
Table 38 Pin Listing 171
Table 39 Pin Type Descriptions 175
Table 40 Absolute maximum ratings (VSS = 0V) 178
x Version 4.0 MXT3020 Refer ence Manual
Table 41 Recommended operating conditions 178
Table 42 DC Electrical characteristics 179
Table 43 MXT3020 package summary 187
MXT3020 Reference Ma nu al Version 4.0 xi
Preface
Maker Communications designs, develops, and markets a complete line of programmable,
High-Intensity Communications Processors™, software solutions, and development tools.
These products are designed to be adapted quickly and effectively to an extensive range of
netw orking applications.
xii Versio n 4. 0 MXT3 02 0 Reference Manual
Preface
Maker Products
Maker Communicationss product line includes:
Traffic Stream Pr oces sing S olut i ons
ATM Cell Processing Solutions
Traffic Stream Processing Solutions
Integrated Circuit
The MXT4400 Traffic Stream Processor is Maker Comm unications’s very high-
performance communications processing engine . Equally adept at supporting pack-
ets and ATM cells, this device re sides in the data path of net working systems and pro-
vides wire-speed, programmable internetworking and traffic management. It is the
first of a pr oduct f amily tha t suppor ts OC-1 2 and OC-48 tr af fic loads. This pr ogram-
mable chip is adapted for a number of different applic ations using either Maker's
firmware packages or customer developed applications.
Software Solutions
Executi ng on the MXT4400, PortMaker™ empl oys a modul ar arch itectur e built on
a common kernel to deliver standard inter-domain services. These services include
ATM Adaptation Layer 5 (AAL5) Segmentation and Reassembly (SAR) at 622 Mb/
s and support for Packet over SONET.
Development Tools
Maker Communications offers a full suite of development tools for the MXT4400
T raffi c Stream Processor . These include a Verilog model of the chip, the TSP Assem-
bler, the MXT4400 simulat ed t est benc h (ESIM), and the gr aphical versio n the reof
(GESIM). The TSP Assembler assembles, links, and creates a program image that is
downloaded to the MXT4400 during device initialization. ESIM is a Verilog-based
simulat or t ha t pr ovi des a tightly cont rolled and fully o bse rva b le en vir onment to test
and debug both processor applications and external host programs before running
them on th e target hardware. ESIM is complemented with a graphical post processor ,
GESIM.
MXT3020 Reference Ma nu al Version 4.0 xiii
Maker Products
ATM Cell Processing Solutions
Integrated Circuits
Maker Communications delivers a wide range of ATM solutions based on the
MXT3010 cell processing engine and the MXT3020 circuit interface coprocess or.
The MXT3010 is a high-performance programmable cell processor engine specifi-
cally de signed t o hand le ATM cell mani pulat ion and t ransmis sion at data rates up to
622 Mb/s . The MXT3020 is an ATM circuit in terface coprocess or for the MXT3010
cell pr ocessor . It provides fle xible interwo rking between T ime Divi sion Multiplexed
(TDM) links and the ATM network.
Software Solutions
The MXT3010 and MXT3020 are complemented with a series of software applica-
tions that provi de s tandar d ce ll p rocess ing f uncti onali ty. CellMaker®-155 and Cell-
Maker®-622 execute on an MXT3010 and provide ATM Adaptation Layer 5
(AAL5) Segment ation and Reassembl y (SAR) at data rat es of 155 Mb/s and 622 Mb/
s, respec tively. AccessMake r™ executes on an MXT3010 with up to four attached
MXT3020 coprocessors. It provides cell processing functions for both packet and cir-
cuit int erworking to suppor t multipl e services concurre ntly including AAL1, AAL5,
IMA, and cell relay.
Development Tools
Maker Communications offers a full suite of development tools for the MXT3010
Cell Processor including Verilog models of the chips, the AS3010 assembler, Cell-
Maker Simulator (CSIM), and Graphical CellMaker Simulator (GCSIM). The
AS3010 assembles, links, and creates a program image that is downloaded to the
MXT3010 during device initialization. CSIM is a Verilog-based simulator that pro-
vides a tightly controlled and fully observable environment to execute and debug
both processor applications and external host programs before running them on the
target hardware. Maker also provides two development boards. CSIM is comple-
mented wit h a graphical post processor , GCSIM. The MXT3016 is a 32-bit, PCI bus-
based deve lopment board used to te st 622Mb/s applications. Th e MXT3025 is a 32-
bit, PCI bus-based evaluation board used to test OC-3 ATM (MXT3010) and T1
(MXT3020) applications.
xiv Version 4. 0 MXT3 02 0 Refere nc e Manua l
Preface
Using this Manual
This manual is a reference document intended to assist in the design of communica-
tions systems. This manual is product specific and should be used in conjunction with
other Maker product documentation to develop systems. For a complete listing of
Maker documentation refer to the web site at http://www.maker.com/support.
Additional Document References
The information provided in Maker documentation assumes some reader familiarity with the
following do cuments:
ATM Forum’s UTOPIA Specification, Level 2, Version 1.0, af-phy-0039.000,
dated June 1995
PCI Spec ification
Terminology
The glossary contained in this manual defines Maker terminology as well as networking/
communications terminology applicable to Maker products.
Notes and Cautions
The manual uses these conventions:
Notes contain information that is incidental to the current subject matter.
Cautions warn of the risk of unfortunate system damage or loss of data.
MXT3 0 20 Refe rence Ma nual Versio n 4.0 xv
Using this Manual
Typographical Conventions
This document uses the following typographical conventions:
API commands appear in mixed case, for example Open_Channel.
Simulator commands appear in lower case, for example cdl_dump.
Instruction mnemonics and registers appear in uppercase, for example the
R_TSSCFG register.
User input appears in bold monospace font.
System output and code examples appear in monospace font.
Variables that accompany commands or configuration switches appear in <ital-
ics and in brackets>, for example sim <14000>
Text references to locations off of the current page appear in italics. For exam-
ple, see Maker Products on page xi.
For on-line viewers using ADOBE Acrobat PDF readers, all hypertext links
appear in blue.
Change bars
Change bars are provided to indicate revisions made since the publication of the manual.
xvi Version 4.0 MXT3020 Refer e nc e Man ual
Preface
Contacting Support Services
Maker Communications h as the following forums for getting in formation, communicatin g
ideas, and reporting problems:
Sales and customer support: 508-628-0622
Customer support: support@maker.com
Produc t inquiries: info@maker.com
Facsimile: 508-628-0256
Web: www.maker.com
MXT3020 Reference Ma nu al Version 4.0 xvii
Organiza tio n of this manual
Organization of this manual
This refe rence manual includes three sections: Subsystems, Register Reference , and
Signal Descriptions and Electrical Characteristics. Also included are Appendix A,
Acronyms, and Appendix B, Registered Decoder PAL Source Code.
The Subsystems section is a general tutorial on the organization and features of the
MXT3020. Inten ded for r eader s unfamil iar wi th the chip, th is sect ion in cludes info r-
mation on the:
Circuit Interface
Data Mover (Scatter/Gather) Units with List RAMs and Task Buffer RAMs
Scatter and Gather Memory Interfaces
Port 2 Int erface
Section 2, Register Refe rence, is intended for experienced users of the MXT3020.
This section condenses the material provided in the Subsystems section into tabular
form, and pr ovides the bit assignments and functions for all MXT3020 registers,
which are listed in alphabetical order.
Section 3, Signal Des criptions and Electrical Chara cteristic s, section includes inf or-
mation on:
Timing information
Pin out and pin listing
Signal descriptions
Electrical para meters
Thermal characteristics
Mechanical information
xviii Version 4. 0 MXT3 02 0 Refere nc e Man ua l
Preface
MXT3020 Reference Manual Version 4. 0
Section 1 Subsystems
This section is compos ed of five chapt er s. It provides an o ver view of the MXT3020
ATM circuit interface coprocessor and its major functional subsystems.
Version 4.0 MXT3020 Reference Manual
MXT3020 Reference Manual Version 4. 0 1
CHAPTER 1 Device Overview
The MXT30 20 is a TDM cir cuit inte rface copr ocesso r for buil ding syste ms that in te-
grate ATM, packets , and TDM – including voice-ov er-ATM products . T og ether with
the MXT3010, the MXT3020 delivers the performance and features to support mul-
tiple s ervices concurrentl y, including stru ctured and unstruct ured AAL1 circui t emu-
lation, ATM User-Network Interface (UNI), Inverse Multiplexing for ATM (IMA),
AAL2, and TM4.0 compli ant AAL5. With up to four MXT3020s connect ed to a sin -
gle MXT3010, systems can be developed that support any combination of up to 32
T1, E1, or J2 links through standard framers, or up to 64 bidirectional links (up to 8
Mb/s each) supporting SCSA and MVIP computer telephony buses.
MXT3020 applications include:
Circuit emulation service for converting TDM data into AAL1 cells in both
Structured Data Transfer (SDT) and Unstructured Data Transfer (UDT) modes.
ATM User-Network Interface support and inverse multiplexing over TDM cir-
cuits including T1, E1, and J2.
Key features of the MXT3020 include:
A g lue le ss con nect i on t o t he MXT3010. The MXT30 10’s SWAN process or pro-
grams and contro ls the MXT3020.
Support for structur ed and unstructured data transf er modes on 16 bidirectional
TDM wires that directly support SCSA and MVIP telephony busses, or 8 unidi-
rectional TDM wire pairs that connect to T1, E1, or J2 framers.
2 Version 4.0 MXT3020 Reference Manual
Device Overview
Data Mover Units that sup port f ull y arbitrary mapping of DS0 s to cell payloads
including cross link mapping for use in tr unking applications. The Data Mover
Units contain cell delineation, Header Error Control (HEC) generation and
checking, plus cell payload scrambling and descrambling hardware to support
T1 and E1 User-Network Interfaces.
Su ppor t f or Nx64 mode with up to 2048 DS0's of tr affic with up t o 10 24 vi rtual
circuits.
Internal cloc k recovery using Synchronous Resi dual Ti me Stamp (SRTS) or
Adaptive techniques.
Figure 1 shows a block diagram of a possible application using the MXT3020 as a
coprocessor for the MXT3010 to provide an interface between ATM and T1/E1 facil-
ities.
FIGURE 1. T1/E1/ATM Interface Using the MXT3010 and MXT3020
MXT3010
Framers
ATM Facility
Scatter
Memory
Eight T1 or E1 Lines
Gather
Memory
MXT3020
Scatter
Memory
Eight T1 or E1 Lines
Gather
Memory
MXT3020
Port2 Bus
Framers
Eight T1 or E1 Lines
MXT3020
Eight T1 or E1 Lines
MXT3020 Gather
Memory
Gather
Memory
Scatter
Memory Scatter
Memory
MXT3020 Reference Manual Version 4.0 3
Figure 2 shows a block diagram of the MXT3020.
FIGURE 2. Block diagram of the MXT3020
The m ajor sect ions of the MXT3020 are the:
Circuit Interface
Data Mover (Scatter/Gather) Units with List RAMs and Task Buffer RAMs
Scatter and Gather Memory Interfaces
Port 2 Int erface
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Ta sk Buffer
RAMs
SDU Gather Unit
Gather List RAM
4 Version 4.0 MXT3020 Reference Manual
Device Overview
CIRCUIT INTERFACE
The C ircuit In terface receives an d transmits TDM serial da ta over eight se rial link
pairs.
Each link pair supports structured and unstructured data transfer (SD T and
UDT) modes, and is independent with its own clocks and unidirect ional mode
frame sync hronization.
Each link pair can be configured in a unidirectional mode suitable for use with
framers or in a bidirectional mode compatible with telephony busses. When
configured in unidirectional mode, each link pair implements one receive line
and one transmit line. When configured in bidirectional mode, each link of the
pair implements an independent bidirectional line.
For each link, a tri-state control map is provided. The MXT3020 steps through
the tri-state control map as each DS0 occurs, enabling or disabling the tri-state
output en able on the link as directed by the co ntrol bits in the map.
Rece ived TDM frames are wr itten into buffers in Gather Memory. Transmi t
TDM frames are read from buffers in Scatter memory.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Ta sk Buffer
RAMs
SDU Gather Unit
Gather List RAM
MXT3020 Reference Manual Version 4.0 5
The Data Mover (Sca tter/Gather) Units
THE DATA MOVER (SCATTER/GATHER) UNITS
The Data Mover Units (DMUs) are specialized scatter/gather machines. One DMU
disasse mbles SAR Se rvice Dat a Units (SDUs) fr om ATM cel ls and prepares data f or
transmission over TDM links. Simultaneously, the other DMU receives data from
TDM links and assembles it into ATM SAR SDUs. The Data Mover Units are pro-
grammed by the MXT3010, which lo ads li sts of i nstru ction s for con troll ing th e data
transf er proce ss into a designat ed area of Gather Memory. The MXT3010 the n loads
control information and data into the T a sk Buffer RAM of the scatter machine or con-
trol information into the Task Buffer RAM of the gather machine.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Ta sk Buffer
RAMs
SDU Gather Unit
Gather List RAM
6 Version 4.0 MXT3020 Reference Manual
Device Overview
SCATTER AND GATHER MEMORY INTERFACES
The Scatter and Gather Memory interf aces are each 16-bits wide and support up to
512 Kbytes of pipelined synchronous SRAM. Each port can accept accesses from
any of the on-chip masters (Circuit Interface, Data Mover Units, or Port2 Interface).
Because the Scatter and Gather Memory ports are independent, operations to these
ports can occur simultaneously.
Port 2 Interface
Circuit Interf ace
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter U nit
Scatter List RAM
Gather
Task Buffer
RAMs
SDU Gather Unit
Gather List RAM
MXT3020 Reference Manual Version 4.0 7
Port2 Interface
PORT2 INTERFACE
The Port2 Inte rface is t he MXT3020’s co nnection to the MXT3010 device . Throug h
the Port2 Interface, the MXT3010 can read and write Scatter and Gather memory , the
Task Buffer RAMs, List RAMs, and all internal registers. See “MXT3020 address
space” on page 83. Once a Port2 transfer begins, the MXT3020's Port2 Interface
demultiplexes the Port2 bus and decodes the address. If the address maps to this chip,
the MXT3020 performs the read or write operation to the register or RAM selected
by the address. The MXT3020 address space is accessible only in burst transfer
mode.
An MXT3020 occupi es 1 Mbyte of Port2 addr ess space. Two MXT3020s can resi de
on a Port 2 bus without th e need fo r additi onal devi ce selec tion log ic. The P2A20 pin
of one MXT3020 is strapped low to decode Port2 bus address space 0x000000 to
0x0FFFFF while the P2A20 pin of the other MXT3020 is strapped high to decode
Port2 a ddress space 0x100000 to 0x1FFFFF. Alternative ly , multiple MXT3020’ s can
be supported with the addition of a devi ce selection PAL. See “Multiple MXT3020
implementation” on pa ge 130.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Task Buffer
RAMs
SDU Gather Unit
Gather List RAM
8 Version 4.0 MXT3020 Reference Manual
Device Overview
MXT3020 Reference Manual Version 4. 0 9
CHAPTER 2 Cir cuit Interface
The Circuit Interface logic receives and transmits TDM serial data. The Circuit Inter-
face supports eight serial link pairs.
Each link pair supports structured and unstructured data transfer (SDT and
UDT) modes.
Each link pair is compl et ely i ndependent with its own cl ock s and unidirectional
mode frame synchronization.
TDM serial data rates supported are 1.544, 2.048, 4.096, 6.144, or 8.192 Mhz.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Ta sk Buffer
RAMs
SDU Gather Unit
Gather List RAM
10 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Each link pair can be configured in a unidirectional or a bidirectional mode. In
unidirectional mode, each link pair is configured as one 2-wire port with a dedi-
cated receive and transmit line, and can connect to T1, E1, and J2 framers. In
bidire ction al mode, each li nk pair is configur ed as two singl e-wir e bidirect ional
links, and can directly support SCSA and MVIP telephony busses.
A tri-state control map for each link can be stored in a section of the Gather
Memory re served for contro l purposes. The si ze of the tri-s tate control map for a
link is det er m ine d by t h e number of DS0s o ccurring in each fr ame, as a tri-stat e
control bit is provided for each DS0 on the link. Synchronized by Frame Sync
on the li nk, the MXT3020 steps through the tri-state control map as each DS0
occurs, enabling or disabling the tri-state output enable on the link as directed
by the tr i-state control bits in the map. In bidirectional mode, each wire is indi-
vidually tri-statable on a DS0 by DS0 basis. In unidirectional mode, each trans-
mit wire is individually tri-statable on a DS0 by DS0 basis.
Serial da ta receive d by the links is packed into h alfwo rds and wri tten to buffers
in Gather Memory. Data to be transmitted is read fr om Scatter Memory and
shif ted out onto the tr ansmi t links . The Circui t Inter face m ainta in s all nece ssary
pointers to Scatter/Gather Memory to support constant-bit-rate data with mini-
mal intervention from the SWAN processor in the MXT3010.
MXT3020 Reference Manual Version 4.0 11
Circuit Interface r e gi st ers
CIRCUIT INTERFACE REGISTERS
Per-Link registers
Each of the eight link pairs has a configuration register, three address counters, and
five l in k s ervice clock and Sync hronous Residual Time Stamp (SRTS) cont rol regis-
ters:
TABLE 1. Circuit Interface registers (for each link)
Global registe rs
In additi on t o the ei ght register s pr ovi ded for each link, the Circuit Int er fa ce has six
global configuration/status re gisters:
TABLE 2. Cir c uit Interface r egisters (global)
Register Function
Link Configuration register See “Link Config ur ation register” on page 12.
Link Tx Buffer Address counter See “Link Buffer Address counters” on page 23.
Link Rx Buffer Address counter
Link Tri-state Control Address
counter See “Link Tri-sta te Control Address counter” on page 27.
Link service clock control registers:
N register, K register,
L counter, FTC counter,
Link SRTS Value register
See “Link service clock generation registers” on page 33.
Register Function
CI Tri-state Control Base Address
register See “CI Tri-state Control Base Address register” on page 37.
CI Configuration register See “CI Configuration register” on page 3 7.
CI Quiet Frame Base Address reg-
ister See “CI Quiet Frame Base Address register” on page 42.
CI SRTS FTC register See “CI SRTS FTC register” on page 45.
CI SRTS Valid Status register See “CI SRT S Valid Status register” on page 45.
CI Status register See “CI Status register” on page 46.
12 Version 4.0 MXT3020 Reference Manual
Circuit Interface
LINK CONFIGURATION REGISTER
The Link Conf iguration register controls the operating mode of each link. There is
one of t hese read/write re gisters for each li nk. The bit map is shown i n Figure 3 and
the bit fun ctions ar e described in the paragraphs which follow.
FIGURE 3 Link Configuration register bit assignments
D_FCNT (bit 13)
The Link Buffer Address counters (page 23) are 15 bits long and consist of a DS0
portion and a frame count portion. The number of bits used in the DS0 portion
depends up on the number of DS0’s in the fra me (MAXDS0 in the “CI Conf iguration
regist er ” on page 37). The bits n o t u sed for the DS0 portion are t he f ra m e co unt por -
tion. The D_FCNT bit enables/disables incrementing the frame count portion. Set-
ting this bit to one (1) disables incrementing the frame count portion, causing
programs used in special applications to repeatedly use a single portion of frame
buffer storage. Clearing this bit to zero (0) enables incrementing the frame count por-
tion. This latter choic e is used by most pr ograms.
TxCLKS (bits 12 and 11)
These bits select the link transmitter clock source (SRTS, BCLK, ACLK). See
“Added detail: Bits 12-10 – clock source control” on page 15..
1514131211109876543210
00
D_FCNT
TxCLKS
ACLK_MD
ACTDS0 BI DTM D_DELAY
LSB_1ST
SRTS_MD
LkRSET
Bit 12 Bit 11 Clock Source
0 0 Internal SRTS Clock
0 1 External BCLK inpu t
1 0 External ACLK input
1 1 Reserved
MXT3020 Reference Manual Version 4.0 13
Link Config ura tio n register
ACLK_MD (bit 10)
This bit sel ects the ACLK pin I/O dir ect io n. W hen t hi s bi t is one (1), the ACLK pin
is an ou tpu t. Whe n t his bit is zero (0), the ACLK pi n i s a n i nput . See “Added detail:
Bits 12-10 – clock source control” on page 15.
ACTDS0 (bits 9, 8, and 7)
These bits indicate the actual number of DS0's per frame. This information is used by
the tri -s tat e en abl e control map (see “The tri-state enable cont rol map” on page 28).
BI (bit 6)
This bit controls t he mode of a link pa ir. When this bit is one (1) , the link ope rates in
bidirectional mode. When this bit is zero (0), the link operates in unidirectional mode.
These modes ar e described in greate r detail in “Adde d detail : Bit 6 – link pair mode”
on page 19.
DTM (bit 5)
This bit se lects the Data Transf er M ode of t h e li nk pair. When th is bi t is one (1), th e
link operates in Structured Data Transfer (SDT) mode. When this bit is zero (0), the
link operates in Unstructur ed Data Transfer (UDT) mode.
Bit 9 Bit 8 Bit 7 Actual number of DS0s per frame
00024
00132
01064
01196
100128
101 through 111 Reserved
14 Version 4.0 MXT3020 Reference Manual
Circuit Interface
D_DELAY (bits 4 and 3)
These bits control the position of Frame Sync relative to the first bit of a frame.
LSB_1ST (bit 2)
This bit controls the direction of the link shift registers. When this bit is one (1), the
link sh ift regis ters operat e in LSB mode, sh ifting the least sig nificant bit of each byte
onto the ser ial lin e firs t. When this bit is z ero (0), the link sh ift reg ister s operate in
MSB mode, shifting the most significant bit of each byte onto the serial line first.
SRTS_MD (bit 1)
This bit contro ls the mode of the SRTS value gener ator. Figure 4 shows a simpli fied
diagram of the SRTS support hardware.
FIGURE 4 SRTS support hardware
When this bit is one (1), the SRTS value generator operates in maste r mode. In this
mode, the value generator uses the external ly supplied TDM service clock (BCLK
pin) to generate SRTS values for transmission over the ATM link with the data.
Bit 4 Bit 3 Frame Sync to first data delay
0 0 1 cycle
0 1 2 cycles
1 0 3 cycles
1 1 Reserved
Numerically
Controlled
Oscillator 0
1
Regenerated
service clock
Divide
by 3008
(Settable)
SRTS
value
SRTS
4-bit up-
counter
SRTS
Value
Latch
FNET
BCLK
N Value
K Value
MXT3020 Clock (FN) SRTS_MD
SRTS value generator
L Value
3-bit
divider in
N register
MXT3020 Reference Manual Version 4.0 15
Link Config ura tio n register
When the SRTS_MD bit is zero (0), the SRTS value generator operates in slave
mode. In slave mode, the SR TS value generator measures the service clock generated
by the numerically controlled oscillator within the MXT3020. When SRTS is used
for cl ock recover y , the SR TS v alues thus generated are used by software t o adjust t he
values of N and K and lock the regenerated TDM service clock to the remote TDM
service clock.
LkRESET (bit 0)
This bit c ontrols the re set state of a link pa ir . Setti ng this bit to one (1) plac es the link
in the reset state. Clearing this bit to zero (0) removes the link from the reset state.
Added detail: Bits 12-10 – clock source control
ACLK pin
In addition to the ASER and BSER pins, an ACLK pin is provided. The state of bit
10 (ACLK_MD) in the Link Configuration register determines whether this pin is
used as an input or as an output:
If ACLK_M D is cl ear (0) , th e ACL K pin fu nct io ns as an input and functions as
the Transmit Input Clock in both the bidirectional (bus) and unidirectional
(frame r) modes.
If ACLK_MD is set (1), the ACLK pin functions as an output and functions as
the Transmit Link (Output) Clock in the unidirectional (framer) mode. In bidi-
recti onal (b us) mode, the tr i-st ate co ntrol that is bei ng used t o cont rol th e ASER
line is presented on the ACLK pin and can be used to control external output-
enabled devi ce s.
BCLK pin
The BCLK pin provides t he Receive Cloc k signals for both ASER and BSER in both
the unidirectional and bidirect ional modes.
16 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Table 3 shows four configur ations using ACLK and BCLK to provide clocking in
unidirectional mode. Table 3 also shows three configurations using ACLK and
BCLK to provide clocking in bidirectional mode. The figures cited in the table pro-
vide additional information about the clocking configurations.
Note:While sixteen configurations are theoretically possible (four bits are used), only the seven
show n in the figures a re functiona l. O t h er c onfigurat ion s a r e n on - functional an d m us t not be
used.
TABLE 3. Configurations for ACLK and BCLK
Bits
12,11,10,6 Description Figure
0100 (Unidirectional mode) An external clock on the BCL K pin pro-
vides the clocking for both the link logic transmitter and receiv er .
The ACLK pin is unused .
Figure 5,
“Config uratio n Uni-
1,” on page 17
1000 (Unidirectional mode) An external clock on the ACLK pin pro-
vides clocki ng for the link log ic tran smitter. An extern al clock on
the BCLK pin provi des clock ing for the link l ogic receiver.
Figure 6,
“Config uratio n Uni-
2,” on page 17
0010 (Unidirectional mode) The internal SRTS clock provide s clock-
ing for the link logic transmitter and outputs this clock on the
ACLK pin. An external clock on the B CLK pin provides clock-
ing for the link logic receiver.
Figure 7,
“Config uratio n Uni-
3,” on page 18
0110 (Unidirectional mode) An external clock on the BCL K pin pro-
vides the c lock ing fo r both the link lo g i c tra n smit ter a nd rece iv er
and provides the same clock signal as an output on the ACLK
pin.
Figure 8,
“Config uratio n Uni-
4,” on page 18
0101 (Bidi rectional mode) An extern al clock on the BCLK pi n pro-
vides the clocking for both the link logic transmitter and receiv er .
The ACLK pin is unused .
Figure 9,
“Configuration Bi-
1,” on page 18
1001 (Bidi rectional mode) An extern al clock on the ACLK pi n pro-
vides clocki ng for the link log ic tran smitter. An extern al clock on
the BCLK pin provi des clock ing for the link l ogic receiver.
Figure 10,
“Configuration Bi-
2,” on page 19
0111 (Bidi rectional mode) An extern al clock on the BCLK pi n pro-
vides the clocking for both the link logic transmitter and receiv er .
The tri-state control that is being us ed to control the ASER line is
presen ted on the ACLK pin and can be used to cont rol ex terna l
output -enab led devices.
Figure 11,
“Configuration Bi-
3,” on page 19
MXT3020 Reference Manual Version 4.0 17
Link Config ura tio n register
FIGURE 5 Configuration Un i-1
FIGURE 6 Configuration Un i-2
Internal SRTS Clock 00
01
10
Link Confi guration bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pa ir Serial iz e /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
0 1 00
Sign al on BC LK pin pr o vi de s all clo ck ing
Internal SRTS Clock 00
01
10
Link Confi guration bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pa ir Serial iz e /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
1 0 00
Signal on BCLK pin provides receiver clocking
Signal on ACLK pin provides transmitter clocking
18 Version 4.0 MXT3020 Reference Manual
Circuit Interface
FIGURE 7 Configuration Un i-3
FIGURE 8 Configuration Un i-4
FIGURE 9 Configuration Bi-1
Inter na l SRTS Cloc k 00
01
10
Link Confi guration bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pa ir Serial iz e /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
0 0 01
Sign al on BCLK pin provide s receiver clock ing
Internal SRTS provides transmit clocking and output on ACLK
Internal SRTS Clock 00
01
10
Link Config urat ion bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pair Seri alize /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
0 1 01
Signal on BCLK pin pr o vides all clocking and outp ut on AC LK
Internal SRTS Clock 00
01
10
Link Config urat ion bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pair Seri alize /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
0 1 10
Sign al on BC LK pin pr o vi de s all clo ck ing
Tri-state gating
Tri-state control B
MXT3020 Reference Manual Version 4.0 19
Link Config ura tio n register
FIGURE 10 Configuration Bi-2
FIGURE 11 Configuration Bi-3
Added detail : Bit 6 – li nk pair mode
The MXT3020 circuit interface can be operated in either bidirectional or unidirec-
tional mode. The BI bit (bit [6]) in the Link Configuration register selects the mode
of operation. Bidirectional mode is typically used with telephony busses, and unidi-
recti onal mode is ty pically us ed with TDM framers . Figure 12 sho ws the two modes.
Internal SRTS Clock 00
01
10
Link Config urat ion bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pair Seri alize /
Deseriali z e Logic
Rclk
Tclk
6
UNI
BI
Tri-state control A
10
1 0 10
Sign al on BC LK pin pr ovide s r e ce iv e r cl oc king
Tri-sta te ga ti ng
Sign al on AC L K pin provides transm it te r cloc k i ng
Tri-state con trol B
Internal SRTS Clock 00
01
10
Link Config urat ion bit 12 11
ACLK pin
BCLK pin
ASER pin
BSER pin
Link Pair Seri alize /
Deseriali z e Logic
Rclk
Tclk
6
uni
BI
Tri-state control A
10
0 1 11
Sign al on BC LK pin pr o vi de s all clo ck ing
Tri-sta te ga ti ng
Tri-state control for external gating is provided on ACLK pin
Tri-state con trol B
20 Version 4.0 MXT3020 Reference Manual
Circuit Interface
FIGURE 12 MXT3020 operat in g modes - eight lin k pairs
As indicated in the figure, the MXT3020 treats the TDM links as eight link pairs,
regardless of operating mode. Thus, the two operating modes can be compared by
analyzing a single link pair.
Pins associated with a link pair
There are fi ve pins associat ed with each li nk pair . Dependi ng upon the confi guration
of the link, these pins may be connected to a variety of diff erent signals within the
MXT3020. Table 4 summarizes the connection possibilities, and the paragraphs
which follow discuss each pin and its configuration alternatives in greater detail.
TABLE 4. MXT3020 link interface pins and signals
Pin Signals carried in unidirectional mode Signals carried in bidirectional mode
ASER TxData (“A Serial”) for link nTx/RxData for link n
BSER RxData (“B Serial”) for link nTx/RxData for link n + 8
ACLK
(output)
(input) Tx Link Clk for ASER
Tx Input Clk for ASER/BSER Copy of tri-state enable for ASER
Tx Input Clk for ASER/BSER
BCLK RxCLK for ASER/BSER RxCLK for ASER/BSER
BSCE Frame Sync Copy of tri-state enable for BSER
Link Pair 0/8
Link Pair 1/9
Link Pair 2/10
Link Pair 3/11
Link Pair 4/12
Link Pair 5/13
Link Pair 6/14
Link Pair 7/15
Link Pair 0
Link Pair 1
Link Pair 2
Link Pair 3
Link Pair 4
Link Pair 5
Link Pair 6
Link Pair 7
Unidirectional Mode
Bidirection al Mode
Link 0
Link 8
Link 1
Link 9
Link 2
Link 10
Link 3
Link 11
Link 4
Link 12
Link 5
Link 13
Link 6
Link 14
Link 7
Link 15
MXT3020 Reference Manual Version 4.0 21
Link Config ura tio n register
ASER and BSER pins
Figure 13 shows the ASER (A serial) and BSER (B serial) pins. As indicated in Table
4, in the unidirectional mode, ASER and BSER are TxData and RxData respec tively .
In bidirectional mode, ASER and BSER carry Tx/RxData. Since ASER and BSER
are bidirectional busses in that mode, the transmit functions of ASER and BSER need
to be di sable d when rece ived da ta is arri ving. Enablin g and di sabli ng of the t ransmit
function are accomplished by tri-state enable circuitry described in “Link Tri-state
Control Address counter” on page 27.
FIGURE 13 MXT3020 operating modes - ASER and BSER
Added detail: BSCE pin
As indi cated in Table 4 o n page 20, the BSCE pin can be use d either as a Frame Sync
pin, or as a copy of the tri-state enable for the BSER pin. Usage of the BSCE pin
depends upon the MXT3020 operating mode and is explained below.
BSCE usage in unidirectional mode
When the MXT3020 is used in unidirectional mode , it is typically c onnected to TDM
framers that provide Frame Sync signals. T wo methods of wiri ng the Frame Sync s ig-
nal are availa ble:
If a single Fr ame Sync sign al is used , it can be connected t o the FSYNC pin (pin
160) of the MXT3020. In addition, the FS_MODE bit (bit [0] of the CI Config-
uration register) should be cleared to zero (0) to indicate that a Frame Sync sig-
nal common to all links is being supplied on the FSYNC pin.
