NZX13B,143 - NXP - Datasheet.Directory

1. Product profile

1.1 General description

General-purpose Zener diodes in a SOD27 (SC-40) small hermetically sealed glass

package.

1.2 Features and benefits

Total power dissipation: Ptot ≤500 mW

Low differential resistance

Low leakage current

AEC-Q101 qualified

1.3 Applications

General regulation functions

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02.

2. Pinning information

[1] The marking band indicates the cathode.

NZX series

Single Zener diodes

Rev. 3 — 21 January 2011 Product data sheet

Table 1. Quick reference data

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=200mA [1] --1.5V

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode ak

006aaa15

Product data sheet Rev. 3 — 21 January 2011 2 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

3. Ordering information

[1] The series consists of 112 types with nominal working voltages from 2.1 V to 36 V.

4. Marking

5. Limiting values

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB) without metallization pad;

maximum lead length 8 mm.

Table 3. Ordering information

Type number Package

Name Description Version

NZX2V1B to NZX36X[1] SC-40 hermetically sealed glass package; axial leaded;

2 leads SOD27

Table 4. Marking codes

Type number Marking code

NZX2V1B to NZX36X the diodes are type branded

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IFforward current - 250 mA

Ptot total power dissipation Ttp ≤25 °C-500mW

Tjjunction temperature - 175 °C

Tamb ambient temperature −55 +175 °C

Tstg storage temperature −65 +175 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --380K/W

Rth(j-t) thermal resistance from

junction to tie-point [1] --300K/W

Product data sheet Rev. 3 — 21 January 2011 3 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

Fig 1. Transient thermal impeda n ce from junc tion to ambien t as a function of pulse dura tion; typical values

006aab601

tp (ms)

10−1104105

103

102

110

102

103

Rth(j-a)

(K/W)

δ = 1

0.75

0.50

0.33

0.20

0.10

0.05

0.02

0.01

≤0.001

Table 7. Characteristics

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage I F= 200 mA [1] --1.5V

Table 8. Characteristics per type ; NZX2V1B to NZX18C

Tj=25

C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif (Ω)

Reverse current

IR(μA)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

2V1 B 2.0 2.2 100 5 0.5

2V4 A 2.3 2.5 100 50 1

B2.42.6

2V7 A 2.5 2.7 100 20 1

B2.62.8

C2.72.9

3V0 A 2.8 3.0 100 10 1

B2.93.1

C3.03.2

3V3 A 3.1 3.3 100 5 1

B3.23.4

C3.33.5

Product data sheet Rev. 3 — 21 January 2011 4 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

3V6 A 3.4 3.6 100 5 1

B3.53.7

C3.63.8

3V9 A 3.7 3.9 100 3 1

B3.84.0

C3.94.1

4V3 A 4.0 4.2 100 3 1

B4.14.3

C4.24.4

D4.34.5

4V7 A 4.4 4.6 100 3 2

B4.54.7

C4.64.8

D4.74.9

5V1 A 4.8 5.0 100 2 2

B4.95.1

C5.05.2

D5.15.3

5V6 A 5.2 5.5 40 1 2

B5.35.6

C5.45.7

D5.55.8

E5.65.9

6V2 A 5.7 6.0 15 3 4

B5.86.1

C6.06.3

D6.16.4

E6.36.6

6V8 A 6.4 6.7 15 2 4

B6.66.9

C6.77.0

D6.97.2

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25

C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif (Ω)

Reverse current

IR(μA)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 3 — 21 January 2011 5 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

7V5 A 7.0 7.3 15 1 5

B7.27.6

C7.37.7

D7.57.9

X 7.07 7.45

8V2 A 7.7 8.1 20 0.7 5

B7.98.3

C8.18.5

D8.38.7

9V1 A 8.5 8.9 20 0.5 6

B8.79.1

C8.99.3

D9.19.5

E9.39.7

10 A 9.5 9.9 25 0.2 7

B 9.7 10.1

C 9.9 10.3

D 10.2 10.6

11 A 10.4 10.8 25 0.1 8

B10.711.1

C10.911.3

D 11.1 11.6

12 A 11.4 11.9 35 0.1 8

B 11.6 12.1

C 11.9 12.4

D 12.2 12.7

X 11.44 12.03

13 A 12.4 12.9 35 0.1 8

B 12.6 13.1

C 12.9 13.4

14 A 13.2 13.7 35 0.05 9.8

B 13.5 14.0

C 13.8 14.3

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25

C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif (Ω)

