TLP118
1 2017-05-25
TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC
TLP118
PDP (Plasma Display Panel)
FA (Factory Automation)
Interfaces of measuring and control instruments
Operate at high ambient temperatures up to
125°C
The Toshiba TLP118 consists of GaAℓAs infrared light emitting
diodes and integrated high-gain, high-speed photodetectors.
The TLP118 is housed in the SO6 package. The output stage is
an open collector type.
The photodetector has an internal Faraday shield that provides
a guaranteed common-mode transient immunity of ±15 kV/μs.
Inverter logic type (Open collector output)
Package: SO6 pin
Guaranteed performance over: -40 to 125°C
Power supply voltage: 4.5 to 5.5 V
Input threshold current: IFH = 5.0 mA (max)
Propagation delay time tpHL/tpLH: 60 ns (max)
Common-mode transient immunity: ±15 kV/μs (min)
Isolation voltage: 3750 Vrms (min)
UL approved : UL1577, File No.E67349
cUL approved: CSA Component Acceptance Service No. 5A, File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1
(Note 1)
EN62368-1(pending)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1 : When VDE approved type is needed,
please designate “Option( V4)”
Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
JEDEC
―
JEITA
―
TOSHIBA
11−4L1
Weight: 0.08 g (typ.)
Creepage distance 5.0 mm (min)
Clearance distance 5.0 mm (min)
Insulation thickness 0.4 mm (min)
1:ANODE
3:
CATHODE
4:GND
5
:VO (Output)
6:
VCC
V
CC
GND
SHIELD
1
3
4
5
6
Pin Configuration (Top View)
Schematic
Construction Mechanical Ratings
Start of commercial production
2009-10
6
3
－
1
＋
5
4
SHIELD
VCC
V
O
GND
I
CC
I
F
I
O
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Absolute Maximum Ratings (Ta=25°C)
CHARACTERISTIC
SYMBOL
RATING
UNIT
LED
Forward Current
IF
25
mA
Forward Current Derating (Ta ≥ 110°C)
ΔIF /°C
-0.67
mA/°C
Pulse Forward Current (Note 1)
IFP
50
mA
Pulse Forward Current Derating (Ta ≥ 110°C) ΔI
FP
/°C -1.34 mA/°C
Input Power Dissipation
PD
40
mW
Input power Dissipation Derating (Ta > 85°C)
ΔPD/°C
-1.0
mW/°C
Reverse Voltage
VR
5
V
DETECTOR
Output Current 1 (Ta ≤ 125°C) I
O
25 mA
Output Voltage
VO
6
V
Supply Voltage
VCC
6
V
Output Power Dissipation
PO
80
mW
Output Power Dissipation Derating (Ta ≥ 110°C) ΔP
O
/°C -2.0 mW/°C
Operating Temperature Range
Topr
-40 to 125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Lead Soldering Temperature (10 s)
Tsol
260
°
C
Isolation Voltage (AC,60 s, R.H.≤
60%, Ta = 2 5°C)
(Note 2) BV
S
3750 V
rms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤ 1ms, duty = 50%.
Note 2: This device is regarded as a two terminal device: pins 1 and 3 are shorted together,
as are pins 4, 5 and 6.
Recommended Operating Conditions
CHARACTERISTIC
SYMBOL
MIN
T Y P.
MAX
UNIT
Input Current , High Level
IFH
7.5
―
15
mA
Input Voltage , Low Level
VFL
0
―
0.8
V
Supply Voltage*
VCC
4.5
―
5.5
V
Operating Temperature T
opr
-40 ― 125 °C
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
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Electrical Characteristics
(Unless otherwise specif ied, Ta=-40 to 125°C, VCC=4.5 to 5.5 V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT
CONDITION MIN T Y P. MAX UNIT
Input Forward Voltage
VF
―
IF = 10 mA , Ta = 25°C
1.45
1.61
1.85
V
Temperature Coefficient
of Forward Voltage
ΔVF/ Δ Ta ― IF = 10 mA ― -1.6 ― mV/°C
Input Reverse Current
IR
―
VR = 5 V , Ta = 25
°
C
―
―
10
μ
A
Capacitance between Input
terminals
CT ― V = 0 V, f = 1 MHz, Ta = 25°C ― 60 ― pF
Logic High Output Current IOH 1
VF=0.8 V ,VO=5.5 V
―
―
250
μA
Ta = 25°C
―
0.5
10
Logic Low Output Voltage VOL 2 IF = 10 mA, IO = 13 mA (Sinking) ― 0.2 0.6 V
Logic Low Supply Current ICCL 3 IF = 10 mA ― 1.5 5 mA
Logic High Supply Current ICCH 4 IF = 0 mA ― 1.5 5 mA
“H Level Output to L Level
Output” Input Current
IFHL ― IO = 13 mA (Sinking), VO < 0.6 V ― 1.0 5.0 mA
*All typical values are at Ta=25°C, VCC=5 V unless otherwise specified
Isolation Characteristi cs (Ta = 25°C)
Characteristic Symbol Test Condition MIN TYP. MAX UNIT
Capacitance input to output C
S
V
S
= 0 V,f = 1 MHz (Note 1)
― 0.8 ― pF
Isolation resistance RS R.H. ≤ 60%,VS = 500 V (Note 1)
1×10
12
10
14
― Ω
Isolation voltage BVS
AC,60 s 3750 ― ―
Vrms
AC,1 s, in oil ― 10000 ―
DC,60 s, in oil ― 10000 ― V
dc
Note 1: This device is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6.