Link Pair 0/8 Link Pair 0
Unidirectional Mode
Bidirection al Mode
BSER
ASER ASER
BSER
Link 0
Link 8
22 Version 4.0 MXT3020 Reference Manual
Circuit Interface
If the application calls for different link pairs to use different Frame Sync sig-
nals, Frame Sync signals ca n be wired to the BSCE pin s of individu al link pairs.
In addition, the FS_MODE bit (bit [0] of the CI Configuration register) should
be set to one ( 1) to indicate tha t Fram e Sync signa l s for each link pai r are being
provided on their respective BSCE pins.
In addition to the actions listed above, bits [4:3] of the Link Configuration register
and bit [10] of the CI Configuration register are used to control the use of Frame Sync
in various applications.
BSCE usage in bidirectional mode
Bidirectional mode is used with telephony busses, where per-link Frame Sync signals
are not required. The refore, the BSCE pin is not used for Fr ame Sync in bidirectional
mode. In bidirectional mode, the tri-state control that is being used to control the
BSER line is presented on the BSCE pin and can be used to control external output-
enabled devi ce s.
MXT3020 Reference Manual Version 4.0 23
Link Buffer Address counters
LINK BUFFER ADDRESS COUNTERS
Link Rx Buffer Address counter
This register indicates where the next data received on this TDM link pair will be
stored in the Gather Memory. The contents of this counter combined with the link
number provide an 18-bit pointer to a halfword-aligned circular queue in Gather
Memory where received data can be written by the Circuit Interface logic. Every link
pair has a separate queue for re cei ved dat a, t hus each li nk pa ir has one of these read/
write registers. The counters are initializ ed by the SWAN processor i n the MXT3010
and are incremented automatically by the link hardware during data transfers.
Restriction on Link Rx Buffer Address co unter
Values in this regist er can only b e modifi ed when the link i s in the reset state . This restrictio n
does not affect the automatic incrementing that the MXT3020 performs during data transfers.
1514131211109876543210
Rx (Gather) Address counter 0
24 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Link Tx Buffer Address counter
This register indicates the location in Scatter Memory from which the next data to be
transmitted on the TDM link will be taken. The contents of this counter combined
with the li nk number provi de an 18- bi t poi nte r to a hal fwor d- ali gne d circul ar queue
in Scatter Memory where transmit link data can be read by the Circuit Interface logic.
There is a separate transmit data queue for every link pair; thus, there is one of these
read/wr ite r egist ers fo r eac h link pair. The counter s are init iali zed by the SWAN pro-
cessor i n the MXT3010 and are increme nted automat ically by the l ink hardwar e dur-
ing data transfers.
Restrictions on Link Tx Buffer Address counter
Values written to this register must be 4 higher than those written to the Link Rx Buffer
Address counter. Values in this register can only be modified when the link is in the reset
state. These restri ct ions do not affect the automat ic incrementing that t he MXT3020 per-
forms during data transfers.
1514131211109876543210
Tx (Scatter) Address counter] 0
MXT3020 Reference Manual Version 4.0 25
Link Buffer Address counters
Details of the Link Tx/Rx Buffer Address counters
Each address counter is composed of a frame counter (FC) and a DS0 counter. The
DS0 counter wraps based upon the settings of the ACTDS0 field in the “Link Con-
figuration register” on page 12 . The frame counter wraps based on the MAXDS0 and
MAXTBS/MAXRBS fields in the “CI Configuration register” on page 37.
The MAXDS0 and MAXTBS/MAXRBS settings determine the buffer size allocated
to each link. This is shown in Table 5.
TABLE 5. Buffer size allocation
MAXDS0 MAXTBS/MAXRBS Buffer size (Wrap boundary)
24 or 32 64 frames 2K
64 64 frames 4K
96 or 128 64 frames 8K
24 or 32 128 fr a mes 4K
64 128 fr a mes 8K
96 or 128 128 frames 16K
24 or 32 256 fr a mes 8K
64 256 fr a mes 16K
96 or 128 256 frames 32K
24 or 32 512 fr a mes 16K
64 512 fr a mes 32K
96 or 128 512 frames 64Ka
a. The 64K bu ffer size is not supported in bidirectional mode.
26 Version 4.0 MXT3020 Reference Manual
Circuit Interface
The positions of the frame counter and DS0 counter portions of the Link TX/RX
Buff er Address counters are shown in Table 6.
In Table 6, vari able y repre sen ts the highes t orde r bit used by the f rame counte r. The
value of y depends upon the buffer size, as shown in Table 7.
TABLE 6. Frame Counter / DS0 Counter
Unidirectional mode Bidirectional mode
MAXDS0 Frame counter DS0 counter Frame counter DS0 counter
24 or 32 [y:5] [4:0] [y:6] [5:1]
64 [y:6] [5:0] [y:7] [6:1]
96 or 128 [y:7] [6:0] [y:8] [7:1]
TABLE 7. Relation of buffer size to variable y
Buffer size Unidirectional mode, y= Bidirectional mode, y=
2K 10 11
4K 11 12
8K 12 13
16K 13 14
32K 14 15
64K 15 Not supported
MXT3020 Reference Manual Version 4.0 27
Link Tri-stat e Control Address count er
LINK TRI-STATE CONTROL ADDRESS COUNTER
The contents of the Tri-state Control (TSC) Address counter are combined with the
Tri-state Control Base Address register and the Link ID number (LID) to create an
18-bit p oin ter t o a ha lfword -alig ned e ntry i n Gather Memo ry c ontai ning th e tr i-st ate
control map for the link. The format of the Tri-state Con trol Address coun ter is
shown below. The format of the complete pointer is shown in “Creation of the tri-
state control map pointer” on page 28.
An example of the tri-state control pro cess
The MXT3020 provides tri-state control of ASER [7:0] and BSER [7:0] when oper-
ating in bidirectional mode. The MXT3020 also provides tri-state control of ASER
[7:0] when operating in unidirectional mode. Tri-state control is provided by tri-state
control maps located in Gather Memory.
Figure 14 shows, in simplified form, the fundamentals of tri-state control. To sim-
plify the figure, only the tri-state control of ASER [0], operating in bidirectional
mode, is shown.
1514131211109876543210
0TSCNT0
28 Version 4.0 MXT3020 Reference Manual
Circuit Interface
FIGURE 14 Tri-state enable for the ASER pins
In the exa mple shown, data is bei ng generated i n T1 format. That is, a byte o f data is
presented for a 64 Kbps channel (DS0); then a byte of data is presented for the next
DS0. When data has been pre sented for 24 DS0’ s, a new frame begins and a new byte
of data for the first DS0 is presented. The data being presented is only enabled onto
the ASER[0 ] pin if the bit in the tr i-state m ap for this lin k indicate s that enablin g dur-
ing the time period of this DS0 is permitted. Specifically, a zero (0) in the tri-state
map indicates that the data should be enabled onto the ASER [0] pin. Thus, in the
example, data is being applied to DS0 #0 and DS0 #1, but not to DS0 #23.
If one thinks of the registers shown in Figure 14 as shift registers, it is important to
note that the tri-state map “shifts” at one-eighth the rate of the data registers, as a bit
in the tri-state map controls the enabling or disabling of an entire byte of data. For
each byte time (at a DS0 rate) on each link, the MXT3020 provides two tri-state
enable bi ts, on e for ASER and on e for BSER.
The tri-state enable control map
Creation of the tri-state control map pointer
The contents of the Tri-state Control Address counter (page 27) are combined with
the Tri-sta te Cont rol Base Address regist er (p age 37) and the Link ID number ( LID)
to create an 18-bit pointer to a halfword-aligned entry in Gather Memory containing
the tri-state co ntrol map for the link. The pointer has the following format:
ASER [0]
MXT3020 serial data being transmitted on the ASER pin of link pair 0
MXT3020 tri-state map for link pair 0
Data traversing the bus line connected to ASER [0] pin
00001 1 11
Data byte for DS0 #0
Data byte
DS0 #0 Data byte
DS0 #23 Data by te
DS0 #1
Tim e slo t
DS0 #0 Time slot
DS0 #23 Time slot
DS0 #1
0
010
Time slot for DS0 #0
Enabling
Gate
MXT3020 Reference Manual Version 4.0 29
Link Tri-stat e Control Address count er
Bidirectional mode
The tri-state control map pointer identifies eight buffers (LID [7:5]) in memory, one
buf fer for ea ch link pair. Each buf fer consist s of 16 halfword s (TSCNT [4:1]) or 256
bits. For each link pair , duri ng each DS0 data by te, the MXT3020 read s two of these
tri-s tate enable bits, one for ASER an d one for BSER. F igure 15 sh ows the sequ ence
in wh ich th ese enable bits are used.
FIGURE 15 ASER and BSER tri-state enable bit usage1 (bidirectional)
Figure 15 shows a tri-state map that would be sufficient for 24 DS0’ s on one link pair .
By changing the value of LID and using the same three values for TSCNT, similar
maps could be loaded into memor y to control 24 DS0’ s on each of th e eight link pairs
served by the MXT3020.
The tri-state control map shown in Figure 15 serves 24 DS0’s and uses 48 bits. The
MXT3020 can acc ommodate t ri-sta te control maps wit h as many a s 128 DS0’s (256
bits) for each link pair.
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
TSC_BASE LID TSCNT
1. In all MXT3020 figures, memory addressing is Big Endian.
15 0
7
8
BSER[0] during DS0 #1
BSER[0] during DS0 #0
ASER[0] du ring DS0 #1
ASER[0] du ring DS0 #0
TSCNT[4:1] = 00000
15 07
8
BSER[0] during DS0 #9
BSER[0] during DS0 #8
ASER[0] du ring DS0 #9
ASER[0] du ring DS0 #8
TSCNT[4:1] = 00001
0x---00
0x---02
15 0
7
8
BSER[0] during DS0 #17
BSER[0] during DS0 #16
ASER[0] during DS0 #1 7
ASER[0] during DS0 #1 6
TSCNT[4:1] = 00010
0x---04
Memory
Address Tri-State c ounter
30 Version 4.0 MXT3020 Reference Manual
Circuit Interface
If the actual number of DS0s is less than 128, there is no requirement that the tri-state
control map be filled with 256 bits, as the Tri-state Control Address counter wraps
based up on the actual number of DS0s indicated in t he ACTDS0 bits in the Link Con-
figuration register. The wrap boundaries for the Tri-state Address counter are indi-
cated in the following table:
Unidirectional mode
The contents of the Tri-state Control Address counter (page 27) are combined with
the Tri-sta te Cont rol Base Address regist er (p age 37) and the Link ID number ( LID)
to create an 18-bit pointer to a halfword-aligned entry in Gather Memory containing
the tri-state co ntrol map for the link.
The tri-state control map pointer (page 28) identifies eigh t buffer s (LID [7:5]) in
memory, one buffer for each link pair. Each buffer consists of eight halfwords
(TSCNT [3:1])1 or 128 bits. For each link pair, during each DS0 data byte, the
MXT3020 reads one of the se tri- state ena ble bits to contro l the ena bling of da ta onto
the ASER pin. Figure 16 shows the sequence in which these enable bits are used.
Mode ACTDS0 Wrap Boundary
Bidirectio na l 24 6 bytes
Bidirectio na l 32 8 bytes
Bidirectional 64 16 bytes
Bidirectional 96 24 bytes
Bidirectional 128 32 by tes
1. TSCNT[4] is not used in unidirectional mode.
MXT3020 Reference Manual Version 4.0 31
Link Tri-stat e Control Address count er
FIGURE 16 ASER and BSER tri-state enable bit usage (unidirectional)
Figure 16 shows a tri-state map that would be sufficient for 32 DS0’ s (E1) on one link
pair . By changing the value of LID and using the same two values for TSCNT , similar
maps could be loaded into memory to c ontrol 32 DS0’ s on each of the eigh t link pairs
served by the MXT3020.
The tri-state control map shown in Figure 16 serves 32 DS0’s and uses 32 bits. The
MXT3020 can acc ommodate t ri-sta te control maps wit h as many a s 128 DS0’s (128
bits) for each link pair.
If the actual numbe r of DS0s is less than 128, ther e is no requirement that the tri-state
control map be filled with 128 bits, as the Tri-state Control Address counter wraps
based upo n the act ual numb er of DS0s. The actua l number of DS0s is de termined b y
the ACTDS0 b its in the Link Configurat ion regist er , and the wrap bounda ries fo r the
Tri-state Address counter are indicated in the following table:
Mode ACTDS0 Wrap Boundary
Unidirectional 24 4 bytes
Unidirectional 32 4 bytes
Unidirectional 64 8 bytes
Unidirectional 96 12 bytes
Unidirectional 128 16 by tes
15 07
8
ASER[0] during DS0 #0
ASER[0] during DS0 #1
ASER[0] during DS0 #8
ASER[0] during DS0 #9
TSCNT[4:1] = 00000
15 07
8
ASER[0] during DS0 #16
ASER[0] during DS0 #17
ASER[0] during DS0 #24
ASER[0] during DS0 #25
TSCNT[4:1] = 00001
0x---00
0x---02
Memory
Address Tri-State c ounter
32 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Summary of tri-state control operation
The MXT3020 provides tri-state control of ASER [7:0] and BSER [7:0] when oper-
ating in bidirectional mode. The MXT3020 also provides tri-state control of ASER
when operating in unidirectional mode. To set up a tri-state map, software selects a
TSC Base Address, and for each link pair (LID) provides up to 16 (bidirectional
mode) or 8 (Unidirectional mode) halfwords specifying the tri-state enable map.
During operation, the MXT3020 services each link pair sequentially. For each link,
the MXT3020 maint ains a Tri-st ate Contr ol Addre ss count er (TSCNT) ba sed on the
receipt of Frame Sync by the link. Thus, for each link (LID), the MXT3020 has an
indicat ion (TSCNT) of whi ch DS0 is being handled by t hat link. The MXT302 0 uses
this information (LID and TSCNT), in conjunction with the TSC Base Address, to
obta in t he tri-state control map appropriate to the DS0 bei ng s erviced by that li nk at
that time. In bidirecti onal m ode, tw o tri- state enable bits from t he map are us ed to
control the gating of bytes of DS0 data onto the ASER and BSER pins respectively
(see Fi gur e 14 a nd Figure 15). In uni dir ec tional mode, a tri -s tate en abl e b it f rom the
map is use d to control the gating of a byte of DS0 data onto the ASER pin (see Figure
14 and Figure 16).
MXT3020 Reference Manual Version 4.0 33
Link service clock generation registers
LINK SERVICE CLOCK GENERATION REGISTERS
For each link, there are five registers used for link service clock generation:
Link Service Clock N register
Link Service Clock K register
Link Service Clock L register
Link FTC counter
Link SRTS Value register
Figure 17 shows the relationship of these registers and counters to the link service
clock circuitry.
FIGURE 17 Link service clock generation registers
Three of the r egisters (N, K, L) control a numeric ally co ntrolled oscillat or which has
an inte ger por tion N a nd a fr actio nal por tion, K/L. Th e equat ion for the ou tput c lock
is shown below:
Numerically
Controlled
Oscillator 0
1
Regenerated
SRTS
value
BCLK
N register
K register
FN SRTS_MD
L register
FTC register
3008
CI SRTS Valid
Status register
1-bit “ready” flag
service clock
Circuitry provided for each link (8 copies) Shared by all
links (1 copy)
Link SRTS
Value register
Link FTC
counter
SRTS
4-bit up-
counter
FNET 3-bit
divider in
N register
Link Service Clock period NK
L
----
+


System clock period×=
34 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Link Service Clock N register
The LSC_N value in the Link Service Clock N register represents the integer multi-
ple of system c lock per iods use d to gene rate t he link service clock. T his is the coar se
setting of the numerically controlled oscillator used to generate the service cl ock.
Setting bit 7 of this register to one (1) enables the SRTS counters. There is one of
these registers for each link.
Bits 15-13 of this register provide a pr ogrammable divider for the network clock
(FNET) (s ee Figure 17 on page 3 3). The table below shows t he division pr ovided for
various settings of bits 15-13. In addition, t he table sho ws the setti ngs that s hould be
used to support common TDM service clock frequencies when an FNET clock of
19.44 MHz is used.
.
1514131211109876543210
FNET_DIV Reserved
EN_CNT
LSC_N
Bits 15-13 Divide by Divider output frequencies for
FNET = 19.44 MHz TDM service clock frequencies
for FNET= 19.44 MHz
0 1 19 .4 4 MH z
1 2 9.72 MHz 8.192 MHz
2 3 6.48 MHz
3 4 4.86 MHz 4.096 MHz
4 5 3. 88 8 MH z
5 6 3.24 MHz
6 7 2. 77 7 MH z
7 8 2.43 MHz 2.048 MHz and 1.544 MHz
Restriction on FNET_DIV bits
Bits [15:8] of this register are write only and read back as all zeroes. All bits in this register
are cleared t o zeroes by Reset. Th us, the FNET_D IV bi ts are write-only and are cleared to
zeroes by Reset.
MXT3020 Reference Manual Version 4.0 35
Link service clock generation registers
Link Service Clock K register
The valu e in the Link Service Clock K regist er repr esents the frac tion control numer -
ator us ed to generat e the link ser vice clock. Th is is the f ine settin g of the numeri cally
controlled oscillator used to generate the service clock.There is one of these read/
write registers for each link.
Link Service Clock L counter
The value i n the Link Servi ce Clock L counte r represent s the fraction c ontrol denom-
inator us ed to generate the link service cl oc k. Thi s is a free run n in g co unt er that can
be read and written for di agnostic purposes and can be seeded with an initial value.
However, the value loa ded int o this co unter do es not al ter t he ef fec tive de nominat or
value, which is always 65,536 (216). This counter advances once for each service
clock cycle generated. There is one of these counters for each link.
1514131211109876543210
LSC_K
1514131211109876543210
LSC_L
36 Version 4.0 MXT3020 Reference Manual
Circuit Interface
Link FTC counter
The SRTS value generator for each link creates an SRTS value by using an FTC
counter to count a designated number (Frequency Terminal Count) of service clock
periods. A register common to all links (see “CI SRTS FTC register” on page 45)
establ ishes the number of servi ce cloc k perio ds to be co unted. Thi s number i s gener -
ally 3008 (decimal). There is one readable Link FTC counter for each link (see “Link
FTC read back” entries in “Circuit Interface per-link registers” on page 85). To
change the count used by the Link FTC counter, write the CI SRTS FTC register
(page 45).
Link SRTS Value register
Each link has a single SRTS generat or con trolled by the SRTS_M D bit f or tha t link
(see “L ink Configura tion register ” on page 12). A 4-bit val ue is latch ed into the local
SR TS value each time the FTC counter expires (see “Link FTC counter” on page 36).
There is one of these read/write registers for each link.
1514131211109876543210
0 LINK_SRTS_FTC
1514131211109876543210
0 SRTS_VALUE [3:0]
MXT3020 Reference Manual Version 4.0 37
CI Tri-state Contr ol Base Address register
CI TRI-STATE CONTROL BASE ADDRESS REGISTER
The value in this register defines the base address of the Tri-state Control table in
Gather Memory. The contents of this register and the Tri-state Control Address
counter are combined wit h the Link ID numbe r (LID) to cre ate an 18-bi t pointer to a
halfword-aligned entry in Gather Memory containing the tri-state control map for the
link. See “Creation of the tri-state control map pointer” on page 28.. There is only one
CI Tri-state Control Base Address register; it is a read/write register.
CI CONFIGURATION REGISTER
This register controls the operating mode of the Circuit Interface. There is only one
CI Configuration register; it is a read/write register.
FS_POL (Bit 15)
This bit contr ols the inter pret ation of the p olari ty o f the Frame Sy nc input . If t his bi t
is set to one (1), FSYNC active level is zero (0). If this bit is cleared to zero (0),
FSYNC active level is one (1).
Snap Shot Period (Bits 14-12)
These bi ts should be wri tt en as 010 and igno re d o n r eads. W i th this setti ng, the max-
imum unidirectional-mode link speed is 8 MHz and the maximum bidirectional-
mode link speed is 4, 6, or 8 MHz f or System Clock s peeds of 33 MHz, 40 MHz, a nd
50 MHz respectively.
1514131211109876543210
0 TSC_BASE
1514131211109876543210
FS_POL
SS_PER LP_BK FS_EN MAXRBS MAXTBS MAXDS0
FS_MODE
38 Version 4.0 MXT3020 Reference Manual
Circuit Interface
LP_BK (B it 11)
This bi t enables l ink loopback mode. If th is bit is s et to one ( 1), the li nk pair is pla ced
in loopba ck mode. In unidi rection al mode, all l inks loop th eir ASER trans mit output
back to BSER receive input. In bidirectional mode, the ASER transmit output is
looped back to the ASER receive input, and the BSER transmit output i s looped back
to the BSER receive input. If this bit is cleared to zero (0), the link pair is placed in
normal operating mode.
When a link pair is in loopback mode, no data is presented to the ASER or BSER
pins. Clock signals are not affected by loopback. During loopback mode, cl ocking
and Frame Sync must be suppli ed in t he same fa shion as for nor mal oper ating mode.
FS_EN (Bit 10)
This bit enables/disables Frame Sync detection. When asserted, this global bit per-
mits all SDT mode li nks to acquire Frame Sy nc simultaneously. If this bit is set to
one (1), Frame Sync detection is enabled, enabling all SDT mode links that have their
LkRESET bits1 clear (0). If this bit is clea red to zero (0), Frame Sync det ection is dis-
abled, di sab li ng a ll SDT mode l ink s. Thi s bi t o nly appl ie s t o SDT mode l in ks. UDT
mode links ignore this bit.
MAXRBS (Bits 9-7)
These bit s specify th e maximum amount of TDM to ATM receive frame s torage allo -
cated for any link in the system.
1. LkRESET bits are in the Link Configurati on registers for each link. See “LkRESET (bit 0)” on
page 15.
Bit 6 Bit 5 Bit 4 Maximum TDM to ATM receive frame storage
00064 frames
001128 frames
010256 frames
011512 frames
100 through 111 Reserved
MXT3020 Reference Manual Version 4.0 39
CI Configuratio n register
MAXTBS (Bits 6-4)
These bits specify the maximum amount of ATM to TDM transmit frame storage
allocated for any link in the system.
MAXDS0 (Bits 3-1)
These bits specify the maximum number of DS0’s per frame for any link in the
system.
FS_MODE (bit 0)
This bit determines the frame sync source for all of the links. If this bit is set to one
(1), each link receiv es its fra me sync (or an equ ivalent signal) fr om that l ink’s BSCE
pin. If this bit is cleared to ze ro (0), all l inks re ceive fr ame sync (or an equival ent sig -
nal) from the chip Frame Sync pin. This bit must be cleared to zero (0) when any links
are in the bidirectional mode.
Bit 9 Bit 8 Bit 7 Maximum ATM to TDM transmit frame
storage
00064 frames
001128 frames
010256 frames
011512 frames
100 through 111 Reserved
Bit 3 Bit 2 Bit 1 Maximum DS0’s per frame
00 0 24
00 1 32
01 0 64
01 1 96
10 0 128
101 through 111 Reserved
40 Version 4.0 MXT3020 Reference Manual
Circuit Interface
MAXDS0, MAXTBS, and MAXRBS and buffer sizing
The MAXDS0, MAXTBS, and MAXRBS bit s def i ne a c ommon buffer size in Sc at -
ter/Gather memory for all of the TDM links. The common buffer size for all links is
the maximum required by any link being served. The following examples are pro-
vided:
Example #1:
If thre e act ive transmit links have a MAXRBS = 128 frames and a MAXDS0 = 128
DS0s, each link buffer is 16 Kbytes (128 x 128).
DSOs 31 63 127
Frames
0 <---------------------------------- 128 DS0s ---------------- ----------------- ------->
1
2TX0 BUFFER
-16 Kbytes
-
127
0 <---------------------------------- 128 DS0s ---------------- ----------------- ------->
1
2TX1 BUFFER
-16 Kbytes
-
127
0 <---------------------------------- 128 DS0s ---------------- ----------------- ------->
1
2TX2 BUFFER
-16 Kbytes
-
127
MXT3020 Reference Manual Version 4.0 41
CI Configuratio n register
Example #2:
If there are t hree active transmit links with a MAXRBS = 128 frames and MAXDS0s
of 128, 32, and 64 DS0s per frame, all three buff ers are the 16 Kbytes (128 x 128)
required by the link wi th the largest buf fering requirement. Utilization of the three 16
Kbyte buffers is shown in the figure.
DSOs 31 63 127
Frames
0 <------------------------------------ 128 DS0s -------------------------------------->
1
2 TX0 BUFFER
-16 Kbytes
-
127
0 <----32 DS0s---->
1
2 TX1 BUFFER NOT USED
-4 Kbytes 12 Kbytes
-
127
0 <----------------64 DS0s--------------->
1
2 TX2 BUFFER NOT USED
-8 Kbytes 8 Kbytes
-
127
42 Version 4.0 MXT3020 Reference Manual
Circuit Interface
CI QUIET FRAME BASE ADDRESS REGISTER
An 11-bit value in this register defines the base address of the Quiet Frame in Gather
Memory. Additional bits indicate the type of Scatter and Gather SRAM used, control
access t o the high memory s pace (FE000 - FFC00), an d enable the quie t logic. There
is only one CI Quiet Fram e Base Address register; it is a read/write register.
QUIET_FRAME (Bits 15-5)
These bits define the base address of the Quiet Frame in Gather Memory.
RESERVED (Bit 4)
This bit is reserved. It should be written as a zero and ignored on reads.
GATH_4M (Bit 3)
Set this bit to one (1 ) if the Gather Me mory is implement ed with a si ngle 256 K x 16
(4 Mb) SRAM. Set this bit to zero (0) if smaller parts are used. This bit controls the
Gather Memory address decoding and asserts GATH_OE_[0] when any Gather
Memory location is read. GATH_OE_[0] connects to the SRAM output enable pin.
SCAT_4M (Bit 2)
Set this bit t o one (1) if the Scatte r Memory is implement ed wit h a singl e 25 6K x 16
(4 Mb) SRAM. Set this bit to zero (0) if smaller parts are used. This bit controls the
Scatter Memory address decoding and asserts SCAT_OE_[0] when any Scatter
Memory location is read. SCAT_OE_ [0] connects to the SRAM output enable pin.
1514131211109876543210
QUIET_FRAME 0
GATH_4M
SCAT_4M
EN_HMEM
EN_QUIET
MXT3020 Reference Manual Version 4.0 43
CI Quiet Frame Base Address register
EN_HMEM (Bit 1)
This bit enables MXT3020 response to Port 2 access in the co-processor high mem-
ory space (i.e. FE000 - FFC00). I f this bit i s set to one (1), the MXT3020 responds to
high memory addresses. If this bit is cleared to zero (0), the MXT3020 does not
respond to high memory addresses.
When two MXT3020s are present on the sa me P2 bus, all 2 Mbytes of available
address space are assigne d. However, the MXT3020 defau lts at power -up to not use
a small window of space between FE000 and FC000. If a designer wishes , these
addresses can be used for a CAM or similar burst mode device. If, however, it is
desired to use this space for additional Gather Memory, programs utilizing the
MXT3020 should set EN_HMEM to one (1).
EN_QUIET (Bit 0)
This bit ena bles th e quiet l ogic. If this bit is set to one (1), the qui et logi c is enabl ed.
If this bit is cleared to zero (0), the quiet logic is disabled.
Quiet Logi c
The Circui t Interf ace contai ns the quiet logic. For e ach transmit link, a dummy quie t
frame exists in Gather Memory with the proper quiet value for each DS0 in the frame.
The quiet logic copies these quiet frames into the Transmit Link buffers as soon as
the data in the buffers has been shifted out onto the TDM lines. The quiet frames
reside in the T ransmit Link buffers until replaced by data arriving from the ATM link.
In this way, the MXT3020 ensures that in the event of an ATM link underflow, the
correct quiet values (rather than stale data) are transmitted on the TDM links.
The quiet logic reads the quiet values from predefined quiet frames in Gather Mem-
ory and writes them into the TDM transmit frame buffers in Scatter Memory. There
must be one quie t frame for every ac tive TDM tr ansmit ter. The logic reads bur sts of
eight hal fwords from the Gat her Memory and then arbi trates for , and writes, the half-
words into Scatter Memory. This process continues until one frame in each TDM
transmit buffer is overwritten.
44 Version 4.0 MXT3020 Reference Manual
Circuit Interface
To be efficient, and to reduce t he overhead required for this op eration, the controllers
use the Link Reset and Data Transfer Mode bits of the Link Configuration registers
to skip links that are unused or are setup for unstructured data transfer mode. The
quiet f ram e area ca n b e a maxi mum size of 16 frames with 128 by tes pe r fr ame, or 2
Kbytes in s ize. The 2-Kbyte ar ea can b e locat ed anywher e in Gath er Memory abo ve
the TDM Link receive buffers, which always begin at Port2 address 0x80000. The
Quiet Fra me Base Addr ess r egist er loc ates t he qui et fr ame area and must be set up at
initializatio n. Bit [0] of this regi ster enables/disables the quiet logic .
Although each quiet frame has storage for 128 quiet DS0 values, only the actual num-
ber of quiet DS0’s need to be initialized for each frame. For example, if only three
links were transmitting, links 0, 1, and 2, and they supported 128, 32 and 64 DS0’s
respect ivel y, then t he al locat ion map for th e qui et f rame area would lo ok li ke the fol -
lowing:
FIGURE 18 Quiet Frame Allocation Map
31 63 127
0 <------------------------------------ 128 DS0s ----------------------------------------->
1 <-32 DS0s-> Not Used
2 <----------------64 DS0s----------------> Not Used
-
-
-
-
15 Not Used
MXT3020 Reference Manual Version 4.0 45
CI SRTS FTC register
CI SRTS FTC REGISTER
The value in the CI SR TS FTC register represents the number of service clock1 peri-
ods betwee n updates of the Link SRTS Value register (see “Link FTC counter” on
page 36 a nd “Link SRTS Value register ” on page 36 ). Whenever a Link FTC c ounter
counts down to zero, it is reloaded from the CI SRTS FTC regist er, whi ch is typic ally
set to 3008. There is only one CI SRTS FTC register; it is a read/write register.
CI SRTS VALID STATUS REGISTER
This stat us regi ster i ndicat es whethe r a link has a valid SRTS value latched . When a
link’s SRTS value is read by the SWAN processor in the MXT3010, its respective
valid b it is clea red. There is onl y one CI SRTS Valid St atus reg ister; it i s a re ad-onl y
register.
SRTS_VALID (Bits 7-0)
These bit s indica te, on a bit -per -link ba sis, whether t he link co rresp onding to that bit
has a valid SRTS value latched . If bit n is a one (1), a valid SR TS value for link n has
been latch ed. If bit n is a zero (0), a valid SR TS value for link n has not be en lat ched.
1. The service clock rate for a T1 facility is 1.544 MHz.
1514131211109876543210
0 CI_SRTS_FC
1514131211109876543210
0SRTS
VALID
7
SRTS
VALID
6
SRTS
VALID
5
SRTS
VALID
4
SRTS
VALID
3
SRTS
VALID
2
SRTS
VALID
1
SRTS
VALID
0
46 Version 4.0 MXT3020 Reference Manual
Circuit Interface
CI STATUS REGISTER
Bits in this register indicate, for ea ch link, whether that link has acquired Frame Sync
or has lost Frame Sync. There is only one CI S tatus re gister; it i s a read-only reg ister.
ACQ n
These bits indicate whether link n has acquired Frame Sync. If an ACQ bit is a one
(1), link n has acquired Frame Sync. If an ACQ bit is a zero (0), Link n has not
acquired Frame Sync or has lost Frame Sync.
LOST n
These bits indicate whether link n has lost Frame Sync. If a LOST bit is a one (1),
link n has lost Frame Sync after acquiring it. When this bit sets, the corresponding
ACQ bit is cleared. This bit i s cle ar ed by Link Reset or Chip Rese t. If a LOST bit is
a zero (0), link n has not lost Frame Sync.
1514131211109876543210
ACQ7 LOST7 ACQ6 LOST6 ACQ5 LOST5 ACQ4 LOST4 ACQ3 LOST3 ACQ2 LOST2 ACQ1 LOST1 ACQ0 LOST0
MXT3020 Reference Manual Version 4.0 47
Interface Pins
INTERFACE PINS
There are five pins associated with each of the eight link pairs. The modes are con-
trol led by the L ink Config uration r egisters .
Note: y represents the link number, where
In addition, the FSYNC and FNET interface pins are common to all of the links in
the Circuit Interface.
TABLE 8. Circuit Interface pins, per link
Pin Mode Function Drive
ASER (y) Unidirectional
Bidirectional Transmit Data
T ransmit/Receive Data (A) Output
I/O
BSER (y) Unidirectional
Bidirectional Receive Data
T ransmit/Receive Data (B) Input
I/O
ACLK (y) Unidirectional
ACLK_MD = 1 Transmit Link Clock Output
ACLK_MD = 0 Transmi t Input Clock Input
Bidirectional
ACLK_MD = 1 ASER (y) Tri-state Enable Output
ACLK_MD = 0 Transmi t Input Clock Input
BCLK (y) All Receive Clock
(for A and B) Input
BSCE (y) Unidire ctional Link Frame Sync Input
Bidirectional BSER (y) Tri-state Enable Output
TABLE 9. Circuit Interface pins, common to all links
Pin Name Function Drive
FSYNC Frame Sync Comm on Frame Sync input for all
links when FS_MODE bit is 0. Input
FNET Network Clock Network clock used for SRTS (refer-
ence input) Input
0y7.≤≤
48 Version 4.0 MXT3020 Reference Manual
Circuit Interface
MXT3020 Reference Manual Version 4. 0 49
CHAPTER 3 Data Mover Units and Task
Buffer RAMs
The Data Mover Units (DMUs) are specialized scatter/gather machines. One DMU
disasse mbles SAR Se rvice Dat a Units (SDUs) fr om ATM cel ls and prepares data f or
transmission over TDM links. Simultaneously, the other DMU receives data from
TDM links and assembles it into ATM SAR SDUs. The Data Mover Units are pro-
grammed by the MXT3010, which lo ads li sts of i nstru ction s for con troll ing th e data
transf er proce ss into a designat ed area of Gather Memory. The MXT3010 the n loads
control information and data into the T a sk Buffer RAM of the scatter machine or con-
trol information into the Task Buffer RAM of the gather machine.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Ta sk Buffer
RAMs
SDU Gather Unit
Gather List RAM
50 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
When the MXT3010 has fini shed l oading a task buf fer in t he scat ter machine’s Task
Buff er RAM, the scatter machine does the following:
Accesses the Gather Memory, fetches the list of instructions (“list block”) for
controlling the scattering process, and stores those instruct ions in its List RAM
(LRAM),
Reads sequential bytes of ATM SAR SDU data from the Task Buffer RAM,
writing that data into locations in Scatter Memory (TDM transmit frame stor-
age). The locations written are those designated by the instructions in the list
block.
When t he MXT30 10 has finished l oa din g a task buf fe r in the gather machine s Task
Buffer RAM, the gather machine does the f ollow ing:
Accesses the Gather Memory, fetches the list of instructions (“list block”) for
controlling the gathering process, and stores those instructions in its List RAM
(LRAM),
Reads bytes of data from Gather Memory (TDM receive frame storage) and
packs the bytes into sequential location s in its Task Buffer RAM. The loca tions
read are those designated by the instructions in the list block.
Additional informa tion about the Task Buf fer RAMs is provided in “Task Buf fer For-
mat” on page 55, and the Data Mover Int erfaces to the Scat ter/ Gather M emories are
discussed in “Scatter and Gather Memory Interfaces” on page 75.
LISTS AND TASKS
A Data Mover Unit pr ogram (for scat ter or gather opera tions) consis ts of two pieces,
a list and a task. The list is the code that contains the data moving instructions. It is
essenti ally a list of li nk numbers and DS0s withi n a frame that are ass ociated with an
ATM SAR SDU. The MXT3010 store s the list in contiguo us ha lfword-al ig ned l oca-
tions in Gather Memory, and the Data Mover Unit transfers it to the List RAM. An
example is shown below, and additional examples are shown under the heading
“Examples of Scatter and Gather Operations” on page 72.
MXT3020 Reference Manual Version 4.0 51
Activating the Data Mover Unit
LIST: gath link# ds0#
gath l ink# ds0 #
. (up to 128 instructions per list)
gath l ink# ds0 #
The MXT3010 stores the task (a group of control words) in the Task Buff er RAM,
and the Data Mover Unit uses it to set up the DMU registers and memory pointers
previou s to the da ta move. The fo rmats and fu nctions for these cont rol words are pro-
vided in “Task Buffer Format” on page 55.
ACTIVATING THE DATA MOVER UNIT
Activat ion of a Data Mover Uni t requ ires t wo steps , load ing th e list blocks and load -
ing the Task Buffer RAM. Completion of the Task Buffer RAM loading operation
automatically initiates Data Mover Unit operation.
Loading list blocks
As the first step toward activating the Data Mover Unit, the MXT3010 loads a list
block into the portion of Gather Memory that is used for control purposes. A list
block is a list of ins tructions that is responsib le for moving dat a between Task Buf fer
RAM and Scatte r/ Gat her Me mory. Afte r l oad ing th e li st bl ock, the MXT3010 loads
control information i nto the MXT3020 Task Buff er RAM, including a Channe l Map
Poin ter which points to the first instruc tion of the list block to be execute d.
When the Data Mover Unit begins operation, it fetches the list block, or a piece of
the list if i t is greater th an 64 instructio ns long , and loads it into its pr ivate onboard
List RAM (LRAM), from which it subsequently reads and executes instructions. One
of the Task Buffer RAM registers contains a counter (List Size) indicating the num-
ber of instr uctions tha t have been placed in the lis t block. The Data Mover Unit uses
this i nformation t o determine wh en it has reac hed the end of a set of li st block instruc-
tions.
52 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
Restrictions on list blocks
The list bl ock must start on a Ga the r memor y boundary based on the si ze of the list.
Each list block must be repeated twice ( conc atenated on the end. ) For example, if a
list block had fou r instructio ns, A, B, C, and D, it would appear in memory as: A, B,
C, D, A, B, C, D. I n this exa mple, th e lis t block and its c opy would occupy a tota l of
eight halfwords (sixteen bytes).
Generating addresses
The gener ation of a ddresses for t he MXT3010 to load the li st blocks a nd for the Data
Mover Unit t o acce ss the list blocks is des cribe d in gre ater det ail i n “Addres s Gener -
ation” on pag e 67. The generat ion of List RAM addres ses i s al so cove red i n tha t sec -
tion.
Transfer Count and Instruction Pointer
A list b loc k i dent i fi es only the DS0s within a frame that nee d to be mov ed. A frame
can cont ain 24, 32, 64, 96, or 128 DS0 s, bu t a l ist block ca n ca ll out a small number
for tra nsf er. Once all the ins tr uct i ons i n th e li st block have been executed , and a ll of
the selected DS0s in a data frame have thus be en transf erred, the D ata Mover Unit
moves to the next frame in memory and executes the list block instructions again.
Once all t he dat a has been tran sferred, the Data Mov er Unit will stop exe cuting the
list at a particular instruction in the List RAM. When this list block is used again, the
Channel Map Pointer in the Task Buffer Register must point to this same instruction
List Size (See “List Size” on page 57.) Address B oundar y
0 - 1 8 byt e s
2 - 3 16 bytes
4 - 7 32 bytes
8 - 15 64 bytes
16 - 31 128 bytes
32 - 63 256 bytes
64 - 127 512 bytes
MXT3020 Reference Manual Version 4.0 53
Activating the Data Mover Unit
so that the scatter or gather process can continue from where it left off. To calculate
the proper new value for the Channel Map Pointer, software must keep track of the
size of the list and the number of bytes transmitted.
The list blocks only have to be set up when a virtual circuit is first established and
can remain untouched w hile that virtual circu it exis ts. As more data a rrives , the
MXT3010 re-loads the task buffer changing only the Channel Map Pointer and the
Frame Number to new values which it has calculated.
Loading the Task Buffer RAM
The Data Mover Unit is activated by the MXT3010 performing a burst mode DMA
transf er int o t he Task Buffe r RAM o f t he se le ct ed Dat a Mover Uni t. I n the case of a
scatter operation, this DMA transfer includes both control information and SAR data.
In the case of a gather operation, the DMA transfer includes only control information.
Completion of the DMA transfer automatically sets the T ask Buffer Busy flag for that
task buf fer. The control words are aut omatically r ead from the bu ffer and l oaded into
the Data Mover Unit ’s state re gisters. In addition , an i nstruction list is fe tched from
Gather Memory and loaded into the List RAM. Starting at location zero in the List
RAM, each element of the list is fetched and memory-to-memory transfers begin.
In the case of a sca tter operation, these transfers o ccur between th e T ask Buf fer RAM
and the Scatter Memory. This process continues until the command queues are
exhaust ed, at which point access contr ol to the Scatte r Memory is rel eased. The com-
pletion status is indicated to the MXT3010 via the Scatter Task Buffer Busy flags
(STBR_BSY[1:0]).
For a ga ther operat ion, the proc edure is id entical exc ept that the memor y-to-memory
transf ers occur be tween the Gath er Memory and t he Task Buffer RAM, as SAR data
is placed into the task buffer by the Data Mover Unit. When all the SAR data has been
gathered, the completion status is indicated to the MXT3010 via the Task Buffer
Busy flags (see “Status (STAT)” on page 65). The MXT3010 must then perform
DMA transfers to move the SAR da ta back over the Port2 bus.
54 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
DATA MOVER UNIT INSTRUCTION SET
The list blocks contain instructions for the Data Mover Unit. The Data Mover Unit
instru ct ion set consist s of seve n ins truct ions.Al l seven inst ruct ions are of th e follo w-
ing fo rmat:
:
1514131211109876543210
Op Code BIa
a. The BI bit is one (1) if th e link is bidirectional and zero (0) if the link is unidirectional.
Link Number DS0 Number
TABLE 10. Data Mover Unit Instructions
Op Code Instruction Action
0000 No-Op None
0001 Reserved Reserved
0010 Gather Reads one byte of data from the Gather M emory address (Li nk#, Frame
Count, DS0#) and stores it in the T ask Buf fer RAM at the T ask Buf fer Offset
(TBO) location. TBO is incremented; Transfer Count (TC) is decremented.
001 1 Gather
Immediate Stores the value of a constant (CONST) in the Task Buffer RAM at the Task
Buffer Offset (TBO) location. TBO is i ncremented and Transfer Count (TC)
is decr emented.
0100 Scatter Reads one byte of data from the Task Buffer RAM at the T ask Buffer Offset
(TBO) location and stores it into Scatter Memory Address (Link#, Frame
Count, DS0#). TBO is incremented; Transfer Count (TC) is decremented.
0101 Scatter
Immediate Stores the value of a constant (CONST) into Scatter Memory Address
(Link#, Frame Count, DS0#). TBO is incremented; TC is decremented.
01 10 Mcast Reads one byte of data from the Task Buffer RAM at the Task Buffer Offset
(TBO) location and stores it into Scatter Memory Address (Link#, Frame
Count, DS0#). TBO and TC are NOT changed.
0111 Mcast
Immediate Stores the value of a constant (CONST) into Scatter Memory Address
(Link#, FC, DS0#). TBO and TC values are NOT changed.
MXT3020 Reference Manual Version 4.0 55
Task Buffer Format
TASK BUFFER FORMAT
Each Task Buffer RAM has space for t wo 64-byte task buffer s. The addresse s shown
are the offsets into a single task buffer. At the conclusion of the DMA transfer that
loads the task bu ffer, co ntrol information is automatically tra nsfer red to the Data
Mover Unit registers indicated. Therefore, the information placed into the buffer
must correspond to the format shown.
FIGURE 19 Pre-Scatter/Gather Task Buffer Register Format
1514131211109876543210 Loaded into
00 Channel Map Pointer CMP
02 List Size Frame Number MAPD and FC
04 0 0 SAR Size 0 0 SAR Offset TC and TBO
06 Immediate S H T C FNC 0 0 Immediate & HSCT
08 SAR SDU Bytes 0-1
If this is to be a
scatter operation,
the data to be scat-
tered must be in
these bytes.
0A SAR SDU Bytes 2-3
0C SAR SDU Bytes 4-5
:
:
3E SAR SDU Bytes 54-55
56 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
When the scatt er or gather ope ration has complet ed, the Task Buffer Register has the
following format:
FIGURE 20 Post-Scatter/Gather Task Buffer Register Format
Channel Map Poin ter
When combine d w ith the conte nts of th e ISEG[1:0] register, this 16-bit field poin ts
to a list block located in Gather Memory . The bits represent Gather Memory address
bits [16:1]. As indicated in “Restrictions on list blocks” on page 52, there are two
copies of each list block stored in memory. The Channel Map Pointer must point to
an instruction in the first copy of the list block. This pointer is loaded into the Channel
Map Pointer register in the DMU.
1514131211109876543210Relationship to Figure 19
00 Channel Map Pointer Unchanged
02 List Size Frame Number Unchanged
04 0 0 SAR Size 0 0 SAR Offset Unchanged
06 Header Bit 0 C T H Start of Cell Updated on gather
08 SAR SDU Bytes 0-1
If this was a gather
operation, the data
gathered appears in
these bytes.
0A SAR SDU Bytes 2-3
0C SAR SDU Bytes 4-5
:
:
3E SAR SDU Bytes 54-55
MXT3020 Reference Manual Version 4.0 57
Task Buffer Format
List Size
This is a 7-bit coun ter i ndica ting the nu mber of in struc tions t hat ha ve been p laced in
the lis t block. It shoul d be set to n-1, where n i s the number of ins tructions in a single
copy of the li st block. This infor mation is loaded in to the MAPD and Fill regist ers in
the DMU, where it is used to determine when the DMU has reached the end of the
list block instructions.
Frame Number
This is a 9-bit counter identifying the data frame within a Link Buffer in Scatter/
Gather Memory. This information is loaded into the Frame Counter (FC) register in
the DMU.
SAR Size
This is a 6-bi t co unt er i n it ia li ze d with the number of data transfers to be per fo rmed,
as dete rmined by t he amount of SAR dat a. It should be set to n-1, where n is the num-
ber of da ta transfe rs to be performed (including HEC i f enabled). This i nformation is
loaded in to th e T ra nsfer Counter ( TC) regis ter in t he DMU, where i t is decr emented
after each data transfer is completed.
SAR Offset
The 6-bit value in the SAR Offset field should equal the offset of the first byte of SAR
SDU data. For example, if the first t ask buffer was lo aded, and th e first SAR SDU
data byte was placed at loc ation 0A, then the c ontents of the SAR Of fset fiel d should
equal 0A. The SAR SDU dat a ca n st ar t anywhere beyond the f irst ei ght bytes of the
buf fer but must be contiguous. This informati on is loaded into the Task Buffer Offset
(TBO) register in the DMU. In the DMU, this value is used as a counter that points
to the ne xt location to be read or written in the Task Buffer. Since the Task Buffers
are 64 bytes, only bits [5:0] are required for addressing, and bits [7:6] are always
zero.
58 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
Register 06 (write) - Additional control bits
The bits i n this regis ter function as control bits when the Task Buff er Register is wr it-
ten.
Bits 18-8 (write) Immediate
On writes to the T ask Buffer RAM, this register contains data for use by gather imme-
diate, scatter immediate and mcast immediate instructions. This information is
loaded i nto th e CONST r egister in the DMU. This re giste r must be load ed, even if it
is loaded with all zeroes, because loading this register initiates Data Mover Unit oper-
ation.
Bit 7 (write) S-bit
On writes to the Task Buffer RAM, th is bit controls the scram bling of data on scatter
operations and the descrambling of data on gather operations. When this bit is zero
(0), scrambling/descrambling is disabled. When this bit is one (1), scrambling/
descrambling is enabled.
Bit 6 (write) H-bit
On writes to the Task Buffer RAM, this bit controls the generation of the Header
Error Cont rol (HEC) on scatter operations 1 and the checking of the HEC on gather
operations2. When HEC generation/checking is enabled on gather operations, cell
delineation is also enabled, as the MXT3020, in the process of searching for HEC,
will r eport its pos ition in the S tart of Cell register (see “Bits 5-0 (read) SOC” on page
61) Wh en this bit is zero (0), HEC generation/checking is dis abl ed. When this bit is
one (1), HEC generation/checking is enabled.
1. The generated HEC byte is inserted as the fifth byte of the cell.
2. The received HEC byte is di scarded after checking.
MXT3020 Reference Manual Version 4.0 59
Task Buffer Format
Bit 5 (write) T-bit
On writes to the Task Buffer RAM, this bit enables/disables the Threshold Test on
gather operations. See “TT register” on page 66. When this bit is zero (0), the Thresh-
old Test is disabled. When this bit is one (1), the Threshold Test is enabled.
Bit 4 (write) C-bit
On writes to the Task Buffer RAM, this bit enables/disables CRC-10 operation.
When this bit is zero (0), CRC-10 operation is disabled. When this bit is one (1),
CRC-10 operation is enabled.
Bits 3-2 (write) FNC bits
On writes to the Task Buf fer RAM, th ese bits control de tails o f the CRC-10 f unction
on gather and scatter operations.
When the burst DMA which loaded this task buffer concludes, this information is
automatically transferred to the HSCT Flags register in the DMU register set.
Bits 3-2 Description
0 0 Check CRC and save partial resulta
a. The 00 and 01 co des are used when the scatter/gather
bein g performed does not inclu de the end of a message.
Code s 01 an d 11 are us e d at the en d of a me s s a ge,
0 1 Check CRC and discard
1 0 Generate CRC and save partial resulta
1 1 Gen erate CRC and app end to transmissio n
60 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
Register 06 (read) - Additional status bits
The bits in thi s reg ister funct ion as stat us bit s when th e Task Buf fer Re giste r is r ead.
Bits 15-10 (read) Header Bit in Error
If HEC checking is enabled and a header bit er ror occurs, the H-bit (bit [06]) is set.
These bits identify which bit in the 5-byte header was received in error. The follow-
ing fo rmat is use d:
If no header bit error is detect ed, this regist er will return the value 3F.
Bit 9 (read)
This bit reads as zero (0).
Bit 8 (read) C-bit
On reads of the Task Buffer RAM, this bit indicates the result of the CRC-10 check-
ing. If th is bit is zero ( 0), no CRC-10 er ror was dete cted. If th is bit is one (1) , a CRC-
10 error was detected.
Bit 7 (read) T-bit
On reads of the Task Buf fer RAM , this bi t indica tes th e re sult of th e Thresh old Test.
If this bit is zero (0), Threshold Test checking was successful. If this bit is one (1),
Threshold Test checking failed.
Bit 6 (read) H-bit
On reads of the Task Buffer RAM, this bit indicates the result of the Header Error
Control (HEC) che cking. If t his bi t is zero ( 0), HEC c hecking was suc cessf ul. If this
bit is one (1), HEC checking failed. The bit in error is reported in bits 15-10.
15 14 13 12 11 10
Byte in error (0-4) Bit in error (0-7)
MXT3020 Reference Manual Version 4.0 61
Data Mover Unit Registers
Bits 5-0 (read) SOC
On reads of the Task Buffer RAM, these bits (SOC) i ndic at e t he number of the gath-
ered byte in which the HEC code (indicating the Start Of Cell (SOC)) was found.
DATA MOVER UNIT REGISTERS
The Data Mover Unit register set contains 17 registers. Many of these registers
(mark ed “A” in Table 11) are loaded automat ical ly by th e Data Mover Uni t onc e the
list block instr uctions have been loaded into the Gather Memory, a nd com mands
have been loaded into the Task Buffer RAMs.
TABLE 11. Data Mover Unit Registers
Register A Function
Channel Map Pointer (CMP) A See “Channel Map Pointer” on page 56.
Instruction Pointer (IP) See “Instruction Pointer (IP)” on page 63.
Frame Counter (FC) A See “Frame Number” on page 57.
Transfer Counter (TC) A See “SAR Size” on page 57.
Task Buffer Offset (TBO) A See “SAR Offset” on page 57.
CRC Function Code (FNC) A See “CRC Function Code (FNC)” on page 63.
HSCT Flags (HSCT) A See “Register 06 (write) - Additional control bits” on
page 58.
Instruction Segment (ISEG) See “Instruction Segment (ISEG)” on page 64.
Immediate (IMMED) A See “Register 06 (write) - Additional control bits” on
page 58.
Command (CMD) See “Command (CM D)” on page 64.
Task Ti mer (TKT) See “Task Ti mer (TKT)” on page 65.
Status (STAT) See “Status (STAT)” on page 65.
Map Data counter (MAPD) A See “List Size” on page 57.
Fill Address counter (FILL) A See “List Size” on page 57.
Thresh old Test Type r egister (TT) See “ TT register” on page 66.
Threshold Value register (TVR) See “TVR register” on page 66.
Start of CRC-10 register See “Start of CRC-10 [5:0]” on page 66.
CRC-10 register See “CRC-10 [9:0]” on page 66.
62 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
The Data Mover Unit r egister se t is orga nized as shown in Figure 21. W ith the ex cep-
tion of the Instr uction Segment (I SEG) Task Timer (T KT), Scatte r Count (SC) ,
Gather Count (GC), Threshold T est T ype (TT), and Threshold Value (TVR) registers,
none of thes e registers ar e accessed by the MXT3010 except in deb ug or di agno stic
situations.
FIGURE 21 DMU register set organization
The registers shown in italics are initialized from task buffer entries and are described
in “Task Buffer Format ” on page 55. Once the i nitial value s have been a utomatical ly
loaded from the task buffer, they are incremented/decremented by the Data Mover
Unit as appropriate during the data transfer process.
Channel Map Pointer (CMP)
This regi ster is loaded from the Task Buffer RAM. See “Channel Map Pointer” on
page 56.
1514131211109876543210
Channel Map Pointer (CMP) [15:0]
0Instruction Pointer (IP) [5:0] Frame Counter (FC) [8:0]
00 Transfer Counter (TC) [5:0] 00 Task Buffer Offset (TBO) [5:0]
FNC H S C T ISEG Imme dia te (CO NST)
00000000 Command
Task Timer (TKT)
Status (STAT)
0MAPD [6:0] 00 Fill [5:0]
00000 TT
a [2:0]
a. The TT and TVR registers exist only in the Gather DMU.
Threshold Value Registera (TVR) [7:0 ]
Start of CRC-10 [5:0] CRC-10 [9:0]
MXT3020 Reference Manual Version 4.0 63
Data Mover Unit Registers
Instruction Poi nter (IP)
This is a 7-bit counter that points to the next location to be read in the List RAM. Bits
[15:9] re pr esent Instruction Poin te r bit s [6: 0 ] . Since the Lis t RAMs are 64x16, only
bits [5:0] are required for addressing, and bit [6] is always zero.
Frame Counter (FC)
This re gister is load ed from t he Task Buf fer RAM. See “Fra me Number” on page 57.
Tran sfer Coun ter (TC)
This regi ster is loaded from the Task Buffer RAM. See “SAR Size” on page 57.
Task Buffer Offset (TBO)
This regi ster is loaded from the Task Buffer RAM. See “SAR Offset” on page 57.
CRC Function Code (FNC)
This registe r is loaded from the Task B uffer RAM. See “Regis ter 06 (writ e) - Ad di-
tional control bits” on page 58.
HSCT Control Flags
This registe r is loaded from the Task B uffer RAM. See “Regis ter 06 (writ e) - Ad di-
tional control bits” on page 58.
64 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
Instruction Segment (ISEG)
This is a static register which holds bits [18:17] of the List Block address in Gather
Memory . These bits are appended to the Channel Map Pointer and must be initialized
by the MXT3010. ISEG[1:0] correspond to Gather Memory address bits [18:17].
TABLE 12. Relation of ISEG register to address ranges
Immediate (CONST)
This registe r is loaded from the Task B uffer RAM. See “Regis ter 06 (writ e) - Ad di-
tional control bits” on page 58.
Command (CMD)
This re gis ter cont rols the Task T i mer and the DMU Halt Fl ag. Unl ike ot her r egist ers
in whic h the progra mmer must consid er the prope r states of all bits before writing to
the register, each seve n bit command code in this regis ter control s a single specific
function independently of ot her functions. For example, entering 1000 0001 to
enable the Task Timer has no effect on the Halt/Continue function.
ISEG Offset in Gat her Memory MXT 3020 Addres s a
a. See “MXT3020 address space” on page 83.
00 00000-1FFFE 0x80000-0x9FFFE
01 20000-3FFFE 0xA0000-0xBFFFE
10 40000-5FFFE 0xC0000-0xDFFFE
11 60000-7FFFE 0xE000 0-0xFFFFE (Do not use b e yond 0xFE000)a
76543210
S Command Code [6:0]
S-bit Command Code Description
0 000 0000 Halt (For diagnostic use)
1 000 0000 Co nti nu e (Fo r di ag n ostic u s e an d to reco ve r fro m a n i llega l i nstru c tion tr ap )
0 000 0001 Disable Task Timer
1 000 0001 Enable Task Timer
All other codes are reserved.
MXT3020 Reference Manual Version 4.0 65
Data Mover Unit Registers
Task Timer (TKT)
This is a 16-bit counter, intended for performance monitoring, that counts clock
cycles while either Task Buffer Busy flag is set.
Status (STAT)
This is an 16-bit register containing the status of the Data Mover Unit.
MAPD and Fill
These registers are loaded from the Task Buffer RAM. See “List Size” on page 57.
1514131211109876543210
0000HALT
TKT_EN
0IIT0
IDU_BSY
DMI_BSY
TBI_BSY
0 0 TBR_BSY
Bit Name Function
15-12 0 Unused
11 HALT DMU Halt Flag (To set/cl ear, see “Command (CMD)” on page 6 4)
10 TKT_EN Task Timer Enable (To set/clear, see “Command (CMD)” on page 64)
90 Unused
8 IIT Illegal Instruction Trap (To recover , see “Command (CMD)” on p age 64)
70 Unused
6 IDU_BSY IDU Busy Flag (For debug use only)
5 DMI_BSY DMI Busy Flag (For debug use only)
4 TBI_BSY TBI Busy Flag (For debug use only)
30 Unused
20 Unused
1-0 TBR_BSY Task Buffer Busy Flagsa
a. Use these bits to detect scatter/gather completion. In addition to their appearance in the Status
register s, the se flags also appear on external pins. See “Interface Pins” on page 71.
66 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
TT register
This register controls the type of thresholding done on the gathered data. The three
bits per mit a choice of eight comparis ons between ga thered dat a and the valu e in the
Threshold Value Register (TVR).
TVR register
This register contains an 8-bit value used for threshold testing done on the gathered
data.
CRC-10 [9:0]
The valu e loaded in to this register before a sca tter/g ather o peration i s used as the ini-
tial or seed value for CRC-10 calculations. The MXT3020 clears this register at the
end of a s catter/gat her if CRC-10 was ena bled and a funct ion code (FNC) of 01 or 1 1
was selected. At all other times, this register is updated with the CRC-10 partial
result.
Start of CRC-10 [5:0]
This register indicates the number of bytes that are to be processed before CRC-10
calculation begins. Any value from 0 to 63 may be selected.
TT register Threshold comparison Comparison type
000 gath_data [7:0] TVR [7:0] unsigned integer
001 gath_data [7:0] > TVR [7:0] unsigned integer
010 gath_data [7:0] = TVR [7:0] unsigned integer
011 gath_data [7:0] TVR [7:0] unsigned inte g er
100 gath_data [6:0] TVR [6:0] sign-magnitude integer
101 gath_data [6:0] > TVR [6:0] sign-magnitude integer
110 gath_data [6:0] = TVR [6:0] sign-magnitude integer
111 gath_data [6:0 ] TVR [6:0] sign-magnitude integer
MXT3020 Reference Manual Version 4.0 67
Address Generation
ADDRESS GENERATION
List Block Address Generation
The lis t bloc k, or a porti on the reof, i s loa ded in to the Lis t RAM at t he st art of a Dat a
Mover Unit operat ion. Th e Channe l Map Poi nte r cont ains a 16-bi t val ue tha t is used
to form an 19-bit index into Gather Memory where the list is located. The 19-bit
address , [18:0], i s formed by using the Channel Ma p Pointer con tents as address bi ts
[16:1]. Bit [0] is always set to zero since list entries are always 16-bits wide. Bits
[18:17] ar e se t up by the MXT3010 at ini ti al iz ati on t i me by wri t ing the ISEG Regis-
ter ( page 64).:
The Channel Map Pointer in the Data Mover Unit increments auto matically as
instructions a re fetc hed from Gather me mory, and the pr ocess cont inues until 64
instructions have been fetched, or until the List Size has been downcounted to
indicate that the instructi on being fetched is the last in struc tion.
List RAM Address Generation
The List RAM address is a 6-bit address that is generated by the Data Mover Unit’s
Instruction Pointer (IP) (page 63). The list block is copied into the List RAM, starting
at the address pointed to by the Channel Map Pointer . As the list block is being copied
into the List RAM, the Instruction Pointer begins cycling through the valid List RAM
entrie s, starting at zero (t he first entry in th e List RAM), and the instr uctions at those
locati ons are execute d. The Inst ruct ion Po inter wraps to zero when t he List Size reg -
ister indicates that the last instruction of the List RAM has been reached, and repeats
the process of cycling through the instructions in the List RAM until the Tr ansfer
Counter (TC) register reaches zero, and the last byte of data has been processed.
1817161514131211109876543210
ISEG Channel Map Pointer [15:0] 0
68 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
For diagnostic and debug purposes, the List RAM is mapped into the address space
of the MXT3020 and can be read and written direct ly through the Port2 interface.
Scatter/Gather Memory Addr ess Gen eration
Although Data Mover Unit instruction lists are located in Gather Memory, Scatter/
Gather Memory address generation refers to the creation of addresses required to
access a specific DS0 within a data frame. These DS0 addresses are generated by
mer ging the contents of the link number field of the data move in struction, the Frame
Counter (FC) and the DS0 number fi eld of the data move instruction into a 19-bit
memory address. How these elements are merged depends on the content of the
MAXDS0[2:0] and MAXTBS/MAXRBS[2:0] fields in the CI Configuration
register. The MAXDS0 f ield identifies how many DS0s compo se a serial d ata frame.
The MAXTBS/MAXRBS field tells how many DS0- sized frames make up the serial
data buffer storage area for the link number. The figures below show how the
complete address is built for various settings of the MAXDS0[2:0] and MAXTBS/
MAXRBS[2:0] fields in the Circuit Interface Configuration regi ster.
Figure 22, Figu re 23, and Figure 24 apply to unidi recti onal mode. Figu re 25, Figure
26, and Figure 27 apply to bidirectional mode.
