LTC2862/LTC2863/ LTC2864/LTC2865 60V Fault Protected 3V to 5.5V RS485/RS422 Transceivers FEATURES DESCRIPTION n The LTC(R)2862/LTC2863/LTC2864/LTC2865 are low power, 20Mbps or 250kbps RS485/RS422 transceivers operating on 3V to 5.5V supplies that feature 60V overvoltage fault protection on the data transmission lines during all modes of operation, including power-down. Low EMI slew rate limited data transmission is available in a logic-selectable 250kbps mode in the LTC2865 and in 250kbps versions of the LTC2862-LTC2864. Enhanced ESD protection allows these parts to withstand 15kV HBM on the transceiver interface pins without latchup or damage. n n n n n n n n n n n n Protected from Overvoltage Line Faults to 60V 3V to 5.5V Supply Voltage 20Mbps or Low EMI 250kbps Data Rate 15kV ESD Interface Pins, 8kV All Other Pins Extended Common Mode Range: 25V Guaranteed Failsafe Receiver Operation High Input Impedance Supports 256 Nodes 1.65V to 5.5V Logic Supply Pin (VL) for Flexible Digital Interface (LTC2865) H-Grade Option Available (-40C to 125C) Fully Balanced Differential Receiver Thresholds for Low Duty Cycle Distortion Current Limited Drivers and Thermal Shutdown Pin Compatible with LT1785 and LT1791 Available in DFN and Leaded Packages Extended 25V input common mode range and full failsafe operation improve data communication reliability in electrically noisy environments and in the presence of large ground loop voltages. PRODUCT SELECTION GUIDE APPLICATIONS n n n n n n PART NUMBER Supervisory Control and Data Acquisition (SCADA) Industrial Control and Instrumentation Networks Automotive and Transportation Electronics Building Automation, Security Systems and HVAC Medical Equipment Lighting and Sound System Control DUPLEX ENABLES MAX DATA RATE (bps) VL PIN LTC2862-1 HALF YES 20M NO LTC2862-2 HALF YES 250k NO LTC2863-1 FULL NO 20M NO LTC2863-2 FULL NO 250k NO LTC2864-1 FULL YES 20M NO LTC2864-2 FULL YES 250k NO LTC2865 FULL YES 20M/250k YES L, LT, LTC, LTM, Linear Technology the Linear logo and Module are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. LTC2865 Receiving 10Mbps 200mV Differential Signal with 1MHz 25V Common Mode Sweep TYPICAL APPLICATION RS485 Link With Large Ground Loop Voltage LTC2862 VCC1 DI1 A,B 50V/DIV VCC2 R RO1 RE1 DE1 A,B LTC2862 R Rt RO2 RE2 DE2 Rt D D GND1 V GROUND LOOP 25V 2862345 TA01a A-B A-B 0.5V/DIV DI2 RO 5V/DIV RO GND2 100ns/DIV 2862345 TA01b 2862345f 1 LTC2862/LTC2863/ LTC2864/LTC2865 ABSOLUTE MAXIMUM RATINGS (Note 1) Supply Voltages VCC..............................................................-0.3 to 6V VL................................................................-0.3 to 6V Logic Input Voltages (RE, DE, DI, SLO) ..........-0.3 to 6V Interface I/O: A, B, Y, Z .............................. -60V to +60V Receiver Output (RO) (LTC2862-LTC2864) ....................-0.3V to (VCC+0.3V) Receiver Output (RO) (LTC2865) ..................................-0.3V to (VL + 0.3V) Operating Ambient Temperature Range (Note 4) LTC286xC................................................. 0C to 70C LTC286xI .............................................. -40C to 85C LTC286xH .......................................... -40C to 125C Storage Temperature Range................... -65C to 150C Lead Temperature (Soldering, 10 sec) .................. 300C PIN CONFIGURATION LTC2862-1, LTC2862-2 LTC2862-1, LTC2862-2 TOP VIEW TOP VIEW RO 1 8 VCC RE 2 7 B DE 3 6 A DI 4 5 GND S8 PACKAGE 8-LEAD (150mil) PLASTIC SO TJMAX = 150C, JA = 150C/W, JC = 39C/W LTC2863-1, LTC2863-2 RO 1 RE 2 DE 3 DI 4 8 VCC 7 B 9 6 A 5 GND DD PACKAGE 8-LEAD (3mm x 3mm) PLASTIC DFN EXPOSED PAD (PIN 9) CONNECT TO PCB GND TJMAX = 150C, JA = 43C/W, JC = 3C/W LTC2863-1, LTC2863-2 TOP VIEW TOP VIEW VCC 1 8 A RO 2 7 B DI 3 6 Z GND 4 5 Y S8 PACKAGE 8-LEAD (150mil) PLASTIC SO TJMAX = 150C, JA = 150C/W, JC = 39C/W LTC2864-1, LTC2864-2 VCC 1 RO 2 DI 3 GND 4 8 A 7 B 9 6 Z 5 Y DD PACKAGE 8-LEAD (3mm x 3mm) PLASTIC DFN EXPOSED PAD (PIN 9) CONNECT TO PCB GND TJMAX = 150C, JA = 43C/W, JC = 3C/W LTC2864-1, LTC2864-2 TOP VIEW TOP VIEW NC 1 14 VCC RO 1 RO 2 13 NC RE 2 RE 3 12 A DE 3 11 B DI 4 7 Z GND 5 6 Y DE 4 DI 5 10 Z GND 6 9 Y GND 7 8 NC S PACKAGE 14-LEAD (150mil) PLASTIC SO TJMAX = 150C, JA = 88C/W, JC = 37C/W 10 VCC 9 A 11 8 B DD PACKAGE 10-LEAD (3mm x 3mm) PLASTIC DFN EXPOSED PAD (PIN 11) CONNECT TO PCB GND TJMAX = 150C, JA = 43C/W, JC = 3C/W 2862345f 2 LTC2862/LTC2863/ LTC2864/LTC2865 PIN CONFIGURATION LTC2865 LTC2865 TOP VIEW RO RE DE DI VL GND 1 2 3 4 5 6 13 TOP VIEW 12 11 10 9 8 7 VCC A B Z Y SLO MSE PACKAGE 12-LEAD PLASTIC MSOP EXPOSED PAD (PIN 13) CONNECT TO PCB GND TJMAX = 150C, JA = 40C/W, JC = 10C/W RO 1 12 VCC RE 2 11 A DE 3 13 10 B DI 4 9 Z VL 5 8 Y GND 6 7 SLO DE PACKAGE 12-LEAD (4mm x 3mm) PLASTIC DFN EXPOSED PAD (PIN 13) CONNECT TO PCB GND TJMAX = 150C, JA = 43C/W, JC = 4.3C/W ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2862CS8-1#PBF LTC2862CS8-1#TRPBF 28621 8-Lead (150mil) Plastic SO 0C to 70C LTC2862IS8-1#PBF LTC2862IS8-1#TRPBF 28621 8-Lead (150mil) Plastic SO -40C to 85C LTC2862HS8-1#PBF LTC2862HS8-1#TRPBF 28621 8-Lead (150mil) Plastic SO -40C to 125C LTC2862CS8-2#PBF LTC2862CS8-2#TRPBF 28622 8-Lead (150mil) Plastic SO 0C to 70C LTC2862IS8-2#PBF LTC2862IS8-2#TRPBF 28622 8-Lead (150mil) Plastic SO -40C to 85C LTC2862HS8-2#PBF LTC2862HS8-2#TRPBF 