Reverse current

IR(μA)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 3 — 21 January 2011 6 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

15 A 14.1 14.7 40 0.05 10.5

B 14.5 15.1

C 14.9 15.5

X 14.35 15.09

16 A 15.3 15.9 45 0.05 11.2

B 15.7 16.5

C 16.3 17.1

18 A 16.9 17.7 55 0.05 12.6

B 17.5 18.3

C 18.1 19.0

Table 8. Characteristics per type ; NZX2V1B to NZX18C …continued

Tj=25

C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif (Ω)

Reverse current

IR(μA)

IZ=5mA IZ=5mA

Min Max Max Max VR(V)

Product data sheet Rev. 3 — 21 January 2011 7 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Table 9. Characteristics per type; NZX20A to NZX36X

Tj=25

C unless otherwise specified.

NZXxxx Sel Working voltage

VZ(V) Differential

resistance

rdif (Ω)

Reverse current

IR(μA)

IZ=2mA IZ=2mA

Min Max Max Max VR(V)

20 A 18.8 19.7 60 0.05 14

B 19.5 20.4

C 20.2 21.2

22 A 20.9 21.9 65 0.05 15.4

B 21.6 22.6

C 22.3 23.3

24 A 22.9 24.0 70 0.05 16.8

B 23.6 24.7

C 24.3 25.5

X 22.61 23.77

27 A 25.2 26.6 80 0.05 18.9

B 26.2 27.6

C 27.2 28.6

X 26.99 28.39

30 A 28.2 29.6 100 0.05 21

B 29.2 30.6

C 30.2 31.6

X 29.02 30.51

33 A 31.2 32.6 120 0.05 23.1

B 32.2 33.6

C 33.2 34.5

36 A 34.2 35.7 140 0.05 25.2

B 35.3 36.8

C 36.4 38.0

X 35.36 37.19

Product data sheet Rev. 3 — 21 January 2011 8 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Tj=25°C NZX2V1 to NZX4V3

Tj=25°C to 150 °C

Fig 2. Forward current as a function of forward

voltage; typical values Fig 3. Temperature coefficient as a function of

working current; typical va lues

NZX4V7 to NZX12

Tj=25°C to 150 °C

Fig 4. Temperature coefficient as a function of working curr ent; typical values

VF (V)

0.6 10.8

mbg781

100

200

300

(mA)

006aac510

IZ (mA)

0604020

−2

−1

(mV/K)

−3

4V3

3V6

2V1

3V0

2V4

2V7

3V3

3V9

02016

−5

mbg782

4812 IZ (mA)

(mV/K)

4V7

9V1

8V2

7V5

6V8 6V2

5V6

5V1

Product data sheet Rev. 3 — 21 January 2011 9 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 12.

[2] The series consists of 112 types with nominal working voltages from 2.1 V to 36 V.

Fig 5. Package outline SOD27 (SC-40)

05-12-22Dimensions in mm

1.85

max

25.4

min

0.56

max

25.4

min

4.25

max

Table 10. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number[2] Package Description Packing quantity

5000 10000

NZX2V1B to NZX36X SOD27 26 mm tape ammopack, axial -143 -

52 mm tape ammopack, axial - -133

52 mm reel pack, axial - -113

Product data sheet Rev. 3 — 21 January 2011 10 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

10. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

NZX_SER v.3 20110121 Product data sheet - NZX_SER v.2

Modifications: •Type number NZX2V1B added.

•Figure 3: amended.

•Section 11 “Legal information”: updated.

NZX_SER v.2 20090603 Product data sheet - NZX_SER v.1

NZX_SER v.1 20080724 Product data sheet - -

Product data sheet Rev. 3 — 21 January 2011 11 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict wit h the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whet her the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 21 January 2011 12 of 13

NXP Semiconductors NZX series

Single Zen er di od e s

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

11.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors NZX series

Single Zen er di od e s

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 21 January 2011

Document identifier : NZX _SE R

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

9 Packing information . . . . . . . . . . . . . . . . . . . . . 9

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Contact information. . . . . . . . . . . . . . . . . . . . . 12

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13