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Switching Characteristics
(Unless otherwise specifi ed, Ta=-40 to 125 °C
､
VCC=4.5 to 5.5V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT
CONDITION MIN T Y P. MAX UNIT
Propagation delay time (H→L) t
pHL
5
I
F
=0→7.5 mA
RL=350Ω
CL=15pF
(Note 1)
― 30 60 ns
Propagation delay time (L→H) tpLH IF=7.5→0 mA ― 30 60 ns
Switching Time Dispersion
between ON and OFF
|tpHL-
t
pLH
| IF=0↔7.5 mA
RL=350Ω,
CL=15pF
(Note 1)
― ― 30 ns
Propagation Delay Skew (Note 2)
tpsk
-40
―
40
ns
Fall Time (90 – 10 %) tf IF=0→7.5 mA
RL=350Ω
CL=15pF
(Note 1)
― 30 ― ns
Rise Time (10 – 90 %) tr IF=7.5→0 mA ― 30 ― ns
Common Mode transient
Immunity at High Level Output
CMH
6
VCM=1000 Vp-p , IF=0 mA,
V
CC
=5 V , Ta = 2 5 °C 15 ― ― kV/μs
Common Mode transient
Immunity at Low Level Output
CML
VCM=1000 Vp-p , IF=10 mA,
VCC=5 V , Ta = 2 5 °C -15 ― ― kV/μs
*All typical values are at Ta=25°C
Note : A ceramic capacitor (0.1 μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of
the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Note 1: f=5MHz, duty=50%, input current tr=tf=5ns,
CL is approximately 15pF which includes probe and Jig/stray wiring capacitance.
Note 2: Propagation delay skew is defined as the difference between the largest and smallest propagation delay
times (i.e. tpHL or tpLH) of multiple samples. Evaluations of these samples are conducted under identical
test conditions (supply voltage, input current, temperature, etc).
TEST CIRCUIT 1: IOH Test Cir cu it TEST CIRCUIT 2: V OL Test Ci rcuit
TEST CIRCUIT 3: ICCL Test Circuit T EST CIRCUIT 4: ICCH Test Ci r cu it
IF
A
VCC
0.1 μF
I
CCL
0.1μF
VOL
VCC
V
IO
↑
SHIELD
IF
SHIELD
A
VCC
0.1 μF
I
CCH
SHIELD
0.1μF
SHIELD
VF
VCC
IOH
A
VO
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TEST CIRCUIT 5: Switching Time Test Circuit
TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit
V
O
V
OL
t
pLH
t
pHL
1.5 V
50%
tf tr
90%
10%
IF
0.1μF
RIN=100Ω
*CL=15pF *CL=15pF
RL=350Ω
IF=7.5mA(P.G)
(f=5MHz , duty=50%, tr=tf= Less than 5ns)
IF monitor
VO
P. G .
SHIELD
VCM
10%
90% 1000 V
・SW B : I
F
=0 mA
・SW A : IF=10 mA
0.8 V
2V
VO
tr
tf
CML
CMH
＋
－
SW
B
VCC
VCM
VO
0.1
μ
F
IF
A
RL=350Ω
→
*C
L:
includes probe and stray capacitance.
P.G.: Pulse generator
VCC
)(
)(800
s
tr
V
H
CM
µ
=
)(
)(800
s
tf
V
L
CM
µ
=
SHIELD
TLP118
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I
F
- V
F
∆ V
F/
∆ Ta - I
F
Forward Current IF (mA)
Temperature Coefficient
of Forward Voltage ∆VF/ ∆Ta (mV/˚C)
Forward Voltage VF (V)
Forward Current IF (mA)
VO- I F
IFHL-Ta
Output Voltage VO (V)
“H Level Output to L Level Output” Input Current
IFHL (mA)
Forward Current I
F
(mA)
Ambient Temperature Ta (°C)
ICCL-Ta
ICCH-Ta
Logic Low Supply Current ICCL (mA)
Logic High Supply Current ICCH (mA)
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
*The above graphs show typical characteristics.