MXT3020 Reference Manual Version 4.0 69
Address Generation
FIGURE 22 Creation of 19-Bit Address (Uni) When DS0 = 24 or 32
FIGURE 23 Creation of 19-Bit Address (Uni) When DS0 = 64
FIGURE 24 Creation of 19-Bit Address (Uni) When DS0 = 96 or 128
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 00000 Link [2:0] FC [5:0] DS0 [4:0]
MAXT/RBS = 128 0000 Link [2:0] FC [6:0] DS0 [4:0]
MAXT/RBS = 256 0 0 0 Link [2:0] FC [7:0] DS0 [4:0]
MAXT/RBS = 512 0 0 Link [2:0] FC [8:0] DS0 [4:0]
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 0000 Link [2:0] FC [5:0] DS0 [5:0]
MAXT/RBS = 128 0 0 0 Link [2:0] FC [6:0] DS0 [5:0]
MAXT/RBS = 256 0 0 Link [2:0] FC [7:0] DS0 [5:0]
MAXT/RBS = 512 0 Link [2:0] FC [8:0] DS0 [5:0]
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 0 0 0 Link [2:0] FC [5:0] DS0 [6:0]
MAXT/RBS = 128 0 0 Link [2:0] FC [6:0] DS0 [6:0]
MAXT/RBS = 256 0 Link [2:0] FC [7:0] DS0 [6:0]
MAXT/RBS = 512 Link [2:0] FC [8:0] DS0 [6:0]
70 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
FIGURE 25 Creation of 19-Bit Address (Bi) When DS0 = 24 or 32
FIGURE 26 Creation of 19-Bit Address (Bi) When DS0 = 64
FIGURE 27 Creation of 19-Bit Address (Bi) When DS0 = 96 or 128
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 0000 Link [2:0] FC [5:0] DS0 [4:0]
Link [3]
MAXT/RBS = 128 0 0 0 Link [2:0] FC [6:0] DS0 [4:0]
Link [3]
MAXT/RBS = 256 0 0 Link [2:0] FC [7:0] DS0 [4:0]
Link [3]
MAXT/RBS = 512 0 Link [2:0] FC [8:0] DS0 [4:0]
Link [3]
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 0 0 0 Link [2:0] FC [5:0] DS0 [5:0]
Link [3]
MAXT/RBS = 128 0 0 Link [2:0] FC [6:0] DS0 [5:0]
Link [3]
MAXT/RBS = 256 0 Link [2:0] FC [7:0] DS0 [5:0]
Link [3]
MAXT/RBS = 512 Link [2:0] FC [8:0] DS0 [5:0]
Link [3]
Frames Scatter/gather Memory Address
1817161514131211109876543210
MAXT/RBS = 64 0 0 Link [2:0] FC [5:0] DS0 [6:0]
Link [3]
MAXT/RBS = 128 0 Link [2:0] FC [6:0] DS0 [6:0]
Link [3]
MAXT/RBS = 256 Link [2:0] FC [7:0] DS0 [6:0]
Link [3]
MXT3020 Reference Manual Version 4.0 71
Interface Pins
Task Buffer RAM Add ress Generatio n
The address for accesses to the Task Buffer RAM are provided directly by the Task
Buff er Offset register. The Task Buffer Offset points to the byte location in Task
Buffer RAM that is to be moved to Scatter Memory or which is to be written with
data from Gather Memory. After the execution of a scatter or gather instruction, the
Task Buffer Offset is automatically incremented to point at the next sequential
location in the Task Buffer RAM.
INTERFACE PINS
The MXT3020C p rovides a means for t he MXT3010 to re ad the st atus of t he Scatter
Task Buffer Busy flags and Gather Task Buffe r Busy flags f or up to four MXT3020C
devices with a single non-burst DMA read of location 0x400000. This read also
clears the flags.
Pins 188 through 185 are tri-stated until a single non-burst DMA read of location
0x400000 oc curs. W iring details for using these signals i n both single MXT3 020 and
multiple MXT3020 configurations are provided in “Scatter/Gather T ask Buf fer Busy
flags” on page 134.
TABLE 13. Data Mover Unit and Task Buffer RAM interface pins
Pin number Pin name Function Drive
188 STBRBSY1 Scatter Task Buffer 1 Busy flag Output
187 STBRBSY0 Scatter Task Buffer 0 Busy flag Output
186 GTBRBSY1 Gather Ta sk Buffer 1 Busy flag Output
185 GTBRBSY0 Gather Ta sk Buffer 0 Busy flag Output
184 M 20INT MXT 3020 In terrupt Output
72 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
EXAMPLES OF SCATTER AND GATHER OPERATIONS
Scatter
The scatter process reads bytes of data from sequential locations in the Task Buffer
RAM and writes them into random locations in Scatter Memory. The Data Mover
Unit constructs the Scatter Memory address of the byte to scatter as described in
“Scatter/Gather Memory Address Generation” on page 68. The Data Mover Unit
also main tai ns a poi nter t o the ne xt loc ation in t he Task Buffer RAM as d esc ribed i n
“Task Buffer RAM Address Genera tion” on page 71. Both addresses are
automatically incremented after the scatter instruction is issued. The figure below
demonstrates the results of executing a list of eight scatter instructions. Eight
sequential bytes from the Task Buffer RAM are scattered into eight locations in
Scatte r Memory.
scat link(0) ds0(x) //Task Buff er address
scat link(0) ds0(e) //is incremented after
scat link(0) ds0(B) //each instruction
scat link(0) ds0(i)
scat link(0) ds0(r)
scat link(0) ds0(g)
scat link(0) ds0(l)
scat link(0) ds0(k)
FIGURE 28 Exam ple of a Scatter Operation
abc d e f g h
ijklmn op
qrt
suvwx
yzABCDEF
7
0
5
2
6
3
1
4
15 087 63 0
10
3
2
5
4
7
6
00
08
10
18
Scatter
Memory (bytes)
Task Buffer Scatter Memory (bytes)
MXT3020 Reference Manual Version 4.0 73
Examples of Scatter and Gather Operations
Gather
The gather process reads bytes of data from random locations in Gat her Memory and
writes them sequentially into the T ask Buffer RAM. The Data Mover Unit constructs
the Gather Memory address of the byte to gather as described in “Scatter/Gather
Memory Address Generation” on page 68. The Data Mover Unit also maintains a
pointer to the next location in the Task Buffer RAM as described in “Task Buffer
RAM Address Generation” on page 71. Both addresses are automatically incre-
mented aft er the gathe r inst ruction is issued. The figure below demon strat es the
results of executing a list of eight gather instructions. Eight bytes from a 32-byte
frame are collected and packed sequentially into eight locations in the Task Buffer
RAM.
gath link(0) ds0(c) //Task Buffer address
gath link(0) ds0(z) //is incremented after
gath link(0) ds0(o) //each instruction
gath link(0) ds0(q)
gath link(0) ds0(D)
gath link(0) ds0(j)
gath link(0) ds0(p)
gath link(0) ds0(a)
FIGURE 29 Exam ple of a Gather Operation
abc d e f g h
ijklmn op
qrt
suvwx
yzABCDEF
70
526
3
14
15 087 63 0
10
3
2
5
4
7
6
00
08
10
18
Gather
Memory (bytes)
Task Buffer Gather Memory (byte s)
74 Version 4.0 MXT3020 Reference Manual
Data Mover Units and Task Buffer RAMs
Multicast
The multicast process is similar to the scatter process in that bytes are moved from
Task Buffer RAM to Scatter Memory. The difference is that the scatter process is a
one-to-one process, meaning that one byte of Task Buffer RAM data is mapped to
exactly one location in Scatter Memory . In contrast, the multicast process is a one-to-
many process. A byte of Task Buffer RAM data can be copied to multiple locations
in Sca tter Me mory. As with the scattering pro cess , the Da ta Mover Unit constructs
the Scatter Memory address of the byte to scatter as described in “Scatter/Gather
Memory Address Generation” on page 68. The Data Mover Unit also maintains a
pointer to the Task Buffer RAM as described in “Task Buffer RAM Address
Generation” on page 71. Unlike the scatter operation, however, the T ask Buffer RAM
pointer is NOT incremented after the issue of an mcast instruction. The following
figure demonstrates the results of executing the list of mcast instructions.
mcast link(0) ds0( x) //Task Buff er address
mcast link(0) ds0(e ) //is NOT incremente d
mcast link(0) ds0(B)
mcast link(0) ds0(i)
scat link(0) ds0(r) //increments TBO
mcast link(0) ds0(g)
mcast link(0) ds0(l)
mcast link(0) ds0(k)
FIGURE 30 Example of an Mcast Operation
abc d e f g h
ijklmnop
qrt
suvwx
yzABCDEF
1
0
1
0
1
0
0
0
15 087 63 0
10
3
2
5
4
7
6
00
08
10
18
Mcast
Memory (bytes)
Task Buffer Scatter Memory (bytes)
MXT3020 Reference Manual Version 4. 0 75
CHAPTER 4 Scatter and Gather Memory
Interfaces
The Scatter and Gather Memory interf aces are each 16-bits wide and support up to
512 Kbytes of pipelined synchronous SRAM. Each port can accept accesses from
any of the on-chip masters (Circuit Interface, Data Mover Units, or Port2 Interface).
Because t he Sca tter Memory Cont ro ller and Gat her Memor y Contro ller are i ndepen -
dent, operations to these ports can occur simultaneously.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Task Buffer
RAMs
SDU Gather Unit
Gather List RAM
76 Version 4.0 MXT3020 Reference Manual
Scatter and Gath er Memory Interfaces
SCATTER MEMORY CONTROLLER
The Scatter Memory Controller connects the Scatter Data Mover Unit, the Circuit
Interf ace, and the Port 2 Interfac e to up to 512 Kbytes of SRAM storage. The Scatter
Memory starts at location 0x00000 and can address 128, 256 or 512 Kbytes
depending on the number of SRAM parts connected to the Scatter Memory port of
the MXT3020. The controller supports one or two 64Kx16 parts, one or two
128Kx16 parts, or one 256Kx16 part.
The Scatter M emory Contr oller services four different fu nctional units withi n the
MXT3020. Only thr ee uni ts wri te dat a into t he Scat ter Memor y: the Port2 I nterf ace,
the Scatter Data Mover Unit, and the quiet logic. The TDM transmit section of the
Circuit Inte rface re ads this s pace, and t he Port 2 Interf ace can re ad thi s space as well.
The arbitration is priority-based where the TDM transmit section of the Circuit Inter-
face, quiet logic, and Port2 interfaces have highest priority followed by the Data
Mover Unit. A lower priority devices transfer is preempted by a higher priority
device, but continues after the higher priority device has completed its transfer.
Restriction on Scatter Memory Usage
Do not issue read operations to Scatter Memory that cross memory banks.
MXT3020 Reference Manual Version 4.0 77
Gather Memory Contro ller
GATHER MEMORY CONTROLLER
The Gather Memory Controller connects the gather Data Mover Unit, the List RAMs,
the Circuit Interface, and the Port2 Interface with up to 511 Kbytes1 of SRAM
storage . The Gather Memory star ts at located 0x80000 an d ca n address 128 Kbytes
or 256 Kbytes de pending on the SRAM parts connected to the Gather Memo ry por t
of the MXT3020. The controller supports one or two 64Kx16 parts, one or two
128Kx16 parts, or one 256Kx16 part.
The Gather Memory Controller services six different functional units within the
MXT3020. All six read data from the Gather Memory but only two, the Port2 Inter-
face, and the TDM receive section of the Circuit Interface, write this space. The arbi-
tration is priority-based where the TDM receive section of the Circuit Interface and
Port2 interfaces have highest priority followed by the List RAM s and then the Data
Mover Unit. A lower priority devices transfer is preempted by a higher priority
device, but continues after the higher priority device has completed its transfer. .
1. The last 1K bytes of address space (0xFFC00 - 0xFFFFF) is mapped to the
MXT3020 internal RAMs and registers and is not accessible.
Restriction on Gather Memory Usage
Do not issue read operations to Gather Memory that cross memory banks.
78 Version 4.0 MXT3020 Reference Manual
Scatter and Gath er Memory Interfaces
DETERMINING SCATTER AND GATHER MEMORY REQUIREMENTS
Scatter Memory
The Scatt er Memory size i s determined by how much CDV is requ ired and the s peed
of the links. T1/E1 links use 32 DS0s pe r frame per li nk in frame st orage. Stor ing 128
frames of ATM-to-TDM data (scatter), provides 128 frames times 125 µsec per frame
times 0.51, or 8 msec of CDV tolerance. The MXT3020 can support up to 512 frames,
or 32 msec of CDV tolerance (without buffering in Port1 memory). Thus, the mem-
ory used for sca tter i s number of frames times the number of DS0s p er frame times 1
byte per DS0 ti mes the number of links. For ex ample, us ing 512 frames with T1/E 1,
would require 512 x 32x 1 x 8=128K of Scatter Memory. The following table sum-
marizes these results:
Gather Memory
Gather Memory requirements include the following:
memory for frame storage
2K for quiet logic data,
2K for tri-state control maps, and
memory for scatter/gather maps.
1. The 0.5 factor is included because the CDV calculati on is relative to th e center of the bu ffer.
CDV Tolerance Scatter Memory Size (T1/E1)
8 msec (128 frames) 32K
16 msec (256 frames) 64K
32 msec (512 frames) 128K
MXT3020 Reference Manual Version 4.0 79
Interface Pins
The memory requirement for gather frame storage is calculated in a fashion similar
to that for scatter frame storage, but less memory is required because fewer frames
need to be stored in the TDM-to-ATM direction.
The calculation for scatter/gather maps depends on number of VC’s and the align-
ment of maps. For bi-directional connections, both a scatter and a gather map are
needed. As sumi ng a worst ca se alignment based on N=32, maps must be aligne d on
128-by te boundar ies in gather memory. Since both sc atter an d gather maps are main-
tained in gather memory, there are two maps per connection and a requirement for
256-byte gather memory blocks per bi-directional connection. If all of the connec-
tions on an 8 E1 MXT3020 were N=1, then one would use 8 x 32 x 256 bytes = 64
Kbytes for signal maps in this exampl e. If the application use d 128 frames of frame
storage (t he min imum the sof tware as sume s), the frame sto rage woul d use 128 x 32
x 1 x 8 = 32K for frame storage. Consequently, the total Gather Memory requireme nt
would be 32K+2K+2K+64K, which is less than 128K.
INTERFACE PINS
The MXT3020 provides a complete interface to the scatter and gather memories,
which are typically implemented with two 64Kx16, one 128Kx16 or two 128Kx16
3.3 volt synchronous SRAMs.
TABLE 14. Scatter and Gather Memory Interface Pins
Pin Function Drive
GATH_ADDR[18:1] Gather Memo ry Address lines Output
GATH_DATA[15:0] Gather Memory Data lines I/O
GATH_WE[1:0] Gather Memory Write Enables Output
GATH_OE[1:0] Gather Memory Output Enables Output
SCAT_ADDR[18:1] Scatter Memory Address lines Outpu t
SCAT_DATA[15:0] Scatter Memory Data lines I/O
SCAT_WE[1:0] Scatter Memory Write Enables Output
SCAT_OE[1:0] Scatter Memory Output Enables Output
80 Version 4.0 MXT3020 Reference Manual
Scatter and Gath er Memory Interfaces
MXT3020 Reference Manual Version 4. 0 81
CHAPTER 5 Port2 Interface
The Port2 Inte rface is t he MXT3020’s connec tion to the MXT3010 dev ice. Thr ough
the Port2 Interface, the MXT3010 can read and write Scatter and Gather memory , the
Task Buffer RAMs, List RAMs, and all internal registers. Once a Port2 transfer
begins, the MXT3 020’s Port2 I nter face d emulti plexes the Po rt2 bu s a nd decod es the
address. If the address maps to this chip, the MXT3020 performs the read or writ e
operation to the register or RAM selected by the address.
Port 2 Interface
Circuit Interface
Scatter MemGather Mem
Links 0-7
Port2 Bus
Interface Interface
Scatter
Task Buffer
RAMs
SDU Scatter Unit
Scatter List RAM
Gather
Task Buffer
RAMs
SDU Gather Unit
Gather List RAM
82 Version 4.0 MXT3020 Reference Manual
Port2 Interface
MXT3020 ADDRESSING
An MXT3020 requires 1 Mbyte of Port2 (P2) address space. Thus, a maximum of
two MXT3020s can reside on a P2 bus unless additional address selection logic is
provided (see “Multiple MXT3020 implementation” on page 130).
Strapping the P2A20 pin
The P2A20 pin of one MXT3020 is strapped low to decode P2 bus address space
0x000000 t o 0x0FFFFF while the P2A20 pin of t he other MXT30 20 is strapped high
to decode P2 address space 0x100000 to 0x1FFFFF.
Slave-only connection
The Port2 Interface provides a slave-only connection to the P2 bus; therefore, all data
transfers to and from the MXT3020 are initiated by the MXT3010.
Burst mode transfers
With one exception, the MXT3020 responds only to burst transfers on the P2 bus.
This all ows the MXT3 020 to coe xist wit h non-bu rst dev ices on t he P2 bus usi ng the
same address space. The one exception is a non-burst read of the Scatter/ Gather Task
Buffer Busy flags. See “Scatter/Gather Task Buffer Busy flags” on page 134.
Restriction on P2 access
MXT3020 internal registers can be written or read only one 16-bit halfword at a time.
Address Space
The breakdown of the MXT3020 address space is shown in Figure 31 on page 83.
MXT3020 Reference Manual Version 4.0 83
MXT3 02 0 addre s s s pace
MXT3020 ADDRESS SPACE
FIGURE 31 MXT3020 address space
0x00000 Scatter Memory (512 Kbytes)
0x80000 Gather Memory (504 Kbytes)
List Blocks, Quiet T ransmit Frames, Tri-State Control (TSC) Maps, and Gather Memory
0xFE000 Co-processor High Memory (7 Kbytes)
0xFFC00 Scatter Task Buffer 0 (64 bytes)
0xFFC40 Scatter Task Buffer 1 (64 bytes)
0xFFC80 Reserved (64 bytes)
0xFFCC0 Reserved (64 bytes)
0xFFD00 Gather Task Buffer 0 (64 bytes)
0xFFD40 Gather Task Buffer 1 (64 bytes)
0xFFD80 Reserved (64 bytes)
0xFFDC0 Reserved (64 bytes)
0xFFE00 Scatter List RAM (128 bytes)
0xFFE80 Gather List RAM (128 bytes)
0xFFF00 Scatter DMU and Gather DMU registers (64 bytes)
(See Figure 32 and Figure 33 on page 84)
0xFFF40 Circuit Interface per-link registers (128 bytes)
(See Figure 34 on page 85)
0xFFFC0 Circuit Interface global and SRTS value registers
0xFFFFF
84 Version 4.0 MXT3020 Reference Manual
Port2 Interface
FIGURE 32 Scatter Data Mover Unit Register Map
FIGURE 33 Gather Data Mover Unit Register Map
1514131211109876543210
0xFFF00 Channel Map Pointer (CMP) [15:0]
0xFFF02 0Instruction Pointer (IP) [5:0] Frame Counter (FC) [8:0]
0xFFF04 00 Transfer Counter (TC) [5:0] 00 Task Buffer Offset (TBO) [5:0]
0xFFF06 FNC H S C T IS EG Immediate (CONS T)
0xFFF08 00000000Command
0xFFF0A Task Timer (TKT)
0xFFF0C Status (STAT)
0xFFF0E 0MAPD [6:0] 00 Fill [5:0]
0xFFF10 0000000000000000
0xFFF12 Start of CRC-10 [5:0] CRC-10 [9:0]
1514131211109876543210
0xFFF20 Channel Map Pointer (CMP) [15:0]
0xFFF22 0Instruction Pointer (IP) [5:0] Frame Counter (FC) [8:0]
0xFFF24 00 Transfer Counter (TC) [5:0] 00 Task Buffer Offset (TBO) [5:0]
0xFFF26 FNC H S C T IS EG Immediate (CONS T)
0xFFF28 00000000Command
0xFFF2A Task Timer (TKT)
0xFFF2C Status (STAT)
0xFFF2E 0MAPD [6:0] 00 Fill [5:0]
0xFFF30 00000 TT [2:0] Threshold Value Register (TVR) [7:0]
0xFFF32 Start of CRC-10 [5:0] CRC-10 [9:0]
MXT3020 Reference Manual Version 4.0 85
MXT3 02 0 addre s s s pace
FIGURE 34 Circuit Interface per-link registers
TDM Link 0 - 3 Register Map TDM Link 4 - 7 Register Map
0xFFF40 Link 0 Configuration 0xFFF80 Link 4 Configuration
0xFFF42 Link 0 Rx Buffer Address counter 0xFFF82 Link 4 Rx Buffer Address counter
0xFFF44 Link 0 Tx Buffer Address counter 0xFFF84 Link 4 Tx Buffer Address counter
0xFFF46 Link 0 TSC Map Address counter 0xFFF86 Link 4 TSC Map Address counter
0xFFF48 Link 0 Service Clock N register 0xFFF88 Link 4 Service Clock N register
0xFFF4A Link 0 Service Clock K register 0xFFF8A Link 4 Service Clock K register
0xFFF4C Link 0 Service Clock L counter 0xFFF8C Link 4 Service Clock L counter
0xFFF4E Link 0 SRTS FTC read back 0xFFF8E Link 4 SRTS FTC read back
0xFFF50 Link 1 Configuration 0xFFF90 Link 5 Configuration
0xFFF52 Link 1 Rx Buffer Address counter 0xFFF92 Link 5 Rx Buffer Address counter
0xFFF54 Link 1 Tx Buffer Address counter 0xFFF94 Link 5 Tx Buffer Address counter
0xFFF56 Link 1 TSC Map Address counter 0xFFF96 Link 5 TSC Map Address counter
0xFFF58 Link 1 Service Clock N register 0xFFF98 Link 5 Service Clock N register
0xFFF5A Link 1 Service Clock K register 0xFFF9A Link 5 Service Clock K register
0xFFF5C Link 1 Service Clock L counter 0xFFF9C Link 5 Service Clock L counter
0xFFF5E Link 1 SRTS FTC read back 0xFFF9E Link 5 SRTS FTC read back
0xFFF60 Link 2 Configuration 0xFFFA0 Link 6 Configuration
0xFFF62 Link 2 Rx Buffer Address counter 0xFFFA2 Link 6 Rx Buffer Address counter
0xFFF64 Link 2 Tx Buffer Address counter 0xFFFA4 Link 6 Tx Buffer Address counter
0xFFF66 Link 2 TSC Map Address counter 0xFFFA6 Link 6 TSC Map Address counter
0xFFF68 Link 2 Service Clock N register 0xFFFA8 Link 6 Service Clock N register
0xFFF6A Link 2 Service Clock K register 0xFFFAA Link 6 Service Clock K register
0xFFF6C Link 2 Service Clock L counter 0xFFFAC Link 6 Service Clock L coun ter
0xFFF6E Link 2 SRTS FTC read back 0xFFFAE Link 6 SR TS FTC read back
0xFFF70 Link 3 Configuration 0xFFFB0 Link 7 Configuration
0xFFF72 Link 3 Rx Buffer Address counter 0xFFFB2 Link 7 Rx Buffer Address counter
0xFFF74 Link 3 Tx Buffer Address counter 0xFFFB4 Link 7 Tx Buffer Address counter
0xFFF76 Link 3 TSC Map Address counter 0xFFFB6 Link 7 TSC Map Address counter
0xFFF78 Link 3 Service Clock N register 0xFFFB8 Link 7 Service Clock N register
0xFFF7A Link 3 Service Clock K register 0xFFFBA Link 7 Service Clock K register
0xFFF7C Link 3 Service Clock L counte r 0xFFFBC Link 7 Service Clock L counter
0xFFF7E Link 3 SRTS FTC read back 0xFFFBE Link 7 SRTS FTC read back
86 Version 4.0 MXT3020 Reference Manual
Port2 Interface
FIGURE 35 Circuit Interface global and SRTS value registers
INTERFACE PINS
TABLE 15. Port2 Interface pins
0xFFFC0 CI Tri-state Control Base Address register
0xFFFC2 CI C onfi guration reg ist er
0xFFFC4 CI Quie t Frame Base Address register
0xFFFC6 CI SRTS FTC registe r
0xFFFC8 CI SRTS Valid Status reg ist er
0xFFFCA CI Status register
0xFFFCC Reserved
0xFFFCE Reserved
0xFFFD0 Link 0 Local SRTS Value
0xFFFD2 Link 1 Local SRTS Value
0xFFFD4 Link 2 Local SRTS Value
0xFFFD6 Link 3 Local SRTS Value
0xFFFD8 Link 4 Local SRTS Value
0xFFFDA Link 5 Local SRTS Value
0xFFFDC Link 6 Local SRTS Value
0xFFFDE Link 7 Local SRTS Value
0xFFFE0 Reserved
Pin Direction Function
P2AD[15:0] I/O Port 2 Address/Data lines
P2AI[3:0] I Port 2 Address Index Bus
P2RQ_ I Port 2 Requ est
P2RD I/O Port 2 Read/Write Select
P2END_ I Port 2 End
P2QBRST I Port 2 Burst
P2TRDY_ O Port 2 Target Ready
P2ASEL_ O Port 2 Address Select
P2A20 I Port 2 Address bit [20] Pol ari ty
MXT3020 Reference Manual Version 4.0 87
CHAPTER 6 Register Refer ence
This chapter contains reference information on each of the following registers and
multi-bit fields within those registers:
Register or multi-bit field
“ACTDS0” on page 103
“Channel Map Pointer (TBR and DMU)” on page 89
“CI Con figurati on regist er” on pa ge 90
“CI Quiet Frame Base Addres s register” on page 92
“CI SRTS FTC register” on page 93
“CI SRTS Valid Status register” on pag e 94
“CI Status register” on page 95
“CI Tri-state Co ntrol Ba se Address register on page 96
“Command register” on page 97
“CRC-10 register” on page 98
“D_DELAY” on page 104
“FILL” on page 114
“FNC” on page 101
“FNET_DIV” on page 109 -
“Frame Counter” on page 102
“Frame Number” on page 113
“Header Bit in Error” on page 100
“Immediate and Control Flags register (T BR and DMU)” on page 99
“In st ruc tion Pointer and Fr a m e Cou nte r on pa g e 102
“ISE G ” on pag e 101
88 Version 4.0 MXT3020 Reference Manual
Register Reference
“Link Con f ig ur ation register” on pa ge 103
“Link FT C counter” on pag e 105
“Link Se r vi ce Cl oc k K regis ter” on page 107
“Link Se rvice Cloc k L co un te r ” on pag e 108
“Link Se r vi ce Cl oc k N regis ter” on page 109
“LINK_SR TS_FTC” on page 105
“Link SRTS Value register” on page 110
“Link Tri-state Control Address counter” on page 111
“Link Tx Buffer Address counter” on page 112
“List Size and Frame Number” on page 113
“LSC_K ” on page 10 7
“LSC_L” on page 108
“LSC_N” on page 109
“MAPD and FILL registers” on page 114
“MAXDS0” on page 91
“MAXRBS” on page 91
“MAXTBS” on page 91
“QUIET_FRAME” on page 92
“RX_ADR” on page 106
“SAR SDU registers” on page 115
“SAR Size and S AR Offset” on page 116
“SRTS_VALUE” on page 110
“Start of Cell (SOC)” on page 100
“Start of CRC-10” on page 98
“Status register” on page 118
“Task Buffer Offset (TBO)” on page 120
“Task Timer regist er” on page 119
“TBR_BSY” on page 118
“Transfer Counter and Task Buffer Offset registers” on page 120
“Transfer Counter (TC)” on page 120
“TSC_BASE” on page 96
“TSCNT” on page 111
“TT register” on page 117
“TVR register” on page 117
“TX_ADR” on page 112
“TxCLK S” on page 103
Register or multi-bit field
MXT3020 Reference Manual Version 4.0 89
Channel Map Pointer (TBR and DMU)
Registers
CHANNEL MAP POINTER (TBR AND DMU)
When combi ned with t he content s of the ISEG regist er (see “I mmediate and Control
Flags register (TBR and DMU)” on pa ge 99), this 16-bit fiel d points to an instruction
in a list block located in Gather Memory . The bits represent Gather Memory address
bits [16:1]. This pointer is loaded from a Task Buffer RAM into the Channel Map-
Pointer r egister in a DMU.
Format in Task Buffer RAMs and DMUs:
Locations: 0xFFC00 (Scatter Task Buffer 0)
0xFFC40 (Scatter Task Buffer 1)
0xFFD00 (Gather Task Buffer 0)
0xFFD40 (Gather Task Buffer 1)
0xFFF00 (Scatt er D MU)
0xFFF20 (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
CMP
Bit Name Function Additional information
15-0 CMP When combined with th e cont ents of the ISEG[1 :0]
register , this 16-bit field points to a n instruction in a
list bloc k lo ca ted in Ga th e r M emo ry. The bi ts rep r e-
sent Gather Memory address bits [16:1].
90 Version 4.0 MXT3020 Reference Manual
Register Reference
CI CONFIGURATION REGISTER
This register controls the operating mode of the Circuit Interface. There is only one
CI Configuration register; it is a read/write register.
Location: 0xFFFC2
Reset Value: 0000 0000 0000 0001
1514131211109876543210
FS_POL
SS_PERR LP_BK FS_EN MAXRBS MAXTBS MAXDS0
FS_MODE
Bit Name Function Additional information
15 FS_POL This bit controls the interpretation of the polarity of the
Frame Sync input.
0 FSYNC Active Level is 1
1 FSYNC Active Level is 0
14-12 SS_PERR These bits control the TDM Request Snap Shot Period.
They determine the rate at which link requests for the
Gather or Scatter Memories are sampled. A setting of
010 causes the sample rate to be 30 times the system
clock an d is the recommende d setting. At this setting, the
following combinations of clock speed and link speed are
valid:
System Clock Max Uni Link Spee d Max Bi Link Speed
33 MHz 8 MHz 4 MHz
40 MHz 8 MHz 6 MHz
50 MHz 8 MHz 8 MHz
11 LP_BK This bit enables link loopback mode.
0 Normal op er a ting Mode
1 In unidirectional mode, all links will loop their
ASER trans mit output back to BSER receive in put.
In bidirectional mode, the ASER transmit output is
looped back to the ASER receive input, and th e
BSER transmit output is looped back to the BSER
receive input.
MXT3020 Reference Manual Version 4.0 91
CI Configuratio n register
Registers
10 FS_EN This bit enables/disables Frame Sync detection. This bit
only applie s to SDT mo de lin k s. UDT m od e lin ks ig no re
this bit. To cause SDT links to acquire Frame Sync
simultaneously, first clear their LkRESET bits (“Link
Configuration register” on page 103) to zero (0) and then
assert this global bit.
0 Disable Frame Sync acquisition (This disab les all
SDT mode links.)
1 Enable Frame Sync acquisition (Th is enables all
SDT mode links.)
9-7 MAXRBS These bits specify the maximum amount of TDM to
ATM receive frame st orage allocated for any link in the
system.
0 64 frames
1 12 8 frames
2 25 6 frames
3 51 2 frames
6-4 MAXTBS These bits specify the maximum amount of ATM to
TDM transmit frame sto rage a lloc ated fo r a ny li nk in the
system.
0 64 frames
1 12 8 frames
2 25 6 frames
3 51 2 frames
3-1 M AXDS0 These bits specify the maximum number of DS0's per
frame for any link in the system.
024
132
264
396
4128
0 FS_MODE This bit determines the frame sync source for all of the
links. Th is b it mu st b e cleare d to zero (0) whe n any link s
are in the bidirectional mode.
0 Frame Sync from Frame Sync pin
1 F rame Sync from link BSCE pin
Bit Name Function Additional information
92 Version 4.0 MXT3020 Reference Manual
Register Reference
CI QUIET FRAME BASE ADDRESS REGISTER
An 11-bit value in this register defines the base address of the Quiet Frame in Gather
Memory. Additional b its i ndicat e the t ype of SRAM us ed, cont rol ac cess t o the hi gh
memory space (FE000 - FFC00), and enable the quiet logic. There is only one CI
Quiet Frame Base Address register; it is a read/write register.
Location: 0xFFFC4
Reset Value: 0000 0000 0000 0000
1514131211109876543210
QUIET_FRAME
Reserved
GATH_4M
SCAT_4M
EN_HMEM
EN_QUIET
Bit Name Fun ct ion Addition al Informa tio n
15-5 QUIET_FRAME Thes e bits define the base address of the
Quiet Frame in Gather Memo ry. “Quiet Logic” on page 43
4 Reserved
3 GATH_4M Set this bit to one (1) if 256K x 16 (4Mb)
SRAMs are used to im plement Gathe r Me m -
ory. Otherwise, write as zero (0).
“GATH_4M (Bit 3)” on
page 42
2 SCAT_4M Set this bit to one (1) if 256K x 16 (4Mb)
SRAMs are used to implement Scatter Mem-
ory. Otherwise, write as zero (0).
“SCAT_4M (Bit 2)” on
page 42
1 EN_HMEM This bit enables MXT3020 response to Port
2 access in the Co-Processor High Memory
Space (i.e. FE000 - FFC00).
0 Access to high memory is disabled
1 Access to high memory is enabled
0 EN_QUIET This bit enables the quiet logic. “Quiet Logic” on page 43
0 Qui et logic i s disabl ed
1 Quiet logic is enabled
MXT3020 Reference Manual Version 4.0 93
CI SRTS FTC register
Registers
CI SRTS FTC REGISTER
The value in the CI SR TS FTC register represents the number of service clock1 peri-
ods betwee n updates of the Link SRTS Value register (see “Link SRTS Value regis-
ter” on page 110). Whene ver a Link FTC count er co unts do wn to ze ro, it is r eloade d
from the CI SRTS FTC regis ter, which is typically set to 3008. There is onl y one CI
SRTS FTC register; it is a read/write register..
1. The service clock rate for a T1 facility is 1.544 MHz.
Location: 0xFFFC6
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved CI_SRTS_FTC
Bit Name Function Additional information
15-12 Reserved
11-0 CI_SRTS_FTC These bits are the numb er of serv ice cloc k pe ri-
ods between Local SRTS samples of the network
clock counter. Service clock periods are cou nted
by FTC counters in each link. The bits in this
register are used to refresh those counters.
Figure 17 on page 33
94 Version 4.0 MXT3020 Reference Manual
Register Reference
CI SRTS VALID STATUS REGISTER
This stat us regi ster i ndicat es whethe r a link has a valid SRTS value latched . When a
link’s SRTS value is read by the SWAN processor in the MXT3010, its respective
valid b it is clea red. There is onl y one CI SRTS Valid St atus reg ister; it i s a re ad-onl y
register..
Location: 0xFFFC8
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved SRTS
VALID
7
SRTS
VALID
6
SRTS
VALID
5
SRTS
VALID
4
SRTS
VALID
3
SRTS
VALID
2
SRTS
VALID
1
SRTS
VALID
0
Bit Name Function Additional information
15-8 Reserved
7-0 SRTS_VALID nThese bits indicate, on a bit-per-link basis,
whether the link corresponding to that bit has a
vali d SRTS value latched.
“CI Status register” on
page 46
0 A valid SRTS value has not been latch ed
1 A valid SRTS value has been latched
MXT3020 Reference Manual Version 4.0 95
CI Status register
Registers
CI STATUS REGISTER
Bits in this register indicate, for ea ch link, whether that link has acquired Frame Sync
or has l ost Frame Sync. The re is only on e CI Stat us register; i t is a read -only register..
Note: n represents the link number, where
Location: 0xFFFCA
Reset Value: 0000 0000 0000 0000
1514131211109876543210
ACQ7 LOST7 ACQ6 LOST6 ACQ5 LOST5 ACQ4 LOST4 ACQ3 LOST3 ACQ2 LOST2 ACQ1 LOST1 ACQ0 LOST0
Bit Name Function Additional information
15, 13, 11, 9, ACQ n 0 Link n has not acquired Frame Sync
7, 5, 3, 1 1 Link n has acquired Frame Sync
14, 12, 10, 8, LOST n0 Link n has not lost Fr ame Sync
6, 4, 2, 0 1 Link n has lost Frame Sync after acquiring
it. When this bit sets, the corresponding
ACQ bit is cl eared. This bi t is cleared by
Link Reset o r Chi p R eset. If a LOST bit is a
zero (0), link n has not lost Frame Sync.
0n7.≤≤
96 Version 4.0 MXT3020 Reference Manual
Register Reference
CI TRI-STATE CONTROL BASE ADDRESS REGISTER
The cont ents of t his r egist er a nd the Tri-stat e Cont rol Ad dress co unter are combined
with the Link ID number (LID) to create an 18-bit pointer to a halfword-aligned entry
in Gather Memory containing the tri-state control map for the link. There is only one
CI Tri-state Control Base Address register; it is a read/write register..
Location: 0xFFFC0
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved TSC_BASE
Bit Name Function Addition al informatio n
15-11 Reserved
10-0 TSC_BASE These bits define the base address of the
Tri-state Control table in Gather Memory. “Creation of the tri-state
control map pointer” on
page 28
MXT3020 Reference Manual Version 4.0 97
Command register
Registers
COMMAND REGISTER
This regi ster is part of the DMUs. It controls the Task Timer and the DMU Halt Flag..
Locations: 0xFFF08 (Scatter DMU)
0xFFF28 (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved S Command Code
Bit Name Function Addition al informatio n
15-8 Reserved
7-0 S-bit and
Command Code This bit and field conta ins the command to be exe-
cuted by the DMU.
Bits
7 654 32 10
1 000 00 00
0 000 00 00
1 000 00 01
0 000 00 01
Halt
Continue
Disable Task Timer
Enable Task Timer
All other codes are reserved
98 Version 4.0 MXT3020 Reference Manual
Register Reference
CRC-10 REGISTER
This regi ster is par t of the DMUs. It contr ols the star ting point of the CRC-10 accum-
mulation process and contains the accumulated CRC-10 partial result.
Locations: 0xFFF12 (Scatter DMU)
0xFFF32 (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
CRC-10 Start of CRC [5:0]
Bit Name Function Additional information
15-6 CRC-10 The value loaded into this field before a scatter/
gather op eration is used as the initia l or seed value
for CRC-10 calculations. The MXT3020 clears
this field at the end of a scatter/gather if CRC-10
was enabled and a function code (FNC) of 01 or
11 was selected. At all other times, this field is
updated with the CRC-10 partial result.
5-0 Start of CRC-10 This field indicates the number of bytes that are to
be processed before CRC-10 calculation begins.
Any value from 0 to 63 may be selected.
MXT3020 Reference Manual Version 4.0 99
Immediate and Control Flags register (T BR and DMU)
Registers
IMMEDIATE AND CONTROL FLAGS REGISTER (TBR AND DMU)
At the co nclusion o f the DMA t hat loads the Task Buf fer RAM, the I mmediate inf or-
mation is automatically loaded into the CONST register in the DMU and the Control
Flag s info rmatio n is automati cally loaded into th e Control Flags in the DMU
Pre-Scatter/Gather Task Buffer RAM format
Locations: 0xFFC06 (Scatter Task Buffer 0)
0xFFC46 (Scatter Task Buffer 1)
0xFFD06 (Gather Task Buffer 0)
0xFFD46 (Gather Task Buffer 1)
0xFFF06 (Scatt er D MU)
0xFFF26 (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Immediate S H T C FNC Reserved
Bit Name Function when written Additional
Information
15-8 Immedi a t e D a t a f or us e by gat h er i m mediate, scatter immediate and
mcast imme diate in structio n s. This reg ister m ust b e loa d ed
to initiate DMU operation.
7S 0
1Scrambling/descrambling is disabled.
Scrambling/descrambling is enabled.
6H 0
1HEC generation/check ing is disabled.
HEC generation/checking is enabled.
5T 0
1Threshold Test is disabl ed
Threshold Test is enabled
4C 0
1CRC-10 operation is disabled
CRC-10 operation is enabled
3-2 FNC 00
01
10
11
Check CRC and save partial result
Check CRC and discard
Generate CRC and save partial result
Generate C RC and append to transmi ssion
00 & 10 used
mid-mes-
sage; 01 &
11 at end
1-0 Reserved
100 Version 4.0 MXT3020 Reference Manual
Register Reference
Post-Scatter/Gather Task Buffer RAM format:
1514131211109876543210
Header Bit in Error
Reserved
C T H Start of Cell (SOC)
Bit Name Function when read Additiona l
Information
15-10 Header Bit in
Error If HEC checking is enabled and a header bit error oc curs,
this field identifies which bit in the 5-byte header was
received in error. Bits 15-13 indicate the byte in error; bits
12-10 indicate the bit in error within the byte. If no header
bit error is detected, this register will return the value 3F.
9 Reserved Reserved - reads as zero (0).
8C 0
1There were no CRC-10 errors detected.
A CRC-10 error was detected.
7T 0
1Threshold T est was successful
Threshold Test c hecking failed
6H 0
1There were no HEC errors detected.
An HEC error was detected; see bits 15-10
5-0 SOC (read) Number of the gathered byte in which the HEC code (indi-
cating the Start Of Cell (SOC)) was found.
MXT3020 Reference Manual Version 4.0 101
Immediate and Control Flags register (T BR and DMU)
Registers
Data Mover Unit format
Note: All of the bits in this register are internal state bits used by the Data Mover Unit (DMU). If
desired, th ey can be accessed for debug purposes, but they are not normally accessed by pro-
grams. Rather, the DMU is programmed by loading the Task Buffer RAMs.
1514131211109876543210
FNC H S C T ISEG Immediate (CONST)
Bit Name Function Additional
Information
15-14 FNC 00
01
10
11
Check CRC and save partial result
Check CRC and discard
Generate CRC and save partial result
Generate CRC and append to transmission
00 & 10 us ed
mid-message;
01 & 11 at end
13 H 0
1HEC generation/checking is disabled.
HEC generation/checking is enabled.
12 S 0
1Scrambling/descrambling is disabled.
Scramblin g/ de scr amb ling is enabled .
11 C 0
1CRC-10 operation is disabled
CRC-10 operation is enabled
10 T 0
1Threshold Test is disabled
Threshold Test is enabled
9-8 ISEG Bits [18:17] of the List Block address in Gather Mem-
ory. These bits are appe nded to the Cha nnel Map Poin ter
and must be initialized by the MXT3010.
7-0 Immediate
(CONST) Data for use by gather immediate, scatter immediate and
mcast immediate instructions.
102 Version 4.0 MXT3020 Reference Manual
Register Reference
INSTRUCTION POINTER AND FRAME COUNTER
This is a regist er in the DMUs.
Locations: 0xFFF02 (Scatter DMU)
0xFFF22(Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Instruction Pointer Frame Counter
Bit Name Function Additional information
15-9 Instruction Pointer This is a 7-bit counter that points to the next
location to be read in the List RAM. Bits [15:9]
represent Instru ction Point er bits [6:0]. Sin ce the
List RAMs are 64x16, only bits [5:0] are
required for addressing, and bit [6] is always
zero.
8-0 Frame Counter This is a 9-bit counter identify ing the da ta frame
within a Link Buf fer in Sc atte r/Gathe r Me mory.
MXT3020 Reference Manual Version 4.0 103
Link Config ura tio n register
Registers
LINK CONFIGURATION REGISTER
This re gister cont rols the op erating mode o f each link pair . The re is one of these read/
write registers for each link pair.
Location: 0xFFFn0 (n = 4 + Link#)
Reset Value: 0000 0000 0000 0001
1514131211109876543210
Reserved
D_FCNT
TxCLKS
ACLK_MD
ACTDS0 BI DTM D_DELAY
LSB_1ST
SRTS_MD
LkRSET
Bit Name Function Additional Information
15-14 Reserved
13 D_FCNT This bi t enables/disables in crementing the frame
count portion
0Enabled
1Disabled
12-11 TxC LKS These bits select the link transmitter cl ock
source “Added detail: Bits 12-10 –
clock sourc e control” on
page 15
0 Internal SRTS Clock
1 External RxCLK Input
2 External TxCLK Input
10 ACLK_MD This bit selects the ACLK pin I/O direction “Added detail: Bits 12-10 –
clock sourc e control” on
page 15
0 Input
1Output
9-7 ACTDS0 These bits indicate the Actual # of DS 0's per
frame. This information is used by the tri-state
enable control map.
“The tri-state enable control
map” on page 28
024
a
132
264
396
4 128 (5-7 are reserved)
104 Version 4.0 MXT3020 Reference Manual
Register Reference
6 BI This bit controls the modes of a link pair. “Added detail: Bit 6 – link
pair mode” on page 19
0 Unidirectional mode
1 Bidirectional mode
5 DTM This bit selects the Data Transfer Mode of the
link pair as sh o w n be low :
0 Unstructured Data Transfer (UDT) mode
1 Structured Data Transfer (SDT) mode
4-3 D_DEL AY These bits con trol the po si tio n of Fr ame Syn c
relative to the first bit of a frame on both recep-
tion and transmission.
Frame Sync to First Data Delay
0 1 cycle
1 2 cycles
2 3 cycles
2 LSB_1ST This bit controls the direction of the link shift
registers, selecting whether the most significant
bit (MSB) or the least significant bit (LSB) is
shifted into the serial line first.
0 MSB first
1 LSB first
1 SRTS_MD This bit controls the mode of the SRTS value
generator. DTM (bit 5)” on page 13
0 Slave mode
1Master mode
0 LkRESET This bit controls the reset state of a link pair.
0 Removes the link from the reset state
1 Places the link in the reset state
a. In DS0 = 24 mode, the MXT3020 expects a 193-bit frame. It strips the in-band Frame Sync pulse
from this frame before forming DS0s in SDT mode.
Bit Name Function Additional Information
MXT3020 Reference Manual Version 4.0 105
Link FTC count er
Registers
LINK FTC COUNTER
The SRTS value generator for each link creates an SRTS value by using an FTC
counter to count a designated number of service periods. A register common to all
links (see “CI SRTS FTC register” on page 93) establis hes the number of service
clock periods to be counted. This number is generally 3008 (decimal). There is one
readable Link FTC counter for each link (see “Link FTC read back” entries in
Figure 34, “Circuit Interface per-link registers,” on page 85). To change the count
used by the Link FTC counter, write the CI SRTS FTC register (page 93).
Location: 0xFFFnE (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved LINK_SRTS_FTC
Bit Name Func tion Additional Inform a tio n
15-12 Reserved
11-0 LINK_SRTS_FTC These bits specify the number of service
cloc k peri od s that ela pse befor e a new SRTS
value is produced.
“Link s er vic e clo c k gene r -
ation registers” on
page 33
106 Version 4.0 MXT3020 Reference Manual
Register Reference
LINK RX BUFFER ADDRESS COUNTER
This register indicates where the next data received on this TDM link pair will be
stored in the Gather Memory. The contents of this counter combined with the li nk
number provide an 18-bit pointer to a halfword-aligned circular queue in Gather
Memory whe re rece ived data c an be wr itten by the Circuit Int erfac e logic.
.
Location: 0xFFFn2 (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
RX_ADR
Reserved
Bit Name Function Additional Informatio n
15-1 RX_ADR These bits contain the Link Rx Buffer Address
counter for this serial pair. These bits correspon d to
the DS0 and F C fields in the figures shown in “Scat-
ter/Gather Memory Address Generation” on page 68.
“Details of the Link Tx/
Rx Buffer Address
counters” on page 25
0 Reserved
Restriction on Link Rx Buffer Address Counter
Values in this regist er can only b e modifi ed when the link i s in the reset state . This restrictio n
does not affect the automatic incrementing that the MXT3020 performs during data transfers.
MXT3020 Reference Manual Version 4.0 107
Link Service Clock K register
Registers
LINK SERVICE CLOCK K REGISTER
The value in this register represents the fraction control numerator used to generate
the link service clock. This is the fine setting of the numerically controlled oscillator
used to generate the ser vi ce c lo ck.There is one of these read/write registers f or each
link.
Location: 0xFFFnA(n = 4 + Lin k #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
LSC_K
Bit Name Function Addition al info rmatio n
15-0 LSC_K These bits contain the fraction control numerator
used to generate th e link service cl ock. “Link service clock gener-
ation registers” on page 33
108 Version 4.0 MXT3020 Reference Manual
Register Reference
LINK SERVICE CLOCK L COUNTER
The value in this counter represents the fraction control denominator used to generate
the li nk service clock. This is a fr ee running counter t h at c an b e r ea d and written for
diagnostic purposes and can be seeded with an initial value. However, the value
loaded into this counter does not alter the effective denominator value, which is
always 65 ,536 (216). This c ount er advances once f or each service cl ock cycle gener-
ated. There is one of these counters for each link.
Location: 0xFFFnC (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
LSC_L
Bit Name Function Addit ion al informatio n
15-0 LSC_L These bits contain the fraction control denomi-
nator used to gen era te the link service clock . “Link service clock gen-
eration registers” on
page 33
MXT3020 Reference Manual Version 4.0 109
Link Service Clock N register
Registers
LINK SERVICE CLOCK N REGISTER
The valu e in this register represents the integer multiple of system clock periods used
to generate the li nk service clock. This is the coarse setting of the numerically con-
trolled oscil lator us ed to generate the service clock. There is one of thes e registers for
each link.
.
Location: 0xFFFn8 (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
FNET_DIV Reserved
EN_CNT
LSC_N
Bit Name Functio n Addition al Informa tio n
15-13 FNET_DIV 000
001
010
011
100
101
110
111
Divide FNET by 1
Divide FNET by 2
Divide FNET by 3
Divide FNET by 4
Divide FNET by 5
Divide FNET by 6
Divide FNET by 7
Divide FNET by 8
“Link Se rvice Cloc k N
register” on page 34
12-8 Reserved
7 EN_CNT This bit enab les the link servi ce clock counters
0Disabled
1Enabled
6-0 LSC_N These bits represent the inte ger multipl e of system
clock per iods used to generate the link service
clock. The rang e of valu es used is 3 t o 127.
“Link service clock gen-
eration registers” on
page 33
Restriction on FNET_DIV bits
Bits [15:8] of this register are write only and read back as all zeroes. All bits in this register
are cleared t o zeroes by Reset. Th us, the FNET_D IV bi ts are write-only and are cleared to
zeroes by Reset.
110 Version 4.0 MXT3020 Reference Manual
Register Reference
LINK SRTS VALUE REGISTER
Each link has a single SRTS generat or con trolled by the SRTS_M D bit f or tha t link
(see “Channel Map Pointer (TBR and DMU)” on page 89). A 4-bit value is latched
into th e local SRTS value each time t he FTC coun ter expir es (see “L ink SRTS Value
register” on page 110). There is one of these read/write registers for each link.
Location: 0xFFFDn (n = Link # *2)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved SRTS_VALUE
Bit Name Function Addit ion al inf o rma tio n
15-4 Reserved
3-0 SRTS_VALUE These bits are the new SRTS value. “Link service clock genera-
tion registers” on page 33
MXT3020 Reference Manual Version 4.0 111
Link Tri-stat e Control Address count er
Registers
LINK TRI-STATE CONTROL ADDRESS COUNTER
The contents of this counter are combined with the Tri-state Control Base Address
register and the Link ID number (LID) to create an 18-bit pointer to a halfword-
aligned entry in Gather Memory containing the tri-state control map for the link.
Location: 0xFFFn6 (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved TSCNT 0
Bit Nam e Function Addit ion al inf o rma tio n
15-5 Reserved
4-1 TSCNT These bits contain the 4-bit Tri-state Control
Address counter for this serial pair. “Creation of the tri-st ate con-
trol map pointer” on page 28
0Reserved
112 Version 4.0 MXT3020 Reference Manual
Register Reference
LINK TX BUFFER ADDRESS COUNTER
This register indicates the location in Scatter Memory from which the next data to be
transmitted on the TDM link will be taken. The contents of this counter combined
with the li nk number provi de an 18- bi t poi nte r to a hal fwor d- ali gne d circul ar queue
in Scatter Memory where transmit link data can be read by the Circuit Interface logic.
.
Location: 0xFFFn4 (n = 4 + Link #)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
TX_ADR
Reserved
Bit Name Function Addition al Informa tio n
15-1 TX_ADR These bits contain the Link Tx Buffer Address
counter for this serial pair. These bits correspond to
the DS0 and FC fields in the figures shown in “Cre-
ation of the tri-state control map point e r” on page 28.
“Details of the Link T x/Rx
Buffer Address counte r s”
on page 25
0Reserved
Restrictions on Link Tx Buffer Address Counter
Values written to this register must be 4 higher than those written to the Link Rx Buffer
Address counter. Values in this register can only be modified when the link is in the reset
state. These restri ct ions do not affect the automat ic incrementing that t he MXT3020 per-
forms during data transfers.
MXT3020 Reference Manual Version 4.0 113
List Size and Frame Numb er
Registers
LIST SIZE AND FRAME NUMBER
This is a register in the Task Buffer RAM. At the conclusion of the DMA that loads
the Task Buffer RAM, the List Size information is automatically loaded into the
MAPD register in the DM U and the Fra me Nu mber information is aut omatically
loaded into the FC register in the DMU.
Locations: 0xFFC02 (Scatter Task Buffer 0)
0xFFC42 (Scatter Task Buffer 1)
0xFFD06 (Gather Task Buffer 0)
0xFFD42 (Gather Task Buffer 1)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
List Size Frame Number
Bit Name Function Additional information
15-9 List Size This is a 7-bit counter indi catin g th e numb er of
instruct ions that have be en placed in the l ist block.
It should be set to n-1, where n is the number of
instruction s in a sin gle c o py of th e list b lock . Th is
information is loaded into the MAPD and Fill reg-
isters in the DMU, where it is used to determine
when the DMU has reached the end of the list
block instructions.
8-0 Frame Number This is a 9-bit counter identifying the data frame
within a Link Buffer in Scatter/Gather Memory.
This informat ion is loaded into the Frame Cou nter
(FC) register in the DMU.
114 Version 4.0 MXT3020 Reference Manual
Register Reference
MAPD AND FILL REGISTERS
These registers, part of the DMUs, report on scatter and gather completions. They
also control threshold testing.
Locations: 0xFFF0E (Scatter DMU)
0xFFF2E(Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved
MAPD Reserved FILL
Bit Na me Function Addition al info rmatio n
15 Reserved
14-8 MAPD This counter, loaded from the List Size in the
T ask Buffer RAM, is used to determine when the
DMU has reached the end of the list block.
7-6 Reserved
5-0 FILL This counter, loaded from the List Size in the
T ask Buffer RAM, is used to determine when the
DMU has reached the end of the list block.
MXT3020 Reference Manual Version 4.0 115
SAR SDU registers
Registers
SAR SDU REGISTERS
These re giste rs ar e part of t he Task Buf f er RAM. In a s catte r oper ation , th ey cont ain
the data to be scatte red. In a ga ther o peration, they cont ain the gathere d data ..
Locations: 0xFFC3E (Scatter Task Buffer 0)
0xFFC7E (Scatter Task Buffer 1)
0xFFD3E (Gather Task Buffer 0)
0xFFD7E (Gather Task Buffer 1)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
SAR SDU bytes
Bit Name Function Addition al informatio n
15-0 SAR SDU bytes SAR SDU bytes
116 Version 4.0 MXT3020 Reference Manual
Register Reference
SAR SIZE AND SAR OFFSET
This regi ster is part of the Task Buffer RAMs. At the conclusion of the DMA that
loads a T a sk Buffer RAM , the SAR Size in formation is au tomatically loaded into the
T ran sfer Count er (TC) in th e DMU and th e SAR Off set informat ion is a utomatica lly
loaded into the Task Buffer Offset (TBO) register in the DMU.
Locations: 0xFFC04 (Scatter Task Buffer 0)
0xFFC44 (Scatter Task Buffer 1)
0xFFD04 (Gather Task Buffer 0)
0xFFD44 (Gather Task Buffer 1)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved SAR Size Reserved SAR Offset
Bit Name Function Additional information
15-14 Reserved
13-8 SAR Size This is a 6-bit counter initialized with the number
of data transfer s to be performed. It shoul d be set
to n-1, where n is the number of data transfers to be
performed (including HEC if enabled). This infor-
mation is loaded in to the Transfer Counter (TC)
register in the DMU.
7-6 Reserved
5-0 SAR Offset The 6-bit value in the SAR Offset field should
equal t he of fset of th e first by te of SAR S DU data.
This informatio n is loaded into the Task Buffer
Offset (TBO) register in the DMU. Since the Task
Buffers are 64 bytes, only bits [5:0] are required for
addressing, and bits [7:6] are always zero.
MXT3020 Reference Manual Version 4.0 117
TT and TVR registe rs
Registers
TT AND TVR REGISTERS
These registers, part of the gather DMU, control threshold testing of gathered data.
Location : 0x FF F30 ( Gathe r DM U)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Reserved TT [2:0] TVR [7:0]
Bit Name Function Additional
information
15-11 Reserved
10-8 TT register This register controls the type of thresholding
done on the gathered data. The thresholding is an
unsigned comparison of ga thered data to the value
in the Threshold Value Register.
000 gath_data [7:0] TVR [7:0]
001 gath_ da ta [7:0] > TVR [7:0]
010 gath_ da ta [7:0] = TVR [7:0]
011 gath_data [7:0] TVR [7:0]
100 gath_data [6:0] TVR [6:0]
101 gath_ da ta [6:0] > TVR [6:0]
110 gath_data [6:0] = TVR [6:0]
111 gath_data [6:0] TVR [6:0]
7-0 TVR re gister This register contains an 8-bit value used for
threshol d test ing .
118 Version 4.0 MXT3020 Reference Manual
Register Reference
STATUS REGISTER
This registe r contains the st atus of the DMU .
Location s: 0xFFF0C (Scatter DMU)
0xFFF2C (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
0000HALTTKT_EN0IIT0
IDU_BSY
DMI_BSY
TBI_BSY
0 0 TBR_BSY
Bit Na me Function Addition al informatio n
15-12 0 Unused
11 HALT DMU Halt Flag
10 TKT_EN Task Time Enabled
90 Unused
8 IIT Illegal Instruction Trap
70 Unused
6 IDU_BSY IDU Busy Flag The IDU_BSY, DMI_BSY, and
TBI_BSY bits are for debug purposes
only.
5 DMI_BUS Y DMI Busy Flag
4 TBI_BSY TBI Busy Flag
30 Unused
20 Unused
1-0 TBR _BSY Task Buffe r Busy Flags Used to detect scatter/ gath er com pleti on
MXT3020 Reference Manual Version 4.0 119
Task Timer register
Registers
TASK TIMER REGISTER
This register, part of the DMUs, is used for performance monitoring.
Location s: 0xFFF0A (Scatter DMU)
0xFFF2A (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
Task Timer (TKT)
Bit Na me Function Addition al info rmatio n
15-0 Task Timer
(TKT) This is a 16-bit counter, intended for perfor-
mance monitoring, that count s clock cycles
while either TBR_BSY flag is set.
120 Version 4.0 MXT3020 Reference Manual
Register Reference
TRANSFER COUNTER AND TASK BUFFER OFFSET REGISTERS
These registers are part of the DMUs. At the conclusion of the DMA that loads the
Task Buf f er RAM, the SAR Size informati on is automatically loa ded into the Trans-
fer Count er registe r , and the SAR Of fset inf ormation is a utomaticall y loaded into the
Task Buffer Offset register.
Locations: 0xFFF04 (Scatter DMU)
0xFFF24 (Gather DMU)
Reset Value: 0000 0000 0000 0000
1514131211109876543210
0 0 Transfer Counter (TC) 0 0 Task Buffer Offset (TBO)
Bit Name Function Additional information
14-8 Transfer
Counter (TC) This is a 6-bit counter loaded from the SAR Size
register in the Task Buff er RAM. It is decremented
after each data transfer is completed.
5-0 Task Buffer
Offset (TBO) This value is used as a counter that points to the
next location to be read or written in the Task
Buffer. Since the Task Buffers are 64 byte s , only
bits [5:0] are required for addressing, and bits [7:6]
are always zero.
MXT3020 Reference Manual Version 4. 0
Section 3 Physical
Specification
The chapte rs in this section provide the address maps, timing, pinning, signals, and
package mechanical and ther mal information for the MXT3020.
Version 4.0 MXT3020 Reference Manual
MXT3020 Reference Manual Version 4. 0 123
CHAPTER 7 Interfacing Guidelines
This chapter provides interfacing guidelines for connecting the MXT3020 to:
Scatt er/Gather Memory
The MXT3010
Other MXT3020’s
This chapter also provides information on clock signal distribution.
124 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
INTERFACING TO SCATTER/GATHER MEMORY
Both the Scatter/Gather memory interfaces have a 16-bit wide data path and each
support up to 512 Kbytes. The memories are pipeline synchronous SRAMs with a 20
ns cycle time. An example is the Micron MT58LC128K18D9LG. Figure 36 shows
the interconnection of the MXT3020 to 512 Kbytes of Scatter and 512K bytes of
Gather memory.
FIGURE 36. Schematic of MXT3020C to Scatter/Gather Memories
Notes: 1 . Table 16 on page 125 shows the contr ol lead con nections f or each SRAM.
2. The MXT3020 receives its clock from FN_CLK1. See “Interfacing the MXT3 020 to the
MXT3010” on page 126.
Bank 1
SCAT_ADDR [17:1]
SCAT_DATA [15:0]
MXT3020
Note 1 Note 2
Addr [16:0]
Data [1 5:0]
GATH_ADDR [17:1]
GATH_DATA [15:0]
Note 1
Bank 1
Note 2
Addr [16:0]
Data [15:0]
Bank 0
Note 2
Addr [16:0]
Data [15:0]
Bank 0
Note 2
Addr [16:0]
Data [15:0]
MXT3020 Reference Manual Version 4.0 125
Interfacin g to Sc at te r/ Gath er Memory
TABLE 16. Scatter/Gather Memory control connections
Signal Scatter Mem
Bank 0 Scatter Mem
Bank 1 Gather Mem
Bank 0 Gather Mem
Bank 1
3020 SWE_1 WEH# WEH# ------ ------
3020 SWE_0 WEL# WEL# ------ ------
3020 SOE_0 OE# ------ ------ ------
3020 SOE_1 ------ OE# ------ ------
SCAT_CE_a
a. At the Scatter Memory, SCAT_CE_ is a connection to GND through a resistor in the range of
120 ohms to 1K ohms.
CE# CE# ------ ------
3020 GWE_1 ------ ------ WEH# WEH#
3020 GWE_0 ------ ------ WEL# WEL#
3020 GOE_0 ------ ------ OE# ------
3020 GOE_1 ------ ------ ------ OE#
GATH_CE_b
b. At the Gather Memory, GATH_CE_ is a connection to GND through a resistor in the ran ge of
120 ohms to 1K ohms.
------ ------ CE# CE#
3020 SCAT_ADDR [18] CE2# CE2 ------ ------
3020 SCAT_ADDR [17:1] ADDR [16:0] ADDR [16:0] ------ ------
VDD CE2 ------ ------ ------
GND ------ CE2# ------ ------
3020 GATH_ADDR [18] ------ ------ CE2# CE2
3020 GATH_ADDR [17:1] ------ ------ ADDR [16:0] ADDR [16:0]
VDD ------ ------ CE2 ------
GND ------ ------ ------ CE2#
FN_CLK2 ------ ------ CLK ------
FN_CLK3 ------ ------ ------ CLK
FN_CLK4 CLK ------ ------ ------
FN_CLK5 ------ CLK ------ ------
VDD GW#, ADV#, ADSP# of all Scatter/Gather SRAMs
GND ADS0#, BWE#, MODE, ZZ of all Scatter/Gather SRAMs
126 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
INTERFACING THE MXT3020 TO THE MXT3010
The MXT3020 c onnects t o the MXT3010 Por t2 inte rface, which supports both bur st
and non-burst trans fer modes. This interface is used to configure and to transfer SAR
SDU data between the MXT3020 and the MXT3010. The MXT3010 can address 2
Mbytes in burst mode and 512 Kbytes in non-burst mode. The P2QBRST signal from
the MXT3010 identifies burst (1) or non-burst (0) cycles. The MXT3020 is a burst-
mode only device and requires a 1 Mbyte address space.
A single MXT3020 can interface directly to the MXT3010. The schematic below
illust rate s the con necti ons betwe en the MXT3 020 and Port 2 of the MXT3010 . Only
the Port2 signals a re shown for clarity. Note that P2A20 is strapped low and therefore
the MXT3020 wil l be mapped into t he lower 1 Mbyt e region. The MXT3 020 should
always be mapped into this space in order to function properly with the framework
of the CircuitMaker application.
FIGURE 37. MXT3020 to MXT3010 interconnection schematic
Notes: 1. The MXT3020 does not us e the P2IR DY_signal.
2.Wiring details for the STBRBSY [1:0] and GTBRBSY [1:0] signals are provided in “Scatter/
Gather Task Buffer Busy flags” on page 134.
P2ADR[15:0]
P2AI[3:0]
P2RQ_
P2QBRST
P2RD
P2TRDY
P2ASEL_
P2END_
P2IRDY_ NC
P2ADR[15:0]
P2AI[3:0]
P2RQ_
P2QBRST
P2RD
P2TRDY
P2ASEL_
P2END_
P2A20
MXT3010 MXT3020
STBRBSY [1:0]
GTBRBSY [1:0]
MXT3020 Reference Manual Version 4.0 127
Interfacing the MXT3020 to the MXT3010
Port2 Burst and Non-Burst Operation
Burst mode
Burst mode transfers consist of an address phase followed by one or more data
cycles. The MXT3010 Port2 DMA controller uses this mode to transfer data an d con-
trol information to the MXT3020 (see “Port2 Interface timing” on page 144) The
MXT3010 initiates all transfers, as the MXT3020 is always a slave device.
