STPS1L40 Low drop power Schottky rectifier Features Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche capability specified A A K K SMA (JEDEC DO-214AC) STPS1L40A SMB (JEDEC DO-214AA) STPS1L40U Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. A K Packaged in SMA, SMB and STmite flat this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. STmite flat STPS1L40MF Table 1. June 2009 Doc ID 5507 Rev 6 Device summary Symbol Value IF(AV) 1A VRRM 40 V Tj (max) 150 C VF(max) 0.42 V 1/11 www.st.com 11 Characteristics 1 STPS1L40 Characteristics Table 2. Absolute ratings (limiting values) Symbol VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Unit 40 V 8 STmite flat 2 A SMA / SMB TL = 130 C = 0.5 Average forward current STmite flat TC = 135 C = 0.5 IFSM Surge non repetitive forward current IRRM 1 A tp = 10 ms sinusoidal 60 A Repetitive peak reverse current tp = 2 s F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 s square 1 A PARM Repetitive peak avalanche power tp = 1 s Tj = 25 C 900 W - 65 to + 150 C 150 C 10000 V/s Value Unit Tj dV/dt Storage temperature range Maximum operating junction temperature (1) Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Parameter Rth(j-l) Junction to lead Rth(j-c) Junction to case Table 4. Symbol Parameter IR (1) Reverse leakage current VF (1) SMA 30 SMB 25 STmite flat 20 C/W Static electrical characteristics Tests conditions Tj = 25 C Tj = 125 C Tj = 25 C Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM IF = 1 A Min. Typ. Max. Unit - - 35 A - 6 10 mA - - 0.5 - 0.37 0.42 - - 0.63 - 0.5 0.61 V IF = 2 A 1. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.23 x IF(AV) + 0.19 IF2(RMS) 2/11 Value SMA / SMB IF(AV) Tstg 1. Parameter Doc ID 5507 Rev 6 STPS1L40 Characteristics Figure 1. 0.8 Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) 1.2 0.7 = 0.1 = 0.05 0.6 = 0.2 = 0.5 IF(AV)(A) SMA Rth(j-a) = Rth(j-l) 1.0 =1 0.8 0.5 0.6 0.4 0.3 Rth(j-a) = 120 C/W 0.4 0.2 T T 0.2 0.1 0.0 0.0 = tp / T IF(AV)(A) 0.2 Figure 3. 1.2 Average forward current versus ambient temperature (SMA, = 0.5) 0.4 0.6 0.8 1.0 1.2 = tp / T tp 1.4 tp 0.0 0 1.6 25 Average forward current versus Figure 4. ambient temperature (SMB, = 0.5) IF(AV)(A) Tamb(C) 50 75 100 125 150 Average forward current versus ambient temperature (STmite flat, = 0.5) I (A) 1.2 F(AV) STmite flat SMB Rth(j-a) = Rth(j-l) 1.0 Rth(j-a) = Rth(j-c) 1.0 0.8 0.8 Rth(j-a) = 100 C/W 0.6 0.6 Rth(j-a) = 250 C/W 0.4 0.4 T T 0.2 0.2 = tp / T tp = tp / T Tamb(C) 0.0 tp Tamb(C) 0.0 0 Figure 5. 25 50 75 100 125 150 Normalized avalanche power derating versus pulse duration 0 Figure 6. 25 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 C) PARM(tp) PARM(1 s) 1.2 1 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(C) tp(s) 0 0.1 1 10 100 1000 25 Doc ID 5507 Rev 6 50 75 100 125 150 3/11 Characteristics Figure 7. STPS1L40 Non repetitive surge peak forward current versus overload duration (maximum values, SMA) I (A) 7 M Figure 8. Non repetitive surge peak forward current versus overload duration (maximum values, SMB) I (A) 7 M SMA SMB 6 6 5 5 Ta = 25 C 4 Ta = 75 C 3 Ta = 125 C 2 1 IM 0 1.E-04 1.E-03 Figure 9. 1.E-02 1.E-01 1.E+00 Non repetitive surge peak forward current versus overload duration (maximum values, STmite flat) I (A) 16 M STmite flat Ta = 125 C 2 IM 1.E+00 Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout 0.6 8 Tc = 25 C 0.5 6 Tc = 75 C 0.4 Tc = 125 C IM 2 t = 0.5 0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Zth(j-a)/Rth(j-a) 0.9 0.8 0.7 0.3 0.2 0.1 t(s) Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 0.9 Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout 0.8 0.7 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 1.E+00 1.E+01 1.E+02 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+03 Zth(j-a)/Rth(j-a) STmite flat Epoxy printed circuit board, copper thickness = 35 m, recommended pad layout Single pulse 0.1 0.1 0.0 1.E-02 tp(s) 1.E-01 Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (STmite flat) 1.0 SMB Single pulse 0.0 1.E-02 0.6 4/11 1.E-01 SMA 0.9 0.7 1.0 1.E-02 Zth(j-a)/Rth(j-a) 0.8 4 1.E-03 Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 12 10 t = 0.5 0 1.E-04 1.0 14 Ta = 75 C 3 1 t(s) t = 0.5 Ta = 25 C 4 0.0 1.E-02 Doc ID 5507 Rev 6 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 STPS1L40 Characteristics Figure 13. Reverse leakage current versus reverse voltage applied (typical values) I (mA) 1.E+02 R Figure 14. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F = 1 MHz Vosc = 30 mVRMS Tj = 25 C Tj = 150 C 1.E+01 Tj = 125 C Tj = 100 C 1.E+00 100 Tj = 75 C 1.E-01 Tj = 50 C 1.E-02 Tj = 25 C VR(V) 1.E-03 0 5 10 15 20 25 30 35 1 40 Figure 15. Forward voltage drop versus forward current (typical values, high level) VR(V) 10 10 100 Figure 16. Forward voltage drop versus forward current (typical values, low level) I (A) 3.0 FM I (A) 10.00 FM 2.5 Tj = 125 C 1.00 2.0 Tj = 125 C 1.5 Tj = 25 C Tj = 25 C 1.0 0.10 0.5 0.01 0.0 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.0 0.0 Doc ID 5507 Rev 6 VFM(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 5/11 Characteristics STPS1L40 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 140 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMB) Rth(j-a)(C/W) 120 120 Rth(j-a)(C/W) SMA Epoxy printed circuit board, FR4 copper thickness = 35 m 100 SMB Epoxy printed circuit board, FR4 copper thickness = 35 m 100 80 80 60 60 40 40 20 20 0 0.0 Scu(cm) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Scu(cm) 0 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat) 250 Rth(j-a)(C/W) Epoxy printed circuit board, FR4 copper thickness = 35 m 225 STmite flat 200 175 150 125 100 75 50 25 0 0.0 6/11 Scu(cm) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 5507 Rev 6 4.0 4.5 5.0 STPS1L40 2 Package information Package information Epoxy meets UL94, V0 Cathode band (SMA, SMB) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Figure 20. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) Doc ID 5507 Rev 6 7/11 Package information Table 6. STPS1L40 SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 21. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) 8/11 Doc ID 5507 Rev 6 STPS1L40 Package information Table 7. STmite flat dimensions Dimensions Ref. L E1 D L1 Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 L2 b b2 L3 E Millimeters c A c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 Figure 22. Footprint dimensions 0.85 0.63 2.00 0.65 (0.033) (.025) (0.079) (.026) 0.95 0.65 (0.026) (0.037) 1.95 (0.077) 4.13 (0.163) millimeters (inches) Doc ID 5507 Rev 6 9/11 Ordering information 3 Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS1L40A GB4 SMA 0.068 g 5000 Tape and reel STPS1L40U GC4 SMB 0.107 g 2500 Tape and reel STPS1L40MF F1L4 STmite flat 0.016 g 1200 Tape and reel Revision history Table 9. 10/11 STPS1L40 Document revision history Date Revision Changes Jul-2003 4A Aug-2004 5 SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080). 24-Jun-2009 6 Added STmite flat package. Last update. Doc ID 5507 Rev 6 STPS1L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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