DATA SH EET
Product specification
Supersedes data of 1996 May 28 1997 Aug 15
INTEGRATED CIRCUITS
TDA7056B
5 W mono BTL audio amplifier with
DC volume control
1997 Aug 15 2
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
FEATURES
DC volume control
Few external components
Mute mode
Thermal protectio n
Short-circuit proof
No switch-on and switch-off clic ks
Good overall stab ility
Low power cons umption
Low HF radiation
ESD protected on all pins.
GENERAL DESCRIPTION
The TDA7056B is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control.
It is designed for use in TV an d monitors, but is also
suitable for battery-fed portable recorders and radios.
The device is contained in a 9-pin medium power package.
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for headphone
applications (single-ended).
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPsupply vo ltage 4.5 18 V
POoutput power VP=12V
RL=1633.5W
RL=855.5W
Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB
gain control 68 73.5 dB
Iq(tot) total quiescent current VP=12V; R
L= 9.2 13 mA
THD tot al ha rmo n i c distortion PO=0.5W 0.3 1 %
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA7056B SIL9MPF plastic single in-line medium power package wit h fi n; 9 leads SOT110-1
1997 Aug 15 3
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
input
7MSA708 - 1
2
3
TDA7056B
VP
5
6I + i
8
I – i
TEMPERATURE
PROTECTION
4
signal
ground
DC volume control
1
n.c.
positive output
negative output
power
ground
Vref STABILIZER
9
n.c.
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
VP2 positive supply voltage
VI3 voltage input
GND1 4 signal ground
VC 5 DC volume control
OUT+ 6 positive output
GND2 7 p ower ground
OUT8 negative output
n.c. 9 not connected
Fig.2 Pin configuration.
handbook, halfpage
MSA707
1
2
3
4
5
6
7
8
9
I
V
TDA7056B
n.c.
VP
OUT
GND2
OUT
GND1
VC
n.c.
1997 Aug 15 4
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
FUNCTIONAL DESCRIPTION
The TDA7056B is a mono BTL output amplifie r with DC
volume control, designed for use in TV and monitor but is
also suitable for battery-fed portable recorders and radios.
In conventional DC volume circuits the contr ol or in put
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low. In the TDA7056B
the DC volume control stage is integrated into the input
stage so that no coupling capacitors are required. With this
configuration, a low offset voltage is still maintained and
the minimum supply voltage remains low.
The BTL principle offer s the follo wing advantages:
Lower peak value of the supply current
The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a re duced power supp ly with smaller
capacitors can be used which results in co st re ductions.
For portable appl ications there is a trend to decrease the
supply voltage , r es ulting in a reduction of ou tp ut power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to 33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temper ature rises above
+150 C the gain will be reduced, thereby reducing the
output power. Special attention is give n to s witch -on and
switch-off clicks, low HF radiation and a good overall
stability.
Power dissipation
Assume VP=12V; R
L=16.
The maximum sine wave dissipation is = 1.8 W.
The Rth vj-a of the package is 55 K/W.
Therefore Tamb (max) =15055 1.8 = 51 C.
LIMITING VALUES
In accordance with the A bsolute Maxi m u m Rating System (IEC 134).
THERMAL CHARACTE RISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPsupply voltage 18 V
V3, 5 input voltage pins 3 and 5 5V
IORM repetitive peak output current 1.25 A
IOSM non-repetitive peak output current 1.5 A
Ptot total power dissipation Tcase 60 C9W
Tamb operating ambient temperature 40 +85 C
Tstg storage temperature 55 +150 C
Tvj virtual junction temperature +150 C
Tsc short-circuit time 1h
SYMBOL PARAMETER VALUE UNIT
Rth j-a thermal resistance from junction to ambient in free air 55 K/W
Rth j-c thermal resistance from junction to case 10 K/W
1997 Aug 15 5
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
CHARACTERISTICS
VP=12V; V
DC = 1.4 V; f = 1 kHz; RL=16; Tamb =25C; unless otherwise spec ified (see Fig.13).
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output volta ge (RMS value) at f = 500 kH z is measured with RS=0 and B = 5 kHz.