Operating in burst mode, the Port2 Interface can access one million 16-bit halfwords.
It does this by using P2AD[15:0] for logical address bits [19:4] and P2AI[3:0] for
logical address bits [3:0].
The MXT3020 adds Wait states as needed, using P2TRDY_.
Non-burst mode
Non-burst mode consists of an address phase followed by a single data phase (read
or write). The MXT3010 Port2 DMA controller uses this mode to select the appro-
priate MXT3020 in multiple-MXT3020 configurations (see “Multiple MXT3020
implementation” on pa ge 130). The MXT3010 also uses this mode, in conjunction
with the MXT3 020, to acc ess non-b urst de vices ( see “MXT30 20 Assist ance to Non-
burst Devi ces” on page 158) and to re ad the Scatter/ Gather Task Buffer busy flags in
the MXT3020(s) (see “Scatter/Gather Task Buffer Busy flags” on page 134).
Operati ng i n non- bur st mode, the Port2 Interf ace can access 512k byt es. It does t hi s
by using P2AI[3:2] for logical address bits [17:15] and P2AD[15:0] for logical
address bits [15: 0].
When non-burst mode is selected, a programmable number of wait states (up to 7
wait states) can be specified within the DMA2R/W instruction.
128 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
The DMA2 instructions
A simplified version of the basi c MXT3010 DMA2 instruction format is shown
below:
DMA2W - Direct Memory operation - Port2 Write
DMA2R - Direct Memory operation - Port2 Read
The rsa, r sb and rla f ields with in the DMA2 instructio n specify t he regist ers that sup -
ply the source and destination address for the DMA transfers. Burst or non-burst
transfer mode is selected by bit 7 of the rsa (source register). Burst transfers are ini-
tiated when rsa [7] = 1, an d non-burst when rs a [7]=0. Dependent on the transfer type
(burst or non-burst mode), the mapping of the bits in rsa and rsb take on different
meanings.
Figure 38 an d T ab le 17 illustrat e the correspondenc e between rsa/r sb register valu es,
the Port2 bus signals, and a logical halfword address for Port2 burst DMA transfers.
FIGURE 38 Diagram of Port2 burst DMA instruction bits
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9876543210
0 1 1 1 1 BC rla rsa Control rsb
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 109876543210
0 1 1 1 0 BC rla rsa Control rsb
15 Unused Unused
08 07 06 05 04 00
P2AD[15:11]
Burst
B
A19 A18 A17 A16 A15
rsa
15 05 04 01
P2AI[3:0]
P2AD[10:0]
A14 A13 A12 A11 A10 A09 A08 A07 A06 A05 A04 A03 A02 A01 A00
00
rsb
MXT3020 Reference Manual Version 4.0 129
Interfacing the MXT3020 to the MXT3010
Figure 39 an d T ab le 18 illustrat e the correspondenc e between rsa/r sb register valu es,
the Por t2 bus si gnals, an d a logic al half word addre ss for Po rt2 non- burst DMA trans-
fers.
FIGURE 39 Diagram of Port2 non-burst DMA instruction bits
.
TABLE 17. Port2 burst DMA instruction bit mapping
Reg Bits Function Port2 Bus Logical Halfword Bit
rsa 15:08 Not used - -
07 Burst bit = 1 (selects burst mode) -
06:05 Not used - -
04:00 Address P2AD[15:11] 19:15
rsb 15:05 Address P2AD[10:0] 14:04
04:01 Address P2AI[3:0] 3:0
00 Discarded - -
TABLE 18. Port2 non-burst DMA instruction bit mapping
Reg Bits Function Port2 Bus Logical Halfword Bit
rsa 15:11 Not used - -
10:08 #wait s [2:0] (selec ts number of wait states) -
07 Burst bit = 0 (selects mode) -
06:05 Address P2AI[3:2] 17:16
04:00 Address P2AD[15:11] 15:11
rsb 15:05 Address P2AD[10:0] 10:0
04:00 Discarded - -
15 Unused 08 07 06 05 04 00
P2AD[15:11]
Burst
B
A17 A16 A15 A14 A13 A12 A11
rsa
15 05 04
P2AD[10:0]
A10 A09 A08 A07 A06 A05 A04 A03 A02 A01 A00
00
rsb
1011 Waits P2AI[3:2]
Unused
130 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
MULTIPLE MXT3020 IMPLEMENTATION
Port2 burst address space can accommodate two MXT3020s; however the Circuit-
Maker application expects each MXT3020 to be mapped into the lower 1 Mbyte
region. Therefore, when interfacing the MXT3010 to multiple MXT3020s, addi-
tional logic is necessary for device selection. A registered 2- to-4 decoder, imple-
mented with a 26V12 PAL (10 ns speed), is used to select an individual MXT3020
with the us e of P2A20. To select a MXT3 020, the regist ered decode r will be read by
the MXT3010 utilizing a Port2 non-bur st read. CircuitMaker will manipulate the
decoder to select a specific MXT3020.
The non-b urs t re ad fr om the reg ister ed dec oder wi ll res ult i n ass erti ng (l ow true ) the
selected MXT3020’s P2A20 input. MXT3020 devices that are not selected will be
mapped in the upper 1 Mbyte region, since their P2A20 input will be negated. Note
that one MXT3020 will be selected to provide the P2ASEL_ for the non-burst cycles.
P2ASEL_ is required for this selection mechanism (see “MXT3020 Assistance to
Non-burst Devices” on page 158)
Port 2 address bits P2AI[3:2] are used to decode the non-burst address space into four
regions. The decoder is selected by a non-burst read cycle in the fourth region by
decoding P2AI[3:2] equal to 11. The least significant address bits (P2AD[1:0]) are
captured by the decoder and determine which MXT3020 is selected. The data
returned by the DMA read should be ignored. Only after an MXT3020 is selected can
Port2 bur st t ransf ers commen ce to c onfigu re or trans fer data . Figu re 40 on page 131
shows a schematic of this implementation, and the source code for the PAL is
included in Appendix B of this document.
MXT3020 Reference Manual Version 4.0 131
Multiple MXT3020 implementation
FIGURE 40. Schematic of circuit for interfacing quad MXT3020’s
Notes:1.Each de vice has a clock input and each is driven by a separate FN_CLK output from the
clock di stributi on circuit shown in Figure 43 on pag e 138.
2. Each de vice shown ha s a r e set input driv en by the RST _ signal. RST_ is synchronous with
FN_CLK. All Port2 devices should have RST_ released on the same clock cycle.
3. Wiring details for the STBRBSY [1:0] and GTBRBSY [1:0] signals are provided in “Scatter/
Gather Task Buffer Busy flags” on page 134.
P2AD[15:0]
P2AI[3:0]
P2RQ_
P2QBRST
P2RD
P2TRDY
P2ASEL_
P2END_
P2IRDY_ NC
P2AD[15:0]
P2AI[3:0]
P2RQ_
P2QBRST
P2RD
P2TRDY
P2ASEL_
P2END_
P2A20
MXT3010 MXT3020 #0
STBRBSY[1:0]
GTBRBSY[1:0]
M20INT
Connect to
corresponding
pins of
MXT3020’s
#1, #2, and #3
PAL26V12
MXT3020_SEL0
MXT3020_SEL1
MXT3020_SEL2
MXT3020_SEL3
To the P2A20 pin
of MXT3020’s
#1, #2, an d #3
respectively.
P2AD[1:0]
P2AI[3:2]
P2RQ_
P2QBRST
P2RD
P2ASEL_
M20INT [#1]
M20INT [#2]
M20INT [#3] To ISCI_C of MXT3010
132 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
DEVICE SELECTION CODE EXAMPLE
The code fragment below selects a particular MXT3020. The DMA2R instruction
transfers a halfword from the source address specified in rsa/rsb to a Cell Buffer
RAM location specif ied in rla. In this example, the source address indentifies the
desired MXT3020 to the registered decoder . The data read is ignored by the software,
but the Cell Buffer RAM location specified by rla will be overwritten.
Due to an error in the MXT3020B, the non-burst read to the decoder must be fol-
lowed by a burst operation (please refer to PR 380 for detailed information). The
MXT3020 sel ect l ines will get asser ted on the next Port 2 bu rst operat ion. The pre vi-
ously selected device will remain selected until this burst operation is completed. A
burst wri te opera ti on is pref er re d, sin ce it s cyc le time i s les s th an a burs t re ad ope ra -
tion. In the code below, suitable for us e wi th t he MXT30 20B and C, a burst write t o
the Circuit Interface Status register is used for this purpose. The Circuit Interface Sta-
tus register is a read-only register and writing to it has no effect.
;;; Routine name: $FI_SelectMXT3020 - Select an MXT3020
;;;
;;; On entry: a0 MXT3020 index (0-3)
;;; On exit: a0-a2 Trashed
;;;
;;; This function selects an MXT3020 by issuing a read
;;; followed by a write to one of the following addresses:
;;;
;;; MXT3020 #0 - 0x600000
;;; MXT3020 #1 - 0x600020
;;; MXT3020 #2 - 0x600040
;;; MXT3020 #3 - 0x600060
; Set up for burst write transfer to Bit Bucket
; For FI_BitBkt, any free CBR space will do.
; We use 0x37E.
; Note: GPB = r51, a0=r0, a1=r1 and a2=r2
#define #$RegSpaceHi 0x008F
#define #$CIStatusReg 0xFFCA
MXT3020 Reference Manual Version 4.0 133
Device sele ction code example
$FI_SelectMXT3020
limd a1 0x60 ; 3020 device select at 0x6000x0
mv GPB a2 ; save RLA register
limd GPB #FI_BitBkt ; destination for dummy read
sftli a0 5 a0 ; adjust the 3020 index to become the
; least significant 16 bits of
; the appropriate device selection
; address
;non-burst read for device selection
dma2r a1/a0 GPB BC/2 ; Read device selection register
mv a2 GPB ; Restore RLA register
;dummy burst write
limd a1 #$RegSpaceHi ; MSBs of CI status register
limd a0 #$CIStatusReg; LSBs of CI status register
dma2w a1/a0 GPB BC/2 ; Burst write to CI statu s reg (r/o)
br
nop
134 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
SCATTER/GATHER TASK BUFFER BUSY FLAGS
The MXT3010 can read the status of the Scatter Task Buffer Busy flags and Gather
Task Buf fer Busy flags f or four MXT3020C devi ces in a singl e non-burst DMA re ad
directed to location 0x400000. This read also clears the flags.
The Scatter/Gather Task Buffer Busy flags also appear on pins 185, 186, 187, and
188. They are tri-stated unless they are being read with a non-burst read. The flags
are a one (1) or logi c high if the ass ociated Task Buf fer is bus y and a zero (0 ) or logic
low if the associated Task Buffer is not busy.
The Scatter and Gather T ask Buffer Busy flags should be wired directly to the P2_AD
lines as shown in Table 19. When wiring a single MXT3020C, use the connections
listed in the MXT3020 #0 column.
TABLE 19.Scatter and Gather Task Buffer Busy flag wiring
Signal MXT3020 #3 MXT3 020 #2 MXT3020 #1 MXT3020 #0
STBRBSY1 P2AD [15] P2AD [11] P2AD [7] P2AD [3]
STBRBSY0 P2AD [14] P2AD [10] P2AD [6] P2AD [2]
GTBRBSY1 P2AD [13] P2AD [9] P2AD [5] P2AD [1]
GTBRBSY0 P2AD [12] P2AD [8] P2AD [4] P2AD [0]
MXT3020 Reference Manual Version 4.0 135
Scatter/Gather Task Buffer Busy flags
Quad MXT3020 layout considerations
The Port2 interface bus is a high speed multiplexed address and data bus that must
be handl ed prope rly t o ensur e prop er sys tem operat ion. Fi gure 41 and Fig ure 42 pro -
vide example designs upon which SPICE modeling has been performed.
FIGURE 41Quad MXT3020 interconnect topology #1
FIGURE 42Quad MXT3020 interconnect topology #2
MXT3020 MXT3020 MXT3010
MXT3020 MXT3020
Port2 Bus
Scale 1”
The shaded area represents the
prox i mi ty of the Po r t2 bu s
signals to pin 1 of each device.
MXT3020 MXT3020 MXT3010 MXT3020
MXT3020
Port2 Bus Scale 1”
136 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
Timing analysis of quad MXT3020 on Port 2
T imin g analyse s of the interco nnection topologie s shown in Figure 41 and Figur e 42
are giv en below. The t wo topologies were si mul ate d using SPICE. Either of the two
interconnection topologies will work; however, topology #1 has better margins.
TABLE 20. Synopsis of MXT3020 and MXT3010 timing requirements
TABLE 21. Simulated interconnect delay
Note:The daisy-chain interconnect delay for the MXT3010 driving to an MXT3020 is worst case
for an “inner” MXT3020. That delay is 0.96 nsec (3.6 allowed)
Port 2 interface timing: 50 MHz / 20 nsec cycle
3020 Setup Required: > 8.5 nsec (control signals worst case)
3020 Setup Required: > 4.5 nsec (address / data)
3020 Hold Required: > 0 nsec
3020 Clock to out: 3 nsec min, 9.5 nsec max (control sigs worst case)
3020 Clock to out: 3 nsec min, 8 nsec max (data out)
3010 Setup Required: > 8 nsec (control signals worst case)
3010 Setup Required: > 4 nsec (address / data)
3010 Hold Required: > 0 nsec
3010 Cl ock to out: 2.2 nsec min, 9.5 nSec max (addr / data)
3010 Cl ock to out: 2 nsec min, 7.9 nSec max (control)
Tolerable interconnect delay:
Control del a y: < 3.6 nsec (3010 - > 3020)
Control del a y: < 2.5 nsec (3020 --> 3010)
Address Delay: < 4 nsec (either direction)
Clustered topology (Topology#1 - Figure 41)
Worst case: MXT3010 (U3) driving furthest MXT3020 (U1)
Interconnect delay: 0.85 nsec (3.6 allowed)
Daisy-chain topology (Topology#2 - Figure 42)
Worst case: Outer MXT3020 (U1 or U5) driving MXT3010 (U3)
Interconnect delay: 2.1 nsec (2.5 all owed)
MXT3020 Reference Manual Version 4.0 137
Scatter/Gather Task Buffer Busy flags
PCB Design Concerns for quad MXT3020
The Port2 interface of the MXT3010 and MXT3020 is a high-speed bidirectional
multiplexed addre ss/data bus. To ensure optimum circu it performance, the Port 2 bus
should be routed on a single pair of layers. This layer pair should be between the 3.3V
plane and the ground plane. This ensures that the signal return currents will be able
to follow the transmission lines. It is recommended that the Port2 bus not be routed
on a lay er which is a djacent to t he 5V plane, as there may be n o 5V decoupling in the
area of this circuit.
138 Version 4.0 MXT3020 Reference Manual
Interfacin g Guid e lin es
CLOCK TREE DISTRIBUTION
The design of the clock tree distribution circuit has two important goals:
1. Reduction of clock skew
To reduce clock skew, it is recommended tha t the designer imple ment the circuit
shown in F igure 43. Th is circ uit uses the Texas In struments CDC586, which is a
clock driver with an integrated PLL. As shown in Table 16 on page 125 and in
Figure 43, the CDC58 6 use s a se par at e dr ive r fo r ea ch s ynch rono us SRAM and
for the MXT3020.
To further control clock skew, it is important to make the impedances of the
traces equal. This can be done by ensurin g that the trace l engths of th e clock and
feedback signals are equal and have minimum vias. In addition, all of the clock
traces should be routed in the same layer.
2. Reduction of clock jitter
To maintain low jitter, the clock edge rate of the MXT3020 FN input must be
kept at 1.5 ns or less. This can be accomplished with the CDC586.
FIGURE 43. Clock Distribution Circuit
Notes: 1.Series termin ation resistors for the FN_CLK le ads should b e placed c lose to the d river pins .
2. There should be no more than a single load on each of the FN_CLK clock leads shown.
3. The feedback etch length from pin 4Y3 to FBIN and the FN_CLK leads should all be the
same length .
1Y1
1Y2
1Y3
2Y1
2Y2
2Y3
3Y1
3Y2
3Y3
4Y1
4Y2
4Y3
FBIN
NC
47 Ohms FN_CLK1
FN_CLK2
FN_CLK3
FN_CLK4
FN_CLK5
47 Ohms
AGND1
AGND1
AVCC
CLR_
OE_
SEL1
SEL0
CLKIN
System Clock
(FN)
4.7K
VDD
+3.3 V
10 µF0.1µF.01µF .001µF
CDC586
MXT3020 Reference Manual Version 4. 0 139
CHAPTER 8 Timing
MXT3020 TIMING - GENERAL INFORMATION
Definition of switching levels
FIGURE 44Switching level voltages
The following switching level information has been used in the generation of the
MXT3020 device timing.
For a low-to-high transition, a signal is considered to no longer be low when it
reaches 0.8 V and is considered to be high upon reaching 2.0 V.
For a high-to-low transition, a signal is considered to no longer be high when it
reaches 2.0 V and is considered to be low upon reaching 0.8 V.
VH
2.0V
0.8V
VL
140 Version 4.0 MXT3020 Reference Manual
Timing
Input clock details
FIGURE 45Input clock waveform (pin FN)
TABLE 22. Input clock timing parameters (in nanoseconds)
1. With the exce pt ion of t he PLL ci rcuit, the MXT3020 is a ful ly s tat i c des ign and
can operate with 1/TC(FN) = 0. The device is characterized for operation
approaching 0 Hz, but is not tested under this condition.
2. In order to maintain low ji tter, pay close attention to the input clock edge rate.
One primary component of jitter occurs only during the input clock state transi-
tion. To reduce this jitter component, Maker recommends that the FN pin be
driven directly from the output of a part designed for clock tree distribution.
Makers refer ence desi gn uses an FCT380 7 device fr om IDT. Other desi gns that
requir e a clock driver with an i ntegrate d PLL use th e CDC586 cloc k driver from
Texas Instruments.
33 MHz 40 MHz 50 MHz
Min Max Min Max Min Max Description
TC(FN) 30.28 (1) 24.98 (1) 19.98 (1) Input clock peri od
TH(FN) .4xTC.6xTC.4xTC.6xTC.4xTC.6xTCInput clock high duration
TL(FN) .4xTC.6xTC.4xTC.6xTC.4xTC.6xTCInput clock low duration
TR(FN) -1.4 -1.4 -1.2 Input clock rise time (2)
TF(FN) -1.4 -1.4 -1.2 Input clock fall time (2)
TC(FN) TH(FN)
TL(FN)
TR(FN) TF(FN)
2.0V
0.8V
MXT3020 Reference Manual Version 4.0 141
Timing
TIMING
This section provides timing tables and diagrams for:
Circuit Interface
Port2 Interface
Scatter/Gather Memo ry Interface
SCSA Bus Timing
MVIP Bus Timing
MXT3020 Assistance to Non-burst Devices
MXT3020 Reset Timing
142 Version 4.0 MXT3020 Reference Manual
Timing
CIRCUIT INTERFACE
This section includes a Circuit Interface timing table and these timing diagrams:
Receive Timing in Unidirectional Mode, Transmit Timing in Unidirectional Mode,
and Receive/Transmit Timing in Bidirectional Mode.
Notes:
1. All units are nanoseconds (n s).
2. The cl ock ment ioned in the descriptions of Txpd, Txdz, Txzd , and Ttsd is the worst-case of
either ACLK, BCLK, or SRT S genera ted at th e ACLK pin.
3. Each figures shows received or transmitted data for various values of D_DELAY. See
“D_DELAY (bits 4 and 3)” on page 14.
4. The numbers shown for 50 MHz operation al so apply at lower operating speeds.
TABLE 23. Circuit Interface timing
Symbol Description 50 MHz (Note 1)
min max
Tfps Rece ive FSYNC Setup - from valid FSYNC to rising edge of BCLK 4.5 -
Tfph Receive FSYNC Hold - valid FSYNC after rising edge of BCLK 0 -
Txpd Transmit Serial Data Delay - from rising clock (Note 2) to serial data
valid 310.5
Txdz Transmit Data Disable Delay - from rising clock (Note 2) to serial data
tri-state 415
Txzd Transmit Data Enable Delay - from rising clock (Note 2) to serial data
valid 513
Trds Receive Serial Data Setup - from valid serial data to falling BCLK 0.5 -
Trdh Receive Serial Data Hold - valid serial data after falling BCLK 0 -
Ttsd Tri-state Enable Delay - from rising clock (Note 2) to valid A/BSCE 5 13
MXT3020 Reference Manual Version 4.0 143
Circ uit Interface
FIGURE 46. Receive timing in unidirectional mode
FIGURE 47. Transmit timing in unidirectional mode
Note:The CLK signal sho w n is the worst-case of ACLK, BCLK, or SRTS generated at the ACLK pin .
FIGURE 48. Receive/Transmit timing in bidirectional mode
Note: The CLK signal shown is the worst-case of ACLK, BCLK, or SRTS generated at the ACLK pin.
BCLK
FSYNC
Tfps
Tfph
BSER
Trds
Trdh
First bit of
new frame if
D_DELAY=00
First bit of
new frame if
D_DELAY=01
First bit of
new frame if
D_DELAY=10
CLK
FSYNC
Tfps
Tfph
ASER
Txpd
First bit of
new frame if
D_DELAY=00
First bit of
new frame if
D_DELAY=01
First bit of
new frame if
D_DELAY=10
CLK
B/ASER
Txpd Txzd
Txdz
3-state
Trds
FSYNC
Tfps Tfph
144 Version 4.0 MXT3020 Reference Manual
Timing
PORT2 INTERFACE TIMING
This section includes a Port2 Interface timing table and these timing diagrams: Port2
Burst W rite Timing (1 W ord), Port2 Burst W rite Timing (4 W ords), Port2 Burst Read
Timing (1 Word), and Port2 Burst Read Timing (2 Words).
Notes:
1. All units are nanoseconds (n s).
2. The Add ress Set-up Time for P2_A20 is 7.5 nano seconds.
3. The numbers shown for 50 MHz operation al so apply at lower operating speeds.
TABLE 24. Port2 Interface timing
Symbol Description 50 MHz (Note 1)
min max
Tads Address set-up time - from valid address to rising FN (Note 2) 3.5
Tadh Address hol d time - valid address af ter rising FN 0.5 -
Tcds Control signal set-up time - from valid control signal to rising FN 6 -
Tcdh Control signal hold time - valid control signal after rising FN 0.5 -
Twds Write Data set-up time - from valid write data to rising FN 3.5 -
Twdh Write Data hold time - valid write data after rising FN 0.5 -
The following two signals are driven and t imed by the MXT3020:
Tcpd Control signal delay - from rising FN to control signal valid 4 10
Trpd Read Data delay - from rising FN to read data valid 4 11
MXT3020 Reference Manual Version 4.0 145
Port2 Interfac e timing
FIGURE 49. Port2 burst write timing (1 halfword)
Note: The P2_BRST signal is not shown in the figure, and is asserted throughout the burst write
transfer
FN
P2_AD [15: 0]
P2_TRDY_
Tcds
Request
P2_RQ_
Tads
P2_ASEL_
STATE
Tadh
Write D a ta
Address Release Bus
P2_RD
Address Data
P2_AI [3:0] 0001
0000
P2_END_
Twds
Twdh
Tcpd
Tcdh
Tcpd
Tcpd
Tcdh
Tcdh
Tcds
Tcds
146 Version 4.0 MXT3020 Reference Manual
Timing
FIGURE 50. Port2 burst write timing (4 halfwords)
Note: The P2_BRST signal is not shown in the figure, and is asserted throughout the burst write
transfer
FN
P2_AD [15: 0]
P2_TRDY_
Tcds
Request
P2_RQ_
Tads
P2_ASEL_
STATE
Tadh
Data 0
Address Release
P2_RD
Address Data 0
P2_AI [3:0]
P2_END_
Twds
Twdh
Data 2 Data 3
Data 1
Data 1 Data 2 Data 3
Tcpd Tcpd
Tcpd Tcpd
Tcds
Tcdh
0001 0010 0011
0000
Tcdh
Tcdh
Tcds
MXT3020 Reference Manual Version 4.0 147
Port2 Interfac e timing
FIGURE 51. Port2 burst read timing (1 halfword)
Notes:
1. The P2_BRST signal is not shown in the figure, and is asserted throughout the burst read trans-
fer.
2. The transfer state immedia te ly aft er the address state is the bus turnaround state.
3. While the figure above shows two wait st ates, there can be any number of wai t states.
FN
P2_AD [15: 0]
P2_TRDY_
Tcds
P2_RQ_
Tads
P2_ASEL_
STATE Address
Request Release
P2_RD
Address
P2_AI [3:0]
P2_END_
Tadh
Read
Data
(Note 2) Wait (Note 3)
Trpd
Tcds
Tcdh
Tcpd
Tcpd
0000 0001
Tcds
Tcdh
Tcpd
Tcpd
Trpd
148 Version 4.0 MXT3020 Reference Manual
Timing
FIGURE 52. Port2 burst read timing (2 halfwords)
Notes:
1. The P2_BRST signal is not shown in the figure, and is asserted throughout the burst read trans-
fer.
2. The transfer state immedia te ly aft er the address state is the bus turnaround state.
3. While the figure above shows one wait state, there can be any number o f wait states.
FN
P2_AD [15: 0]
P2_TRDY_
Tcds
P2_RQ_
Tads
P2_ASEL_
STATE Address
Request Release
P2_RD
Address
P2_AI [3:0]
P2_END_
Tadh
Read 0
Data 1
(Note 2) Wait
Trpd
Read 1
Data 0
Tcds
Tcdh
0001
0000 0010
Tcdh
Tcds
Tcpd
Tcpd Tcpd
Tcpd
MXT3020 Reference Manual Version 4.0 149
Scatter/ Gath er Memo ry I nterfa ce
SCATTER/GATHER MEMORY INTERFACE
This s ection inc ludes a me mory inte rface ti ming tabl e and ti ming diag rams for wo rd
writes, burst byte writes, and burst byte reads.
Notes: 1.All units are nanoseconds (ns).
2.The numbers shown for 50 MHz operation als o apply at lower operating spee ds.
TABLE 25. Scatter/Gather Memory Interface Timing Table
Symbol Description 50 MHz (Note)
min max
Tcpd Control Delay - from rising FN to control valid 3.5 10.5
Tcph Control Hold - valid control after rising FN 3.0 -
Tapd Address Delay - from rising FN t o address valid 3.5 10.5
Taph Address Hold - valid address after rising FN 3.0 -
Twzd Transmit Data Enable Delay from rising FN to write data valid (See Fig-
ure 53 and Figure 54.) 3.5 10.5
Twpd Write Data Delay - from rising FN to write data valid (See Figure 54.) 3 9
Twdz Write Data Disable Delay - from rising FN to write data tri-state (See
Figure 53 and Figure 54.) 411
Trds Read Data Setup - from valid read data to rising FN 2.5 -
Trdh Read Data Hold - valid read data after rising FN 0.5 -
150 Version 4.0 MXT3020 Reference Manual
Timing
FIGURE 53. Scatter/Gather Memory Halfwor d Write Timing
Notes:
1. All signal s shown (except the chip clock, FN) are prefixed by either GATH_ or SCAT_ depend-
ing upon whether they are used with the Gather Memory or Scatter Memory respectively.
2. The Output Enable signals (OE_ [1:0]) are not shown and are in the unasserted state throughout
these write operations.
FN
DATA [15:0]
WE_ [1:0]
Tapd
Address Write Data R elease
ADDR [18:1]
Twzd Twdz
11 11
00
Taph
Tcpd Tcph
STATE
Write Data
MXT3020 Reference Manual Version 4.0 151
Scatter/ Gath er Memo ry I nterfa ce
FIGURE 54. Scatter/Gather Memory Burst Write (Byte) Timing
Notes:
1. All signal s shown (excep t the chip clock, FN) are prefixed by either GATH_ or SCAT_ depend-
ing upon whether they are used with the Gather Memory or Scatter Memory respectively.
2. The Output Enable signals (OE_ [1:0]) are not shown and are in the unasserted state throughout
these write operations.
3. For simplicity, the figure shows a burst write of only four bytes; burst transfers of arbitrary
length are possible, retaining the same timing as that shown.
4. Since the Scatter/Gather memories are random access memories, the addresses used do not need
to be in se quential order.
FN
DATA [15:8]
WE_ [1:0]
Tapd
Address Writ e Byte 0 Release
ADDR [18:1]
Twzd
11 01
Taph
Tcpd Tcph
STATE
01 11
10 10
Twpd
Write By te 2
Write Byte 1 Write Byte 3
Twdz
Byte 0 B yte 1 Byte 2 Byte 3
Address
of Byte 0 Address
of Byte 1 Address
of Byte 2 Address
of Byte 3
DATA [7:0]
152 Version 4.0 MXT3020 Reference Manual
Timing
FIGURE 55. Scatter/Gather Memory Burst Read (Byte/Halfword) Timing
Notes:
1. All signal s shown (except the chip clock, FN) are prefixed by either GATH_ or SCAT_ depend-
ing upon whether they are used with the Gather Memory or Scatter Memory respectively.
2. The Write Enable signals (WE_ [1:0]) are not shown and are in the unasserted state throu ghout
these read operations.
3. For simplicity , the figure shows a burst rea d of only four by tes; burst transfers of a rbitrary lengt h
are possible, retaining the same timing as that shown.
4. Since the Scatter/Gather memories are random access memories, the addresses used do not need
to be in se quential order.
FN
DATA [15:0]
OE_ [1:0]
Tapd
Address Read Byte 2
ADDR [18:1]
11
Taph
Tcpd
STATE
01
Trds
Read Byte 1
Trdh
Address Read Byte 0 Read Byte 3 Release
Tcph
Trdz
11
Byte 1Byte 0 Byte 2 Byte 3
Address
of Byte 0 Address
of Byte 1 Address
of Byte 2 Address
of Byte 3
MXT3020 Reference Manual Version 4.0 153
Status Interfac e
STATUS INTERFACE
This section includes a status timing table and timing diagrams for the GTBRBSY
and STBRBSY flags, pl us the M20INT indicatio n. For further in formation about the
GTBRBSY and STBRBSY flags, see “Interface Pins” on page 71
FIGURE 56. Status interface timing
TABLE 26. Status interface timing table
Symbol Description 50 MHz (Note)
min max
Tfpd BS Y Flag (GTBRBSY or STBRBSY ) Delay - valid flag after rising FN 4 11.25
Tipd M20INT Delay - valid indication after rising FN 3.5 9
FN
BSY
STATE Address
Request Release
M20INT
Read 0
(Note 2) Wait Read 1
Tipd
Tfpd
154 Version 4.0 MXT3020 Reference Manual
Timing
SCSA BUS TIMING
This secti on incl udes the SCSA bus timing for the reco mmen ded 2/4 MHz and 8
MHz imple mentation s. Both ti ming table s and ti ming diagr ams are pr ovided. Fig ure
57 shows the reference SCSA interface circuit on which the timing is based.
FIGURE 57. Computer telephony interface refer e nce circ uit
SCSA Link
ABT126
33K
+5
47
74F08
74F02
4.7K
+5
ASCE (n)
ASER (n)
4.7K
+5
SCSA Bus Clock
33K
+5
PCA EPA03
Programmable
Delay Line
2/4 MHz
(28 ns +/- 2ns)
8 MHz
(18ns +/- 2 ns) Jumper J1
Link Clock
(To MXT3020 BCLK [7:0])
74 AS
1008
74AS
1000A
74 AS
1008
MXT3020 Fra me Sync
74 AS
1008
SCSA Frame Sync
MXT3020 Reference Manual Version 4.0 155
SCSA Bus Timing
Notes: 1.All units are nanoseconds (ns).
2.The numbers shown for 50 MHz operation als o apply at lower operating spee ds.
FIGURE 58. SCSA Bus Timing
Note: The FSYNC pin on the MXT3020 can be programmed (via the Circuit Interface Configura-
tion Register) to accept either a positive or a negative assertion FSYNC signal.
TABLE 27. MXT3020 SCSA Bus Timing (2/4 MHz)
Symbol Description 50 MHz (No t e )
min max
Tfps Rx Frame Sync Setup Time - from valid FSYNC to rising edge of SCLK 3 -
Tfph Rx Frame Sync Hold Time - FSYNC valid from rising edge of SCLK 3 -
Txsdd Tx Output Data Delay - from rising edge of SCLK to valid output or out-
put enabled on the bus 29 47
Trsds Rx Input Data Setup Time - from valid data to falling edge of SCLK 6 -
Trsdh Rx Input Data Hold Time - valid data after falling edge of SCLK 8 -
Txsdz Tx Output Disab le Delay - from the SCLK fa lling edg e to output disabled 29 47
SCLK
FSYNC
SD0-15
last bit (8) first bit (1) bits 2-7 last bit (8)
Txsdz
Trsds
Txsdd
Trsdh
Tfps Tfph
Frame Boundary
Timeslot N Timeslot 0
(Note)
156 Version 4.0 MXT3020 Reference Manual
Timing
Notes: 1.All units are nanoseconds (ns).
2.The numbers shown for 50 MHz operation als o apply at lower operating spee ds.
FIGURE 59. SCSA Bus Timing
Note: The FSYNC pin on the MXT3020 can be programmed (via the Circuit Interface Configura-
tion Register) to accept either a po si tive or negative assertion FSYNC signal.
TABLE 28. MXT3020 SCSA Bus Timing (8 MHz)
Symbol Description 50 MHz (Note )
min max
Tfps Rx Frame Sync Setup Time - from valid FSYNC to rising edge of SCLK 3 -
Tfph Rx Frame Sync Hold Time - FSYNC valid from rising edge of SCLK 3 -
Txsdd Tx Output Data Delay - from rising edge of SCLK to valid output or out-
put enabled on the bu s 19 37
Trsds Rx Input Data Setup Time - from valid data to falling edge of SCLK 6 -
Trsdh Rx Input Data Hold Time - valid data after falling edge of SCLK 8 -
Txsdz Tx Output Disabl e Delay - from the SCL K fa lling ed ge to output disabl ed 19 37
SCLK
FSYNC
SD0-15
last bit (8) first bit (1) bits 2-7 last bit (8)
Txsdz
Trsds
Txsdd
Trsdh
Tfps
Tfph
Frame Boundary
Timeslot N Timeslot 0
(Note)
MXT3020 Reference Manual Version 4.0 157
MVIP Bus Timing
MVIP BUS T IMING
This sect ion includes the MVIP bus ti ming for the recommend ed 2 and 4 MHz imple-
mentations. Both a timing table and timing diagrams are provided.
Notes: 1.All units are nanoseconds (ns).
2.The numbers shown for 50 MHz operation als o apply at lower operating spee ds.
FIGURE 60. MVIP BUS Timing (2/4 MHz)
Note: The FSYNC pin on the MXT3020 can be programmed (via the Circuit Interface Configura-
tion Register) to accept either a positi ve or a negative assertion FSYNC signal.
TABLE 29. MXT3020 MVIP Bus Timing (2/4 MHz)
Symbol Description 50 MHz(Note)
min max
Tfois FOi Setup Time - from valid FSYNC to rising edge of C2i 3 -
Tfoih FOi Hold Ti me - FSYNC valid fro m rising ed ge of C2i 3 -
Tstod STo Data Del ay - from rising edge of C2i to valid outp ut or ou tp ut
enabled on the bus 29 47
Tstis STi Data Setup Time - from valid data to falling edge of C2i 6 -
Tstih Rx Input Data Hold Time - valid data after falling edge of C2i 8 -
Tfois Tfoih
Tstis Tstih
Tstod
C2i
STo
STi
Foi
158 Version 4.0 MXT3020 Reference Manual
Timing
MXT3020 ASSISTANCE TO NON-BURST DEVICES
The P2 Bus will support both bu rst transfe r and non-burst tr ansfer devices wi thin the
same address space. Transfers to/from the two different device types are differenti-
ated by the state of the P2_BURST signal. The signal is asserted for transfers
addressed to a burst device and is negated for transfers addressed to a non-burst
device.
The MXT3020 contains logic whic h will recognize the initiat ion of a non-burst trans-
fer whe n P2RQ_ is a sserted an d P2BURST is not asserted . It will respond t o this con -
dition by driving P2ASEL_ to the negated state and driving P2TRDY_ to the asserted
state unt il it detec ts the ass erti on of P2END_. Since th e MXT3020 provides this sig -
nalling sequence (Figure 61), non-burst devices can be attached to the P2 Bus with
litt le, if a ny, additional logic .
FIGURE 61. Timing for MXT3020 Assistance to Non-Burst Devices
Note: For timings, see Table 24, “Port2 Interfa ce timing, ” on page 14 4
P2_TRDY_
Tcds
P2_RQ_
P2_ASEL_
P2_END_
Tcds
Tcdh
Tcdh
P2_BURST
FN
Tcds
Tcpd
Tcpd
Tcpd
Tcpd
MXT3020 Reference Manual Version 4.0 159
MXT3020 reset timing
MXT3020 RESET TIMING
This section includes a MXT3020 reset timing table and diagram.
TABLE 30. MXT3020 Reset Timing
Notes:
1, All uni ts are nanoseconds (ns).
2. While RST_ can be asserted asynchronously, it must be deasserted syn c hronous to FN.
FIGURE 62. MXT3020 Reset Timing
33 MHz 40 MHz 50 MHz
Par Description
Trdw 1 clock
cycle 1 clock
cycle 1 clock
cycle Minimum number of clock cycles that PLL_Reset must
be asserted for use by the MXT3020. Other devices may
require a longer assertion.
Trdd 150 cloc k
cycles 150 clock
cycles 150 clock
cycles Minimum number of additional clock cycles that RST_
must be held low after PLL_Reset has been deasserted.
Trds 5 ns 5 ns 5 ns Minimum input setup time to rising CLK for removal of
reset signal.
PLL_RST
FN
Trds
Trdw
RST_
Trdd
160 Version 4.0 MXT3020 Reference Manual
Timing
MXT3020 Reference Manual Version 4. 0 161
CHAPTER 9 Pin Information
This chapter provides information on the MXT3020 pinouts. The information
includes pin diagrams, signal descriptions, and pin listings.
162 Version 4.0 MXT3020 Reference Manual
Pin Information
MXT3020 PINOUT
Figure 63 provides a diagram of the MXT3020 pinout.
FIGURE 63MXT3020 package/pin di agram
Note: To conserve space in this figure, SCAT _ADRS signals are shown as SCATADR, SCAT_DAT
signals as SCATDAT, GATH_ADRS signals as GATADR, GATH_DAT signals as GATDAT,
GATH_WE signals as GAT_WE, and GATH_OE signals as GAT_OE. The official signal names
used in Ta ble 38 supe rsede the abbreviations used in t his figure.
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
VSS
VDD
BCLK2
BSER2
BSCE2
ASER2
VSS
ACLK2
VDD
BCLK1
BSER1
BSCE1
ASER1
VSS
ACLK1
VDD
BCLK0
BSER0
BSCE0
ASER0
FSYNC
BSCE5
ASER5
VSS
ACLK5
VDD
BCLK4
BSER4
BSCE4
ASER4
VSS
ACLK4
VDD
BCLK3
BSER3
BSCE3
ASER3
VSS
ACLK3
VDD
BSCE7
ASER7
VSS
ACLK7
VDD
BCLK6
BSER6
BSCE6
ASER6
VSS
ACLK6
VCC_+5V
VDD
VSS
FNET
VDD
VDD
VSS
BCLK5
BSER5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
BSER7
BCLK7
VDD
M20INT
GTBRBSY0
GTBRBSY1
STBRBSY0
STBRBSY1
VSS
GATDAT15
GATDAT14
GATDAT13
GATDAT12
VDD
GATDAT11
GATDAT10
GATDAT9
GATDAT8
VSS
GATDAT7
GATDAT6
GATDAT5
GATDAT4
VDD
GATDAT3
VSS
VDD
VDD
VSS
GATDAT2
GATDAT1
GATDAT0
VSS
GATADR9
GATADR8
GATADR7
GATADR6
VDD
GATADR5
GATADR4
GATADR3
GATADR2
VDD
VSS
VSS
GATADR1
GAT_WE0_
GAT_WE1_
GAT_OE0_
GAT_OE1_
NC
VDD
GATADR18
GATADR17
GATADR16
GATADR15
GATADR14
VSS
GATADR13
GATADR12
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P2TRDY0_
P2QBRST
VSS
TESTE
VSS-PPLUS
VDD_PLLVCC
VSS_PLLGND
FN
VSS_DGND
VDD_DVCC
PLL_RESET
CLKOB
OOLN
VSS
VDD
SCATDAT15
SCATDAT14
SCATDAT13
SCATDAT12
VSS
VSS
VDD
P2AD9
P2AD10
P2AD11
P2RQ0_
VDD
P2AD12
P2AD13
P2AD14
VSS
P2AD15
P2A20
P2END_
VDD
P2RD
VSS
VDD
ORCLRN
P2ASEL0_
GATADR11
GATADR10
VSS
P2A10
P2A11
P2A12
P2A13
VDD
P2AD0
P2AD1
P2AD2
VSS
P2AD3
P2AD4
P2AD5
VDD
P2AD6
P2AD7
P2AD8
VSS
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156
155
154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
VSS
ACLK0
RST_
TRI_
TDO
TDI
TRS
TCK
TMS
VDD
VSS
SCATADR10
SCATADR11
SCATADR12
VDD
SCATADR13
VDD
VSS
SCATADR14
SCATADR15
SCATADR16
VSS
SCATADR17
SCATADR18
NC
SCAT_OE1_
VDD
VSS
VDD
SCAT_OE0_
VDD
VSS
SCAT_WE1_
SCAT_WE0_
SCATADR1
VSS
SCATADR2
SCATADR3
SCATADR4
SCATADR5
VDD
SCATADR6
SCATADR7
SCATADR8
SCATADR9
SCATDAT0
VSS
SCATDAT1
SCATDAT2
SCATDAT3
SCATDAT4
VCC
SCATDAT5
SCATDAT6
SCATDAT7
VDD
SCATDAT8
SCATDAT9
SCATDAT10
SCATDAT11
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
MXT3020-C
M
MAKER 100424
MXT3020 Reference Manual Version 4.0 163
MXT3020 signal descriptions
MXT3020 SIGNAL DESCRIPTIONS
•Port2
Scatter/Gather Memo ry Interface
Circuit Interface
Miscellaneous signals, such as clock, control and test
Power and ground pins
164 Version 4.0 MXT3020 Reference Manual
Pin Information
TABLE 31. Port 2 Interface Signal Description
Pin # Sym bol I/O Name Description
32, 30,
29, 28,
25, 24,
23, 19,
18, 17,
15, 14,
13, 11,
10, 9
P2AD[15:0] I/O1 Port 2 Address/
Data [15:0] This is a 16-bit multiple xed ad dress and bi -direc-
tional data bus. Data is transferred to/from the
MXT3020 over P2AD[15:0]
7, 6, 5,
4P2AI[3:0] IN2 P ort 2 Address
Index Bus In burst mode P2AI[3:0] represent the four least
significant address bits of the 20-bit address. In
non-burst mode P2AI[3:2] represent the two
most significant address bits of the 18-bit
address.
26 P2RQ_ IN2 Port 2 Request This signal indicates that comm and s are in the
active st age of the MXT3010 Port 2 DMA com-
mand queue.
36 P2RD IN2 Port 2 Read /
Write Select The MXT3010 drives this signal during a DMA
transfer to the MXT3020. This signal indicates a
write (0) transfer or a read (1) transfer.
34 P2END_ IN2 Port 2 End The MXT3010 asserts P2END_ (0) to indicate
the last cycle of the transfer.
42 P2QBRST IN2 Port 2 Burst This signal indicates burst (1) or non-burst (0)
transfer mode.
41 P2TRDY_ I/O1 Port 2 Target
Ready P2TRDY_ is used by the MXT3020 to insert
wait states. This sign al is also used in conjunc-
tion with P2ASE L_ to de select (i.e., tri-st ate) th e
MXT3010.
40 P2ASEL_ I/O1 Port 2 Address
Select The MXT3020 drives this signal and selects
address or data cycles . This si gnal is a lso use d in
conjunction with P2 TRDY_ to deselect (i.e., tri-
state) the MXT 3 010.
33 P2A20 IN2 Port2 Address
Bit 20 P2A20 is used to select the 1 Mbyte region in
Port2 address space in which the MXT3020
resides. When P2A20 is low, the lower 1 Mbyte
regi on is selected; hi gh selec ts the upper 1
Mbyte region.
MXT3020 Reference Manual Version 4.0 165
MXT3020 signal descriptions
Note: SCAT_WE_, SCAT_OE_, GATH_WE_, and GATH_OE_ are active low signals.
TABLE 32. Scatter/Gather Memory Interface signal description
Pin # Symbol I/O Name Description
97, 98, 100,
101, 102, 105,
107, 108, 109,
76, 77, 78, 79,
81, 82, 83, 84,
86
SCAT_ADDR
[18:1] OUT 1 Scatter Memory
Address Lines Addr ess bus to external synchronous
SRAM for Scatter Memory.
56, 57, 58, 59,
61, 62, 63, 64,
66, 67, 68, 70,
71, 72, 73, 75
SCAT_DATA
[15:0] I/O 3 Scatter Memory
Data Lines Dat a bus to ext e r nal synchr onous
SRAM for Scatter Memory.
88,87 SCAT_WE_
[1:0] OUT 1 Scatter Memory
Write Enables Write enables to external synchronous
SRAM for Scatter Memory.
95,91 SCAT_OE_
[1:0] OUT1 Scatter Memory
Output Enab le s Output enables to external synchronous
SRAM for Scatter Memory.
233, 234, 235,
236, 237, 239,
240, 1, 2, 214,
215, 216, 217,
219, 220, 221,
222, 226
GATH_ADDR
[18:1] OUT 1 Gather Memory
Address Lines Addr ess bus to external synchronous
SRAM for Gather Memory.
190, 191, 192,
193, 195, 196,
197, 198, 200,
201, 202, 203,
205, 210, 211,
212
GATH_DATA
[15:0] I/O 3 Gather Memory
Data Lines Dat a bus to ext e r nal synchr onous
SRAM for Gather Memory.
228, 227 GATH_WE_
[1:0] OUT 1 Gather Memory
Write Enables Write enables to external synchronous
SRAM for Gather Memory.
230, 229 GATH_OE_
[1:0] OUT 1 Gather Memory
Output Enab le s Output enables to external synchronous
SRAM for Gather Memory.
96, 2 31 No Connect Formerly SCAT_CE_ an d GATH_CE_
166 Version 4.0 MXT3020 Reference Manual
Pin Information
TABLE 33. Circuit Interface signal description
Pin # Symbol I/O Name Description
179, 172, 158,
151, 144, 135,
128, 121
ASER [7:0] I/O 2 Serial Data A
[7:0] In UNI-directional mode ASER [7:0]
are the Tx Data output signals for the
circuit interfaces. In BI-directional
mode ASER [7:0] are Tx and Rx bi-
directional data lines.
181, 174, 161,
153, 146, 137,
130, 123
BSER [7:0] I/O 2 Serial Data B
[7:0] In UNI-directional mode BSER [7:0]
are the Rx Data input signals for the
circuit interface. In BI-directional
mode BSER [7:0] are Tx and Rx bi-
directional data lines.
177, 170, 156,
149, 142, 133,
126, 119
ACLK [7:0] I/O 2 Serial Clock A
[7:0] In UNI-directional mode ACLK [7:0]
are the Tx clocks for ASER[7:0].
ACLKn can be programmed to be an
input or an output. In BI-directiona l
mode ACLK can be programmed to be
the Tx clock for ASER[7:0] and
BSER[7:0] or a tri-state enable for
ASER [7:0]. See “Link Confi gur ation
regist e r” on pa ge 12 .
182,175,162,
154,147,138,
131,124
BCLK[7:0] IN 1 Serial Clock B
[7:0] BCLK [7:0] are the Rx clocks for
ASER [7:0] and BSER [7:0] for both
UNI and BI modes.
180, 173, 159,
152, 145, 136,
129, 122
BSCE(7:0) I/O 2 Serial Control B In UNI-directional mode BSCE (7:0)
are the frame sync si gnals for the cir-
cuit interfaces. In BI-directional mode
BSCE (7:0) are tri-state enables for
BSER (7:0).
160 FSYNC IN 1 Frame Sync Common frame sync input for all links
when FS_MODE bit is 0.
MXT3020 Reference Manual Version 4.0 167
MXT3020 signal descriptions
TABLE 34. Miscellaneous clock, control, and test signal descriptions
Pin # Symbol I/O Name Description
184 M20INT OUT 1 MXT30 20 Interrupt This line i s asserted whenev er th e
MXT3020 completes a scatter or
gather operation. This signal is held
asserted until the TBR_BSY flags
are read via a P2 Non-burst DMA.
185 GTBRBSY0 OUT 1 Gather TBR_BSY0
(Status register bit 0) This pin is asserted when Gather
Task Buffer 0 is busy.
186 GTBRBSY1 OUT 1 Gather TBR_BSY1
(Status register bit 1) This pin is asserted when Gather
Task Buffer 1 is busy.
187 STBRBSY0 OUT 1 Scatter TBR_BSY0
(Status register bit 0) This pin is asserted when Scatter
Task Buffer 0 is busy.
188 STBRBSY1 OUT 1 Scatter TBR_BSY1
(Status register bit 1) This pin is asserted when Scatter
Task Buffer 1 is busy.
166 FNET IN 1 Network Cloc k N etwork clock used for SRTS
118 RST_ IN 1 Re set Reset for MXT3020. Active low.
117 TRI_ IN 1 Tri-state pin for tester. (0) tri-states
116 TDO OUT 1 Test Data Out JTAG Test Data Output
115 TDI IN 1 Test Data In JTAG Test Data Input
114 TRS IN 1 Test Reset JTAG Test Reset Input
113 TCK IN 1 Test Clock JTAG Test Clock Input
11 2 TMS IN 1 Test Mode Select JTAG Test Mode Select Input
53 OOLN OUT 1 Out Of Lock OOLN is asserted (0) when the
MXT3020’s internal PLL is out of
lock. OOLN is negated (1) when the
PLL is locked . This p in is on ly valid
when ORCLRN is asserted low.
52 CLKOB OUT 1 Clock Output B CLKOB is the clock output for tester
44 TESTE IN 3 Test Pin TESTE is a test pin for the PLL.
When (0) test mode is disabled.
39 ORCLRN IN 3 When this pin is asserted (0), the
OOLN pin indicates whether the
PLL is locked or out of lock. This
pin s hould no rmally be pulled high.
168 Version 4.0 MXT3020 Reference Manual
Pin Information
48 FN IN 4 S ystem Clock Syste m Cloc k (typically the same
System Clock used by the
MXT3010)
51 PLL_RESET IN 3 PLL Reset PLL Reset Input
TABLE 35. Power and Ground pin descriptions
Pin # Symbol I/O Name Description
3, 12, 20 , 21, 31,
37, 43, 54, 60,
74, 85, 89, 93,
99, 1 03, 110,
120, 127, 134,
140, 143, 150,
157, 163, 167,
171, 178, 189,
199, 206, 209,
213, 224, 225,
238
VSS GND Grou nd These p ins provi de ground return
paths for the various power sup-
ply inputs.
8, 16, 22 , 27, 35,
38, 55, 65, 80,
90, 9 2 , 94, 104,
106, 111, 125,
132, 139, 141,
148, 155, 164,
165, 168, 176,
183, 194, 204,
207, 208, 223,
218, 232
VDD VDD 3.3 Volt suppl y These pins each req ui re +3.3
VDC (+/- 5%) power supply
input. Th ey are used to supply
current to the 3.3 volt output
buffers and the core logic of the
device.
45 VSS_PPLUS GND PLL GND Shield for PLL
46 VDD_PLLVCC +3.3V PLL VCC Analog p ower for PLL
47 VSS_PLLGND GND Analog ground for PLL
49 VSS_DGND GND Digital ground for PLL
TABLE 34. Miscellaneous clock, control, and test signal descriptions
Pin # Symbol I/O Name Description
MXT3020 Reference Manual Version 4.0 169
MXT3020 signal descriptions
50 VDD_DVCC +3.3V Di gital po wer for PLL
69, 1 69 VCC +5V or
+3.3V +5 VDC (+/-10%) or +3.3 VDC
(+/-5%) Can be co nnected to
+3.3 VDC if 5 volt tolerant I/O’s
are not requ ired.
TABLE 35. Power and Ground pin descriptions
Pin # Symbol I/O Name Description
170 Version 4.0 MXT3020 Reference Manual
Pin Information
JTAG/PLL MISCELLANEOUS PIN TERMINATIONS
The table below indicates how unused pins on the MXT3020 should be terminated
for nor ma l o per ation.
If a pin is not utilized within a design, the following guidelines should be followed:
TABLE 36. Unused pin termina tio n - specific pins
Pin Name Pin # Termination
ORCLRN 39 Pull Upa
a. A resistor in the range of 4.7K ohms to 10Kohms between the pin and +3.3V
TESTE 44 Pull Downb
b. A resistor in the range of 120 ohms to 1K ohms between the pin and GND.
TRI_ 117 Pull Up
TCK 113 Pull Up
TRS 114 Pull Down
TABLE 37. Unused pin termina tio n - general pins
Pin Type Comment Termination
Output (OUT1) These are internally terminated None required
Input (IN 1, IN 2, IN 3, IN 4) If asserted state is logic low (NAME_) Pull Upa
a. A resistor in the range of 4.7K ohms to 10Kohms between the pin and +3.3V
Input (IN 1, IN 2, IN 3, IN 4) If asserted state is logic high (NAME) Pull Downb
b. A resistor in the range of 120 ohms to 1K ohms between the pin and GND
Input/Output (I/O 1, I/O 2, I/O 3) If firmware enables as output See “Output” above
Input/O utput (I/O 1, I/O 2, I/O 3) If firmware enables as input See “Input” above
MXT3020 Reference Manual Version 4.0 171
Pin Listing
PIN LISTING
Table 38 provide s the pin listings fo r th e MXT3 020. Table 39 on page 175 provid es
descriptions of the pin types listed in this table.
.
TABLE 38. Pin Listing
Pin Pin Label Pin Type Pin Pin Label Pin Type
1 GATH_ADRS11 OUT 1 27 VDD +3.3V
2 GATH_ADRS10 OUT 1 28 P 2AD12 I/O 1
3 VSS GND 2 9 P2AD13 I/O 1
4 P2AI0 IN 2 30 P2AD14 I/O 1
5 P2AI1 IN 2 31 VSS GND
6 P2AI2 IN 2 32 P2AD15 I/O 1
7 P2AI3 IN 2 33 P2A20 IN 2
8 VDD +3.3V 34 P2END_ IN 2
9 P2AD0 I/O 1 35 VDD +3.3V
10 P2AD1 I/O 1 36 P2RD IN 2
11 P2AD2 I/O 1 37 VSS GND
12 VSS GND 38 VDD +3.3V
13 P2AD3 I/O 1 39 ORCLRN IN 3
14 P2AD4 I/O 1 40 P2ASEL_ I/O 1
15 P2AD5 I/O 1 41 P2TRDY_ I/O 1
16 VDD +3.3V 42 P2QBRST IN 2
17 P2AD6 I/O 1 43 VSS GND
18 P2AD7 I/O 1 44 TES TE IN 3
19 P2AD8 I/O 1 45 VSS_PPLUS GND
20 VSS GND 46 VDD_PLLV CC +3.3 V1a
21 VSS GND 47 VSS_PLLGND GND
22 VDD +3.3 48 FN IN 4
23 P2AD9 I/O 1 49 VSS_DGN D GND
24 P2AD10 I/O 1 50 VDD_DVCC +3.3V
25 P2AD11 I/O 1 51 PLL_RESET IN 3
26 P2RQ0_ IN 2 52 CLKOB OUT 1
172 Version 4.0 MXT3020 Reference Manual
Pin Information
53 OOLN OUT 1 87 SCAT_WE0_ OUT 1
54 VSS GND 88 SCAT_WE1_ OUT 1
55 VDD +3.3V 89 VSS GND
56 SCAT_DAT15 I/O 3 90 VDD +3.3V
57 SCAT_DAT14 I/O 3 91 SCAT_OE0_ OUT 1
58 SCAT_DAT13 I/O 3 92 VDD +3.3V
59 SCAT_DAT12 I/O 3 93 VSS GND
60 VSS GND 94 VDD +3.3V
61 SCAT_DAT11 I/O 3 95 SCAT_OE1_ OUT 1
62 SCAT_DAT10 I/O 3 96 No connect
63 SCAT_DAT 9 I/O 3 97 SCAT_ADRS18 OUT 1
64 SCAT_DAT 8 I/O 3 98 SCAT_ADRS 17 OUT 1
65 VDD +3.3V 99 VSS GND
66 SCAT_DAT7 I/O 3 100 SCAT_ADRS16 OUT 1
67 SCAT_DAT6 I/O 3 101 SCAT_ADRS15 OUT 1
68 SCAT_DAT5 I/O 3 102 SCAT _ADRS14 OUT 1
69 VCC +5V / 3. 3V 103 VS S GND
70 SCAT_DAT4 I/O 3 104 VDD +3.3V
71 SCAT_DAT3 I/O 3 105 SCAT _ADRS13 OUT 1
72 SCAT_DAT2 I/O 3 106 VDD +3.3V
73 SCAT_DAT1 I/O 3 107 SCAT_ADRS12 OUT 1
74 VSS GND 108 SCAT_ADRS11 OUT 1
75 SCAT_DAT0 OUT 1 1 09 SCAT_ADRS10 OUT 1
76 SCAT_ADRS9 OUT 1 110 VSS GND
77 SCAT_ADRS8 OUT 1 111 VDD +3.3V
78 SCAT_ADRS7 OUT 1 112 TMS IN 1
79 SCAT_ADRS6 OUT 1 113 TCK IN 1
80 VDD 3.3V 114 TRS IN 1
81 SCAT_ADRS5 OUT 1 115 TDI IN 1
82 SCAT_ADRS4 OUT 1 116 TDO OUT 1
83 SCAT_ADRS3 OUT 1 117 TRI_ IN 1
84 SCAT_ADRS2 OUT 1 118 RST_ IN 1
85 VSS GND 119 ACLK0 I/O 2
86 SCAT_ADRS1 OUT 1 120 VSS GND
TABLE 38. Pin Listing
Pin Pin Label Pin Type Pin Pin Label Pin Type
MXT3020 Reference Manual Version 4.0 173
Pin Listing
121 ASER0 I/O 2 155 VDD +3.3V
122 BSCE0 I/O 2 156 ACLK5 I/O 2
123 BSER0 I/O 2 157 VSS GND
124 BCLK0 IN 1 158 ASER5 I/O 2
125 VDD +3.3V 159 BSCE5 I/O 2
126 ACLK1 I/O 2 160 FSYNC IN 1
127 VSS GND 161 BSER5 I/O 2
128 ASER1 I/O 2 162 BCLK5 IN 1
129 BSCE1 I/O 2 163 VSS GND
130 BSER1 I/O 2 164 VDD +3.3V
131 BCLK1 IN 1 165 VDD +3.3V
132 VDD +3.3V 166 FNET IN 1
133 ACLK2 I/O 2 167 VSS GND
134 VSS GND 168 VDD +3.3V
135 ASER2 I/O 2 169 VCC 5V/3.3V
136 BSCE2 I/O 2 170 ACLK6 I/O 2
137 BSER2 I/O 2 171 VSS GND
138 BCLK2 IN 1 172 ASER6 I/O 2
139 VDD +3.3V 173 BSCE6 I/O 2
140 VSS GND 174 BSER6 I/O 2
141 VDD +3.3V 175 BCLK6 IN 1
142 ACLK3 I/O 2 176 VDD +3.3V
143 VSS GND 177 ACLK7 I/O 2
144 ASER3 I/O 2 178 VSS GND
145 BSCE3 I/O 2 179 ASER7 I/O 2
146 BSER3 I/O 2 180 BSCE7 I/O 2
147 BCLK3 IN 1 181 BSER7 I/O 2
148 VDD +3.3V 182 BCLK7 IN 1
149 ACLK4 I/O 2 183 VDD +3 .3 V
150 VSS GND 184 M20INT OUT 1
151 ASER4 I/O 2 185 GTBRBSY0 OUT 1
152 BSCE4 I/O 2 186 GTBRBSY1 OUT 1
153 BSER4 I/O 2 187 STBRBSY0 OUT 1
154 BCLK4 IN 1 188 STBRBSY1 OUT 1
TABLE 38. Pin Listing
Pin Pin Label Pin Type Pin Pin Label Pin Type
174 Version 4.0 MXT3020 Reference Manual
Pin Information
189 VSS GND 215 GATH_ADRS8 OUT 1
190 GATH_DAT15 I/O 3 216 GATH_ADRS7 OUT 1
191 GATH_DAT14 I/O 3 217 GATH_ADRS6 OUT 1
192 GATH_DAT13 I/O 3 218 VDD +3.3V
193 GATH_DAT12 I/O 3 219 GATH_ADRS5 OUT 1
194 VDD +3.3V 220 GATH_ADRS4 OUT 1
195 GATH_DAT11 I/O 3 221 GATH_ADRS3 OUT 1
196 GATH_DAT10 I/O 3 222 GATH_ADRS2 OUT 1
197 GATH_DAT9 I/O 3 223 VDD +3.3V
198 GATH_DAT8 I/O 3 224 VSS GND
199 VSS GND 225 VSS GND
200 GATH_DAT7 I/O 3 226 GATH_ ADRS1 OUT 1
201 GATH_DAT6 I/O 3 227 GATH_ WE0_ OUT 1
202 GATH_DAT5 I/O 3 228 GATH_ WE1_ OUT 1
203 GATH_DAT4 I/O 3 229 GATH_ OE0_ OUT 1
204 VDD +3.3V 230 GATH_OE1_ OUT 1
205 GATH_DAT3 I/O 3 231 No connect
206 VSS GND 232 VDD +3.3V
207 VDD +3.3V 233 GATH_ADRS18 OUT 1
208 VDD +3.3V 234 GATH_ADRS17 OUT 1
209 VSS GND 235 GATH_ADRS16 OUT 1
210 GATH_DAT2 I/O 3 236 GATH_ADRS15 OUT 1
211 GATH_DAT1 I/O 3 237 GATH_ADRS14 OUT 1
212 GATH_DAT0 I/O 3 238 VSS GND
213 VSS GND 239 GATH_ADRS13 OUT 1
214 GATH_ADRS9 OUT 1 240 GATH_ADRS12 OUT 1
a. See “VDD_PLLVCC decoupling” on page 180.
TABLE 38. Pin Listing
Pin Pin Label Pin Type Pin Pin Label Pin Type
MXT3020 Reference Manual Version 4.0 175
Pin Listing
Table 39 provides descriptions for the pin types referred to in Table 38 on page 171.
For the pr oper treatment of pins that are not utilized within a design, see Table 37,
“Unused pin termination - general pins,” on page 170.
TABLE 39. Pin Type Descriptions
Pin type Description
IN 1 Input buffer, 5V to lerant, 3 .3V Schmitt Input
IN 2 Input buffer, 5V tolerant, 3.3V TTL Input
IN 3 Input buffer, 3.3V CMOS Input
IN 4 Input buffer, 5V tolerant, 3.3V CMOS Input, PLL REFCLK
OUT 1 Tri-state-able outpu t b uffer, 4 ma source, Noise-isolated, 3. 3V TTL
I/O 1 Bi-directional buffer, 4 ma source, 5V tolerant, 3.3V TTL Input
I/O 2 Bi-directional buffer, 8 ma source, 5V tolerant, 3.3V TTL Input
I/O 3 Bi-directional buffer, 4 ma source, 3.3V TTL Input, not 5V tolerant
+3.3V + 3.3 VDC (±5%)
+3.3V1 +3.3 VDC (±5%) Power for PLL; see “VDD_PLLVCC decoupling” on page 180
+5V/3.3V +5 VDC (±10%). Th is sup ply can be 3.3 Volts if 5 Volt tolerant I/O’s aren’ t ne cessary.
