Pressure MPX5010 Rev 13, 10/2012 Freescale Semiconductor Data Sheet: Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPxx5010 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. Features * * * * * * * 5.0% Maximum Error over 0 to 85C Ideally Suited for Microprocessor or Microcontroller-Based Systems Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package Temperature Compensated over -40 to +125C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations Available in Surface Mount (SMT) or Through-hole (DIP) Configurations MPX5010 MPXV5010 MPVZ5010 Series 0 to 10 kPa (0 to 1.45 psi) (0 to 1019.78 mm H2O) 0.2 to 4.7 V Output Application Examples * * * * * Hospital Beds HVAC Respiratory Systems Process Control Washing Machine Water Level Measurement (Reference AN1950) * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Appliance Liquid Level and Pressure Measurement ORDERING INFORMATION Device Name Case No. None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking Unibody Package (MPX5010 Series) MPX5010DP 867C MPX5010GP 867B MPX5010GS 867E MPX5010GSX 867F Small Outline Package (MPXV5010 Series) * * * * * MPX5010DP MPX5010GP MPX5010D MPX5010D * * * * MPXV5010DP 1351 * MPXV5010G6U 482 * MPXV5010GC6T1 482A * MPXV5010GC6U 482A * MPXV5010GC7U 482C * MPXV5010GP 1369 * Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) * * * * * MPXV5010DP MPXV5010G MPXV5010G MPXV5010G MPXV5010G MPXV5010GP MPVZ5010G6U MPVZ5010G7U MPVZ5010GW6U MPVZ5010GW7U * * * * MPVZ5010G MPVZ5010G MZ5010GW MZ5010GW 482 482B 1735 1560 * * * * (c) 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved. Pressure SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5010GC6U/C6T1 CASE 482A-01 MPXV5010G6U, MPVZ5010G6U CASE 482-01 MPXV5010DP CASE 1351-01 MPVZ5010GW6U CASE 1735-01 MPXV5010GP CASE 1369-01 SMALL OUTLINE PACKAGES THROUGH-HOLE J MPVZ5010G7U CASE 482B-03 MPXV5010GC7U CASE 482C-03 MPVZ5010GW7U CASE 1560-02 UNIBODY PACKAGES MPX5010GP CASE 867B-04 MPX5010DP CASE 867C-05 MPX5010GS CASE 867E-03 MPX5010GSX CASE 867F-03 MPX5010 2 Sensors Freescale Semiconductor, Inc. Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 -- 10 1019.78 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io -- 5.0 10 mAdc Minimum Pressure Offset(2) @ VS = 5.0 Volts (0 to 85C) Voff 0 0.2 0.425 Vdc Full Scale Output(3) @ VS = 5.0 Volts (0 to 85C) VFSO 4.475 4.7 4.925 Vdc Full Scale Span(4) @ VS = 5.0 Volts (0 to 85C) VFSS 4.275 4.5 4.725 Vdc Accuracy(5) (0 to 85C) -- -- -- 5.0 %VFSS V/P -- 450 4.413 -- mV/mm mV/mm H2O Response Time(6) tR -- 1.0 -- ms Output Source Current at Full Scale Output IO+ -- 0.1 -- mAdc Warm-Up Time(7) -- -- 20 -- ms Offset Stability(8) -- -- 0.5 -- %VFSS Sensitivity 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX5010 Sensors Freescale Semiconductor, Inc. 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 40 kPa Storage Temperature Tstg -40 to +125 C Operating Temperature TA -40 to +125 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 (SOP) 3 (Unibody) Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 2 (Unibody) 3 (SOP) GND Gain Stage #2 and Ground Reference Shift Circuitry Vout 1 (Unibody) 4 (SOP) Pins 1 and 5 through 8 are NO CONNECTS for small outline package. Pins 4, 5, and 6 are NO CONNECTS for unibody package. Figure 1. Fully Integrated Pressure Sensor Schematic MPX5010 4 Sensors Freescale Semiconductor, Inc. Pressure ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 3 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPxx5010G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, Fluoro Silicone Gel Die Coat other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Thermoplastic Case Wire Bond Vout OUTPUT Vs Lead Frame IPS 1.0 F P2 0.01 F GND 470 pF Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram SOP (not to scale) 5.0 Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Transfer Function (kPa): Vout = VS (0.09 P + 0.04) 