SN54HCT573, SN74HCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS176E – MARCH 1984 – REVISED JULY 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Operating Voltage Range of 4.5 V to 5.5 V
D
High-Current 3-State Outputs Drive Bus
Lines Directly or Up To 15 LSTTL Loads
D
Low Power Consumption, 80-µA Max ICC
D
Typical tpd = 21 ns
D
±6-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
D
Inputs Are TTL-Voltage Compatible
D
Bus-Structured Pinout
description/ordering information
These octal transparent D-type latches feature
3-state outputs designed specifically for driving
highly capacitive or relatively low-impedance
loads. The ’HCT573 devices are particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers.
While the latch-enable (LE) input is high, the
Q outputs respond to the data (D) inputs. When
LE is low, the outputs are latched to retain the data
that was set up at the D inputs.
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased
drive provide the capability to drive bus lines without interface or pullup components.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP – N Tube SN74HCT573N SN74HCT573N
SOIC DW
Tube SN74HCT573DW
HCT573
SOIC
–
DW
Tape and reel SN74HCT573DWR
HCT573
–40°C to 85°CSOP – NS Tape and reel SN74HCT573NSR HCT573
SSOP – DB Tape and reel SN74HCT573DBR HT573
TSSOP PW
Tube SN74HCT573PW
HT573
TSSOP
–
PW
Tape and reel SN74HCT573PWR
HT573
CDIP – J Tube SNJ54HCT573J SNJ54HCT573J
–55°C to 125°CCFP – W Tube SNJ54HCT573W SNJ54HCT573W
LCCC – FK Tube SNJ54HCT573FK SNJ54HCT573FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2Q
3Q
4Q
5Q
6Q
3D
4D
5D
6D
7D
2D
1D
OE
8Q
7Q V
1Q
8D
GND
LE
SN54HCT573 . . . FK PACKAGE
(TOP VIEW)
CC
SN54HCT573 ...J OR W PACKAGE
SN74HCT573 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1D
2D
3D
4D
5D
6D
7D
8D
GND
VCC
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
LE
Copyright 2003, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
SN54HCT573, SN74HCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS176E – MARCH 1984 – REVISED JULY 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
FUNCTION TABLE
(each latch)
INPUTS OUTPUT
OE LE D Q
L H H H
LHL L
LLX Q
0
H X X Z
logic diagram (positive logic)
OE
LE
1D 1Q
1
11
219
To Seven Other Channels
C1
1D
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HCT573, SN74HCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS176E – MARCH 1984 – REVISED JULY 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HCT573 SN74HCT573
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage VCC = 4.5 V to 5.5 V 2 2 V
VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
∆t/∆vInput transition rise/fall time 500 500 ns
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HCT573 SN74HCT573
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
VOH
VI=V
IH or VIL
IOH = –20 µA
45V
4.4 4.499 4.4 4.4
V
V
OH
V
I =
V
IH
or
V
IL IOH = –6 mA
4
.
5
V
3.98 4.3 3.7 3.84
V
VOL
VI=V
IH or VIL
IOL = 20 µA
45V
0.001 0.1 0.1 0.1
V
V
OL
V
I =
V
IH
or
V
IL IOL = 6 mA
4
.
5
V
0.17 0.26 0.4 0.33
V
IIVI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA
IOZ VO = VCC or 0 5.5 V ±0.01 ±0.5 ±10 ±5µA
ICC VI = VCC or 0, IO = 0 5.5 V 8 160 80 µA
∆ICC†One input at 0.5 V or 2.4 V,
Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 2.9 mA
Ci4.5 V
to 5.5 V 3 10 10 10 pF
†This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HCT573 SN74HCT573
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
t
4.5 V 20 30 25
ns
t
w
,
5.5 V 17 27 23
ns
t
p
4.5 V 10 15 13
ns
t
su
,
5.5 V 9 14 12
ns
th
4.5 V 5 5 5
ns
t
h
,
5.5 V 5 5 5
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54HCT573, SN74HCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS176E – MARCH 1984 – REVISED JULY 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
VCC
TA = 25°C SN54HCT573 SN74HCT573
UNIT
PARAMETER
(INPUT) (OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
D
Q
4.5 V 25 35 53 44
td
D
Q
5.5 V 21 32 48 40
ns
t
pd
LE
Any Q
4.5 V 28 35 53 44
ns
LE
Any
Q
5.5 V 25 32 48 40
t
OE
Any Q
4.5 V 26 35 53 44
ns
t
en
OE
Any
Q
5.5 V 23 32 48 40
ns
tdi
OE
Any Q
4.5 V 23 35 53 44
ns
t
dis
OE
Any
Q
5.5 V 22 32 48 40
ns
tt
Any Q
4.5 V 9 12 18 15
ns
t
t
Any
Q
5.5 V 911 16 14
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM TO
VCC
TA = 25°C SN54HCT573 SN74HCT573
UNIT
PARAMETER
(INPUT) (OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
D
Q
4.5 V 32 52 79 65
td
D
Q
5.5 V 27 47 71 59
ns
t
pd
LE
Any Q
4.5 V 38 52 79 65
ns
LE
Any
Q
5.5 V 36 47 71 59
t
OE
Any Q
4.5 V 33 52 79 65
ns
t
en
OE
Any
Q
5.5 V 28 47 71 59
ns
tt
Any Q
4.5 V 18 42 63 53
ns
t
t
Any
Q
5.5 V 16 38 57 48
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per latch No load 50 pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
SN54HCT573, SN74HCT573
OCTAL TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCLS176E – MARCH 1984 – REVISED JULY 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
1.3 V
1.3 V1.3 V 0.3 V0.3 V 2.7 V 2.7 V
3 V
3 V
0 V
0 V
trtf
Reference
Input
Data
Input
1.3 V
High-Level
Pulse 1.3 V 3 V
0 V
1.3 V 1.3 V
3 V
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
1.3 V
1.3 V1.3 V 10%10% 90% 90%
3 V
VOH
VOL
0 V
trtf
Input
In-Phase
Output
1.3 V
tPLH tPHL
1.3 V 1.3 V
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-
Phase
Output
1.3 V
10%
90%
3 V
≈VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
W aveform 1
(See Note B)
1.3 V
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
≈0 V
1.3 V
1.3 V
tPZH tPHZ
Output
W aveform 2
(See Note B)
Test
Point
From Output
Under Test
RL
VCC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 kΩ
1 kΩ
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF Open Open––
CL
(see Note A)
NOTES: A. CL includes probe and test-fixture capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HCT573DBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573N ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT573N3 OBSOLETE PDIP N 20 TBD Call TI Call TI
SN74HCT573NE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCT573NSR ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573NSRE4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573NSRG4 ACTIVE SO NS 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCT573PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HCT573DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74HCT573DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74HCT573NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74HCT573PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HCT573DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74HCT573DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74HCT573NSR SO NS 20 2000 367.0 367.0 45.0
SN74HCT573PWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated