PZU6.2B2A,115 - NXP Semiconductors

1. Product proﬁle

1.1 General description

General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted

Device (SMD) plastic package.

1.2 Features

1.3 Applications

nGeneral regulation functions

1.4 Quick reference data

[1] Pulse test: tp≤300 µs; δ≤0.02.

[2] tp= 100 µs; square wave; Tj=25°C prior to surge

[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

PZUxBA series

Single Zener diodes

Rev. 01 — 19 September 2008 Product data sheet

nNon-repetitive peak reverse power

dissipation: PZSM ≤40 W

nLow reverse current IRrange

nTotal power dissipation: Ptot ≤320 mW nSmall plastic package suitable for

surface-mounted design

nTolerance series:

B: approximately ±5%;

B1, B2, B3: approximately ±2%

nAEC-Q101 qualiﬁed

nWide working voltage range:

nominal 2.4 V to 36 V (E24 range)

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 100 mA [1] - - 1.1 V

PZSM non-repetitivepeakreverse

power dissipation [2] --40W

Ptot total power dissipation Tamb ≤25 °C[3] - - 320 mW

Product data sheet Rev. 01 — 19 September 2008 2 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V.

[2] /DG: halogen-free

Table 2. Pinning

Pin Description Simpliﬁed outline Graphic symbol

1 cathode [1]

2 anode 21

006aaa152

Table 3. Ordering information

Type number Package

Name Description Version

PZU2.4BA to

PZU36BA[1] SC-76 plastic surface-mounted package; 2 leads SOD323

PZU2.4BA/DG to

PZU36BA/DG[1][2]

Product data sheet Rev. 01 — 19 September 2008 3 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

4. Marking

[1] * = B: tolerance series B, approximately ±5%

* = B1, B2, B3: tolerance series B1, B2, B3: approximately ±2%

Table 4. Marking codes

Type number[1] Marking code Type number[1] Marking code

B B1 B2 B3 B B1 B2 B3

PZU2.4*A X8 - - - PZU2.4*A/DG Y8 - - -

PZU2.7*A X9 XA XB - PZU2.7*A/DG Y9 YA YB -

PZU3.0*A XT XU XV - PZU3.0*A/DG YT YU YV -

PZU3.3*A XW XX XY - PZU3.3*A/DG YW YX YY -

PZU3.6*A XZ MC MD - PZU3.6*A/DG YZ NC ND -

PZU3.9*A ME MF MG - PZU3.9*A/DG NE NF NG -

PZU4.3*A MM MN MP MR PZU4.3*A/DG NM NN NP NR

PZU4.7*A MS MT MU MV PZU4.7*A/DG NS NT NU NV

PZU5.1*A MW MX MY MZ PZU5.1*A/DG NW NX NY NZ

PZU5.6*A LF LG LH LK PZU5.6*A/DG RF RG RH RK

PZU6.2*A LL LM LN LP PZU6.2*A/DG RL RM RN RP

PZU6.8*A LR LS LT LU PZU6.8*A/DG RR RS RT RU

PZU7.5*A LV LW LX LY PZU7.5*A/DG RV RW RX RY

PZU8.2*A LZ CR CS CT PZU8.2*A/DG RZ ER ES ET

PZU9.1*A CU CV CW CX PZU9.1*A/DG EU EV EW EX

PZU10*A VA VB VC VD PZU10*A/DG WA WB WC WD

PZU11*A VE VF VG VH PZU11*A/DG WE WF WG WH

PZU12*A VK VL VM VN PZU12*A/DG WK WL WM WN

PZU13*A VP VR VS VT PZU13*A/DG WP WR WS WT

PZU14*A - - VU - PZU14*A/DG - - WU -

PZU15*A VV VW VX VY PZU15*A/DG WV WW WX WY

PZU16*A VZ X1 X2 X3 PZU16*A/DG WZ Y1 Y2 Y3

PZU18*A X4 X5 X6 X7 PZU18*A/DG Y4 Y5 Y6 Y7

PZU20*A XC XD XE XF PZU20*A/DG YC YD YE YF

PZU22*A XG XH XK XL PZU22*A/DG YG YH YK YL

PZU24*A XM XN XP XR PZU24*A/DG YM YN YP YR

PZU27*A XS - - - PZU27*A/DG YS - - -

PZU30*A MH - - - PZU30*A/DG NH - - -

PZU33*A MK - - - PZU33*A/DG NK - - -

PZU36*A ML - - - PZU36*A/DG NL - - -

Product data sheet Rev. 01 — 19 September 2008 4 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

5. Limiting values

[1] tp= 100 µs; square wave; Tj=25°C prior to surge

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Soldering point of cathode tab.