3. The ripple rejection is measured with RS=0 and f = 10 0 Hz to 10 kHz. The r ipple voltage VR of 200 mV
(RMS value) is applied to th e positive supply rail.
4. The noise output voltage (RMS value) is measured with RS=5k unweighted.
5. The DC volume contr ol c an be configured in severa l way s. Two possible circuits are sho wn in Figs 1 4 an d 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPpositive supply voltage 4.5 18 V
Iq(tot) total quiescent current note 1; RL=9.2 13 mA
Maximum gain (V5=1.4V)
POoutput power THD = 10%; RL=1633.5 W
THD = 10%; RL=855.5 W
THD total harmonic distortion PO=0.5W 0.3 1 %
Gv(max) maximum total voltage gain 39.5 40.5 41.5 dB
VIinput signal handling (RMS value) Gv(max) =0dB; THD1% 1.0 V
Vno noise output voltage (RMS value) note 2; f = 500 kHz 210 V
B bandwidth at 1dB 0.02 to 300 kHz
SVRR supply voltage ripple rejection note 3 34 38 dB
VODC output offset voltage V8v60200mV
ZIinput impedance (pin 3) 15 20 25 k
Mute position
VOoutput voltage in mute position note 4; V50.4 V;
VI=1.0V 35 45 V
DC volume control; note 5
gain control 68 73.5 dB
I5control current V5=0V 20 25 30 A
1997 Aug 15 6
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
Fig.3 Gain control as a function of DC volume
control.
handbook, halfpage
0 2.0
40
−80
−120
0
MBH372
0.4 0.8 1.2 1.6
−40
Gv
(dB)
V (V)
DC
Fig.4 Noise output voltage as a fun ction of DC
volume control.
Measured with RS=5k unweighted.
Frequency range is 22 Hz to 22 kHz.
handbook, halfpage
20
Vno
(mV)
MBH365
1
10
−1
10
−2
0.4 0.8 1.2 1.6
VDC (V)
Fig.5 Control current as a function of DC volume
control.
handbook, halfpage
0 2.0
25
−15
−25
15
MBH376
0.4 0.8 1.2 1.6
−5
VDC (V)
5
IDC
(μA)
Fig.6 Quiescent curr ent versus supply v oltage.
Measured with RL=.
handbook, halfpage
020
15
5
MBH367
10
20
4
IP
(mA)
81216
VP (V)
1997 Aug 15 7
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
Fig.7 Total harmonic distortion versus output
power.
(1) RL16 .
(2) RL=8.
handbook, halfpage
10
6
4
2
0
MBH361
10
-1
1PO (W)
THD
(%)
10
8
(1) (2)
Fig.8 Total harmonic distortion versus frequ ency.
PO=0.1W.
(1) Gv(max) =40dB.
(2) Gv(max) =30dB.
handbook, halfpage
0
MBH362
10
2
4
6
8
10
−2
10
2
10
−1
110
f (kHz)
THD
(%)
(1)
(2)
Fig.9 Output power versus sup ply voltage.
Measured at a THD of 10%. The maximum output power is limited by
the maximum power dissipation an d the maximum available output
current.
(1) RL=8.
(2) RL=16.
handbook, halfpage
020
10
0
2
MBH363
4
6
8
4
PO
(W)
81216
VP (V)
(1) (2)
Fig.10 Total worst case power dissipation versus
supply voltage.
(1) RL=8.
(2) RL=16.
handbook, halfpage
020
6
0
1
MBH364
2
3
5
4
4
Pd
(W)
81216
VP (V)
(1) (2)
1997 Aug 15 8
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
Fig.11 Supply voltage ripple rejection versus
frequency.
handbook, halfpage
−70
−60
−50
−40
−30
−20
MBH374
10
−2
10
−1
11010
2
f (kHz)
SVRR
(dB)
(1)
(2)
Measured with VR=0.2V.
(1) VDC =1.4V.
(2) VDC =0.4V.
Fig.12 Input signal handling.
handbook, halfpage
020
2.0
0
0.4
MBH375
0.8
1.2
1.6
4
VI
(V)
81216
VP (V)
Measured at a THD of 1% and a voltage gain of 0 dB.
1997 Aug 15 9
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
TEST AN D APPLICATION INFORMATION
For single-end application the output peak current may not exceed 100 mA; at higher ou tput currents the short circuit
protection (MLC) will be activated.
