June 2009 Doc ID 5507 Rev 6 1/11
11
STPS1L40
Low drop power Schottky rectifier
Features
■Very small conduction losses
■Negligible switching losses
■Low forward voltage drop
■Surface mount miniature packages
■Avalanche capability specified
Description
Single chip Schottky rectifiers suited to switched
mode power supplies and high frequency DC to
DC converters.
Packaged in SMA, SMB and STmite flat this
device is especially intended for surface mounting
and used in low voltage, high frequency inverters,
free wheeling and polarity protection applications.
Table 1. Device summary
Symbol Value
IF(AV) 1 A
VRRM 40 V
Tj (max) 150 °C
VF(max) 0.42 V
K
A
SMB
(JEDEC DO-214AA)
STPS1L40U
SMA
(JEDEC DO-214AC)
STPS1L40A
K
A
K
A
STmite flat
STPS1L40MF
www.st.com
Characteristics STPS1L40
2/11 Doc ID 5507 Rev 6
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.23 x IF(AV) + 0.19 IF2(RMS)
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 40 V
IF(RMS) Forward rms current SMA / SMB 8 A
STmite flat 2
IF(AV) Average forward current SMA / SMB TL = 130 °C δ = 0.5 1A
STmite flat TC = 135 °C δ = 0.5
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 60 A
IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A
IRSM Non repetitive peak reverse current tp = 100 µs square 1 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 900 W
Tstg Storage temperature range - 65 to + 150 °C
TjMaximum operating junction temperature (1)
1. condition to avoid thermal runaway for a diode on its own heatsink
150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead SMA 30
°C/W
SMB 25
Rth(j-c) Junction to case STmite flat 20
Table 4. Static electrical characteristics
Symbol Parameter Tests conditions Min. Typ. Max. Unit
IR (1)
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current Tj = 25 °C VR = VRRM
- - 35 µA
Tj = 125 °C - 6 10 mA
VF (1) Forward voltage drop
Tj = 25 °C IF = 1 A --0.5
V
Tj = 125 °C - 0.37 0.42
Tj = 25 °C IF = 2 A - - 0.63
Tj = 125 °C - 0.5 0.61
dPtot
dTj <1
Rth(j-a)
STPS1L40 Characteristics
Doc ID 5507 Rev 6 3/11
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (SMA, δ = 0.5)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
T
δ= tp/T tp
PF(AV)(W)
IF(AV)(A)
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125
Rth(j-a) = Rth(j-l)
Rth(j-a) = 120 °C/W
SMA
IF(AV)(A)
Tamb(°C)
150
T
δ= tp/T tp
Figure 3. Average forward current versus
ambient temperature (SMB, δ = 0.5)
Figure 4. Average forward current versus
ambient temperature
(STmite flat, δ = 0.5)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150
IF(AV)(A)
T
δ= tp/T tp
Tamb(°C)
SMB
Rth(j-a) = Rth(j-l)
Rth(j-a) = 100 °C/W
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125
IF(AV)(A)
150
Tamb(°C)
STmite flat
Rth(j-a) = Rth(j-c)
Rth(j-a) = 250 °C/W
T
δ= tp/T
tp
Figure 5. Normalized avalanche power
derating versus pulse duration
Figure 6. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Characteristics STPS1L40
4/11 Doc ID 5507 Rev 6
Figure 7. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
Figure 8. Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
0
1
2
3
4
5
6
7
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ= 0.5
t(s)
IM(A)
SMA
T
a= 25 °C
T
a= 75 °C
T
a= 125 °C
0
1
2
3
4
5
6
7
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
IM(A)
IM
t
δ= 0.5
T
a= 25 °C
T
a= 75 °C
T
a= 125 °C
SMB
Figure 9. Non repetitive surge peak forward
current versus overload duration
(maximum values, STmite flat)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
0
2
4
6
8
10
12
14
16
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
IM(A)
IM
t
δ= 0.5
STmite flat
t(s)
