SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES308D - AUGUST 2001 - REVISED MARCH 2003 D D D D D D D D D D D DBV OR DCK PACKAGE (TOP VIEW) Available in the Texas Instruments NanoStar and NanoFree Packages Supports 5-V VCC Operation Inputs and Open-Drain Outputs Accept Voltages Up To 5.5 V Max tpd of 3.7 ns at 3.3 V Low Power Consumption, 10-A Max ICC 24-mA Output Drive at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) 1A GND 2A 1 6 2 5 3 4 1Y VCC 2Y YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) 2A GND 1A 3 4 2 5 1 6 2Y VCC 1Y description/ordering information This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE TA NanoStar - WCSP (DSBGA) 0.17-mm Small Bump - YEA NanoFree - WCSP (DSBGA) 0.17-mm Small Bump - YZA (Pb-free) 40 C to 85C 85 C -40C NanoStar - WCSP (DSBGA) 0.23-mm Large Bump - YEP SN74LVC2G07YEAR SN74LVC2G07YZAR Reel of 3000 SOT (SC-70) (SC 70) - DCK CV _ _ _CV_ SN74LVC2G07YEPR NanoFree - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) SOT (SOT-23) - DBV TOP-SIDE MARKING SN74LVC2G07YZPR Reel of 3000 SN74LVC2G07DBVR Reel of 3000 SN74LVC2G07DCKR Reel of 250 SN74LVC2G07DCKT C07_ CV CV_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES308D - AUGUST 2001 - REVISED MARCH 2003 description/ordering information (continued) This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. FUNCTION TABLE (each buffer/driver) INPUT A OUTPUT Y H H L L logic diagram (positive logic) 1A 2A 1 6 3 4 1Y 2Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6.5 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6.5 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6.5 V Voltage range applied to any output in the high or low state, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 6.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Package thermal impedance, JA (see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165C/W DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259C/W YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 143C/W YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 123C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The value of VCC is provided in the recommended operating conditions table. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES308D - AUGUST 2001 - REVISED MARCH 2003 recommended operating conditions (see Note 4) VCC VIH Operating Supply voltage Data retention only MAX 5.5 UNIT V 1.5 0.65 x VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V High level input voltage High-level MIN 1.65 1.7 VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V V 2 0.7 x VCC 0.35 x VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V 0.7 VIL Low level input voltage Low-level VI VO Input voltage 0 5.5 V Output voltage 0 5.5 V VCC = 3 V to 3.6 V VCC = 4.5 V to 5.5 V 0.3 x VCC VCC = 1.65 V VCC = 2.3 V IOL t/v Low-level output current 4 8 mA 16 VCC = 3 V Input transition rise or fall rate V 0.8 24 VCC = 4.5 V VCC = 1.8 V 0.15 V, 2.5 V 0.2 V 32 VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V 10 20 ns/V 5 TA Operating free-air temperature -40 85 C NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC 1.65 V to 5.5 V IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 16 mA VOL ICC ICC A inputs TYP MAX 1.65 V 0.45 2.3 V 0.3 0.4 VI or VO = 5.5 V VI = 5.5 V or GND, One input at VCC - 0.6 V, IO = 0 Other inputs at VCC or GND 0.55 0 to 5.5 V 5 mA 0 10 mA 1.65 V to 5.5 V 10 mA 3 V to 5.5 V 500 mA Ci VI = VCC or GND All typical values are at VCC = 3.3 V, TA = 25C. POST OFFICE BOX 655303 V 0.55 4.5 V IOL = 32 mA VI = 5.5 V or GND UNIT 0.1 3V IOL = 24 mA II Ioff MIN 3.3 V * DALLAS, TEXAS 75265 3.5 pF 3 SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES308D - AUGUST 2001 - REVISED MARCH 2003 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 1.5 8.6 1 4.4 1 3.7 1 2.9 UNIT ns operating characteristics, TA = 25C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS VCC = 1.8 V TYP VCC = 2.5 V TYP f = 10 MHz 3 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 VCC = 3.3 V TYP 4 VCC = 5 V TYP 4 UNIT pF SN74LVC2G07 DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES308D - AUGUST 2001 - REVISED MARCH 2003 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) From Output Under Test VLOAD Open S1 RL TEST GND CL (see Note A) S1 tPZL (see Notes E and F) RL tPLZ (see Notes E and G) VLOAD VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC VI 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 5 V 0.5 V VM tr/tf 2 ns 2 ns 2.5 ns 2.5 ns VCC VCC 3V VCC VCC/2 VCC/2 1.5 V VCC/2 VLOAD CL 2 x VCC 2 x VCC 6V 2 x VCC 30 pF 30 pF 50 pF 50 pF RL V 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI VM Input VM th VM Data Input VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input 0V tPHL VOH VM Output VM VO L tPHL tPLH VOH Output VM VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VI Output Control VM tPLH VI VM 0V Output tPZL Waveform 1 S1 at VLOAD (see Note B) Output Waveform 2 S1 at VLOAD (see Note B) VM tPLZ VLOAD/2 VM VOL + V VOL tPHZ tPZH VM VLOAD/2 VLOAD/2 - V 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 MECHANICAL DATA MPDS026D - FEBRUARY 1997 - REVISED FEBRUARY 2002 DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE 0,95 6X 6 0,50 0,25 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0-8 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-5/G 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MPDS114 - FEBRUARY 2002 DCK (R-PDSO-G6) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 6 0,10 M 4 1,40 1,10 1 0,13 NOM 2,40 1,80 3 Gage Plane 2,15 1,85 0,15 0-8 0,46 0,26 Seating Plane 1,10 0,80 0,10 0,00 0,10 4093553-3/D 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-203 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MXBG003A NOVEMBER 2001 - REVISED MAY 2002 YEA (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY 0,50 A 0,95 0,85 B 0,25 C 1,45 1,35 1,00 B EE EE 0,50 A 1 2 PIN A1 INDEX AREA 6X 0,19 0,15 0,05 M C A B 0,05 M C 0,35 MAX 0,05 C 0,50 MAX SEATING PLANE 0,15 0,10 C 4203167-3/C 04/2002 NOTES: A. B. C. D. E. All linear dimensions are in millimeters. This drawing is subject to change without notice. NanoStar package configuration. Package complies to JEDEC MO-211 variation EA. This package is tin-lead (SnPb). Refer to the 6 YZA package (drawing 4204151) for lead-free. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MXBG005A - JANUARY 2002 - REVISED APRIL 2002 YZA (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY 0,50 A 0,95 0,85 B 0,25 C 1,00 1,45 1,35 B 0,50 A 1 2 Pin A1 Index Area 6X 0,19 0,15 0,05 M C A B 0,05 M C 0,35 MAX 0,05 C 0,50 MAX Seating Plane 0,15 0,10 C 4204151-3/B 03/2002 NOTES: A. B. C. D. E. All linear dimensions are in millimeters. This drawing is subject to change without notice. NanoFree package configuration. Package complies to JEDEC MO-211 variation EA. This package is lead-free. Refer to the 6 YEA package (drawing 4203167) for tin-lead (SnPb). NanoFree is a trademark of Texas Instruments. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MXBG019 - OCTOBER 2002 YZP (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY 0,50 A 0,95 0,85 B 0,25 C 1,00 1,45 1,35 B 0,50 A 1 2 Pin A1 Index Area 6X 0,25 0,20 0,05 M C A B 0,05 M C 0,05 C 0,50 Max Seating Plane 0,20 0,15 C 4204741-3/A 10/2002 NOTES: A. B. C. NOTES: D. All linear dimensions are in millimeters. This drawing is subject to change without notice. NanoFree package configuration. This package is lead-free. Refer to the 6 YEP package (drawing 4204725) for tin-lead (SnPb). NanoFree is a trademark of Texas Instruments. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 MECHANICAL DATA MXBG022 - OCTOBER 2002 YEP (R-XBGA-N6) DIE-SIZE BALL GRID ARRAY 0,50 A 0,95 0,85 B 0,25 C 1,00 1,45 1,35 B 0,50 A 1 2 Pin A1 Index Area 6X 0,25 0,20 0,05 M C A B 0,05 M C 0,05 C 0,50 Max Seating Plane 0,20 0,15 C 4204725-3/A 10/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. NanoFree package configuration. This package is tin-lead (SnPb). Refer to the 6 YZP package (drawing 420741) for lead-free. NanoFree is a trademark of Texas Instruments. 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