PL IA NT Features *R oH S CO M HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks Controlled impedance RoHS compliant* CAT16-PC5F12LF - Concave Chip Array Electrical Characteristics Product Dimensions Resistance R1 ...............................................70 ohms R2 .............................................187 ohms Tolerance ............................................1 % TCR........................................200 ppm/ C Temperature Range .........-55 C to +125 C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage 16 15 14 13 12 11 10 9 .45 .10 (.018 .004) .60 .10 (.024 .004) .30 .10 DIA. (.012 .004) .40 .10 (.016 .004) 1.60 .15 (.063 .060) .80 .10 (.031 .004) For Standard Values Used in Capacitors, Inductors, and Resistors, click here. 1 DIMENSIONS ARE: .40 .10 (.016 .004) 6.40 .15 (.253 .006) 2 3 4 5 6 7 8 MM (INCHES) Packaging Specifications 4000 pcs - per 7 " reel 4.0 .10 (.157 .004) 2.00 0.20 (.079 .008) 0.9 0.1 (.035 .004) 6.9 0.2 (.272 .008) 13 0.5 DIA. (.512 .020) 5.5 0.1 (.217 .004) 1.5 +.10/-0 (.060 +.004/-0) 4.0 .10 (.158 .004) 60.0 1.0 DIA. (2.36 .039) 12.0 0.2 (.472 .008) 178.0 2.0 (7.008 .080) 21 0.5 (.827 .020) 1.75 .10 (.069 .004) 15.4 1.0 (.606 .039) 13.0 0.3 (.512 .012) Land Pattern Derating Curve Rated power in percentage (%) 2.0 .05 (.079 .002) Solder resist 100 Land 0.7 to 0.9 (.028 to .035) 80 60 Chip resistor array CAT 40 20 0 -55 0 125 70 2.0 to 2.2 (.079 to .087) (C) Ambient temperature 0.4 to 0.45 (.016 to .0178) Schematic 16 15 14 R2 R1 1 13 12 R2 R1 R1 2 10 R2 R1 3 11 R1 4 9 R2 R1 5 0.80 (.032) R1 6 R1 7 8 11/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.