Tc= 25 °C
Tc= 75 °C
Tc= 125 °C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
SMA
Zth(j-a)/Rth(j-a)
tp(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration (STmite flat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Zth(j-a)/Rth(j-a)
Single pulse
SMB
tp(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Zth(j-a)/Rth(j-a)
Single pulse
STmite flat
tp(s)
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
STPS1L40 Characteristics
Doc ID 5507 Rev 6 5/11
Figure 13. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 14. Junction capacitance versus
reverse voltage applied
(typical values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
VR(V)
IR(mA)
Tj= 25 °C
Tj= 50 °C
Tj= 75 °C
Tj= 125 °C
Tj= 150 °C
Tj= 100 °C
10
100
1000
1 10 100
VR(V)
C(pF)
F = 1 MHz
Vosc = 30 mVRMS
Tj= 25 °C
Figure 15. Forward voltage drop versus
forward current
(typical values, high level)
Figure 16. Forward voltage drop versus
forward current
(typical values, low level)
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Tj= 125 °C
Tj= 25 °C
VFM(V)
IFM(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
IFM(A)
VFM(V)
Tj= 125 °C
Tj= 25 °C
Characteristics STPS1L40
6/11 Doc ID 5507 Rev 6
Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat)
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (SMB)
0
20
40
60
80
100
120
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
Scu(cm²)
SMA
Epoxy printed circuit board, FR4
copper thickness = 35 µm
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Scu(cm²)
Rth(j-a)(°C/W)
SMB
Epoxy printed circuit board, FR4
copper thickness = 35 µm
0
25
50
75
100
125
150
175
200
225
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
Scu(cm²)
STmite flat
Epoxy printed circuit board, FR4
copper thickness = 35 µm
STPS1L40 Package information
Doc ID 5507 Rev 6 7/11
2 Package information
●Epoxy meets UL94, V0
●Cathode band (SMA, SMB)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 20. Footprint, dimensions in mm (inches)
Table 5. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.63
(0.103)
5.43
(0.214)
1.4
1.64
(0.064)
1.4
(0.055) (0.055)
Package information STPS1L40
8/11 Doc ID 5507 Rev 6
Figure 21. Footprint, dimensions in mm (inches)
Table 6. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.300)
(0.064)
(0.086)
STPS1L40 Package information
Doc ID 5507 Rev 6 9/11
Figure 22. Footprint dimensions
Table 7. STmite flat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.80 0.85 0.95 0.031 0.033 0.037
b 0.40 0.55 0.65 0.016 0.022 0.026
b2 0.70 0.85 1.00 0.027 0.033 0.039
c 0.10 0.15 0.25 0.004 0.006 0.009
D 1.75 1.90 2.05 0.069 0.075 0.081
E 3.60 3.80 3.90 0.142 0.150 0.154
E1 2.80 2.95 3.10 0.110 0.116 0.122
L 0.50 0.55 0.80 0.020 0.022 0.031
L1 2.10 2.40 2.60 0.083 0.094 0.102
L2 0.45 0.60 0.75 0.018 0.024 0.030
L3 0.20 0.35 0.50 0.008 0.014 0.020
E1
E
c
Db
L3
A
LL1 L2
b2
0.85 0.63 2.00
millimeters
(inches)
4.13
0.95 1.95
0.65
0.65
(0.033) (0.079)
(0.037) (0.077)(0.026)
(0.163)
(.025) (.026)
Ordering information STPS1L40
10/11 Doc ID 5507 Rev 6
3 Ordering information
4 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS1L40A GB4 SMA 0.068 g 5000 Tape and reel
STPS1L40U GC4 SMB 0.107 g 2500 Tape and reel
STPS1L40MF F1L4 STmite flat 0.016 g 1200 Tape and reel
Table 9. Document revision history
Date Revision Changes
Jul-2003 4A Last update.
Aug-2004 5 SMA package dimensions update. Reference A1 max.
changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080).
24-Jun-2009 6 Added STmite flat package.
STPS1L40
Doc ID 5507 Rev 6 11/11
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