28622 8-Lead (150mil) Plastic SO -40C to 125C LTC2862CDD-1#PBF LTC2862CDD-1#TRPBF LFXK 8-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2862IDD-1#PBF LTC2862IDD-1#TRPBF LFXK 8-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2862HDD-1#PBF LTC2862HDD-1#TRPBF LFXK 8-Lead (3mm x 3mm) Plastic DFN -40C to 125C LTC2862CDD-2#PBF LTC2862CDD-2#TRPBF LFXM 8-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2862IDD-2#PBF LTC2862IDD-2#TRPBF LFXM 8-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2862HDD-2#PBF LTC2862HDD-2#TRPBF LFXM 8-Lead (3mm x 3mm) Plastic DFN -40C to 125C LTC2863CS8-1#PBF LTC2863CS8-1#TRPBF 28631 8-Lead (150mil) Plastic SO 0C to 70C LTC2863IS8-1#PBF LTC2863IS8-1#TRPBF 28631 8-Lead (150mil) Plastic SO -40C to 85C LTC2863HS8-1#PBF LTC2863HS8-1#TRPBF 28631 8-Lead (150mil) Plastic SO -40C to 125C LTC2863CS8-2#PBF LTC2863CS8-2#TRPBF 28632 8-Lead (150mil) Plastic SO 0C to 70C LTC2863IS8-2#PBF LTC2863IS8-2#TRPBF 28632 8-Lead (150mil) Plastic SO -40C to 85C LTC2863HS8-2#PBF LTC2863HS8-2#TRPBF 28632 8-Lead (150mil) Plastic SO -40C to 125C LTC2863CDD-1#PBF LTC2863CDD-1#TRPBF LFXN 8-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2863IDD-1#PBF LTC2863IDD-1#TRPBF LFXN 8-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2863HDD-1#PBF LTC2863HDD-1#TRPBF LFXN 8-Lead (3mm x 3mm) Plastic DFN -40C to 125C LTC2863CDD-2#PBF LTC2863CDD-2#TRPBF LFXP 8-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2863IDD-2#PBF LTC2863IDD-2#TRPBF LFXP 8-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2863HDD-2#PBF LTC2863HDD-2#TRPBF LFXP 8-Lead (3mm x 3mm) Plastic DFN -40C to 125C 2862345f 3 LTC2862/LTC2863/ LTC2864/LTC2865 ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2864CS-1#PBF LTC2864CS-1#TRPBF LTC2864S-1 14-Lead (150mil) Plastic SO 0C to 70C LTC2864IS-1#PBF LTC2864IS-1#TRPBF LTC2864S-1 14-Lead (150mil) Plastic SO -40C to 85C LTC2864HS-1#PBF LTC2864HS-1#TRPBF LTC2864S-1 14-Lead (150mil) Plastic SO -40C to 125C LTC2864CS-2#PBF LTC2864CS-2#TRPBF LTC2864S-2 14-Lead (150mil) Plastic SO 0C to 70C LTC2864IS-2#PBF LTC2864IS-2#TRPBF LTC2864S-2 14-Lead (150mil) Plastic SO -40C to 85C LTC2864HS-2#PBF LTC2864HS-2#TRPBF LTC2864S-2 14-Lead (150mil) Plastic SO -40C to 125C LTC2864CDD-1#PBF LTC2864CDD-1#TRPBF LFXQ 10-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2864IDD-1#PBF LTC2864IDD-1#TRPBF LFXQ 10-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2864HDD-1#PBF LTC2864HDD-1#TRPBF LFXQ 10-Lead (3mm x 3mm) Plastic DFN -40C to 125C LTC2864CDD-2#PBF LTC2864CDD-2#TRPBF LFXR 10-Lead (3mm x 3mm) Plastic DFN 0C to 70C LTC2864IDD-2#PBF LTC2864IDD-2#TRPBF LFXR 10-Lead (3mm x 3mm) Plastic DFN -40C to 85C LTC2864HDD-2#PBF LTC2864HDD-2#TRPBF LFXR 10-Lead (3mm x 3mm) Plastic DFN -40C to 125C LTC2865CMSE#PBF LTC2865CMSE#TRPBF 2865 12-Lead Plastic MSOP 0C to 70C LTC2865IMSE#PBF LTC2865IMSE#TRPBF 2865 12-Lead Plastic MSOP -40C to 85C LTC2865HMSE#PBF LTC2865HMSE#TRPBF 2865 12-Lead Plastic MSOP -40C to 125C LTC2865CDE#PBF LTC2865CDE#TRPBF LTXM 12-Lead (4mm x 3mm) Plastic DFN 0C to 70C LTC2865IDE#PBF LTC2865IDE#TRPBF LTXM 12-Lead (4mm x 3mm) Plastic DFN -40C to 85C LTC2865HDE#PBF LTC2865HDE#TRPBF LTXM 12-Lead (4mm x 3mm) Plastic DFN -40C to 125C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VCC = VL = 3.3V unless otherwise noted. (Note 2) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Supplies l 3 5.5 V LTC2865 Only l 1.65 VCC V Supply Current in Shutdown Mode (C-, I-Grade) (N/A LTC2863) DE = 0V, RE = VCC = VL l 0 5 A Supply Current in Shutdown Mode (H-Grade) (N/A LTC2863) DE = 0V, RE = VCC = VL l 0 15 A ICCTR Supply Current with Both Driver and Receiver Enabled (LTC2862-1, LTC2863-1, LTC2864-1, LTC2865 with SLO High) No Load, DE = VCC = VL, RE = 0V l 900 1300 A ICCTRS Supply Current with Both Driver and Receiver Enabled (LTC2862-2, LTC2863-2, LTC2864-2, LTC2865 with SLO Low) No Load, DE = VCC = VL, RE = 0V l 3.3 8 mA VCC Primary Power Supply VL Logic Interface Power Supply ICCS 2862345f 4 LTC2862/LTC2863/ LTC2864/LTC2865 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VCC = VL = 3.3V unless otherwise noted. (Note 2) SYMBOL PARAMETER CONDITIONS MIN Differential Driver Output Voltage R = (Figure 1) l R = 27 (Figure 1) TYP MAX UNITS 1.5 VCC V l 1.5 5 V 2 VCC V 0.2 V Driver |VOD| R = 50 (Figure 1) l |VOD| Change in Magnitude of Driver Differential Output Voltage R = 27 or 50 (Figure 1) l VOC Driver Common-Mode Output Voltage R = 27 or 50 (Figure 1) l 3 V |VOC| Change in Magnitude of Driver Common-Mode Output Voltage R = 27 or 50 (Figure 1) l 0.2 V IOSD Maximum Driver Short-Circuit Current -60V (Y or Z) 60V (Figure 2) l IOZD Driver Three-State (High Impedance) Output Current on Y and Z DE = 0V, VCC = 0V or 3.3V, VO = -25V, 25V Receiver Input Current (A,B) (C-, I-Grade LTC2863, LTC2864, LTC2865) 150 250 mA l 30 A VCC = 0V or 3.3V, VIN = 12V (Figure 3) l 125 A VCC = 0V or 3.3V, VIN = -7V (Figure 3) l VCC = 0V or 3.3V, VIN = 12V (Figure 3) l VCC = 0V or 3.3V, VIN = -7V (Figure 3) l Receiver IIN Receiver Input Current (A,B) (H-Grade LTC2863, LTC2864, LTC2865; C-, I-, H-Grade LTC2862) RIN Receiver Input Resistance VCM Receiver Common Mode Input Voltage (A + B)/2 VTH Differential Input Signal Threshold Voltage (A - B) -25V VCM 25V VTH Differential Input Signal Hysteresis VCM = 0V A -100 143 -100 0 VCC 5.5V, VIN = -25V or 25V (Figure 3) 112 l -25 k 25 l 200 150 l mV mV Differential Input Failsafe Threshold Voltage -25V VCM 25V VCM = 0V VOH Receiver Output High Voltage I(RO) = -3mA (Sourcing) VL 2.25V, I(RO) = -3mA (LTC2865) VL < 2.25V, I(RO) = -2mA (LTC2865) l l l VOL Receiver Output Low Voltage I(RO) = 3mA (Sinking) l 0.4 V IOZR Receiver Three-State (High Impedance) Output Current on RO RE = High, RO = 0V or VCC RO = 0V or VL (LTC2865) l 5 A IOSR Receiver Short-Circuit Current RE = Low, RO = 0V or VCC RO = 0V or VL (LTC2865) l 20 mA 0 25 mV mV VCC -0.4V VL -0.4V VL -0.4V V (LTC2862, LTC2863, LTC2864) VTH Input Threshold Voltage (DE, DI, RE) 3.0 VCC 5.5V l IINL Logic Input Current (DE, DI, RE) 0 VIN VCC l Logic -50 V Differential Input Failsafe Hysteresis Logic -200 A A 0.33 * VCC 0 0.67 * VCC V 5 A 0.67 * VL V 5 A (LTC2865) VTH Input Threshold Voltage (DE, DI, RE, SLO) 1.65V VL 5.5V l IINL Logic Input Current (DE, DI, RE, SLO) 0 VIN VL l 0.33 * VL 0 2862345f 5 LTC2862/LTC2863/ LTC2864/LTC2865 SWITCHING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VCC = VL = 3.3V unless otherwise noted. (Note 2) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Driver - High Speed (LTC2862-1, LTC2863-1, LTC2864-1, LTC2865 with SLO High) fMAX Maximum Data Rate (Note 3) l tPLHD, tPHLD Driver Input to Output RDIFF = 54, CL = 100pF (Figure 4) l 25 50 ns tPD Driver Input to Output Difference |tPLHD - tPHLD| RDIFF = 54, CL = 100pF (Figure 4) l 2 9 ns tSKEWD Driver Output Y to Output Z RDIFF = 54, CL = 100pF (Figure 4) l 10 ns tRD, tFD Driver Rise or Fall Time RDIFF = 54, CL = 100pF (Figure 4) l 15 ns tZLD, tZHD, tLZD, tHZD Driver Enable or Disable Time RL = 500, CL = 50pF, RE = 0V (Figure 5) l 180 ns tZHSD, tZLSD Driver Enable from Shutdown RL =500, CL = 50pF, RE = High (Figure 5) l 9 s tSHDND Time to Shutdown RL = 500, CL = 50pF, RE = High (Figure 5) l 180 ns 20 Mbps 4 Driver - Slew Rate Limited ( LTC2862-2, LTC2863-2, LTC2864-2, LTC2865 with SLO Low) fMAX Maximum Data Rate (Note 3) l 850 1500 ns 50 500 ns 500 ns 1200 ns 250 kbps tPLHD, tPHLD Driver Input to Output RDIFF = 54, CL = 100pF (Figure 4) l tPD Driver Input to Output Difference |tPLHD - tPHLD| RDIFF = 54, CL = 100pF (Figure 4) l tSKEWD Driver Output Y to Output Z RDIFF = 54, CL = 100pF (Figure 4) l tRD, tFD Driver Rise or Fall Time RDIFF = 54, CL =100pF (Figure 4) l tZLD, tZHD Driver Enable Time RL = 500, CL = 50pF, RE = 0V (Figure 5) l 1200 ns tLZD, tHZD Driver Disable Time RL = 500, CL = 50pF, RE = 0V (Figure 5) l 180 ns tZHSD, tZLSD Driver Enable from Shutdown RL = 500, CL = 50pF, RE = High (Figure 5) l 10 s tSHDND Time to Shutdown RL =500, CL = 50pF, RE = High (Figure 5) l 180 ns tPLHR, tPHLR Receiver Input to Output CL = 15pF, VCM = 1.5V, |VAB| = 1.5V, tR and tF < 4ns (Figure 6) l 50 65 ns tSKEWR Differential Receiver Skew |tPLHR - tPHLR| CL = 15pF (Figure 6) 2 9 ns tRR, tFR Receiver Output Rise or Fall Time CL = 15pF (Figure 6) l 3 12.5 ns tZLR, tZHR, tLZR, tHZR Receiver Enable/Disable Time RL = 1k, CL = 15pF, DE = High (Figure 7) l 40 ns tZHSR, tZLSR Receiver Enable from Shutdown RL = 1k, CL = 15pF, DE = 0V, (Figure 7) l 9 s tSHDNR Time to Shutdown RL = 1k, CL = 15pF, DE = 0V, (Figure 7) l 100 ns 500 800 Receiver Note 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 3. Maximum data rate is guaranteed by other measured parameters and is not tested directly. Note 4. This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 150C when overtemperature protection is active. Continuous operation above the specified maximum operating temperature may result in device degradation or failure. 2862345f 6 LTC2862/LTC2863/ LTC2864/LTC2865 TYPICAL PERFORMANCE CHARACTERISTICS Supply Current vs Data Rate Supply Current vs Temperature 10000 4.5 20 ICCTRS ICCTRS 1000 3.0 2.5 2.0 1.5 1.0 100 10 1 ICCTR 0.5 0 ICCTR 3.0 ICCS 4.0 4.5 VCC (V) 3.5 0.1 -50 -25 5.5 5.0 60 40 -0.5 SLEW LIMITED 20 -1.0 50 100 TEMPERATURE (C) DRIVER DELAY (NON SLEW LIMITED) (ns) 0.0 50 4 30 35 45 50 55 40 SUPPLY CURRENT (mA) 0 150 900 30 800 25 NON SLEW LIMITED 0 200 1000 SLEW LIMITED 20 -50 700 150 50 100 TEMPERATURE (C) 150 OUTPUT LOW 100 50 0 -50 -100 OUTPUT HIGH -150 -200 -60 -40 -20 0 20 OUTPUT VOLTAGE (V) 40 60 2862345 G06 2862345 G05 Driver Output Low/High Voltage vs Output Current 0 60 Driver Output Short-Circuit Current vs Voltage RDIFF = 54 CL = 100pF 2862345 G04 Driver Differential Output Voltage vs Temperature 3.5 2.5 3.0 VOH 2.3 RDIFF = 100 2.5 2.0 VDD (V) DRIVER OUTPUT VOLTAGE (V) DRIVER SKEW (NON SLEW LIMITED) (ns) 80 0 NON SLEW LIMITED 2862345 G03 DRIVER DELAY (SLEW LIMITED) (ns) 0.5 DRIVER SKEW (SLEW LIMITED) (ns) 100 NON SLEW LIMITED -1.5 -50 35 120 1.0 100 8 Driver Propagation Delay vs Temperature RDIFF = 54 CL = 100pF 150 12 2862345 G02 Driver Skew vs Temperature 1.5 SLEW LIMITED 25 50 75 100 125 150 TEMPERATURE (C) 2862345 G01 200 16 0 0 OUTPUT CURRENT (mA) 3.5 SUPPLY CURRENT (A) SUPPLY CURRENT (mA) 4.0 250 RDIFF = 54 CL = 100pF DATA RATE (SLEW LIMITED) (kbps) DATA RATE (NON SLEW LIMITED) (Mbps) Supply Current vs VCC TA = 25C, VCC = VL = 3.3V, unless otherwise noted. 