© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 4 1Publication Order Number:
NUP5120/D
NUP5120X6
5−Line Transient Voltage
Suppressor Array
This 5−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as cell phones, portables, computers, printers and
other applications. This device features a monolithic common anode
design which protects five independent lines in a single
SOT−563 package.
Features
Protects up to 5 Lines in a Single SOT−563 Package
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body Model
and Class C (Exceeding 400 V) per Machine Model.
Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8 kV (Contact)
This is a Pb−Free Device
Applications
Hand Held Portable Applications
Serial and Parallel Ports
Notebooks, Desktops, Servers
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol Rating Value Unit
PPK 1 Peak Power Dissipation
8x20 msec double exponential waveform,
(Note 1)
90 W
TJOperating Junction Temperature Range −40 to 125 °C
TSTG Storage Temperature Range −55 to 150 °C
TLLead Solder Temperature – Maximum
(10 seconds) 260 °C
ESD Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 Air (ESD)
IEC 61000−4−2 Contact (ESD)
16000
400
15000
8000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Non−repetitive current pulse per Figure 1.
SOT−563
CASE 463A
STYLE 6
123
654
RN = Specific Device Code
M = Month Code
G= Pb−Free Package
(Note: Microdot may be in either location
)
MARKING
DIAGRAM
RN MG
G
http://onsemi.com
Device Package Shipping
ORDERING INFORMATION
1
2
3
6
5
4
PIN ASSIGNMENT
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
SOT−563 5−LINE TRANSIENT
VOLTAGE SUPPRESSOR
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
http://onsemi.com
NUP5120X6T1G SOT−563
(Pb−Free) 4000/Tape & Reel
NUP5120X6T2G SOT−563
(Pb−Free) 4000/Tape & Reel
NUP5120X6
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Parameter Conditions Symbol Min Typ Max Unit
Reverse Working Voltage (Note 2) VRWM 5.0 V
Breakdown Voltage IT = 1 mA, (Note 3) VBR 6.2 6.8 7.2 V
Reverse Leakage Current VRWM = 3 V IR 0.01 0.5 mA
Capacitance VR = 0 V, f = 1 MHz (Line to GND)
VR = 2.5 V, f = 1 MHz (Line to GND) CJ 54 70 pF
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
NUP5120X6
http://onsemi.com
3
Figure 1. Power Derating vs. Ambient
Temperature
PULSE DURATION (μS)
10
0
101
100
10
1000
PEAK POWER (W)
Figure 2. Peak Power vs. Pulse Duration
Figure 3. Peak Current vs. Clamp Voltage
VCL, CLAMP VOLTAGE (V)
161086
I
PP
, PEAK CURRENT (A)
1412
1
0.1
10
100
VR, REVERSE VOLTAGE (V)
6543210
60
50
40
30
20
10
0
CT, TYPICAL CAPACITANCE (pF)
Figure 4. Typical Capacitance vs. Reverse
Voltage
Figure 5. Reverse Current vs. Reverse Voltage
REVERSE VOLTAGE (V)
4321
REVERSE CURRENT (nA)
65
0.1
10
0.01
100
1000
TJ = 25 °C
FORWARD VOLTAGE (V)
1.21.11.00.90.80.70.6
0.1
0.01
0.001
1
FORWARD CURRENT (A)
Figure 6. Typical Forward Current vs. Forward
Voltage
TA, AMBIENT TEMPERATURE (°C)
1501251007550250
80
60
40
20
0
100
120
% OF RATED POWER OR I
PP
1
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
TA = 25 °C
TA = 25 °C
TA = 25 °C
TA = 25 °C
TA = 25 °C
NUP5120X6
http://onsemi.com
4
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE B
GM
0.08 (0.003) X
D6 5 PL
C
J
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
DIM
A
MIN MAX MIN MAX
INCHES
1.50 1.70 0.059 0.067
MILLIMETERS
B1.10 1.30 0.043 0.051
C0.50 0.60 0.020 0.024
D0.17 0.27 0.007 0.011
G0.50 BSC 0.020 BSC
J0.08 0.18 0.003 0.007
K
S
A
B
Y
12 3
45
S
K
0.004 0.012
0.059 0.067
0.10 0.30
1.50 1.70
6
SOLDERING FOOTPRINT
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its of ficers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
NUP5120/D
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative