Varistor Products
©2010 Littelfuse, Inc.
Revision: June 28, 2010
0201 MLA Varistor Series
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
0201 MLA Series
0201 MLA Varistor Series
RoHS
Description
New 0201-size MLA Multi-Layer Varistor (MLV) series can
protect small electronic products from electrostatic discharge
(ESD) and electrically fast transients (EFT).
It's ultra-compact 0201 size, the smallest form factor available
for MLV devices, is ideal for compact handheld products.
The ML Series is manufactured from semiconducting ceramics,
and is supplied in a leadless, surface mount package.
Plating consists of Silver base material (which is fired on to the
Zno dialectric), Nickel barrier plated under-layer and Matte-Tin
outer surface plate.
Features
• Ultra-small 0201 size for
minimal board space
• Low capacitance (33pF)
for high data rates to
minimize signal distortion
• Meets IEC 61000-
4-2 for ESD
• Low leakage (<25μa)
• Multilayer ceramic
construction technology
• Inherently Bi-directional
• Stable performance
over wide operating and
storage temperature
range -40°C to +85°C
• Operating voltage
VM(DC) = 5.5V
• Rated for surge
current (8 x 20μs)
Applications
Absolute Maximum Ratings
Steady State Applied Voltage: Unit
Maximum DC Voltage (VM(DC)) 5.5 V
Maximum AC Voltage (VM(AC)RMS) 4.0 V
Transient:
Non-Repetitive Surge Current, 8/20μs
Waveform, (ITM)4.0 A
Temperature:
Operating Ambient Temperature Range (TA) -40 to +85 ºC
Storage Temperature Range (TSTG) -40 to +85 ºC • Portable / handheld
electronic devices
• Mobile communications
/ cellular phones
• USB, video and audio ports
• Analog signal / sensor lines
• Data, diagnostic I/O ports
• Computer / DSP products
• Industrial instruments
including non-life sustaing
medical equipment
Device Ratings and Specifications
Part Number
Maximum Ratings @ +85ºCSpecifications @ +25ºC
Maximum Continuous
Working Voltage
Maximum Non-
repetitive Surge
Current (8/20μs)
Maximum
Clamping Voltage
at 1A (8/20μs)
Nominal Voltage at 1mA
DC Test Current
Typical
Capacitance at
f = 1MHz
VM(DC) VM(AC) ITM VCVN(DC) Min VN(DC) Max C
(V) (V) (A) (V) (V) (V) (pF)
V5.5MLA020133NR 5.5 4.0 1 28.0* 8.0 14.0 33.0
V5.5MLA020147NR 5.5 4.0 1 26.0* 8.0 14.0 47.0
V5.5MLA020164NR 5.5 4.0 1 26.0* 8.0 14.0 64.0
Notes:
- Typical leakage at 25ºC at VM(DC): 0201 size <10μA typical, <25μA maximum
- End surface finish of Matte-Tin with Nickel under-layer on Silver base material
- Standard packing quantity 15,000 per reel, 7" reel
Varistor Products
©2010 Littelfuse, Inc.
Revision: June 28, 2010
0201 MLA Varistor Series
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
T
1
T
2
100
50
0
O1TIME
PERCENT OF PEAK VALUE
T
Peak Pulse Current Test Waveform for Clamping Voltage
01 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T1 = Rise Time = 1.25 x T
T2 = Decay Time
Example - For an 8/20 μs Current Waveform:
8μs = T1 = Rise Time
20μs = T2 = Decay Time
Reliability and Environmental Specifications
Judge Criteria Test Condition
Solderability > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec.
Leaching Resistance > 95% solder coverage 245 +/- ºC, 3 +/- 1 sec.
High Temperature Exposure Δ Vv / Vv < 10% 1000 hours 85ºC, un-powered
Thermal Shock Δ Vv / Vv < 10% -45 to +85 ºC, 30 min. cycle, 5 cycles
Operating Life Δ Vv / Vv < 10% 85 ºC, DC working voltage 1000 hours
Bias Humidity Δ Vv / Vv < 10% 40 ºC / 85% RH, DC working voltage 1000 hours
Multilayer Internal Construction
GRAINS
DEPLETION
FIRED CERAMIC
DIELECTRIC
REGION
METAL
ELECTRODES
DEPLETION
REGION
METAL END
TERMINATION
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the ML chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50º C before cleaning.
Lead–free (Pb-free) Soldering Recommendations
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
RAMP RATE
<3˚C/s 60 - 150 SEC
> 217˚C
TEMPERATURE °C
TIME (MINUTES)
300
250
200
150
100
50
00 1.0 2.0 3.0 4.0 5.0 6.0 7.0
Varistor Products
©2010 Littelfuse, Inc.
Revision: June 28, 2010
0201 MLA Varistor Series
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
0201 MLA Series
Product Dimensions (mm)
NOTE : Avoid metal runs in this area, parts not
recommended for use in applications using
Silver (Ag) epoxy paste.
PAD LAYOUT DIMENSIONS
C
B
A
NOTE
CHIP LAYOUT DIMENSIONS
E
L
W
D
Dimension 0201 Size
IN MM
A0.055 1.40
B0.020 0.50
C0.020 0.50
D (max.) 0.014 0.35
E0.008 -/+0.004 0.20 -/+0.10
L0.024 -/+0.002 0.60 -/+0.05
W0.012 -/+0.002 0.30 -/+0.05
Part Numbering System
V 5.5 0201
PACKING OPTIONS
DEVICE SIZE:
DEVICE FAMILY
Littelfuse TVSS Device
R
MAXIMUM DC
WORKING VOLTAGE
MLA xx N
CAPACITANCE OPTION
33 = 33pF
47 = 47pF
64 = 64pF
END TERMINATION OPTION
MULTILAYER SERIES
DESIGNATOR
N = Nickel Barrier Option
(Matte Tin outer surface, plated on Nickel underlayer
plated on silver base metal)
R = 7in (178mm) Diameter Reel, Paper Carrier Tape
15,000 items per reel
0201 = .024 inch x .012 inch
(0.6 mm x 0.3 mm)
Tape and Reel Specifications
Symbol Description
Dimensions in
Millimeters
0201
A0Width of Cavity 0.36 -/+0.02
B0Length of Cavity 0.70 -/+0.02
WWidth of Tape 8.0 -/+0.1
FDistance Between Drive Hole Centers and Cavity Centers 3.5 -/+0.05
EDistance Between Drive Hole Centers and Tape Edge 1.75 -/+0.05
P1Distance Between Cavity Centers 2.0 -/+0.05
P2Axial Drive Distance Between Drive Hole Centers & Cavity Centers 2.0 -/+0.05
P0Axial Drive Distance Between Drive Hole Centers 4.0 -/+0.1
D0Drive Hole Diameter 1.55 -/+0.05
T1Top Tape Thickness 0.42 -/+0.02
K0
t1
D0P0
D1
P1A0
P2
B0
F
E
W
For T and H Pack Options: PLASTIC CARRIER TAPE
For R Pack Options: EMBOSSED PAPER CARRIER TAPE
EMBOSSMENT
TOP TAPE 8mm
NOMINAL
PRODUCT
IDENTIFYING
LABEL
178mm
OR 330mm
DIA. REEL
NOTE: It is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed from bags.