1.5 2.1 1.9 RDIFF = 54 1.0 VOL 1.7 0.5 0.0 0 10 20 30 40 OUTPUT CURRENT (mA) 50 2862345 G07 1.5 -50 0 50 100 TEMPERATURE (C) 150 2862345 G08 2862345f 7 LTC2862/LTC2863/ LTC2864/LTC2865 TYPICAL PERFORMANCE CHARACTERISTICS Receiver Output Voltage vs Output Current (Source and Sink) Receiver Propagation Delay vs Temperature 58 VL = 5.5V Receiver Skew vs Temperature -1.6 VAB = 1.5V CL = 15pF 56 4.0 VL = 3.3V 3.0 VL = 2.25V 2.0 VL = 1.65V 54 52 50 1.0 48 VL = 1.65V TO 5.5V 0.0 4.0 6.0 8.0 0.0 2.0 OUTPUT CURRENT (ABSOLUTE VALUE) (mA) 46 -50 2862345 G09 VAB = 1.5V CL = 15pF -1.8 RECEIVER SKEW (ns) 5.0 RECEIVER DELAY (ns) RECEIVER OUTPUT VOLTAGE (V) 6.0 TA = 25C, VCC = VL = 3.3V, unless otherwise noted. -2.0 -2.2 -2.4 0 50 100 TEMPERATURE (C) 150 2862345 G10 -2.6 -50 0 50 100 TEMPERATURE (C) 150 2862345 G11 2862345f 8 LTC2862/LTC2863/ LTC2864/LTC2865 PIN FUNCTIONS PIN NUMBER PIN NAME LTC2862 LTC2863 LTC2864 (DFN) LTC2864 (SO) LTC2865 DESCRIPTION RO 1 2 1 2 1 Receiver Output. If the receiver output is enabled (RE low) and A-B > 200mV, then RO will be high. If A-B < -200mV, then RO will be low. If the receiver inputs are open, shorted, or terminated without a signal, RO will be high. RE 2 - 2 3 2 Receiver Enable. A low input enables the receiver. A high input forces the receiver output into a high impedance state. If RE is high with DE low, the part will enter a low power shutdown state. DE 3 - 3 4 3 Driver Enable. A high input on DE enables the driver. A low input will force the driver outputs into a high impedance state. If DE is low with RE high, the part will enter a low power shutdown state. DI 4 3 4 5 4 Driver Input. If the driver outputs are enabled (DE high), then a low on DI forces the driver noninverting output Y low and inverting output Z high. A high on DI, with the driver outputs enabled, forces the driver noninverting output Y high and inverting output Z low. VL - - - - 5 Logic Supply: 1.65V VL VCC. Bypass with 0.1F ceramic capacitor. Powers RO, RE, DE, DI and SLO interfaces on LTC2865 only. GND 5 4 5 6, 7 6 Ground. Exposed Pad 9 9 11 - 13 Connect the exposed pads on the DFN and MSOP packages to GND SLO - - - - 7 Slow Mode Enable. A low input switches the transmitter to the slew rate limited 250kbps max data rate mode. A high input supports 20Mbps. Y - 5 6 9 8 Noninverting Driver Output for LTC2863, LTC2864, LTC2865. High-impedance when driver disabled or unpowered. Z - 6 7 10 9 Inverting Driver Output for LTC2863, LTC2864, LTC2865. High-impedance when driver disabled or unpowered. B 7 7 8 11 10 Inverting Receiver Input (and Inverting Driver Output for LTC2862). Impedance is > 96k in receive mode or unpowered. A 6 8 9 12 11 Noninverting Receiver Input (and Noninverting Driver Output for LTC2862). Impedance is > 96k in receive mode or unpowered. VCC 8 1 10 14 12 NC 1, 8, 13 Power Supply. 3V < VCC < 5.5V. Bypass with 0.1F ceramic capacitor to GND. Unconnected Pins. Float or connect to GND. FUNCTION TABLES LTC2862 LTC2864, LTC2865: LOGIC INPUTS MODE DE RE 0 0 0 1 1 0 1 1 Transmit A, B RO LOGIC INPUTS DE RE MODE A, B Y, Z RO Receive RIN High-Z Active RIN Active 0 0 Shutdown RIN High-Z 0 1 Shutdown RIN High-Z High-Z Transceive Active Active 1 0 Transceive RIN Active Active Active High-Z 1 1 Transmit RIN Active High-Z Receive 2862345f 9 LTC2862/LTC2863/ LTC2864/LTC2865 BLOCK DIAGRAMS LTC2862 LTC2863 VCC VCC A* RO RO RECEIVER RECEIVER B* RE DE A* MODE CONTROL LOGIC B* Z* DI DRIVER Y* DI DRIVER GND 2862345 BDb *15kV ESD GND 2862345 BDa *15kV ESD LTC2864 LTC2865 VCC VL VCC A* A* RO RO RECEIVER RECEIVER B* B* RE RE DE MODE CONTROL LOGIC DE MODE CONTROL LOGIC Z* Z* DI DI DRIVER DRIVER Y* Y* SLO GND GND 2862345 BDc 2862345 BDd *15kV ESD *15kV ESD 2862345f 10 LTC2862/LTC2863/ LTC2864/LTC2865 TEST CIRCUITS Y** Y** GND OR DI VCC* + VOD - DRIVER R + VOC - R Z** IOSD GND OR DI VCC* DRIVER + - -60V TO 60V Z** 2862345 FO2 2862345 FO1 *LTC2865 ONLY: SUBSTITUTE VL FOR VCC **LTC2862 ONLY: SUBSTITUTE A, B FOR Y, Z *LTC2865 ONLY: SUBSTITUTE VL FOR VCC **LTC2862 ONLY: SUBSTITUTE A, B FOR Y, Z Figure 1. Driver DC Characteristics Figure 2. Driver Output Short-Circuit Current IIN VIN + - A OR B RECEIVER B OR A 2862345 FO3 V RIN = IN IIN Figure 3. Receiver Input Current and Input Resistance VCC* Y** DI DI CL tPLHD tPHLD 0V tSKEWD RDIFF DRIVER CL Z** Y, Z VO 1/2 VO 2862345 FO4 (Y-Z) 90% 10% 90% 0 0 tRD **LTC2862 ONLY: SUBSTITUTE A, B FOR Y, Z 10% tFD 2862345 F04b *LTC2865 ONLY: SUBSTITUTE VL FOR VCC Figure 4. Driver Timing Measurement 2862345f 11 LTC2862/LTC2863/ LTC2864/LTC2865 TEST CIRCUITS GND OR VCC RL Y** CL VCC* OR DI GND VCC* DE 0V DRIVER tZLD, tZLSD VCC RL DE 1/2 VCC Y OR Z VCC OR GND Z** CL VOL tLZD 1/2 VCC VO 0.5V VOH Z OR Y 0.5V 1/2 VCC 0V tZHD, tZHSD *LTC2865 ONLY: SUBSTITUTE VL FOR VCC **LTC2862 ONLY: SUBSTITUTE A, B FOR Y, Z 2862345 F05b tHZD, tSHDN 2862345 FO5 *LTC2865 ONLY: SUBSTITUTE VL FOR VCC Figure 5. Driver Enable and Disable Timing Measurements tSKEWR = |tPLHR - tPHLR| VAB VAB/2 VCM RO RECEIVER 0 A-B -VAB A tPLHR VCC* B CL VAB/2 VO RO 0 2862345 FO6a tPHLR 90% 1/2 VCC* 10% 90% 1/2 VCC* 10% tRR 2862345 F06b tFR *LTC2865 ONLY: SUBSTITUTE VL FOR VCC Figure 6. Receiver Propagation Delay Measurements 0V OR VCC A RECEIVER VCC OR 0V DI = 0V OR VCC* B RL RO CL VCC OR GND VCC* RE 0V tZLR, tZLSR 1/2 VCC* tLZR VCC* RO VOL RE 1/2 VCC* VO 0.5V VOH RO 2862345 FO7a *LTC2865 ONLY: SUBSTITUTE VL FOR VCC 0.5V 1/2 VCC* 0V tZHR, tZHSR tHZR, tSHDNR 2862345 F07b *LTC2865 ONLY: SUBSTITUTE VL FOR VCC Figure 7. Receiver Enable/Disable Time Measurements 2862345f 12 LTC2862/LTC2863/ LTC2864/LTC2865 APPLICATIONS INFORMATION 