1
10
100
11.2 1.4 1.6 1.8 22.2
-3
-2.5
-2
-1.5
-1
0.1 110 100
0
1
2
3
4
5
6
0123
0.0
1.0
2.0
3.0
4.0
5.0
-40 -20 020 40 60 80 100 120 140
0.0
0.3
0.5
0.8
1.0
1.3
1.5
1.8
2.0
-40 -20 020 40 60 80 100 120 140
0.0
0.3
0.5
0.8
1.0
1.3
1.5
1.8
2.0
-40 -20 020 40 60 80 100 120 140
VCC=5V
IO=13mA
125˚C
25˚C
-40˚C
RL=350Ω
4kΩ
VCC=5V
IF=10mA
VCC=5V
IF=0mA
TLP118
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V
OL
- Ta
t
pHL
/ t
pLH
- Ta
Low Level Output Voltage VOL (V)
Propagation Delay Time tpHL / tpLH (ns)
Ambient Temperature Ta (˚C)
Ambient Temperature Ta (˚C)
*The above graphs show typical characteristics.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
-40 -20 020 40 60 80 100 120 140
0
10
20
30
40
50
60
-40 -20 020 40 60 80 100 120 140
tpHL
tpLH
VCC=5V
IF=10mA
IO=13mA(Sinking)
VCC=5V
RL=350Ω
IF=7.5mA
TLP118
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Soldering and Storage
(1) Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below,
irrespective of whether a soldering iron or a reflow soldering method is used.
1) When Using Soldering Reflow
An example of a temperature profile when lead(Pb)-free solder is used
The soldering temperature profile is based on the package surface temperature
(See the figure shown above.)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) When using soldering Flow
Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120
seconds.
Mounting condition of 260 °C within 10 seconds is recommended
Flow soldering must be performed once.
3) When using soldering Iron
Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3
seconds not exceeding 350 °C
Heating by soldering iron must be done only once per lead
TLP118
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(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 °C to 35 °C,
and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
TLP118
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Specification for Embossed–Tape Packing (TPL)(TPR) for SO6 Coupler
1. Applicable Package
Package Product Type
SO6 Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP118 (TPL, E
[[G]]/RoHS COMPATIBLE (Note 1)
Tape-type
Device-name
Note 1: Please contact your Toshiba sales representative for details on environmental information such as
the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament
and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
3. Tape Dimensions
3.1 Specification Classification Are as Shown in Table 1
Table 1 Tape Type Classification
Tape type Classification Quantity
(pcs / reel)
TPL L direction 3000
TPR R direction 3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
Direction of Tape
L direction
R direction
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3.3 Empty Device Recesses Are as Shown in Table 2.
Table 2 Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0 device Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses 6 devices (max) per reel Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
Figure 2 Tape Forms
Table 3 Tape Dimension s
Unit: mm
Unless otherwise specified: ±0.1
Symbol Dimension Remark
A 4.0 ―
B 7.6 ―
D 5.5 Center line of indented square hole and sprocket hole
E 1.75 Distance between tape edge and hole center
F 8.0 Cumulative error (max) per 10 feed holes
G 4.0 Cumulative error (max) per 10 feed holes
K0 2.6 Internal space
+0.1
-0.3
+0.1
-0.3
0.3 ± 0.05
2.95 ± 0.2
K
0
G
F
φ1.6 ± 0.1
A
E
D
B
12.0 ± 0.3
φ1.5
+0.1
−0
Unit: mm
TLP118
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3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
Figure 3 Reel Form
Table 4 Reel Dimensions
Unit: mm
Symbol Dimension
A Φ330 ±2
B Φ80 ±1
C Φ13 ±0.5
E 2.0 ±0.5
U 4.0 ±0.5
W1 13.5 ±0.5
W2 17.5 ±1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard,
the quantity, the lot number and the Toshiba company name.
E
W1
W2
A
B
C
U
TLP118
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6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
Note 1: Please contact your Toshiba sales representative for details on environmental information such as
the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament
and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in
electrical and electronic equipment.
TLP118 (TPL,E 3000 pcs
Device name
Tape type
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE (Note 1)
TLP118
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
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applicable laws or regulations.
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infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate
the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive.
TOSHIBA
ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE
WITH APPLICABLE LAWS AND REGULATIONS.