Fig.13 Test and applicatio n diagram.
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possibl e to the IC.
(1) This capaci tor can be omitted if the 220 F electrolytic capacito r is connected close to pin 2.
handbook, full pagewidth
input 0.47 μF
7
MSA709 - 2
100 nF 220 μF
2
3
TDA7056B
VP = 12 V
(1)
5
I − i
5 kΩ
RS
6
8
STABILIZER TEMPERATURE
PROTECTION
4
ground
DC
volume
control
RL = 8 Ω
1
n.c. 9
n.c. I + i
+
−
1997 Aug 15 10
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
Fig.14 Applicatio n with potentiometer as volume
control; maximum gain = 34 dB.
handbook, halfpage
MSA710
5
volume
control
1 MΩ1 μF
Fig.15 Applicatio n with potentiometer as volume
control; maximum gain = 40 dB.
handbook, halfpage
MBH366
5
volume
control
VP = 12 V
22 kΩ
100 kΩ
1 μF
1997 Aug 15 11
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
PACKAGE OUTLINE
UNIT AA
max.
2A3b1D1
b2
bcD
(1) E(1) Z
max.
(1)
eLPP
1q1q2
q
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 18.5
17.8 3.7 8.7
8.0
A4
15.8
15.4 1.40
1.14 0.67
0.50 1.40
1.14 0.48
0.38 21.8
21.4 21.4
20.7 6.48
6.20 3.4
3.2
2.54 1
5.9
5.7
4.4
4.2
3.9
3.4 15.1
14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 95-02-25
03-03-12
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
1997 Aug 15 12
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth acco un t of sold er ing ICs can be found in
our “IC Package Databook” (order cod e 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperatur e of the s old er is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necess ary immediately aft er soldering to ke ep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
1997 Aug 15 13
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this do cument was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective s pe cification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This doc ument contains the product specification.
DEFINITIONS
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its custo m er, unless NXP
Semiconductors and cus to m er have explicitly agreed
otherwise in writing. In no even t however, shall an
agreement be valid in which th e NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliab le .
However, NXP Semiconduc tors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
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In no event shall NXP Semiconductors be liable for any
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Notwithstanding any damages that customer might incur
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the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and prod uct descriptions, at any time and
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accepts no liability for inclusion and/or use of NXP
Semiconductor s pr oducts in such equi pme nt or
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Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors pro du ct is su itable and fit for the
customer’s applications and products planned, as well as
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party customer(s). Customers should provide appropriate
design and opera t ing saf eg ua rd s to minimize the risks
associated with their applications and products.
1997 Aug 15 14
NXP Semiconductors Product specification
5 W mono BTL audio amplifier with DC
volume control TDA7056B
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the applic ation or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s ap plications and
products using NXP Semiconductors pr od ucts in order to
avoid a default of the applications and th e products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratin gs only and
(proper) operation of the device at these or any other
conditions abo ve those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Terms and conditions of commercial sale NXP
Semiconductors products are sold subject to the general
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http://www.nxp.com/profile/terms, unless other wis e
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customer’s general terms and conditions with regard to the
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Export control This document as well a s the item(s)
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Quick refer ence data The Quick reference data is an
extract of th e product data given in the Limiting values and
Characteristics sections of this document, an d as such is
not complete, exhaus tive or legally binding.
Non-automotive qualified products Unless this data
sheet expressly states that this specific NXP
Semiconductors product is au tomotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor te sted in accordanc e with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified prod ucts in automotive eq uip m en t or
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In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such au t omo tive application s, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
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NXP Semiconductors for any liability, damages or failed
product clai ms r esult ing fr om custo mer desi gn an d us e o f
the product for automotive ap plic ations beyond NXP
Semiconductors ’ st andard warranty and NXP
Semiconductors’ product specifications.
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Contact information
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© NXP B.V. 2011
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information pr e sent ed in this documen t d oes not form par t o f an y q uotation or contra ct, is believed to be accur ate a nd re li a ble and may be chan ged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or inte llectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No changes were made to the tech nical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands RM5/03/pp15 Date of release: 1997 Aug 15