7. Characteristics

[1] Pulse test: tp≤300 µs; δ≤0.02.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IFforward current - 200 mA

IZSM non-repetitive peak reverse

current [1] - see

Table 8

and 9

PZSM non-repetitive peak reverse

power dissipation [1] -40W

Ptot total power dissipation Tamb ≤25 °C[2] - 320 mW

[3] - 490 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 390 K/W

[2] - - 255 K/W

Rth(j-sp) thermal resistance from

junction to solder point [3] --55K/W

Table 7. Characteristics

=25

C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage [1]

IF= 10 mA - - 0.9 V

IF= 100 mA - - 1.1 V

Product data sheet Rev. 01 — 19 September 2008 5 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

[1] f = 1 MHz; VR=0V

[2] tp= 100 µs; square wave; Tj=25°C prior to surge

Table 8. Characteristics per type; PZU2.4BA to PZU5.6B3A and PZU2.4BA/DG to PZU5.6B3A/DG

=25

C unless otherwise speciﬁed.

PZUxBA Sel Working

voltage

VZ(V)

Differentialresistance

rdif (Ω)Reverse

current

IR(µA)

Temperature

coefﬁcient

SZ(mV/K)

Diode

capacitance

Cd(pF)[1]

Non-repetitive

peak reverse

current

IZSM (A)[2]

IZ=5mA IZ= 0.5 mA IZ=5mA IZ=5mA

Min Max Max Max Max VR(V) Typ Max Max

2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8

2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8

B1 2.5 2.75

B2 2.65 2.9

3.0 B 2.8 3.2 1000 95 10 1 −2.1 425 8

B1 2.8 3.05

B2 2.95 3.2

3.3 B 3.1 3.5 1000 95 5 1 −2.4 410 8

B1 3.1 3.35

B2 3.25 3.5

3.6 B 3.4 3.8 1000 90 5 1 −2.4 390 8

B1 3.4 3.65

B2 3.55 3.8

3.9 B 3.7 4.1 1000 90 3 1 −2.5 370 8

B1 3.7 3.97

B2 3.87 4.10

4.3 B 4.01 4.48 1000 90 3 1 −2.5 350 8

B1 4.01 4.21

B2 4.15 4.34

B3 4.28 4.48

4.7 B 4.42 4.9 800 80 2 1 −1.4 325 8

B1 4.42 4.61

B2 4.55 4.75

B3 4.69 4.9

5.1 B 4.84 5.37 250 60 2 1.5 0.3 300 5.5

B1 4.84 5.04

B2 4.98 5.2

B3 5.14 5.37

5.6 B 5.31 5.92 100 40 1 2.5 1.9 275 5.5

B1 5.31 5.55

B2 5.49 5.73

B3 5.67 5.92

Product data sheet Rev. 01 — 19 September 2008 6 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG

=25

C unless otherwise speciﬁed.

PZUxBA Sel Working

voltage

VZ(V)

Differentialresistance

rdif (Ω)Reverse

current

IR(nA)

Temperature

coefﬁcient

SZ(mV/K)

Diode

capacitance

Cd(pF)[1]

Non-repetitive

peak reverse

current

IZSM (A)[2]

IZ=5mA IZ= 0.5 mA IZ=5mA IZ=5mA

Min Max Max Max Max VR(V) Typ Max Max

6.2 B 5.86 6.53 80 30 500 3 2.7 250 5.5

B1 5.86 6.12

B2 6.06 6.33

B3 6.26 6.53

6.8 B 6.47 7.14 60 20 500 3.5 3.4 215 5.5

B1 6.47 6.73

B2 6.65 6.93

B3 6.86 7.14

7.5 B 7.06 7.84 60 10 500 4 4.0 170 3.5

B1 7.06 7.36

B2 7.28 7.60

B3 7.52 7.84

8.2 B 7.76 8.64 60 10 500 5 4.6 150 3.5

B1 7.76 8.1

B2 8.02 8.36

B3 8.28 8.64

9.1 B 8.56 9.55 60 10 500 6 5.5 120 3.5

B1 8.56 8.93

B2 8.85 9.23

B3 9.15 9.55

10 B 9.45 10.55 60 10 100 7 6.4 110 3.5

B1 9.45 9.87

B2 9.77 10.21

B3 10.11 10.55

11 B 10.44 11.56 60 10 100 8 7.4 108 3

B1 10.44 10.88

B2 10.76 11.22

B3 11.1 11.56

12 B 11.42 12.6 80 10 100 9 8.4 105 3

B1 11.42 11.9

B2 11.74 12.24

B3 12.08 12.6

13 B 12.47 13.96 80 10 100 10 9.4 103 2.5

B1 12.47 13.03

B2 12.91 13.49

B3 13.37 13.96

Product data sheet Rev. 01 — 19 September 2008 7 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