60V Fault Protection 25V Extended Common Mode Range The LTC2862-LTC2865 devices answer application needs for overvoltage fault-tolerant RS485/RS422 transceivers operating from 3V to 5.5V power supplies. Industrial installations may encounter common mode voltages between nodes far greater than the -7V to 12V range specified by the RS485 standards. Standard RS485 transceivers can be damaged by voltages above their typical absolute maximum ratings of -8V to 12.5V. The limited overvoltage tolerance of standard RS485 transceivers makes implementation of effective external protection networks difficult without interfering with proper data network performance within the -7V to 12V region of RS485 operation. Replacing standard RS485 transceivers with the rugged LTC2862-LTC2865 devices may eliminate field failures due to overvoltage faults without using costly external protection devices. To further increase the reliability of operation and extend functionality in environments with high common mode voltages due to electrical noise or local ground potential differences due to ground loops, the LTC2862-LTC2865 devices feature an extended common mode operating range of -25V to 25V. This extended common mode range allows the LTC2862-LTC2865 devices to transmit and receive under conditions that would cause data errors and possible device damage in competing products. The 60V fault protection of the LTC2862 series is achieved by using a high-voltage BiCMOS integrated circuit technology. The naturally high breakdown voltage of this technology provides protection in powered-off and highimpedance conditions. The driver outputs use a progressive foldback current limit design to protect against overvoltage faults while still allowing high current output drive. The LTC2862 series is protected from 60V faults even with GND open, or VCC open or grounded. Additional precautions must be taken in the case of VCC present and GND open. The LTC2862 series chip will protect itself from damage, but the chip ground current may flow out through the ESD diodes on the logic I/O pins and into associated circuitry. The system designer should examine the susceptibility of the associated circuitry to damage if the condition of a GND open fault with VCC present is anticipated. The high voltage rating of the LTC2862 series makes it simple to extend the overvoltage protection to higher levels using external protection components. Compared to lower voltage RS485 transceivers, external protection devices with higher breakdown voltages can be used, so as not to interfere with data transmission in the presence of large common mode voltages. The Typical Applications section shows a protection network against faults to the 120VAC line voltage, while still maintaining the extended 25V common mode range on the signal lines. 15kV ESD Protection The LTC2862 series devices feature exceptionally robust ESD protection. The transceiver interface pins (A,B,Y,Z) feature protection to 15kV HBM with respect to GND without latchup or damage, during all modes of operation or while unpowered. All the other pins are protected to 8kV HBM to make this a component capable of reliable operation under severe environmental conditions. Driver The driver provides full RS485/RS422 compatibility. When enabled, if DI is high, Y-Z is positive for the full-duplex devices (LTC2863-LTC2865) and A-B is positive for the half-duplex device (LTC2862). When the driver is disabled, both outputs are highimpedance. For the full-duplex devices, the leakage on the driver output pins is guaranteed to be less than 30A over the entire common mode range of -25V to 25V. On the half-duplex LTC2862, the impedance is dominated by the receiver input resistance, RIN. Driver Overvoltage and Overcurrent Protection The driver outputs are protected from short circuits to any voltage within the Absolute Maximum range of -60V to 60V. The maximum current in a fault condition is 250mA. The driver includes a progressive foldback current limiting circuit that continuously reduces the driver current limit with increasing output fault voltage. The fault current is less than 15mA for fault voltages over 40V. 2862345f 13 LTC2862/LTC2863/ LTC2864/LTC2865 APPLICATIONS INFORMATION All devices also feature thermal shutdown protection that disables the driver and receiver in case of excessive power dissipation (see Note 4). Full Failsafe Operation When the absolute value of the differential voltage between the A and B pins is greater than 200mV with the receiver enabled, the state of RO will reflect the polarity of (A-B). These parts have a failsafe feature that guarantees the receiver output will be in a logic 1 state (the idle state) when the inputs are shorted, left open, or terminated but not driven, for more than about 3s. The delay allows normal data signals to transition through the threshold region without being interpreted as a failsafe condition. This failsafe feature is guaranteed to work for inputs spanning the entire common mode range of -25V to 25V. Most competing devices achieve the failsafe function by a simple negative offset of the input threshold voltage. This causes the receiver to interpret a zero differential voltage as a logic 1 state. The disadvantage of this approach is the input offset can introduce duty cycle asymmetry