GND Ground
176 Version 4.0 MXT3020 Reference Manual
Pin Information
MXT3020 Reference Manual Version 4. 0 177
CHAPTER 10 Electrical Parameters
This chapter provides information about the ele ctr i cal parameters of the MXT3020.
The following topics are included:
MXT3020 Operating conditions and maximum ratings
MXT3020 Power sequencing
MXT3020 Phase Lock Loop (PLL) implementation
178 Version 4.0 MXT3020 Reference Manual
Electrical Parameters
MXT3020 MAXIMUM RATINGS AND OPERATING CONDITIONS
TABLE 40. Absolute maximum ratings1 (VSS = 0V)
TABLE 41. Recommended operating conditions
Symbol Parameter Min Max Units
VDD3 3.3 volt supp ly -0.3 3.63 V
VDD5 I/O supplya
a. VDD5 must be 5 volts only if 5-volt tolerant I/Os are required. If such I/O s are not required,
VDD5 can be 3.3 V.
VDD3 7.0 V
VIN Input voltage
(IN1, IN2, IN3, IN4, I/O1, I/02) -0.5 VDD5 + 0.3 V
ICLAMP Input clamp current -10 10 ma
TAOperating free-air temperature range 070 °C
TSTG Storage temperature range -40 125 °C
1. Stresses beyond the “Absolute maximum ratings” may cause permanent damage to the device.
These are stress ratings only. Operation at conditions beyond the in dicated “Reco mmended
operating conditions” is not recommended and may adversely affect device reliability.
Symbol Parameter Min Max Units
VDD3 3.3 vol t supply ( 5% tole rance) 3.135 3.47 V
VIH High-level input voltagea
a. Characterized with VDD3 10% tolerance range (2.97V - 3.63V).
2VDD5+.3 V
VIL Low-level input voltageb
b. Characterized with VDD3 10% tolerance range (2.97V - 3.63V).
-0.3 0.8 V
Output current - OUT1 4ma
IOH & IOL Output current - I/O1 4ma
Output current - I/O2 8ma
TJOperating junction temperature 0125 °C
MXT3020 Reference Manual Version 4.0 179
MXT3020 power sequencing
DC electrical characteristic s
TABLE 42. DC Electrical characteristics
MXT3020 POWER SEQUENCING
W ith the exception of optional use of VDD5 as a bias voltage for diodes in the output
driver section, the MXT3020 uses a sin gle voltage, +3.3 VDC ±5 %. Therefore , there
is no need to follow multiple voltage power sequencing rules.
Symbol Parameter Min Max Units
3.3 volt supply current (33 MHz) 212 mA
ICC3 3.3 volt supply current (40 MHz) 258 mA
3.3 volt supply current (50 MHz) 303 mA
3.3 volt supply current (60 MHz) 379 mA
ICC5a
a. The VDD circuit is a clamping diode providing overshoot protection. ICC5 = Iclamp = 10 ma.
The total ICC for the MXT3020 is ICC3 + ICC5.
5 volt supply current 10 mA
VOH VDD = min, IOH = max 2.4 V
VOL VDD = min, IOH = max 0.4 V
CIPin capacitance Typ 6pF
LIPin inductance 810 nH
180 Version 4.0 MXT3020 Reference Manual
Electrical Parameters
MXT3020 PLL CONSIDERATIONS
Overview
The MXT3020 h as an i ntern al Phas e Lock Loop (PLL ) which i t use s to gen erate the
on-chip clock. This PLL allows the on- chip clock tree delay to be neutralized, and
optimum perf ormance of the IC to be obtai ned. The on-ch ip PLL can be af fec ted by
externa l circuit noi se, so caref ul circuit design must be emplo yed to opt imize the per -
formance of the PLL.
Degradat ion of the P LL performanc e manifest s itself as jitter. This jitte r is measur ed
as the timing variation of the chip’ s internal clock to a stable reference clock supplied
to the chip on the FN pin (pin 48). The internal clock can be observed directly; any
jitter on the internal clock will show up as jitter on the CLKOB signal (pin 52). Jitter
will cause a variation in the timing of the chip relative to the board clock. The timing
variat ion will af fect setup and hold t iming and erode timing mar gins at the chip int er-
face.
The following sections cover circuit design issues which affect the operation of the
PLL. Key areas of inter est are de -coupling , creatin g a quiet PLL VDD, and ensuring
a good PCB layout of the PLL area.
VDD_PLLVCC decoupling
The PLL has a separa te power pin labeled VDD_PLLVCC (pin 46). This pin must be
supplied with a very stable voltage level and should be well decoupled. The current
draw of this pin is very low, 2.5 mA nominal. The low current draw allows the volt-
age to be isolated from the 3.3V power plane with a resistor. Due to the low current
draw, a resist or is recommende d for isola ting this suppl y from the main power plane.
The VDD_ PLLVCC pin should also be bypassed with a combina tion of a 10µF tan-
talum cap and a 0.01µF ceramic cap as shown in Figure 64.
If the VDD_PLLVCC pin is supplied voltage from a linear regulator, the designer
must ensure that enough current is being dr awn to keep the regulator in regulation.
The output of a linear regulator is essentially noise free.
MXT3020 Reference Manual Version 4.0 181
MXT3020 PLL considerat ions
While not required, it is highly recommended that VSS_PLLGND have its own via.
FIGURE 64Generating a quiet VDD_PLLVCC
General decoupling
The MXT3020 must be prope rly decoupl ed to ens ure clea n PLL operat ion. The PLL
is most sensitive to noise on the VDD supply. VDD noise contains both low fre-
quency and high frequency components. Power supply switching noise or insuffi-
cient bul k decoupling ca uses low frequency VDD nois e. The switching of the digi tal
logic dr ivers cau ses high fr equency noi se. Both of t hese noise sou rces must be taken
into account to ensure optimum performance.
The MXT3020 i s desi gned i n a h igh sp eed CMOS pr ocess. The dev ice h as 3.3V out-
put dri vers, and thes e output drivers r equire go od decoupl ing to e nsure opt imum per-
formance. There should be sixteen high frequ ency deco upling caps between the 3.3V
plane and t he gr ound plane. The prefer red value is 0.01µF. These should be arrayed
around t he chip, with four decoupling caps installe d on each si de. Additiona lly , there
should be a minimum 20 µF of bulk de coupling on the supply vo ltage (VDD) n earby
to the chip. This can be a single 22µF tantalum capacitor , or preferably a pair of 10µF
tantalum capacitors.
In a switching power supply environment, it is beneficial to filter the switching noise.
This can be acc omplished by filt ering the MXT3020’s VDD with a ferri te bead. The
ferrite bead works in conjunction with the bulk decoupling capacitors to effectively
filte r the power suppl y switch ing nois e. The ferr ite bea d must be sized to han dle the
current draw of the entire chip. An appropriate part is the FairRite 2743021446 sur-
face mount ferrite bead.
VDD Plane
10 Ohms
VDD_PLLVCC
10 µF.01 µF
Locate cl ose to
pin 46
(Pin 46)
(+3.3 Volt s)
182 Version 4.0 MXT3020 Reference Manual
Electrical Parameters
FIGURE 65MXT3020 decoupling capacitor location
Figure 65 shows the optimal location of the decoupling capacitors around the
MXT3020. This diagram depicts the location of 0805 size 0.01µF capacitors under
the chip pin pads on th e bottom s ide of the boar d. The capaci tors are l ocated close to
the ass ociat ed power pins. The capa citor shoul d shar e a common via wit h the power
pin of the chi p with a short and wide etch. The same sh ould be done with the gr ound
connections. Etch connections between the devices and the planes should be made as
short as possible.
Reference clock jitter
The PLL of the MXT3020 locks the internal chip clock to the reference clock sup-
plied to the dev i ce. The PLL will not necessar i ly be able to track jitt er wh ich is on
the reference clock. If there is significant jitter on the reference, and the chip clock
does not track it, the jitter will cause a reduction in timing margin at the chip inter-
face. If reference clock jitter is present, the system timing budget should be derated
by that amount.
Jitter on the re ference clock can be caused by power supply noise affecting compo-
nents o f the cl ock genera tion and distri bution ci rcuit. One potenti al sourc e of ji tter is
power supply noise or poor decoupling of crystal osci ll at ors . Noi se on the oscillator
power pin , whether from the bo ard or self -induced, c an convert to timing jitter at the
3.3 V Bypass
10 µF Cap
10µF Cap
MXT3020
.01 µF C ap
MXT3020 Reference Manual Version 4.0 183
MXT3020 PLL considerat ions
oscillator output. Some devices are better than others in this aspect of operation. To
reduce this noi se source , ensure t hat the oscillato r is well decouple d accordi ng to the
manufacturers specifications.
The distribution of the reference clock can also introduce cl ock jitter. Designs that
use dividers in the reference clock path must avoid the possibility of simultaneous
switching jitter, which can occur in synchronous counters. PLL clock buffers can also
be a sour ce of jitt er , as these devices are generally s usceptible to power supply no ise,
and can convert this noise to timing jitter.
184 Version 4.0 MXT3020 Reference Manual
Electrical Parameters
MXT3020 Reference Manual Version 4. 0 185
CHAPTER 11 Mechanical and Thermal
Information
This chapte r provid es informati on on the MXT3020 mechanical and thermal pro per-
ties.
186 Version 4.0 MXT3020 Reference Manual
Mechanical and Thermal Information
MXT3020 MECHANICAL/THERMAL INFORMATION
The MXT3020 is packaged in a 240-pin enhanced quad flat-pack. Figure 66 shows
the pin configuration and package dimensions.
FIGURE 66MXT3020 package/pin diagram - top view
MXT3020-C
32.0±0.2
34.6±0.4
32.0
±0.2
34.
6
±0.
4
0.50 0.23±0.07
160
61
120
121
180
181
240
TYP
M
MAK ER 100424
MXT3020 Reference Manual Version 4.0 187
MXT3020 mechanical/ t her m al infor m a tio n
FIGURE 67MXT3020 package/pin diagram - side view
TABLE 43. MXT3020 package summary
* These numbers will vary depending on the board stack-up and orientation. All airflow numbers
are quoted with 1m/sec of air flow over the device.
Storage conditions
The MXT3020 is a level 3 IAW IPC-SM-786A or JESD 22-A112 device. The
MXT3020’ s safe floor life (out of bag) prior to solder reflow is 1 week at 30°C/60%
RH.
Package θ
jc
(×C/W) θ
ja
(×C/W)
Package Type Body size (mm) Lead pitch (mm) *Still Air *Air Flow
PQFP 240 32.0 x 32.0 x 3.6 0.5 6.5 30 20
4.1
MAX
3.40
±0.20
0.25
MIN
0°- 5°
0.60±0.15
0.16±0.04
0.40 MIN
1.30 REF
SEATING PLANE
D
0.10 C
188 Version 4.0 MXT3020 Reference Manual
Mechanical and Thermal Information
MXT3020 Reference Manual Version 4. 0 189
APPENDIX A Acronyms
Acronym Definition
AAL ATM Adaptation Layer
ABR Available Bit Rate
ACR Allowed Cell Rate
ATM Asynchronous Transfer Mode
CAM Content Addressable Me mor y
CBR Constant Bit Rate
CDV Cell Delay Variation
CDVT Cell Delay Variation Toleranc e
CI Congestion Indicator
CLP Cell Loss Priority
CPCS Common Part Convergence Sublayer
CPI Common Part Identifier
CRC Cyclic Redundancy Check
CSS Cell Schedu ling System
DMA D irect Memory Access
E1 European 2. 048 Mbps rate TDM system
EFCI Explicit Forward Con gestio n Ind ic a tor
ESS External State Signals
FIFO First In First Out
GCRA Generic Cell Rate Algorithm
GFC General Flow Cont rol
190 Versio n 4.0 MXT302 0 Ref erenc e Man ual
HEC Header Error Control
ICS Interchip Communication System
IFO Instruction Field Options
J2 96-c h an ne l TD M sys te m use d by Ja pa n Telephone
MIB Manageme nt Information Base
MVIP Muti-Vendor Integration ProtocolTM
OAM Operations and Management
PCR Peak Cell Rate
PDU Physical Data Unit
PHY Physical Layer
PIT Programmable Interval T imers
PTI Payload Type Identifier
RAM Random Access Memory
RM Resource Management
RX Receive
SAR Segmentation and Reassembl y
SCSA Signal Computing System Architecture, ANSI standard
SDU Service Data Unit
SHFM Store Halfword to Fast Memory
SRAM Random Access Memory
SRTS Synchronous Residual Time Stamp
SWAN Soft-Wired ATM Network
TDM Time Division Mu ltiplexing
T1 24-channel TDM system used in North America
TX Transmit
UBR Undefined Bit Rate
UDT Unstructured Data Transfer
UU User-to-User
VBR Variable Bit Rate
VC Virtual Channel
VCI Virtual Channel Identifie r
VP Virtual Path
VPI Virtual Path Identifier
Acronym Definition
MXT3020 Reference Manual Vers ion 4.0 191
APPENDIX B Register ed Decoder PAL
Sour ce Code
;pal2v_translate_on
; Tpd = #10
; Tco = #8
;pal2v_translate_off
;
;PALASM Design Description
;
Title mxt3020_dec.pds
Date 6/24/98
Revision 4.0
Author Joseph Tompkins
Company Maker Communications
Pattern A
CHIP DECODE PAL26V12
; Revision History
;
; Rev 1.0 Initial release
; Rev 2.0 Changed to PAL26V12.
; Added inputs: m20_int, m21_int, m22_int, m23_int
; Added output: m20int
; Rev 3.0 Changed to MXT3020 select to be a non-burst read
; instead of a write. Select register has been
; moved to 0x600000 from 0x200000.
; Rev 4.0 "sel_code0" was combinatorial instead of registered because
; of a typo in the clock definition statement. The definition
192 Version 4.0 MXT3020 Reference Manual
; for sel_code0 was written as "sel_code1.clkf = clk" instead
; of "sel_code0.clkf = clk"
;
;===========================================================================
; Non-Burst Decode Logic
;
; P2 Non-Burst Address Map
;
; MXT3010 P2 Bus {P2AI[3:2],P2AD[15:0]}
; Address Address
;
; 0x800000 +------------------+ 0x40000 ^
; | mxt3020_sel_reg | |
; 0x600000 +------------------+ 0x30000 |
; | mxt3020_bsy_reg |
; 0x400000 +------------------+ 0x20000 512 Kbytes
; | not used |
; 0x200000 +------------------+ 0x10000 |
; | not used | |
; 0x000000 +------------------+ v
;
; MXT3020 Select Registers
;
; 0x800000 +------------------+ 0x40000
; | |
; | |
; | |
; | not used |
; | |
; | |
; | |
; 0x600080 +------------------+ 0x40004
; | Select MXT3020 #3|
; 0x600060 +------------------+ 0x40003
; | Select MXT3020 #2|
; 0x600040 +------------------+ 0x40002
; | Select MXT3020 #1|
; 0x600020 +------------------+ 0x40001
; | Select MXT3020 #0|
; 0x600000 +------------------+ 0x40000
;
; MXT3010 P2 Bus
; Address Address
MXT3020 Reference Manual Version 4. 0 193
;
;
;
; MXT3020 TBR Busy Flag Register
;
; MXT3010 P2 Bus
; Address Address
; 15 0
; +---+----+----+----+
; 0x400000 |#3 | #2 | #1 | #0 | 0x20000
; +---+----+----+----+
; | | | |
; | | | +-- [3:0] = {STBR_BSY[1:0], GTBR_BSY[1:0]}
; | | +------- [7:4] = {STBR_BSY[1:0], GTBR_BSY[1:0]}
; | +------------ [11:8] = {STBR_BSY[1:0], GTBR_BSY[1:0]}
; +----------------- [15:12] = {STBR_BSY[1:0], GTBR_BSY[1:0]}
;
;
;===========================================================================
;== Inputs ==;
pin 1 clk
pin 2 p2_ai3 ; Port 2 Address Index [3]
pin 3 p2_ai2 ; Port 2 Address Index [2]
pin 4 p2_req_ ; Port 2 Request (low)
pin 5 p2_rd ; Port 2 Read/Write_ (high)
pin 6 p2_qbrst ; Port 2 Burst/NonBurst_ (high)
;pin 7 vcc ; power pin
pin 8 p2_ad1 ; Port 2 Address/Data line [1]
pin 9 reset_ ; Reset (low)
pin 10 p2_end_ ; Port 2 End (low)
;pin 11 nc_11 ; no connect
pin 12 p2_asel_ ; Port 2 Address Phase Select (low)
pin 13 p2_ad0 ; Port 2 Address/Data line [0]
pin 14 m20_int ; MXT3020 #0 interrrupt
;pin 21 gnd_21 ; ground pin
pin 25 m23_int ; MXT3020 #3 interrrupt
pin 26 m22_int ; MXT3020 #2 interrrupt
pin 27 m21_int ; MXT3020 #1 interrrupt
;pin 28 nc_28 ; no connect
;
194 Version 4.0 MXT3020 Reference Manual
;== Outputs ==;
pin 15 mxt3020_sel2_ registered ; MXT3020 #2 select (low)
pin 16 mxt3020_sel1_ registered ; MXT3020 #1 select (low)
pin 17 mxt3020_sel0_ registered ; MXT3020 #0 select (low)
pin 18 sel_code1 registered ; mxt3020_sel encode bit (internal)
pin 19 sel_code0 registered ; mxt3020_sel encode bit (internal)
pin 20 mxt3020_sel3_ registered ; MXT3020 #3 select (low)
pin 22 m20int combinatorial; MXT3020 Interrupt
;pin 23 io_23 ; unused io
;pin 24 io_24 ; unused io
equations
;===========================================================================
; The MXT3020 Interrupt output is the logical OR of the interrupts from the 4
MXT3020
; chips on the motherboard. The output is tied to the ICSI_C pin of the MXT3010-
EP.
; The interrupt asserts when a gather or scatter completes inside an MXT3020.
;===========================================================================
m20int = m20_int + m21_int + m22_int + m23_int
;===========================================================================
; The MXT3020 selects are generated by a registered 2-to-4 decoder. The decoder
; can be accessed by the MXT3010 via the Port 2 Bus using a non-burst read.
; The most-significant two Port2 non-burst address bits (P2_AI[3:2]) are
; decoded to select one of four regions of PORT 2 non-burst space. If the fourth
; region is accessed then the MXT3020 Select Register is selected. The least-
; significant two bits of the non-burst address are then captured by the Select
; Register logic as "SEL_CODE[1:0]". Only READ operations are decoded.
;
; P2_REQ_ P2_ASEL_ P2_RD P2_QBRST P2_AI[3:2] P2_AD[1:0] SEL_CODE[1:0]
; ---------------------------------------------------------+-------------
; 0 0 1 0 11 00 | 00 <reset value
;0 0 1 0 11 01 |01
;0 0 1 0 11 10 |10
;0 0 1 0 11 11 |11
; |__________| | | |__| |
;
; Address Phase Read Non-Burst Fourth MXT3020 No connect, used
; Region Select internally in PAL
;The first term in each equation is the set term. All others are hold terms.
MXT3020 Reference Manual Version 4. 0 195
;==========================================================================
sel_code1.clkf = clk
sel_code1 =
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * p2_ai3 * p2_ai2 * p2_ad1
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * /p2_ai3 * /p2_ai2 * sel_code1
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * p2_ai3 * /p2_ai2 * sel_code1
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * /p2_ai3 * p2_ai2 * sel_code1
* reset_) +
( p2_req_ * sel_code1 * reset_) +
( p2_asel_ * sel_code1 * reset_) +
(/p2_rd * sel_code1 * reset_) +
( p2_qbrst * sel_code1 * reset_)
sel_code0.clkf = clk
sel_code0 =
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * p2_ai3 * p2_ai2 * p2_ad0
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * /p2_ai3 * /p2_ai2 * sel_code0
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * p2_ai3 * /p2_ai2 * sel_code0
* reset_) +
(/p2_req_ * /p2_asel_ * p2_rd * /p2_qbrst * /p2_ai3 * p2_ai2 * sel_code0
* reset_) +
( p2_req_ * sel_code0 * reset_) +
( p2_asel_ * sel_code0 * reset_) +
(/p2_rd * sel_code0 * reset_) +
( p2_qbrst * sel_code0 * reset_)
;===========================================================================
; The SEL_CODE[1:0] bits are used to assert one of the four MXT3020 select
; lines on the next P2 Burst Space read or write operation. Until a burst space
; operation is detected the previously asserted MXT3020 select will be
; maintained. At reset, mxt3020_sel0_ is asserted and all other selects are
; deasserted.
;
;===========================================================================
;
196 Version 4.0 MXT3020 Reference Manual
mxt3020_sel3_.clkf = clk
mxt3020_sel3_ =
/((/p2_req_ * /p2_asel_ * p2_qbrst * sel_code1 * sel_code0 * reset_) +
( p2_req_ * /mxt3020_sel3_ * reset_) +
( p2_asel_ * /mxt3020_sel3_ * reset_) +
(/p2_qbrst * /mxt3020_sel3_ * reset_))
mxt3020_sel2_.clkf = clk
mxt3020_sel2_ =
/((/p2_req_ * /p2_asel_ * p2_qbrst * sel_code1 * /sel_code0 * reset_) +
( p2_req_ * /mxt3020_sel2_ * reset_) +
( p2_asel_ * /mxt3020_sel2_ * reset_) +
(/p2_qbrst * /mxt3020_sel2_ * reset_))
mxt3020_sel1_.clkf = clk
mxt3020_sel1_ =
/((/p2_req_ * /p2_asel_ * p2_qbrst * /sel_code1 * sel_code0 * reset_) +
( p2_req_ * /mxt3020_sel1_ * reset_) +
( p2_asel_ * /mxt3020_sel1_ * reset_) +
(/p2_qbrst * /mxt3020_sel1_ * reset_))
mxt3020_sel0_.clkf = clk
mxt3020_sel0_ =
/((/p2_req_ * /p2_asel_ * p2_qbrst * /sel_code1 * /sel_code0 * reset_) +
( p2_req_ * /mxt3020_sel0_ * reset_) +
( p2_asel_ * /mxt3020_sel0_ * reset_) +
(/p2_qbrst * /mxt3020_sel0_ * reset_) +
(/reset_))
MXT3020 Reference Manual Version 4. 0 197
Numerics
3008 36, 45, 93
64 Kbyte channel 28
A
ACLK pin 13, 15
ACLK/BCLK configuration table 16
ACLK_MD bit 15
actual number of DS0’s 13
adaptive clock recovery 2
address space 83
ASER pin 21, 3 0, 32
loopback 38
tri-state control 28
ATM to TDM transmit frame storage 39
B
BCLK pin 15
bidirectional mode 4, 10, 13, 20
big endian 29
bits
ACLK_MD 13
ACQn 46
ACTDS0 13
BI 13
C-bit 59–60
D_DELAY 14
D_FCNT 12
DMI_BSY 65
DTM 13
EN_CNT 34
EN_HMEM 43
EN_QUIET 43
FNC 59
FS_EN 38
FS_MODE 39
FS_POL 37, 90
HALT 65
H-bit 60
header bit in error 60
IDU_BSY 65
IIT 65
LkRESET 15
LOSTn 46
Index
198 Version 4.0 MXT30 20 Reference Manual
LP_BK 38
LSB_1ST 14
MAXDS0 39
MAXRBS 38
MAXTBS 39
QUIET_FRAME 42
S-bit 58
SOC 61
SRTS_MD 14
SRTS_VALID 45
TBI_BSY 65
T-bit 59–60
TBR_BSY 65
TKT_EN 65
TxCLKS 12
BSCE pin 21
usage in BI mode 22
usage in UNI mode 21
BSER pin 21, 32
loopback 38
burst m ode 127
burst transfers 82
C
cell delineation 2, 58
cell payload scrambling/descrambling 2
CellMaker-155
description xiii
CellMaker-622
description xiii
Channel Map Po inter 67
circuit emulation service 1
Circuit Interface 4, 9
clock sources 15
glob al register s 83
link pair mode 19
pins (list) 47
registers (list) 11
TDM serial data rates 9
CircuitMaker
description xiii
clock tree distribution 138
Command
Continue 64
Disable Task Timer 64
Ena ble Task Timer 64
Halt 64
command code 64
co-processor high memory 83
counter 111
counters. see registers
CRC-10
enable/disable 59
result indica t i o n 60
Cust omer Su ppo rt xvi
D
Data Mover Unit 5, 49
activation 51
instruction set 54
register set 61
data transfer mode 13
decoupling
general 181
VAA 180
DMA2 instruction format 128
DMU halt flag 64
DMU instructions
Gather 54
Gather Immediate 54
Mcast 54
Mcast Immediate 54
Scatter 54
Scatter Immediate 54
DS0
actual number 13
counter and frame counter 26
tri-state control 28
E
E1 1, 10
electrical parameters 177
F
flags
GTBRBSY 65
STBRBSY 53, 65
FNC bits 101
FNET pin 47
FNET_DIV 34
MXT3020 Reference Manual Version 4.0 199
frame count
portion of address 12
Frame Counter (FC)
defined 63
memory address generation 68
frame counter and DS0 counter 26
Frame Number
defined 57, 102, 113
Frame Sync
common to all links 21
detection 38
FS_MODE 39
indication of acq uisition 46, 95
indication of lo ss 46 , 95
polarity 37
position 14
separate for each link 22
frame synchronization 9
FS_Mo de and b i direc tional mode 39
FSYNC pin 47
Function Code (FNC) bits 59
G
Gather Memory 50
address assignment 83
address lines 71, 79
controller 77
da ta li nes 71, 79
interface pins 79
Link Rx Buffer Address 23, 106
quiet frames and 43
use of 4Mb parts 42
gathering
example 73
H
H-bit 58
Header Bit in Error 60
Header Error Control (HEC) 2
HEC checking 60
high memory s pace 43
HSCT Cont rol Fla gs 63
I
Immediate register 58
defined 99, 101
input clock details 140
Instruction Pointer (IP) 67
defined 63, 102
Instruction Segment (ISEG)
defined 64
interconnection to MXT3010 126
interconnectio n topologies
timing 136
interface 126
ISEG 67
J
jitter 138
JT2 1, 10
L
LID (Link ID number) 27–28, 30, 32, 3 7, 96, 111
memory addess generation and 68
Link Buffer Address counters 12
link pair mode 19
link pairs
number suppo rt ed 20
pins 20
link transmit ter clock source 12
Link Tx Buffer Address
addr ess assignment 85
LINK_SRTS_FT 36
list block
addr ess assignment 83
address generation 67
instructions 50
loading 51
List RAM 50, 63, 102
address generation 67
list size and 51
List Size 51
defined 57, 113
lists and tas ks 50
loading the Task Buffer RAM 53
loopback mode 38
LSB mode 14
LSC_K 35
LSC_L 35
LSC_N 34
200 Version 4.0 MXT30 20 Reference Manual
M
MAXDS0 39–40
maximum rati ngs 178
MAXRBS 38, 40
MAXTBS 39–40
mechanical and thermal information 185
mode
bidirectional 20
unidirectional 20
MSB mode 14
multicast process 74
multiple MXT3020s 130
MVIP 1, 10
MXT3010 1
description xiii
MXT3020
description xiii
MXT3020 addressing 82
MXT4400
description xii
N
non-burst mode 127
numerically controlled oscillator 33
nx64 mode 2
O
operating co nditions 178
P
P2A20 pin strapping 82
package 186
pin diagram 187
pin inform ation 161
pinout 162
PLL considerations 180
Port2 Address Index Bus 86
Port2 Add res s/Data lines 86
Port2 DMA Controller
mapping rsa and rsb to address bits
(burst) 128
mapping rsa a nd rsb to address bits (non-
burst) 129
Port2 Interf ace 7, 81
interface pins 86
PortMaker
description xii
power sequencing 179
Q
quiet frames 43, 92
quiet logic 43
enabling/disabling 43–44
quiet transmit frames
address assignment 83
R
reference clock jitter 182
registers
Channel Map Pointer 51
continuing scatter/gather 52
defined 56, 89
Channel Map Pointer (CMP) 62, 89
CI Configuration 22, 37, 90
memory address generation 68
CI Quiet Frame Base Address 42
CI SRTS FTC 45
address assignment 85
CI SRTS Valid Statu s 45, 94
CI Status 46, 95
CI Tri-State Control Base Address 37
Command (CMD) 64
CRC Function Code (FNC) 63
CRC-10 66
Fill 65
Frame Counter (FC) 63
Immediate (CONST) and Control Flags 64
Instruction Pointer (IP) 63
Instruction Segment (ISEG) 64
Link Configuration 12
address assignment 85
interface pins 47
Link FTC coun t e r 36
Link Rx Buffe r Address 23, 106
address assignment 85
Link Service Clock K 35
address assignment 85
Link Servi ce Clock L co unter 35
MXT3020 Reference Manual Version 4.0 201
address assignment 85
Link Service Clock N 34
address assignment 85
Link SRTS FTC 93
Link SRTS Value 36, 45, 93
address assignment 86
Link Tri-state Control Address counter 27, 111
Link Tri-state C ontrol Base Address 28, 30, 111
Link Tx Buffer Address 24, 112
List Size and Frame Size 113
MAPD 65
MAPD and Fill 114
SAR Offset
defined 57, 116
SAR SDU 115
SAR size and SAR offset 116
Start of CR C-10 66
Status 118
Status (STAT) 65
Task Buffer Offset (TBO) 63
Task Timer 119
Task Timer (TKT) 65
Task Timer and Task Buffer Offset 120
Threshold Test Type (TT) 66
defined 66, 117
Threshold Value (TVR) 66
defined 66, 117
Transfer Counter (TC) 63
TT and TVR 117
restrictions
FNET_DIV bits 34, 109
Link Rx Buffer Address counter 23–24, 76–77,
106, 112
Link Tx Buffer Address counter 112
lis t blocks 52
Scatter Memory usage 76–77
S
SAR Service Data Units 5, 49, 57, 116
SAR Size
defined 57, 116, 120
Scatter Memory
address assignment 83
address lines 79
controller 76
data lines 79
interface pins 79
Link TX Buffer Address 24, 112
quiet frames and 43
use of 4Mb parts 42
Sca tter Task Buffer 83
busy flags 53
Scatter/Gather Memory
address generation 68
common buffer size 40
interfaces 6
pointers 10
Scatter/Gather memory
interfaces 124
Task Buffer Busy flags 134
scattering
example 72
scrambling/descrambling 58
SCSA 1, 10
SDT mode 4, 9
FS_EN and 38
SDU 5, 49
service clock 15, 45, 93
signal descriptions 163
Port2 164
slave-only connection 82
SRTS
as clock source 12
equation 33
indication o f va lid value 45, 94
master mode 14
slave mode 15
value registers 83
SRTS value generator 14
SRTS_VALUE 36
Start of Cell (SOC ) 61, 100
register 58
Status
defined 65
DMI Busy Flag 65
DMU Halt Flag 65
IDU Busy Flag 65
Illegal Instruction Trap 65
202 Version 4.0 MXT30 20 Reference Manual
Task Buffer Ready Flag 65
Task Timer Enable 65
TBI Busy Flag 65
Structured Data Transfer (SDT) mode 1, 13, 104
SWAN processor 1
Synchronous Residual Time St amp (SRTS) 2,
11
T
T1 1, 10
Task Buffer Busy flags 71, 134
Task Buffer Offset 57, 63, 116
Task Buffer RAM address and 71
Task Buffer RAM 5, 49, 51
address gener a tio n 71
format 55
Task Timer (TKT) 64
defined 65 , 119
TDM serial data rates supported 9
TDM to ATM receive frame storage 38
Threshold Test
defined 59
thresholding 66
timing 139
definition of switching levels 139
Transfer Counter (TC) 63, 67
T r ansmit Input Clock 15
Transmit Link (Output) Clock 15
tri-state control
address counter 27–28, 30 , 32, 37, 9 6
address assignment 85
wrapping 30–31
addressing the map 29–30
assi gnment of bits in map 29, 31
example 27
introduction 27
map 4, 10, 13, 27, 32, 83, 103
summary 32
TSC_BASE 29, 37
TSCNT 27, 29
Tx/RxData 21
U
unidirectional mode 10, 13
Unstructured Data Transfer ( UDT) mode 1, 4, 9,
13, 104
FS_EN and 38