5.0% VFSS VS = 5.0 Vdc TEMP = 0 to 85C 4.0 Output (V) 3.0 TYPICAL MAX 2.0 MIN 1.0 0 0 2.0 4.0 6.0 8.0 10 Differential Pressure (kPa) Figure 4. Output vs. Pressure Differential MPX5010 Sensors Freescale Semiconductor, Inc. 5 Pressure Transfer Function Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V 0.25 Vdc Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 +125 3 1 3 1.0 0.0 -40 -20 0 20 40 80 60 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band 0.5 0.4 0.3 Pressure Error (kPa) 0.2 0.1 0 -0.1 Pressure (kPa) 0 1 2 3 4 5 6 7 8 9 10 -0.2 -0.3 -0.4 -0.5 Pressure 0 to 10 (kPa) Error (Max) 0.5 (kPa) MPX5010 6 Sensors Freescale Semiconductor, Inc. Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Part Number sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPX5010DP 867C Side with Part Marking MPX5010GP 867B Side with Port Attached MPX5010GS 867E Side with Port Attached MPX5010GSX 867F Side with Port Attached MPXV5010G6U 482 Stainless Steel Cap MPXV5010GC6U/6T1 482A Side with Port Attached MPXV5010GC7U 482C Side with Port Attached MPXV5010GP 1369 Side with Port Attached MPXV5010DP 1351 Side with Part Marking MPVZ5010G6U 482 Stainless Steel Cap MPVZ5010G7U 482B Stainless Steel Cap MPVZ5010GW6U 1735 Vertical Port Attached MPVZ5010GW7U 1560 Vertical Port Attached MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPX5010 Sensors Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N -B- G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 -T- K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-0 ISSUE A SMALL OUTLINE PACKAGE MPX5010 8 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C SEATING PLANE -T- DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0 15 0 15 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A- 4 5 N -B- G 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0 15 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0 15 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS -TC A E -Q- U N V B R PIN 1 PORT #1 POSITIVE PRESSURE (P1) -P0.25 (0.010) M T Q 6 M 5 4 3 2 1 S K J 0.13 (0.005) M T P S D 6 PL Q S G F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MAX MIN 27.43 28.45 1.080 1.120 0.740 0.760 18.80 19.30 16.51 0.630 0.650 16.00 0.68 0.84 0.027 0.033 0.160 0.180 4.06 4.57 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 5.59 6.10 0.220 0.240 1.78 2.03 0.070 0.080 0.150 0.160 3.81 4.06 4.06 0.150 0.160 3.81 11.18 11.68 0.440 0.460 0.695 0.725 17.65 18.42 21.84 0.840 0.860 21.34 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX CASE 867F-03 ISSUE D UNIBODY PACKAGE MPX5010 10 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 11 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 867B-04 ISSUE G UNIBODY PACKAGE MPX5010 12 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 13 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPX5010 14 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 15 Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPX5010 16 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 1560-03 ISSUE C SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 17 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 18 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 19 Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 20 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 Sensors Freescale Semiconductor, Inc. 21 Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE MPX5010 22 Sensors Freescale Semiconductor, Inc. Pressure Table 3. Revision History Revision number Revision date 13 10/2012 Description of changes * Deleted references to device number MPVZ5010G6T1, MPVZ5010G6U/T1 and MPVZ5010G6U/ 6T1 throughout the document MPX5010 Sensors Freescale Semiconductor, Inc. 23 How to Reach Us: Information in this document is provided solely to enable system and software implementers to use Freescale products. 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