at the receiver output that becomes increasingly worse with low input signal levels and slow input edge rates. Other competing devices use internal biasing resistors to create a positive bias at the receiver inputs in the absence of an external signal. This type of failsafe biasing is ineffective if the network lines are shorted, or if the network is terminated but not driven by an active transmitter. The LTC2862 series uses fully symmetric positive and negative receiver thresholds (typically 75mV) to maintain good duty cycle symmetry at low signal levels. The failsafe operation is performed with a window comparator to determine when the differential input voltage falls between the positive and negative thresholds. If this condition persists for more than about 3s the failsafe condition is asserted and the RO pin is forced to the logic 1 state. This circuit provides full failsafe operation with no negative impact to receiver duty cycle symmetry, as shown in Figure 8. The input signal in Figure 8 was obtained by driving a 10Mbps RS485 signal through 1000 feet of cable, thereby attenuating it to a 200mV signal with slow rise and fall times. Good duty cycle symmetry is observed at RO despite the degraded input signal. Enhanced Receiver Noise Immunity An additional benefit of the fully symmetric receiver thresholds is enhanced receiver noise immunity. The differential input signal must go above the positive threshold to register as a logic 1 and go below the negative threshold to register as a logic 0. This provides a hysteresis of 150mV (typical) at the receiver inputs for any valid data signal. (An invalid data condition such as a DC sweep of the receiver inputs will produce a different observed hysteresis due to the activation of the failsafe circuit.) Competing devices that employ a negative offset of the input threshold voltage generally have a much smaller hysteresis and subsequently have lower receiver noise immunity. RS485 Network Biasing A, B 200mV/DIV A-B 200mV/DIV RO 1.6V/DIV 40ns/DIV 2862345 F08 Figure 8. Duty Cycle of Balanced Receiver with 200mV 10Mbps Input Signal RS485 networks are usually biased with a resistive divider to generate a differential voltage of 200mV on the data lines, which establishes a logic 1 state (the idle state) when all the transmitters on the network are disabled. The values of the biasing resistors are not fixed, but depend on the number and type of transceivers on the line and the number and value of terminating resistors. Therefore, the values of the biasing resistors must be customized to each specific network installation, and may change if nodes are added to or removed from the network. The internal failsafe feature of the LTC2862-LTC2865 eliminates the need for external network biasing resistors 2862345f 14 LTC2862/LTC2863/ LTC2864/LTC2865 APPLICATIONS INFORMATION provided they are used in a network of transceivers with similar internal failsafe features. The LTC2862-LTC2865 transceivers will operate correctly on biased, unbiased, or under-biased networks. Hi-Z State The receiver output is internally driven high (to VCC or VL) or low (to GND) with no external pull-up needed. When the receiver is disabled the RO pin becomes Hi-Z with leakage of less than 5A for voltages within the supply range. High Receiver Input Resistance The receiver input load from A or B to GND for the LTC2863, LTC2864, and LTC2865 is less than one-eighth unit load, permitting a total of 256 receivers per system without exceeding the RS485 receiver loading specification. All grades of the LTC2862 and the H-grade devices of the LTC2863, LTC2864, and LTC2865 have an input load less than one-seventh unit load over the complete temperature range of -40C to 125C. The increased input load specification for these devices is due to increased junction leakage at high temperature and the transmitter circuitry sharing the A and B pins on the LTC2862. The input load of the receiver is unaffected by enabling/disabling the receiver or by powering/unpowering the part. Supply Current The unloaded static supply currents in these devices are low --typically 900A for non slew limited devices and 3.3mA for slew limited devices. In applications with resistively terminated cables, the supply current is dominated by the driver load. For example, when using two 120 terminators with a differential driver output voltage of 2V, the DC load current is 33mA, which is sourced by the positive voltage supply. Power supply current increases with toggling data due to capacitive loading and this term can increase significantly at high data rates. A plot of the supply current vs data rate is shown in the Typical Performance Characteristics of this data sheet. During fault conditions with a positive voltage larger than the supply voltage applied to the transmitter pins, or during transmitter operation with a high positive common mode voltage, positive current of up to 80mA may flow from the transmitter pins back to VCC. If the system power supply or loading cannot sink this excess current, a 5.6V 1W 1N4734 Zener diode may be placed between VCC and GND to prevent an overvoltage condition on VCC. There are no power-up sequence restrictions on the LTC2865. However, correct operation is not guaranteed for VL > VCC. High Speed Considerations A ground plane