HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6319-B Issued Date : 1996.07.18 Revised Date : 2000.10.01 Page No. : 1/4 HMPS8599 PNP SILICON TRANSISTOR Description HMPS8599 is designed for general purpose amplifier applications. Features * Low Collector-Emitter Saturation Voltage * HMPS8599 is complementary to HMPS8099 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +125 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -80 V VCES Collector to Emitter Voltage..................................................................................... -80 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICEO *hFE1 *hFE2 *hFE3 *VCE(sat)1 *VCE(sat)2 VBE(on) fT Cob Min. -80 -80 -5 100 100 75 -0.6 150 - Typ. - Max. -100 -100 -100 300 -0.4 -0.3 -0.8 8 Unit V V V nA nA nA V V V MHz PF Test Conditions IC=-100uA, IE=0 IC=-10mA, IB=0 IE=-10uA, IC=0 VCB=-80V, IE=0 VEB=-4V, IC=0 VCE=-60V, IB=0 IC=-1mA, VCE=-5V IC=-10mA, VCE=-5V IC=-100mA, VCE=-5V IC=-100mA, IB=-5mA IC=-100mA, IB=-10mA IC=-10mA, VCE=-5V VCE=-5V, IC=-10mA, f=100MHz VCB=-5V, IE=0, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6319-B Issued Date : 1996.07.18 Revised Date : 2000.10.01 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 10000 Saturation Voltage (mV) 1000 hFE VCE=5V 100 1000 VBE(sat) @ IC=10IB 100 VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 0.1 1000 1 10 Collector Current (mA) Capacitance & Reverse-Biased Voltage 1000 Cutoff Frequency & Collector Current 100 1000 Cutoff Frequency (MHz) Capacitance (pF) 100 Collector Current (mA) 10 Cob 1 VCE=20V 100 10 0.1 1 10 100 1 10 Reverse Biased Voltage (V) 100 Collector Current (mA) On Voltage Collector Current Safe Operating Area 10000 10 PT=1ms Collector Current-IC (mA) On Voltage (V) PT=100ms 1 VBE(ON) @ VCE=5V 0.1 1000 PT=1s 100 10 1 1 10 100 Collector Current (mA) 1000 1 10 100 Forward Biased Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6319-B Issued Date : 1996.07.18 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 Power Dissipation-PD(mW) 600 500 400 300 200 100 0 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6319-B Issued Date : 1996.07.18 Revised Date : 2000.10.01 Page No. : 4/4 MICROELECTRONICS CORP. TO-92 Dimension 2 A Marking : HSMC Logo B 1 2 Product Series Part Number 3 Date Code Rank 3 C Laser Mark HSMC Logo Product Series D Part Number H I G Ink Mark 1 Style : Pin 1.Emitter 2.Base 3.Collector E F 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification