HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6319-B
Issued Date : 1996.07.18
Revised Date : 2000. 10.01
Page No. : 1/4
HSMC Product Specifi cation
HMPS8599
PNP SILICON TRANSISTOR
Description
HMPS8599 is designed for general purpose amplifier applications.
Features
Low Collector-Emitter Saturation Voltage
HMPS8599 is complementary to HMPS8099
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +125 °C
Junction Temperatur e................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 625 mW
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ....................................................................................... -80 V
VCES Collector to Emitter Voltage..................................................................................... -80 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current...................................................................................................... -500 mA
Characteristics (Ta=25 °C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -80 - - V IC=-100uA, IE=0
BVCEO -80 - - V IC=-10mA, IB= 0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-80V, IE=0
IEBO - - -100 nA VEB=-4V, IC= 0
ICEO - - -100 nA VCE=-60V, IB=0
*hFE1 100 - 300 IC=-1mA, VCE=-5V
*hFE2 100 - - IC=-10mA, VC E= -5V
*hFE3 75 - - IC=-100mA, VCE=-5V
*VCE(sat)1 - - -0.4 V IC=-100mA, IB=-5mA
*VCE(sat)2 - - -0.3 V IC=-100mA, IB=-10mA
VBE(on) -0.6 - -0.8 V IC=-10mA, VCE= - 5V
fT 150 - - MHz VCE=-5V, IC=-10mA, f=100MHz
Cob - - 8 PF VCB=-5V, IE=0, f=1MHz
*Pulse Test : Pulse Width 380us, Duty Cycle2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6319-B
Issued Date : 1996.07.18
Revised Date : 2000. 10.01
Page No. : 2/4
HSMC Product Specifi cation
Characteristics Curve
Current Gain & Collector Current
10
100
1000
0.1 1 10 100 1000
Coll ec tor Cur re nt (mA)
hFE
VCE=5V
Saturation V oltage & Collect or Current
10
100
1000
10000
0.1 1 10 100 1000
Coll ec tor Cur re nt (mA)
Saturation Volt age (m V)
VBE(sat) @ IC=10IB
VCE(sat) @ IC=10IB
Capacitan ce & Rev er se- Biased Vol t age
1
10
100
0.1 1 10 100
R everse Biased Vol t age ( V)
Cap a c ita nce (p F)
Cob
Cutoff Fr equency & Collector Current
10
100
1000
1 10 100
Coll ec tor Cur re nt (mA)
Cutoff Frequency (MHz )
VCE=20V
On Voltage C ollect or C urrent
0.1
1
10
1 10 100 1000
Coll ec tor Cur re nt (mA)
On Voltage (V)
VBE(ON) @ VCE=5V
Safe Operating Area
1
10
100
1000
10000
1 10 100
Forward Biased Vol t age- VCE (V)
Coll ec tor Cur re nt -IC (mA)
PT=1ms
PT=100ms
PT=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6319-B
Issued Date : 1996.07.18
Revised Date : 2000. 10.01
Page No. : 3/4
HSMC Product Specifi cation
PD-Ta
0
100
200
300
400
500
600
700
0 20 40 60 80 100 120 140 160
Ambient Tem p er at ure- Ta(oC)
Power Dissipation -PD(mW)
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6319-B
Issued Date : 1996.07.18
Revised Date : 2000. 10.01
Page No. : 4/4
HSMC Product Specifi cation
TO-92 Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56 α1-*5°-*5°
E - *0.0500 - *1.27 α2-*2°-*2°
F 0.1323 0.1480 3.36 3.76 α3-*2°-*2°
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controll i ng dimens ion : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC sal es office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin famil y, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its produc ts without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liabilit y for any cons equence of customer product design, infringem ent of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerit y Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industri al Park Hs in-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
31
A
D
B
C
Iα1
E
F
α2
α3
G
H
2
Style : Pin 1.Em itter 2.Bas e 3.C ol lec tor
3-Lead TO-92 Plastic Package
HSMC Packa
g
e Code : A
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Laser Mark
HSMC Logo
Part Number
Product Series
Ink Mark