layout with a 0.1F bypass capacitor placed less than 7mm away from the VCC pin is recommended. The PC board traces connected to signals A/B and Z/Y should be symmetrical and as short as possible to maintain good differential signal integrity. To minimize capacitive effects, the differential signals should be separated by more than the width of a trace and should not be routed on top of each other if they are on different signal planes. Care should be taken to route outputs away from any sensitive inputs to reduce feedback effects that might cause noise, jitter, or even oscillations. For example, in the full-duplex devices, DI and A/B should not be routed near the driver or receiver outputs. The logic inputs have a typical hysteresis of 100mV to provide noise immunity. Fast edges on the outputs can cause glitches in the ground and power supplies which are exacerbated by capacitive loading. If a logic input is held near its threshold (typically VCC/2 or VL/2), a noise glitch from a driver transition may exceed the hysteresis levels on the logic and data input pins, causing an unintended state change. This can be avoided by maintaining normal logic levels on the pins and by slewing inputs faster than 1V/s. Good supply decoupling and proper driver termination also reduce glitches caused by driver transitions. RS485 Cable Length vs Data Rate Many factors contribute to the maximum cable length that can be used for RS485 or RS422 communication, including driver transition times, receiver threshold, duty cycle distortion, cable properties and data rate. A typical 2862345f 15 LTC2862/LTC2863/ LTC2864/LTC2865 APPLICATIONS INFORMATION curve of cable length versus maximum data rate is shown in Figure 9. Various regions of this curve reflect different performance limiting factors in data transmission. At frequencies below 100kbps, the maximum cable length is determined by DC resistance in the cable. In this example, a cable longer than 4000ft will attenuate the signal at the far end to less than what can be reliably detected by the receiver. LOW EMI MODE SLO = GND 100 RS485 STANDARD SPEC 1M 10M DATA RATE (bps) 20 100M Figure 9. Cable Length vs Data Rate (RS485/RS422 Standard Shown in Vertical Solid Line) For data rates above 100kbps the capacitive and inductive properties of the cable begin to dominate this relationship. The attenuation of the cable is frequency and length dependent, resulting in increased rise and fall times at the far end of the cable. At high data rates or long cable lengths, these transition times become a significant part of the signal bit time. Jitter and intersymbol interference aggravate this so that the time window for capturing valid data at the receiver becomes impossibly small. The boundary at 20Mbps in Figure 9 represents the guaranteed maximum operating rate of the LTC2862 series. The dashed vertical line at 10Mbps represents the specified maximum data rate in the RS485 standard. This boundary is not a limit, but reflects the maximum data rate that the specification was written for. 80 0 60 NON SLEW LIMITED -20 40 -40 20 -60 0 -80 -20 -100 Y-Z (SLEW LIMITED) (dB) 2862345 F09 Y-Z (NON SLEW LIMITED) (dB) CABLE LENGTH (FT) 1k 100k Low EMI 250kbps Data Rate The LTC2862-2, LTC2863-2, and the LTC2864-2 feature slew rate limited transmitters for low electromagnetic interference (EMI) in sensitive applications. In addition, the LTC2865 has a logic-selectable 250kbps transmit rate. The slew rate limit circuit maintains consistent control of transmitter slew rates across voltage and temperature to ensure low EMI under all operating conditions. Figure 10 demonstrates the reduction in high frequency content achieved by the 250kbps mode compared to the 20Mbps mode. 10k 10 10k It should be emphasized that the plot in Figure 9 shows a typical relation between maximum data rate and cable length. Results with the LTC2862 series will vary, depending on cable properties such as conductor gauge, characteristic impedance, insulation material, and solid versus stranded conductors. -40 SLEW LIMITED -120 0 2 4 6 8 FREQUENCY (MHz) 10 -60 12 2862345 F10 Figure 10. High Frequency EMI Reduction of Slew Limited 250kbps Mode Compared to Non Slew Limited 20Mbps Mode The 250kbps mode has the added advantage of reducing signal reflections in an unterminated network, and thereby increasing the length of a network that can be used without termination. Using the rule of thumb that the rise time of the transmitter should be greater than four times the one-way delay of the signal, networks of up to 140 feet can be driven without termination. 