Document Number: 002-00777 Rev. *L Page 3 of 58
Contents
Distinctive Characteristics .................................................. 1
General Description ............................................................. 2
1. Product Selector Guid e............................................... 4
2. Block Diagram.............................................................. 4
3. Connection Diagrams.................................................. 5
3.1 Special Handling Instructions......................................... 7
4. Pin Configu rati on......................................................... 8
5. Logic Symbol ............................................................... 8
6. Ordering Information................................................... 9
6.1 S29AL016J Standard Products...................................... 9
7. Device Bus Operations.............................................. 10
7.1 Word/Byte Configuration........... ... ... .............. .. ... .......... 11
7.2 Requirements for Reading Array Data......................... 11
7.3 Writing Commands/Command Sequences.................. 11
7.4 Program and Erase Operation Status.......................... 12
7.5 Standby Mode.............................................................. 12
7.6 Automatic Sleep Mode................................................. 13
7.7 RESET#: Hardware Reset Pin. .................................... 13
7.8 Output Disable Mode................................................... 13
7.9 Autoselect Mode....................... ... ... .............. .. ............. 16
7.10 Sector Group Protection/Unprotection......................... 16
7.11 Temporary Sector Group Unprotect............................. 17
8. Secured Silicon Sector Flash Memory Region ....... 20
8.1 Factory Locked: Secured Silicon Sector Programmed
and Protected at the Factory........................................ 20
8.2 Customer Lockable: Secured Silicon Sector NOT
Programmed or Protected at the Factory..................... 20
9. Common Flash Memory Interface (CFI)................... 21
9.1 Hardware Data Protection.................... ........................ 24
10. Command Definitions................................................ 24
10.1 Reading Array Data ..................................................... 24
10.2 Reset Command....................... ... ... .............. .. ............. 25
10.3 Autoselect Command Sequence ................................. 25
10.4 Enter/Exit Secured Silicon Sector Command
Sequence..................................................................... 25
10.5 Word/Byte Program Command Seque nce................... 25
10.6 Unlock Bypass Command Sequence .......................... 26
10.7 Chip Erase Command Sequence ................................ 27
10.8 Sector Erase Command Sequence ............................. 27
10.9 Erase Suspend/Erase Resume Commands................ 27
10.10Command Definitions Table........................................ 29
11. Write Operation Status .............................................. 30
11.1 DQ7: Data# Polling...................................................... 30
11.2 RY/BY#: Ready/Busy#................................................. 31
11.3 DQ6: Toggle Bit I ......................................................... 32
11.4 DQ2: Toggle Bit II ........................................................ 32
11.5 Reading Toggle Bits DQ6/DQ2.................................... 33
11.6 DQ5: Exceeded Timing Limits ..................................... 34
11.7 DQ3: Sector Erase Timer............................................. 34
12. Absol ute Maximum Ratings....................................... 35
13. Operating Ranges....................................................... 35
14. DC Characteristics...................................................... 37
14.1 CMOS Compatible........................................................ 37
15. Test Cond itions........................................................... 38
16. Key to Switchin g Waveforms..................................... 38
17. AC Characteristics...................................................... 39
17.1 Read Operations........................................................... 39
17.2 Hardware Reset (RESET#)........................................... 40
17.3 Word/Byte Co n fi g uration (BYTE#)................................ 41
17.4 Erase/Program Operations.................... .. ..................... 42
17.5 Temporary Sector Group Unprotect.............................. 46
17.6 Alternate CE# Controll ed Erase/Program Operations .. 47
18. Erase and Programming Performance ..................... 48
19. TSOP and BGA Pin Capacitance............................... 49
20. Physical Dimen sion s.................................................. 50
20.1 TS 048—48-Pin Standard TSOP.................................. 50
20.2 VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA)
8.15 mm x 6.15 mm...................................................... 51
20.3 LAE064–64-Ball Fortified Ball Grid Array (BGA)
9 mm x 9 mm................................................................ 52
21. Revision History.......................................................... 53