TD62783APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62783APG,TD62783AFG 8 ch High-Voltage Source Driver The TD62783APG/AFG Series are comprised of eight source current Transistor Array. These drivers are specifically designed for fluorescent display applications. Applications include relay, hammer and lamp drivers. TD62783APG Features * High output voltage: VCC = 50 V (min) * Output current (single output): IOUT = -500 mA (max) * Output clamp diodes * Single supply voltage * Input compatible with various types of logic * Package type-APG: DIP-18 pin * Package type-AFG: SOP-18 pin * Designation: TTL, 5V CMOS TD62783AFG Pin Assignment (top view) Weight DIP18-P-300-2.54D : 1.47 g (typ.) SOP18-P-375-1.27 : 0.41 g (typ.) O1 O2 O3 O4 O5 O6 O7 O8 GND 18 17 16 15 14 13 12 11 10 1 I1 2 I2 3 I3 4 I4 5 I5 6 I6 7 I7 8 I8 9 VCC Schematics (each driver) 20 k VCC 10 k 10 k 2.6 k Input 5 k Output GND Note: The input and output parasitic diodes cannot be used as clamp diodes. 1 2011-02-23 TD62783APG/AFG Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Supply voltage VCC 50 V Output current IOUT -500 mA/ch Input voltage VIN 15 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 500 mA APG Power dissipation AFG 1.47 PD (Note) W 0.96 Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note: Derated above 25C in the proportion of 11.7 mW/C (APG type), 7.7 mW/C (AFG type) Operating Ranges (Ta = -40 to 80C) Characteristics Supply voltage Output current Symbol Test Condition Min Typ. Max Unit VCC 50 V Duty = 10% 8 circuits -260 Duty = 50% 8 circuits -59 Duty = 10% 8 circuits -180 Duty = 50% 8 circuits -38 IOUT AFG Ta = 85C, Tj = 120C, tpw = 25 ms mA/ch VIN 12 Output ON VIN (ON) 2.0 5.0 15 Output OFF VIN (OFF) 0 0.8 Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 400 mA 0.52 0.35 Input voltage Input voltage Power dissipation APG AFG PD 2 V V W 2011-02-23 TD62783APG/AFG Electrical Characteristics (Ta = 25C) Characteristics Output leakage current Output saturation voltage Input current Input voltage Symbol Test Circuit ICEX 1 VCE (sat) IIN (ON) VIN (ON) VIN (OFF) 2 3 4 Test Condition Min Typ. Max Unit VCC = VCC max VIN = 0.4 V Ta = 25C 100 A VIN = VIN (ON), IOUT = -350 mA 2.0 VIN = VIN (ON), IOUT = -225 mA 1.9 VIN = VIN (ON), IOUT = -100 mA 1.8 VIN = 2.4 V 36 52 VIN = 3.85 V 180 260 VCE = 2.0 V, IOUT = -350 mA 2.0 IOUT = -500 A 0.8 V A V ICC (ON) 3 VIN = VIN (ON), VCC = 50 V 2.5 mA/ch Clamp diode reverse current IR 5 VR = 50 V 50 A Clamp diode forward voltage VF 6 IF = 350 mA 2.0 V Turn-ON delay tON 7 VCC = VCC max RL = 125 CL = 15 pF 0.15 s Turn-OFF delay tOFF 7 VCC = VCC max RL = 125 CL = 15 pF 1.8 s Supply current 3 2011-02-23 TD62783APG/AFG Test Circuit 1. ICEX 2. VCE (sat) VCC 3. IIN (ON), ICC VCC VCC VCE (sat) VIN IOUT VIN ICEX 4. VIN (ON), VIN (OFF) IIN (ON) VIN 5. IR VCC 6. VF VCC Open VCE VIN (ON), VIN (OFF) IR V R IOUT VF IF 7. tON, tOFF Input Input 50% 50% 0 Pulse generator (Note 1) VIH VCC 50 s VIN RL tON CL (Note 2) Output tOFF 50% VOH 50% VOL Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance. Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 4 2011-02-23 TD62783APG/AFG IOUT - VIN IIN - VIN 500 1.6 Ta = 25C typ. 300 200 IIN (mA) 400 1.2 Input current Output current IOUT (mA) Ta = 25C typ. 0.8 0.4 100 0 0 0.4 0.8 1.2 1.6 Input voltage VIN 0 0 2.0 (V) 4 8 Input voltage IOUT - VCE (sat) 0.6 (V) IF - V F Ta = 25C Ta = 25C typ. IF (A) (A) 0.4 Diode forward current IOUT Output current VIN 16 0.6 |VCC - VEE| > 5 V 0.2 0 0 12 0.8 1.6 2.4 Output saturation voltage VCE (sat) 0.4 0.2 0 0 3.2 (V) 0.4 0.8 1.2 1.6 Diode forward voltage VF (V) PD - Ta Power dissipation PD (W) 2.0 (1) Type-APG free air (2) Type-AFG free air 1.5 (1) 1.0 (2) 0.5 0 0 50 100 150 200 Ambient temperature Ta (C) 5 2011-02-23 TD62783APG/AFG Package Dimensions Weight: 1.47 g (typ.) 6 2011-02-23 TD62783APG/AFG Package Dimensions Weight: 0.41 g (typ.) 7 2011-02-23 TD62783APG/AFG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 8 2011-02-23 TD62783APG/AFG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 9 2011-02-23 TD62783APG/AFG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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