2862345f 16 LTC2862/LTC2863/ LTC2864/LTC2865 TYPICAL APPLICATIONS Bidirectional 60V 20Mbps Level Shifter/Isolator C LTC2863-1 LTC2863-1 R1 A VCC Y RO DATA OUT 2 VCC DI R2 DATA IN 2 R1 B Z C C R1 Y DI DATA IN 1 A RO R2 DATA OUT 1 R1 Z VCC GND B C GND VCC 60V 2862345 TA03 R1 = 100k 1%. PLACE R1 RESISTORS NEAR A AND B PINS. R2 = 10k C = 47pF, 5%, 50 WVDC. MAY BE OMITTED FOR DATA RATES 100kbps. Failsafe O Application (Idle State = Logic O) 5V I1 RO RO LTC2862 R DE DE DI I2 DI/ VCC B A "A" "B" D GND 2862345 TA04 2862345f 17 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) .189 - .197 (4.801 - 5.004) NOTE 3 .045 .005 .050 BSC 8 .245 MIN 7 6 5 .160 .005 .150 - .157 (3.810 - 3.988) NOTE 3 .228 - .244 (5.791 - 6.197) .030 .005 TYP 1 RECOMMENDED SOLDER PAD LAYOUT .010 - .020 x 45 (0.254 - 0.508) .008 - .010 (0.203 - 0.254) 0- 8 TYP .016 - .050 (0.406 - 1.270) NOTE: 1. DIMENSIONS IN .053 - .069 (1.346 - 1.752) .014 - .019 (0.355 - 0.483) TYP INCHES (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) 2 3 4 .004 - .010 (0.101 - 0.254) .050 (1.270) BSC SO8 0303 2862345f 18 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. DD Package 8-Lead Plastic DFN (3mm x 3mm) (Reference LTC DWG # 05-08-1698 Rev C) 0.70 p0.05 3.5 p0.05 1.65 p0.05 2.10 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 2.38 p0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 3.00 p0.10 (4 SIDES) R = 0.125 TYP 5 0.40 p 0.10 8 1.65 p 0.10 (2 SIDES) PIN 1 TOP MARK (NOTE 6) (DD8) DFN 0509 REV C 0.200 REF 0.75 p0.05 4 0.25 p 0.05 1 0.50 BSC 2.38 p0.10 0.00 - 0.05 BOTTOM VIEW--EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 2862345f 19 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. S Package 14-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) .337 - .344 (8.560 - 8.738) NOTE 3 .045 .005 .050 BSC 14 N 12 11 10 9 8 N .245 MIN .160 .005 .150 - .157 (3.810 - 3.988) NOTE 3 .228 - .244 (5.791 - 6.197) 1 .030 .005 TYP 13 2 3 N/2 N/2 RECOMMENDED SOLDER PAD LAYOUT 1 .010 - .020 x 45 (0.254 - 0.508) .008 - .010 (0.203 - 0.254) 2 3 4 5 .053 - .069 (1.346 - 1.752) NOTE: 1. DIMENSIONS IN .014 - .019 (0.355 - 0.483) TYP INCHES (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) 7 .004 - .010 (0.101 - 0.254) 0 - 8 TYP .016 - .050 (0.406 - 1.270) 6 .050 (1.270) BSC S14 0502 2862345f 20 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. DD Package 10-Lead Plastic DFN (3mm x 3mm) (Reference LTC DWG # 05-08-1699 Rev C) 0.70 p0.05 3.55 p0.05 1.65 p0.05 2.15 p0.05 (2 SIDES) PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 2.38 p0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 3.00 p0.10 (4 SIDES) R = 0.125 TYP 6 0.40 p 0.10 10 1.65 p 0.10 (2 SIDES) PIN 1 NOTCH R = 0.20 OR 0.35 s 45o CHAMFER PIN 1 TOP MARK (SEE NOTE 6) (DD) DFN REV C 0310 5 0.200 REF 1 0.25 p 0.05 0.50 BSC 0.75 p0.05 0.00 - 0.05 2.38 p0.10 (2 SIDES) BOTTOM VIEW--EXPOSED PAD NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2862345f 21 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. DE/UE Package 12-Lead Plastic DFN (4mm x 3mm) (Reference LTC DWG # 05-08-1695 Rev D) 0.70 p0.05 3.60 p0.05 2.20 p0.05 3.30 p0.05 1.70 p 0.05 PACKAGE OUTLINE 0.25 p 0.05 0.50 BSC 2.50 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 p0.10 (2 SIDES) 7 R = 0.115 TYP 0.40 p 0.10 12 R = 0.05 TYP PIN 1 TOP MARK (NOTE 6) 0.200 REF 3.00 p0.10 (2 SIDES) 3.30 p0.10 1.70 p 0.10 PIN 1 NOTCH R = 0.20 OR 0.35 s 45o CHAMFER 0.75 p0.05 6 0.25 p 0.05 1 (UE12/DE12) DFN 0806 REV D 0.50 BSC 2.50 REF 0.00 - 0.05 BOTTOM VIEW--EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE A VARIATION OF VERSION (WGED) IN JEDEC PACKAGE OUTLINE M0-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 2862345f 22 LTC2862/LTC2863/ LTC2864/LTC2865 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. MSE Package 12-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1666 Rev F) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 t 0.102 (.112 t .004) 5.23 (.206) MIN 2.845 t 0.102 (.112 t .004) 0.889 t 0.127 (.035 t .005) 6 1 1.651 t 0.102 (.065 t .004) 1.651 t 0.102 3.20 - 3.45 (.065 t .004) (.126 - .136) 12 0.65 0.42 t 0.038 (.0256) (.0165 t .0015) BSC TYP RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) 0.35 REF 4.039 t 0.102 (.159 t .004) (NOTE 3) 0.12 REF DETAIL "B" CORNER TAIL IS PART OF DETAIL "B" THE LEADFRAME FEATURE. FOR REFERENCE ONLY 7 NO MEASUREMENT PURPOSE 0.406 t 0.076 (.016 t .003) REF 12 11 10 9 8 7 DETAIL "A" 0s - 6s TYP 3.00 t 0.102 (.118 t .004) (NOTE 4) 4.90 t 0.152 (.193 t .006) GAUGE PLANE 0.53 t 0.152 (.021 t .006) 1 2 3 4 5 6 DETAIL "A" 1.10 (.043) MAX 0.18 (.007) SEATING PLANE 0.22 - 0.38 (.009 - .015) TYP 0.650 (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 0.86 (.034) REF 0.1016 t 0.0508 (.004 t .002) MSOP (MSE12) 0911 REV F 2862345f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23 LTC2862/LTC2863/ LTC2864/LTC2865 TYPICAL APPLICATION RS485 Network with 120V AC Line Fault Protection LTC2862-2 RO RX RAYCHEM POLYSWITCH TRF600-150 x2 47 VCC B Rt 120 RE DE 0.1F 250V A DI TX 2862345 TA02 47 CARBON COMPOSITE 5W 1.5KE36CA RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT1785, LT1791 60V Fault Protected RS485/RS422 Transceivers 60V Tolerant, 15kV ESD, 250kbps LTC2850-53 3.3V 20Mbps 15kV RS485 Transceivers Up to 256 Transceivers Per Bus LTC2854, LTC2855 3.3V 20Mbps RS485 Transceivers with Integrated Switchable Termination 25kV ESD (LTC2854), 15kV ESD (LTC2855) LTC2856-1 Family 5V 20Mbps and Slew Rate Limited RS485 Transceivers 15kV ESD LTC2859, LTC2861 5V 20Mbps RS485 Transceivers with Integrated Switchable Termination 15kV ESD LTC1535 Isolated RS485 Transceiver 2500VRMS Isolation, Requires External Transceiver LTM2881 (R) Complete 3.3V Isolated RS485/RS422 Module Transceiver + Power 2500VRMS Isolation with Integrated Isolated DC/DC Converter, 1W Power, Low EMI, 15kV ESD, 30kV/s Common Mode Transient Immunity 2862345f 24 Linear Technology Corporation LT 1211 * PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 FAX: (408) 434-0507 www.linear.com (c) LINEAR TECHNOLOGY CORPORATION 2011