CRCW0201 e3
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Revision: 06-Jun-12 1Document Number: 20052
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Lead (Pb)-free Commodity Thick Film Chip Resistors
FEATURES
High volume product suitable for commercial
applications
Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and
lead containing soldering processes
Metal glaze on high quality ceramic
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER RATING
P70
W
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
SERIES
CRCW0201 0201 RR 0603M
0.05 30
± 200
± 0.5
10.0 to 10M
E96
- 200/+ 400 1.0 to 9.76
± 100
± 1
47.0 to 10M
E24; E96± 200 10.0 to 10M
- 200/+ 400 1.0 to 9.76
± 200
± 5
10.0 to 10M
E24
- 200/+ 400 1.0 to 9.76
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. at 70 °C = 1.0 A
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRCW0201
Rated Dissipation at 70 °C (1) W0.05
Operating Voltage Umax. ACRMS/DC V 30
Insulation Voltage Uins (1 min) V 50
Insulation Resistance > 109
Operating Temperature Range °C - 55 to + 155
Weight/1000 Pieces mg 0.17
CRCW0201 e3
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Revision: 06-Jun-12 2Document Number: 20052
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS in millimeters
Note
No marking for 0201 size.
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW02011K00FNED
MODEL VALUE TOLERANCE TCR PACKAGING
CRCW0201 R = Decimal
K = Thousand
M = Million
0000 = Jumper
D = ± 0.5 %
F = ± 1.0 %
J = ± 5.0 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
X = - 200 ppm/K/+ 400 ppm/K
0 = Jumper
ED
EE
EI
PRODUCT DESCRIPTION: CRCW0201 100 1K0 1 % ET7 e3
CRCW0201 100 562R 1 % ET7 e3
MODEL TCR RESISTANCE
VALUE
TOLERANCE
VALUE PACKAGING LEAD (Pb)-FREE
CRCW0201 ± 200 ppm/K
± 100 ppm/K
- 200/+ 400
ppm/K
1R0 = 1
10R = 10
1K0 = 1 k
10K = 10 k
1M0 = 1 M
0R0 = Jumper
± 0.5 %
± 1 %
± 5 %
ET7
EF4
ET2
e3 = Pure tin
termination finish
PACKAGING
MODEL CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
CRCW0201
ED = ET7 10 000 Paper tape acc.
to IEC 60068-3
Type I
8 mm 2 mm
180 mm/7"
EI = ET2 20 000 254 mm/10"
EE = EF4 50 000 330 mm/13"
SIZE DIMENSIONS SOLDER PAD DIMENSIONS
INCH METRIC L W H T1 T2 a b l
0201 0603 0.6 ± 0.05 0.3 ± 0.05 0.23 ± 0.05 0.15 ± 0.05 0.2 + 0.05
- 0.10 0.28 0.43 0.23
C R C W 0 2 0 1 1 K 0 0 F K E D
CRCW0201 e3
www.vishay.com Vishay
Revision: 06-Jun-12 3Document Number: 20052
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DERATING
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
CRCW0201 e3 1 to 10 M
4.5 - Resistance - ± 0.5 %; ± 1 %; ± 5 %
4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown
4.13 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/- 55/20) °C and
(20/125/20) °C
± 100 ppm/K,
± 200 ppm/K,
- 200 ppm/K/+ 400 ppm/K
4.32 21 (Uu3)Shear
(adhesion) 9 N No visible damage
4.33 21 (Uu1) Substrate bending Depth 2 mm;
3 times
No visible damage,
no open circuit in bent position
± (0.5 % R + 0.05 )
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles ± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 )
- 50 0 50 100 150
0
Ambient Temperature amb in °C
Fraction of Rated Dissipation P70 in %
50
100
70
ϑ
CRCW0201 e3
www.vishay.com Vishay
Revision: 06-Jun-12 4Document Number: 20052
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
4.23 - Climatic sequence: -
± (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic 55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U= Umax.
4.25.1 - Endurance at 70 °C
U= Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (2 % R + 0.1 )
70 °C; 8000 h ± (4 % R + 0.1 )
4.18.2 58 (Td) Resistance to soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (1 % R + 0.05 )
4.35 - Flamability, needle flame test IEC 60695-11-5;
10 s No burning after 30 s
4.24 78 (Cab) Damp heat, steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (2 % R + 0.1 )
4.25.3 - Endurance at
upper category temperature 155 °C, 1000 h ± (2 % R + 0.1 )
4.29 45 (XA) Component solvent resistance Isopropyl alcohol;
50 °C; method 2 No visible damage
4.22 6 (Fc) Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
10 sweeps per axis
± (0.5 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
CRCW0201 e3 1 to 10 M
P70 x R
P70 x R
Legal Disclaimer Notice
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Revision: 12-Mar-12 1Document Number: 91000
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