[1] f = 1 MHz; VR=0V

[2] tp= 100 µs; square wave; Tj=25°C prior to surge

14 B2 13.70 14.30 80 10 100 11 10.4 101 2

15 B 13.84 15.52 80 15 50 11 11.4 99 2

B1 13.84 14.46

B2 14.34 14.98

B3 14.85 15.52

16 B 15.37 17.09 80 20 50 12 12.4 97 1.5

B1 15.37 16.01

B2 15.85 16.51

B3 16.35 17.09

18 B 16.94 19.03 80 20 50 13 14.4 93 1.5

B1 16.94 17.7

B2 17.56 18.35

B3 18.21 19.03

20 B 18.86 21.08 100 20 50 15 16.4 88 1.5

B1 18.86 19.7

B2 19.52 20.39

B3 20.21 21.08

22 B 20.88 23.17 100 25 50 17 18.4 84 1.3

B1 20.88 21.77

B2 21.54 22.47

B3 22.23 23.17

24 B 22.93 25.57 120 30 50 19 20.4 80 1.3

B1 22.93 23.96

B2 23.72 24.78

B3 24.54 25.57

27 B 25.1 28.9 150 40 50 21 23.4 73 1

30 B 28 32 200 40 50 23 26.6 66 1

33 B 31 35 250 40 50 25 29.7 60 0.9

36 B 34 38 300 60 50 27 33.0 59 0.8

Table 9. Characteristics per type; PZU6.2BA to PZU36BA and PZU6.2BA/DG to PZU36BA/DG

…continued

=25

C unless otherwise speciﬁed.

PZUxBA Sel Working

voltage

VZ(V)

Differentialresistance

rdif (Ω)Reverse

current

IR(nA)

Temperature

coefﬁcient

SZ(mV/K)

Diode

capacitance

Cd(pF)[1]

Non-repetitive

peak reverse

current

IZSM (A)[2]

IZ=5mA IZ= 0.5 mA IZ=5mA IZ=5mA

Min Max Max Max Max VR(V) Typ Max Max

Product data sheet Rev. 01 — 19 September 2008 8 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

Tj=25°C (prior to surge) Tj=25°C

Fig 1. Non-repetitive peak reverse power dissipation

as a function of pulse duration; maximum

values

Fig 2. Forward current as a function of forward

voltage; typical values

Tj=25°C to 150 °C

VZ= 2.4 V to 4.3 V Tj=25°C to 150 °C

VZ= 4.7 V to 12 V

Fig 3. Temperature coefﬁcient as a function of

working current; typical values Fig 4. Temperature coefﬁcient as a function of

working current; typical values

006aab215

102

103

PZSM

(W)

tp (s)

10−410−2

10−3VF (V)

0.6 10.8

mbg781

100

200

300

(mA)

060

−2

−3

−1

mgl273

20 40 IZ (mA)

(mV/K) 4.3

3.9

3.6

3.3 3.0

2.4

2.7

02016

−5

mgl274

4812 IZ (mA)

(mV/K)

4.7

9.1

8.2

7.5

6.8 6.2

5.6

5.1

Product data sheet Rev. 01 — 19 September 2008 9 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

Tj=25°C

VZ= 2.4 V to 4.3 V Tj=25°C

VZ= 4.7 V to 12 V

Fig 5. Working current as a function of working

voltage; typical values Fig 6. Working current as a function of working

voltage; typical values

Tj=25°C

VZ= 13 V to 36 V

Fig 7. Working current as a function of working voltage; typical values

006aab246

10−1

10−2

102

(mA)

10−3

VZ (V)

054231

VZ(nom) (V) = 2.4

2.7 3.0

3.3 3.6

3.9 4.3

006aab247

10−1

10−2

102

(mA)

10−3

VZ (V)

01410 128624

VZ(nom) (V) = 4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

006aab248

10−1

10−2

102

(mA)

10−3

VZ (V)

10 403020

VZ(nom) (V) = 13

18 20 22 24 27 30 33 36

Product data sheet Rev. 01 — 19 September 2008 10 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

8. Test information

8.1 Quality information

This product has been qualiﬁed in accordance with the Automotive Electronics Council

(AEC) standard

Q101 - Stress test qualiﬁcation for discrete semiconductors

, and is

suitable for use in automotive applications.

9. Package outline

10. Packing information

[1] For further information and the availability of packing methods, see Section 13.

Fig 8. Package outline SOD323 (SC-76)

03-12-17Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3 1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

Table 10. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

[1]

Type number Package Description Packing quantity

3000 10000

PZU2.4BA to

PZU36BA SOD323 4 mm pitch, 8 mm tape and reel -115 -135

PZU2.4BA/DG to

PZU36BA/DG

Product data sheet Rev. 01 — 19 September 2008 11 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

11. Soldering

Fig 9. Reﬂow soldering footprint SOD323 (SC-76)

Fig 10. Wave soldering footprint SOD323 (SC-76)

0.951.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5

(2×)

0.6

(2×)

0.6 (2×)0.5 (2×)

sod323_fr

Dimensions in mm

1.5 (2×)

2.9

1.2

(2×)

2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm

Product data sheet Rev. 01 — 19 September 2008 12 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

12. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PZUXBA_SER_1 20080919 Product data sheet - -

Product data sheet Rev. 01 — 19 September 2008 13 of 14

NXP Semiconductors PZUxBA series

Single Zener diodes

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors PZUxBA series

Single Zener diodes

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 September 2008

Document identifier: PZUXBA_SER_1

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . 10

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 10

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

10 Packing information. . . . . . . . . . . . . . . . . . . . . 10

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

13.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Contact information. . . . . . . . . . . . . . . . . . . . . 13

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14