201208
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
21 2.0±0.2 1.25±0.2 0.9±0.2 0.5+0.2
-0.3
DESCRIPTION
Chip Bead For EMI Suppression
RECOMMENDED LAND PATTERN
CIB/CIM21 Series (2012/ EIA 1008)
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow
or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB21P110 0.9±0.2 11 0.01 2000
CIB21P150 0.9±0.2 15 0.01 2000
CIB21P260 0.9±0.2 26 0.01 2000
CIB21P300 0.9±0.2 30 0.05 2000
CIB21P330 0.9±0.2 33 0.05 1500
CIB21P470 0.9±0.2 47 0.05 1500
CIM21U600 0.9±0.2 60 0.08 900
CIM21U800 0.9±0.2 80 0.10 900
CIM21U101 0.9±0.2 100 0.10 800
CIM21U121 0.9±0.2 120 0.10 800
CIM21U151 0.9±0.2 150 0.15 600
CIM21U241 0.9±0.2 240 0.15 600
CIM21U301 0.9±0.2 300 0.15 500
CIM21U471 0.9±0.2 470 0.30 500
CIM21U601 0.9±0.2 600 0.30 500
CIM21U102 0.9±0.2 1000(at 70MHz) 0.40 500
CIM21U202 0.9±0.2 2000(at 70MHz) 0.70 300
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
0.8~1.2mm
0.9~1.6mm
0.6~1.2mm 0.6~1.2mm
Ver 201208
CHARACTERISTIC DATA
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB21J260 0.9±0.2 26 0.05 2000
CIB21J300 0.9±0.2 30 0.05 2000
CIB21J400 0.9±0.2 40 0.05 2000
CIM21J600 0.9±0.2 60 0.08 900
CIM21J800 0.9±0.2 80 0.08 1000
CIM21J121 0.9±0.2 120 0.15 800
CIM21J151 0.9±0.2 150 0.15 500
CIM21J221 0.9±0.2 220 0.20 500
CIM21J241 0.9±0.2 240 0.20 500
CIM21J301 0.9±0.2 300 0.20 500
CIM21J471 0.9±0.2 470 0.25 500
CIM21J601 0.9±0.2 600 0.25 500
CIM21J102 0.9±0.2 1000 0.35 500
CIM21J152 0.9±0.2 1500(at 70MHz) 0.45 500
CIM21J182 0.9±0.2 1800(at 70MHz) 0.45 500
CIM21J202 0.9±0.2 2000(at 70MHz) 0.50 500
CIM21J222 0.9±0.2 2200(at 70MHz) 0.70 300
CIM21J252 0.9±0.2 2500(at 50MHz) 0.70 300
CIM21K152 0.9±0.2 1500 0.45 300
CIM21K252 0.9±0.2 2500 0.80 250
CIM21N700 0.9±0.2 70 0.20 600
CIM21N121 0.9±0.2 120 0.25 500
CIM21N241 0.9±0.2 240 0.30 400
Ver 201208
Ver 201208
Ver 201208
CI M21U121NE
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) M: Multi-layer type B:Mono-layer type
(3) Dimension (4) Material Code
(5) Nominal impedance (800:80Ω, 121:120Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING FLOW SOLDERING
Ver 201208
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 4,000
